JPS6028405B2 - piezoelectric resonator - Google Patents
piezoelectric resonatorInfo
- Publication number
- JPS6028405B2 JPS6028405B2 JP52000916A JP91677A JPS6028405B2 JP S6028405 B2 JPS6028405 B2 JP S6028405B2 JP 52000916 A JP52000916 A JP 52000916A JP 91677 A JP91677 A JP 91677A JP S6028405 B2 JPS6028405 B2 JP S6028405B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- piezoelectric
- lid
- adhesive
- ceramic resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 27
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000004840 adhesive resin Substances 0.000 claims description 5
- 229920006223 adhesive resin Polymers 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1042—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a housing formed by a cavity in a resin
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
本発明はエネルギー閉じ込め型セラミックフィルターな
どのような圧電磁器共振子に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a piezoelectric ceramic resonator such as an energy trap type ceramic filter.
従来、上述のようなセラミックフィルターなどを構成す
る電極付き圧蟹素子を外装してなる圧電磁器共振子を得
るには、所定の温度に加熱した圧電素子をェポキシ樹脂
等の粉体中に浸潰して行なう方法が用いられているが、
この方法では作動電極部分に被覆樹脂が直接接触しない
ように作動電極部分を保護したり、空隙を形成する必要
がある。Conventionally, in order to obtain a piezoelectric ceramic resonator made by enclosing a pressure crab element with electrodes, which constitutes a ceramic filter as described above, the piezoelectric element is heated to a predetermined temperature and immersed in powder such as epoxy resin. The method of doing this is used, but
In this method, it is necessary to protect the working electrode part so that the coating resin does not come into direct contact with the working electrode part, or to form a gap.
空隙を形成する手段として、例えば特公昭50−237
8び号公報に提案されているが、この方法においては接
着層を部分的に除外することは煩雑で時間を要するうえ
、除去輪郭が不明確であり、一定厚みの接着層を塗布し
て得ることが困難である。また、粘着層の厚みを100
ミクロン以上といつた厚さに得ることは困難で、数十ミ
クロンの空隙では接着層を有する基板が外力や温度変化
によって容易に作動電極面へ接触するといった問題を有
している。As a means for forming voids, for example, Japanese Patent Publication No. 50-237
However, in this method, partially removing the adhesive layer is complicated and time-consuming, and the removal contour is unclear, and it is difficult to remove the adhesive layer partially. It is difficult to do so. In addition, the thickness of the adhesive layer was set to 100
It is difficult to obtain a thickness of more than microns, and a gap of several tens of microns poses the problem that the substrate with the adhesive layer easily comes into contact with the working electrode surface due to external force or temperature changes.
本発明は、そのような問題を解決するもので、以下、実
施例として示した図面により説明する。The present invention solves such problems and will be explained below with reference to the drawings shown as examples.
第1図において、1はエネルギー閉じ込め型セラミック
フィルターを構成する圧電素子であり、これは四角形状
の庄電基板laの一方の主平面に、それぞれ入力用およ
び出力用の電極2および3を、そして他方の主平面にア
ース用の電極(共通電極)4を図示のようなパターンで
対向配設することによって構成してある。第2図A,B
は上記圧電素子を取付ける絶縁物基板5の平面図とX,
一×,線断面図で、絶縁物基板5の一方の主平面には所
定のパターンの導電体2′,3′,4′が設けられ、そ
れらの端部で、かつ絶縁物基板5の一辺の綾部に位置す
る部分には外部接続用端子6a,6b,6cが半田7な
どで取付けられている。In FIG. 1, reference numeral 1 denotes a piezoelectric element constituting an energy trapping ceramic filter, which has electrodes 2 and 3 for input and output, respectively, on one main plane of a rectangular electrical substrate la; It is constructed by arranging grounding electrodes (common electrodes) 4 facing each other in a pattern as shown in the figure on the other main plane. Figure 2 A, B
is a plan view of the insulator substrate 5 on which the piezoelectric element is mounted, and
In the 1×, line cross-sectional view, conductors 2', 3', and 4' of a predetermined pattern are provided on one main plane of the insulating substrate 5, and at their ends and on one side of the insulating substrate 5. External connection terminals 6a, 6b, and 6c are attached to the portions located on the twill portions with solder 7 or the like.
