JPS6021820B2 - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPS6021820B2 JPS6021820B2 JP10455582A JP10455582A JPS6021820B2 JP S6021820 B2 JPS6021820 B2 JP S6021820B2 JP 10455582 A JP10455582 A JP 10455582A JP 10455582 A JP10455582 A JP 10455582A JP S6021820 B2 JPS6021820 B2 JP S6021820B2
- Authority
- JP
- Japan
- Prior art keywords
- stud
- hole
- soldering
- solder
- soldering method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating processes for reflow soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はプリント板等のスルーホールにスタッドを半田
付けする際に、該スルーホール内に半田が流出する事を
防止する半田付け方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a soldering method for preventing solder from flowing into a through hole of a printed circuit board or the like when a stud is soldered to the through hole.
〔技術の背景〕一般にプリント板に開けられた穴に対し
てスタッドを半田付けする事により、このスタツドを介
してプリント板に電源を供給したり、またプリント板を
接地したりする。[Technical background] Generally, by soldering a stud to a hole drilled in a printed board, power is supplied to the printed board or the printed board is grounded through the stud.
このような、スタッドの半田付けは、プリント板のスル
ーホールにリング半田、スタッドを載せて上部より加熱
したチップを降下させて半田を熔解させて半田付けを行
なう。Such soldering of studs is performed by placing ring solder and studs on through holes of a printed circuit board, and lowering a heated chip from above to melt the solder.
このような半田付けで問題となるのは、スルーホール内
壁に半田が付着する事である。A problem with such soldering is that the solder adheres to the inner wall of the through hole.
従来この半田をスルーホール内に入らないようにするた
めに、上記加熱したチップを該チップ部に接触する時間
を短か〈して流入する事を防止したり、温度を下げて流
入を防止したりする方法を採用していたが、これらの制
約は半田付けを良好に行なうには、マイナス要因となる
ものばかりで完全な半田付けを行なえなくなったり、ま
た、かなり精度の良い半田付け条件を選定しなければな
らず半田付けに係る工数が大きくなる欠点があった。Conventionally, in order to prevent this solder from entering the through hole, the time during which the heated chip is in contact with the chip section is shortened to prevent the solder from entering, or the temperature is lowered to prevent the solder from entering. However, these constraints are all negative factors for good soldering, making it impossible to achieve perfect soldering, and also requiring the selection of fairly accurate soldering conditions. This has the disadvantage that the number of man-hours involved in soldering increases.
従って本発明は上記欠点を解消した新規な半田付け方法
を提供する事を目的とし、特に、温度、時間に影響され
ない半田付け方法を提供する事にある。Therefore, it is an object of the present invention to provide a new soldering method that eliminates the above-mentioned drawbacks, and in particular, to provide a soldering method that is not affected by temperature or time.
本発明は上記目的を達成するために、穴の開けられた板
にスタッドを一方の面より挿入し半田付けを行なう半田
付け方法において、前記板の他方の面より前記スタッド
の内径よりも大きい外径を有し、先端部が所定の角度で
テーパの設けられたピンを該スタッドと接触するように
挿入した後半田付けを行なう事により前記穴内への半田
の流出を防止した事を特徴とする半田付け方法により達
成する事が出来る。In order to achieve the above object, the present invention provides a soldering method in which a stud is inserted into a plate with a hole from one side and soldered to the plate, the outer diameter of which is larger than the inner diameter of the stud from the other side of the plate. A pin having a diameter with a tapered tip at a predetermined angle is inserted so as to make contact with the stud, and solder is prevented from flowing into the hole by performing post-soldering. This can be achieved using a soldering method.
図に本発明の半田付け方法を示す。 The figure shows the soldering method of the present invention.
図においてａはスタッド、ｂはプリント板、ｃは半田、
ｄはナーパーピン、ｅは台、ｆはバネをそれぞれ示す。
ａはスタッドでプリント板ｂに設けられたスルーホール
に対して、取付けられる。In the figure, a is a stud, b is a printed board, c is solder,
d indicates a napper pin, e indicates a stand, and f indicates a spring.
