JPS592935Y2 - Stud spare soldering jig - Google Patents

Description

[Detailed Description of the Invention] (1) Technical Field of the Invention The present invention relates to a stud pre-soldering jig used for pre-soldering a stud, which is a washer-like component.

(2) Background of the technology Many washer-like parts called studs are joined to printed boards, but in order to join studs to printed boards, it is necessary to pre-solder the outer cylindrical part of the studs in advance. There is.

(3) Prior art and problems FIG. 1 is a front view showing a stud, and FIG. 2 is a front sectional view showing a conventional preliminary soldering method.

As shown in FIG. 1, the stud 1 has a cylindrical portion 1b having a hole 1a penetrated therein, and a hub IC is formed in the cylindrical portion 1b.

When pre-soldering only the outer cylindrical portion 1d of this stud 1, which is indicated by diagonal lines in FIG. 1, as shown in FIG. This was done by heating and melting the solder 2 using a heating means such as an infrared lamp, but in this method, sufficient metal diffusion phenomenon did not occur between the solder 2 and the studs 1 because the amount of the solder 2 was small. First, when the stud 1 is later soldered to a printed circuit board or the like via the outer cylindrical portion 1d, there is a drawback that sufficient bonding strength cannot be obtained.

(4) Purpose of the invention In order to eliminate the above-mentioned drawbacks, the present invention is a stud pre-soldering jig that performs pre-soldering using a large amount of molten solder and can cause a sufficient metal diffusion phenomenon between the solder and the stud. The purpose is to provide the following.

(5) Structure of the invention, that is, the invention provides a shielding plate having a recess into which the collar of a stud can fit and be secured, and a shielding plate that can fit into and engage with a hole of a stud fitted in the recess to close the hole. It has a holder provided with a protrusion, and further includes a connecting means for connecting the holder and the shielding plate.

(6) Embodiments of the invention Hereinafter, the invention will be specifically explained based on embodiments shown in the drawings.

FIG. 3 is a front sectional view showing an embodiment of a stud pre-soldering jig according to the present invention, and FIG. 4 is a front sectional view showing a stud pre-soldered using the jig of FIG. 3.

As shown in FIG. 3, the stud preliminary soldering jig 3 has a shielding plate 5 and a holder 6, and the shielding plate 5 has a number of recesses 5a into which the collar IC of the stud 1 can fit and engage. has been done.

Escape holes 5b are bored through each of the recesses 5a, and screw holes 5C are screwed through the shielding plate 5 at predetermined intervals.

On the other hand, the holder 6 is formed with a conical protrusion 6a corresponding to the relief hole 5b, and furthermore, a support leg 6C with a hole 6b formed therein is formed in a shape corresponding to the screw hole 5C. has been done.

Since the present invention has the above-described configuration, when performing preliminary soldering on the outer cylindrical portion 1d of the stud 1 shown in FIG. 1, as shown in FIG. The holder 6 is attached to the shielding plate 5 by fitting and engaging the collar IC of the stud 1, and then fitting and engaging the protrusion 6a into the hole 1a and the relief hole 5b. It is screwed into the screw hole 5C through the screw hole 5C and tightened.

Then, the hole 1a of each stud 1 is closed by the protrusion 6a, and the portion of the collar 1C that is not subjected to preliminary soldering is pressed toward the recess 5a and comes into close contact with it.

In this state, when the jig 3 is immersed in the molten solder bath until the shielding plate surface 5d contacts the solder, the outer cylindrical portion 1d of the stud 1 becomes It is soldered.

Since the amount of molten solder is larger than that of the washer-shaped solder 2 shown in Fig. 2, a sufficient metal diffusion phenomenon occurs between the solder and the outer cylindrical portion 1d, so that preliminary soldering is performed reliably. It will be done.

At this time, since the hole 1a of the stud 1 is closed by the protrusion 6a, molten solder does not enter, so that no preliminary soldering is performed.

Furthermore, since the solder reaches only the shielding plate surface 5d on the surface of the brim 1C on the concave portion 5a side, no soldering is performed.

(7) Effects of the invention As explained above, according to the invention, the outer cylindrical portion 1d of the stud 1 can be pre-soldered using a large amount of molten solder. It can cause sufficient metal diffusion phenomenon, and later stud 1
When soldering to a printed circuit board or the like, sufficient bonding strength can be obtained and highly reliable preliminary soldering can be performed.

[Brief explanation of the drawing]

FIG. 1 is a front view showing a stud, FIG. 2 is a front sectional view showing a conventional pre-soldering method, and FIG. 3 is a front sectional view showing an embodiment of a stud pre-soldering jig according to the present invention. FIG. 4 is a front sectional view showing a stud which has been pre-soldered using the jig shown in FIG. 1... Stud, 1a... Hole, 1C.
...Brim, 3...Stud preliminary soldering jig, 5...Shielding plate, 5a...Concavity, 6.
...Holder, 6a...Protrusion, 7...
...Connection means (bolts).

Claims (1)

[Scope of utility model registration request] a shielding plate having a recess into which the collar of the stud can fit and engage, and a shielding plate that fits into the hole of the stud that is fitted into the recess;
A stud preliminary soldering jig comprising a holder provided with a protrusion capable of closing the hole, and further provided with a connecting means for connecting the holder and a shielding plate.