上義絶緑物基板5としては、フェノール、ェポキシ、ポ
リィミド等の樹脂を基材とし、その表面に銅箔を接着し
たプリント板を、所定のパターンにエッチング処理して
導電体2′,3′,4′を形成したもの、あるいはステ
アタイト、アルミナ等のセラミックやガラス基板上に所
定の導電膜パターンをメッキ、蒸着、焼付等の手段で形
成したものを用い得る。上述の絶縁物基板の導電体2′
,3′,4′の所定位置には、さらに所定のパターンの
導電性接着剤8(例えば銀ペースト)が印刷等の手段で
配設されている。The substrate 5 is made of a resin such as phenol, epoxy, or polyimide, and a printed board with copper foil adhered to the surface is etched into a predetermined pattern to form the conductors 2', 3', 4', or one in which a predetermined conductive film pattern is formed on a ceramic substrate such as steatite, alumina, etc. or a glass substrate by means of plating, vapor deposition, baking, etc. can be used. Conductor 2' of the above-mentioned insulator substrate
, 3', 4' are further provided with a conductive adhesive 8 (for example, silver paste) in a predetermined pattern by printing or other means.
第3図A,Bは第1図の圧電素子1を第2図の絶縁物基
板5上に導亀性接着剤8で所定の位置に接着し、かつ圧
電基板laの角部4箇所に突起を形成した状態を示した
ものである。3A and 3B, the piezoelectric element 1 of FIG. 1 is adhered to a predetermined position on the insulating substrate 5 of FIG. This figure shows the state in which .
その角部への突起形成は、圧電基板laの角部4箇所す
なわち氏電素子1の各電極2,3,4の端部近傍と絶縁
物基板5に印刷した導電性接着剤8とにまたがって、導
電性接着剤9をドット状に塗布することによって実施さ
れている。したがって、導電性接着剤8,9により、圧
電素子1の各電極2,3,4と絶縁物基板5の各導電体
2′,3′,4′とは、それぞれ電気的導通状態に接続
される。圧電素子1の各電極2,3,4の角部に導電性
接着剤9をもって形成したドット状の突起(以下は、こ
れをAと称す)の高さは、本実施例では、圧電素子1の
作動電極面より200〜300ミクロン高くなるような
形状、寸法とした。第4図A,Bは第1図に示す圧電素
子1を取付けた絶縁物基板5すなわち、第3図のものに
蓋体10を装着した状態を示す一部切欠平面図と、X3
−×嫌塚断面図である。The formation of protrusions at the corners extends over the four corners of the piezoelectric substrate la, that is, near the ends of the electrodes 2, 3, and 4 of the electrical element 1, and the conductive adhesive 8 printed on the insulator substrate 5. This is carried out by applying conductive adhesive 9 in dots. Therefore, each electrode 2, 3, 4 of the piezoelectric element 1 and each conductor 2', 3', 4' of the insulating substrate 5 are electrically connected to each other by the conductive adhesives 8, 9. Ru. In this embodiment, the height of the dot-like protrusions (hereinafter referred to as A) formed with conductive adhesive 9 at the corners of each electrode 2, 3, 4 of the piezoelectric element 1 is The shape and dimensions were such that it was 200 to 300 microns higher than the working electrode surface. 4A and 4B are partially cutaway plan views showing a state in which the lid body 10 is attached to the insulator substrate 5 on which the piezoelectric element 1 shown in FIG. 1 is attached, that is, the one shown in FIG. 3, and
−× Yazuka sectional view.
第5図は前記蓋体10の未装着状態における一例を示す
斜視図で、これはポリエステルフィルムなどの矩形状基
材の片面に絶縁物部材からなる熱硬化性あるいは感圧性
の粘着剤層11を塗布してなるもので、一般に片面粘着
テープとして安価に市販されている部村を用い得る。FIG. 5 is a perspective view showing an example of the lid 10 in an unattached state, in which a thermosetting or pressure-sensitive adhesive layer 11 made of an insulating material is coated on one side of a rectangular base material such as a polyester film. It is made by coating and generally commercially available as a single-sided adhesive tape at low cost.