A is attached by a stud to a through hole provided in the printed board b.
ｃは半田で半田付けされた状態を示す。c shows the soldered state.
ｄはテーパーピンでプリント板ｂのスタッドａが半田付
けされる側と反対側より挿入され、この７ーパーピンｄ
は、スルーホールの経より小さい外径を有し、先端にテ
ーパーが切られスタツドａの内面ａーーと端部において
接触する。d is a taper pin that is inserted from the side opposite to the side where stud a of printed board b is soldered, and this 7-per-pin pin d
has an outer diameter smaller than the diameter of the through hole, has a tapered tip, and contacts the inner surface a of stud a at its end.
このテーパーピンｄは台ｅ上にバネｆを介して固定され
、図示していないが、プリント板ｂに対して台ｅが加圧
されている。This taper pin d is fixed onto a stand e via a spring f, and although not shown, the stand e is pressed against the printed board b.
このようにして、上部よりスタッドａのａ−２の部分を
加熱チップにより加熱加圧して半田付けを行なう。In this way, the part a-2 of stud a is heated and pressurized from above using a heating chip to perform soldering.
このように構成すると、スタッドａの下面全周がテーパ
ーピンｄに密着しているため半田のスルーホール内の流
出を防止出来る。With this configuration, since the entire circumference of the lower surface of the stud a is in close contact with the taper pin d, solder can be prevented from flowing out into the through hole.
但し、このスルーホール内への半田の流出は、後にこの
スルーホールに挿入される接続ボルトがスムーズに挿入
されるようにするためであるので、半田の流出で問題と
なるのは、スタツドａの内側ａ−１の径より流出する点
であり、それ以外の半田の流出は問題ではない。However, the reason for the solder to flow into this through hole is to ensure that the connection bolt that will be inserted later into the through hole can be inserted smoothly. This is the point where the solder flows out from the diameter of the inner side a-1, and other flow of solder is not a problem.
以上のように本発明においては、板に設けられた穴内へ
の半田の流出を完全に防止可能であるため、半田付能率
の向上検査工数の減少、信頼性向上を計る事が出来る。As described above, in the present invention, it is possible to completely prevent solder from flowing into the holes provided in the plate, so it is possible to improve soldering efficiency, reduce inspection man-hours, and improve reliability.
図面の簡単な説明図は本発明の半田付け方法を示す。A simple illustration of the drawing illustrates the soldering method of the invention.
Claims (1)
挿入し、該穴の下側より該スタツドの内径よりも大きい
外径を有し、先端部が所定の角度でテーパを付けられた
ピンをバネの加圧により挿入し、該スタツドと該先端部
を接触させた後、半田付けを行なうことを特徴とする半
田付け方法。1 A hole is made in a printed board, a stud is inserted from the top of the hole, and a pin with an outer diameter larger than the inner diameter of the stud and whose tip is tapered at a predetermined angle is inserted from the bottom of the hole. A soldering method characterized in that the stud is inserted under pressure of a spring, the stud and the tip are brought into contact, and then soldering is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10455582A JPS6021820B2 (en) | 1982-06-17 | 1982-06-17 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10455582A JPS6021820B2 (en) | 1982-06-17 | 1982-06-17 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58221668A JPS58221668A (en) | 1983-12-23 |
| JPS6021820B2 true JPS6021820B2 (en) | 1985-05-29 |
Family
ID=14383709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10455582A Expired JPS6021820B2 (en) | 1982-06-17 | 1982-06-17 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6021820B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04319281A (en) * | 1991-04-18 | 1992-11-10 | Fujitsu Ltd | Method for bonding stud and jig therefor |
-
1982
- 1982-06-17 JP JP10455582A patent/JPS6021820B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58221668A (en) | 1983-12-23 |
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