本発明における外装構造は、上述の蓋体10及び導電性
接着剤で形成したドット状突起Aを用いて圧電素子1の
作動電極面に空隙を形成するようにしたもので、以下に
、その組立過程について説明する。The exterior structure of the present invention is such that a gap is formed on the working electrode surface of the piezoelectric element 1 using the above-mentioned lid 10 and the dot-like protrusions A formed with a conductive adhesive.The assembly will be described below. Explain the process.
第4図A,Bに示すごとく、圧電素子1を敗付けた絶縁
物基板5に、蓋体10が圧電素子1を収容するごとくド
ット状突起Aを介して粘着剤層11を用いて蓋体を貼付
する。As shown in FIGS. 4A and 4B, the lid is attached to the insulating substrate 5 on which the piezoelectric element 1 is attached using the adhesive layer 11 through the dot-like protrusions A so that the lid 10 accommodates the piezoelectric element 1. Attach.
この場合、蓋体10の外形寸法は幅が絶縁物基板と同程
度で、長さは外部接続用端子6a,6b,6cに覆いか
ぶさらない程度とすることが望ましい。第4図Bから明
らかなように、圧電素子の外形周辺に接着部分を形成す
るごとく蓋体を貼り合せしても、姿体の粘着剤層は圧電
素子の角部に形成した突起Aによって圧電素子1の作動
電極部分に直接接触することがなく、空隙12が形成さ
れる。上述のごとくして圧電素子1の作動電極部分に所
定の空隙12を形成したのち、蓋体10の粘着剤層11
を加熱して硬化させ、その後、ェポキシ樹脂などの熱硬
化性の粉末あるいは常温硬化の液状樹脂槽(いずれも図
示せず)に圧電素子1、蓋体10を含む絶縁物基板5全
体を浸潰して樹脂被覆層を形成し、所定の温度で加熱硬
化させることによって、圧電素子1を外気から完全に遮
断した密封状態に保つことができる。In this case, it is desirable that the external dimensions of the lid 10 be such that the width is comparable to that of the insulating substrate, and the length is such that it does not cover the external connection terminals 6a, 6b, and 6c. As is clear from FIG. 4B, even if the lid is attached so as to form an adhesive part around the outer shape of the piezoelectric element, the adhesive layer of the body will not be able to generate piezoelectricity due to the protrusions A formed at the corners of the piezoelectric element. A gap 12 is formed without direct contact with the working electrode portion of the element 1. After forming a predetermined gap 12 in the working electrode portion of the piezoelectric element 1 as described above, the adhesive layer 11 of the lid body 10 is
After that, the entire insulating substrate 5 including the piezoelectric element 1 and the lid 10 is immersed in a thermosetting powder such as epoxy resin or a liquid resin bath that hardens at room temperature (none of which are shown). By forming a resin coating layer and curing it by heating at a predetermined temperature, the piezoelectric element 1 can be kept in a sealed state completely shielded from the outside air.
−なお、圧電素子1の圧電基板laの角部に塗布するド
ット状突起Aは別段、導電性接着剤に限定する必要はな
く、ェポキシ樹脂等の絶縁物接着剤を用いても一向にさ
しつかえない。- Note that the dot-shaped protrusions A applied to the corners of the piezoelectric substrate la of the piezoelectric element 1 do not need to be limited to a conductive adhesive, and an insulating adhesive such as epoxy resin may also be used.
さりこ、ドツト塗布位置についても圧電基板laの角部
に限定するものではなく、作動電極部分にドット状突起
あるいは蓋体が接触して悪影響を及ぼさない範囲であれ
ば圧電素子の外形近傍の任意部所に突起を形成してもよ
いことは明らかである。さらにドット状突起の形成箇所
数についても何ら限定されるものではない。また、本発
明は前記5で示したような絶縁物基板に圧電素子1を敬
付けるようにした構造のものに限定されるものではなく
、第6図A,Bに例示するように、圧電基板la′の主
面に装着する電極2,3,4の一部2A,3A,4Aを
延長し、その部分に外部接続用端子6a,6b,6cを
直接的に接続して構成した庄電素子1′を使用する場合
も含む。The dot application position is not limited to the corner of the piezoelectric substrate la, but can be anywhere near the external shape of the piezoelectric element as long as the dot-shaped protrusion or the lid body does not come into contact with the actuating electrode and have an adverse effect. It is clear that protrusions may also be formed at the locations. Further, the number of locations where dot-like protrusions are formed is not limited at all. Further, the present invention is not limited to a structure in which the piezoelectric element 1 is attached to an insulating substrate as shown in 5 above, but a piezoelectric substrate as illustrated in FIGS. 6A and 6B. A Shoden element configured by extending parts 2A, 3A, 4A of electrodes 2, 3, 4 attached to the main surface of la' and directly connecting external connection terminals 6a, 6b, 6c to the extended parts. This includes cases where 1' is used.
この場合には、ドット状突起Aを作動電極部分の近傍の
複数箇所に位置するように両面(または片面)に配設し
、その後、第5図に例示したごとき蓋体10を図示のよ
うに両側に接着し、全体をェポキシ樹脂等の絶縁物部材
で密封状態に被覆するようにすればよい。上述のごとく
本発明の圧電磁器共振子は、圧電素子の作動電極部分の
近傍に、所定の高さの突起を接着樹脂部材で形成すると
共に、蓋体(例えば安価な市販の片面粘着テープなど)
を貼り合わせることによって、簡単に能率よく作動電極
部分に空隙部分を形成することができ、電気的特性の安
定した圧電磁器共振子を得ることができるものである。In this case, the dot-like protrusions A are arranged on both sides (or one side) so as to be located at a plurality of locations near the working electrode portion, and then the lid body 10 as illustrated in FIG. It may be adhered to both sides, and the whole may be hermetically covered with an insulating material such as epoxy resin. As described above, in the piezoelectric ceramic resonator of the present invention, a protrusion of a predetermined height is formed in the vicinity of the actuating electrode portion of the piezoelectric element using an adhesive resin member, and a cover member (for example, an inexpensive commercially available single-sided adhesive tape) is formed.
By bonding them together, a gap can be easily and efficiently formed in the working electrode part, and a piezoelectric ceramic resonator with stable electrical characteristics can be obtained.
第1図は本発明に用し、る圧電素子の一例の平面図、第
2図A,Bは本発明に用い得る絶縁物基板の一例の平面
図とX,一×,線断面図、第3図A,Bは第1図の圧電
素子を第2図の絶縁物基板に取付けた状態を示す平面図
とX2−×2線断面図、第4図A,Bは本発明の一実施
例の禾外装状態における一部切欠平面図とX3−X3線
断面図、第5図は本発明で使用する蓋体の一例の斜視図
、第6図A,Bは本発明の他の実施例の一部切欠平面図
とれ−×4線断面図である。
1,1′……圧電素子、2,3,4…・・・電極、2′
,3′,4′・・…・導電体、5…・・。
絶縁物基板、6a,6b,6c……外部接続用端子、8
,9・・・…導電性接着剤、10……蓋体、11・・・
・・・粘着剤層、12・・・・・・空隙、A……ドット
状突起。第1図第2図
第5図
第3図
第4図
第6図FIG. 1 is a plan view of an example of a piezoelectric element used in the present invention, and FIGS. 2A and 2B are a plan view and a cross-sectional view along the 3A and 3B are a plan view and a sectional view taken along the line X2-X2 showing the piezoelectric element shown in FIG. 1 attached to the insulating substrate shown in FIG. FIG. 5 is a perspective view of an example of the lid body used in the present invention, and FIGS. 6A and B are views of other embodiments of the present invention. It is a partially cutaway plan view and a sectional view taken along the line -x4. 1, 1'... Piezoelectric element, 2, 3, 4... Electrode, 2'
, 3', 4'... Conductor, 5...... Insulator board, 6a, 6b, 6c...terminal for external connection, 8
, 9... Conductive adhesive, 10... Lid, 11...
...Adhesive layer, 12...Void, A...Dot-shaped protrusions. Figure 1 Figure 2 Figure 5 Figure 3 Figure 4 Figure 6
Claims (1)
それらの導電体の所望のものに外部接続用端子や接続さ
れた絶縁物基板と、複数個の電極を有する圧電素子と、
前記圧電素子を被覆する蓋体を具備し、前記圧電素子を
前記絶縁物基板上に配設するとともに、その圧電素子の
各電極を前記絶縁物基板の所定の導電体と電気的導通を
もつて接続し、かつ、圧電素子の縁部に接着樹脂部材で
突起部分を形成し、その突起部分を介して前記蓋体が圧
電素子を収納するごとく前記絶縁物基板に装着され、全
体が絶縁物部材で密封状態に被覆されていることを特徴
とする圧電磁器共振子。 2 特許請求の範囲第1項において、蓋体として、絶縁
性部材の一方の面に粘着性接着剤と、熱硬化性樹脂のい
ずれか一方が塗布されているものを使用するようにした
ことを特徴とする圧電磁器共振子。 3 特許請求の範囲第1項または第2項において、接着
樹脂部材で形成する突起部分は、圧電素子の作動電極面
よりも突出して形成されていることを特徴とする圧電磁
器共振子。 4 所定の形状の圧電基板上に外部接続用端子と直接的
に接続される所定のパターンの複数個の電極が設けられ
た圧電素子と、その圧電素子の作動電極部分を被覆する
蓋体とを具備し、上記圧電素子の少なくとも一方の面の
作動電極部分近傍に接着樹脂部材で複数個の突起部分を
形成し、その突起部分を介して上記蓋体を装着し、その
蓋体を含む圧電素子全体が絶縁部材に密封状態に被覆さ
れていることを特徴とする圧電磁器共振子。 5 特許請求の範囲第4項において、蓋体として、絶縁
性部材の一方の面に粘着性接着剤と、熱硬化性樹脂のい
ずれか一方が塗布されているものを使用するようにした
ことを特徴とする圧電磁器共振子。 6 特許請求の範囲第4項または第5項において、接着
樹脂部材で形成する突起部分は、圧電素子の作動電極面
よりも突出して形成されていることを特徴とする圧電磁
器共振子。[Claims] 1. A plurality of conductors are provided in a predetermined pattern, and
an insulator substrate connected to external connection terminals and a piezoelectric element having a plurality of electrodes to desired conductors;
The piezoelectric element is provided with a lid that covers the piezoelectric element, and the piezoelectric element is disposed on the insulating substrate, and each electrode of the piezoelectric element is electrically connected to a predetermined conductor of the insulating substrate. In addition, a protruding portion is formed on the edge of the piezoelectric element using an adhesive resin member, and the lid body is attached to the insulating substrate through the protruding portion so as to house the piezoelectric element, and the entire piezoelectric element is made of an insulating material. A piezoelectric ceramic resonator characterized by being hermetically coated with. 2. Claim 1 states that the lid uses an insulating member coated with either an adhesive adhesive or a thermosetting resin on one side. Features a piezoelectric ceramic resonator. 3. A piezoelectric ceramic resonator according to claim 1 or 2, characterized in that the protruding portion formed of the adhesive resin member is formed to protrude beyond the operating electrode surface of the piezoelectric element. 4. A piezoelectric element having a plurality of electrodes in a predetermined pattern that are directly connected to external connection terminals on a piezoelectric substrate having a predetermined shape, and a lid body that covers the operating electrode portion of the piezoelectric element. forming a plurality of protrusions using an adhesive resin member in the vicinity of the actuating electrode portion on at least one surface of the piezoelectric element, and attaching the lid through the protrusions, the piezoelectric element including the lid; A piezoelectric ceramic resonator characterized in that the entirety is hermetically covered with an insulating member. 5. Claim 4 states that the lid uses an insulating member coated with either an adhesive adhesive or a thermosetting resin on one side. Features a piezoelectric ceramic resonator. 6. A piezoelectric ceramic resonator according to claim 4 or 5, characterized in that the protruding portion formed of the adhesive resin member is formed to protrude beyond the operating electrode surface of the piezoelectric element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52000916A JPS6028405B2 (en) | 1977-01-07 | 1977-01-07 | piezoelectric resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52000916A JPS6028405B2 (en) | 1977-01-07 | 1977-01-07 | piezoelectric resonator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5398754A JPS5398754A (en) | 1978-08-29 |
| JPS6028405B2 true JPS6028405B2 (en) | 1985-07-04 |
Family
ID=11486998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52000916A Expired JPS6028405B2 (en) | 1977-01-07 | 1977-01-07 | piezoelectric resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028405B2 (en) |
-
1977
- 1977-01-07 JP JP52000916A patent/JPS6028405B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5398754A (en) | 1978-08-29 |
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