JPS6035828B2 - Manufacturing method for resin-encapsulated integrated circuit device - Google Patents
Manufacturing method for resin-encapsulated integrated circuit deviceInfo
- Publication number
- JPS6035828B2 JPS6035828B2 JP58016068A JP1606883A JPS6035828B2 JP S6035828 B2 JPS6035828 B2 JP S6035828B2 JP 58016068 A JP58016068 A JP 58016068A JP 1606883 A JP1606883 A JP 1606883A JP S6035828 B2 JPS6035828 B2 JP S6035828B2
- Authority
- JP
- Japan
- Prior art keywords
- tab
- integrated circuit
- resin
- frame
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明は集積回路のレジン封止技術に関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin encapsulation technique for integrated circuits.
レジンモールド型ＩＣ（半導体集積回路装置）は、複数
個のＩＣに必要とするりードを一体に形成したりードフ
レームを用意し、そのリードフレームの各タブ部に半導
体べレットを接続し、リードとべレツトの電極をコネク
タ線を介して接続し、次いでレジンモールドし、その後
、リードフレームの不要部を切断除去する方法により製
造される。Resin-molded ICs (semiconductor integrated circuit devices) are manufactured by preparing a lead frame in which the leads required for multiple ICs are integrally formed, and connecting semiconductor pellets to each tab of the lead frame. The lead frame is manufactured by connecting the electrodes of the top via a connector wire, then resin molding, and then cutting and removing unnecessary parts of the lead frame.
従来において用いられたりードフレームの一例は第２図
に示される。An example of a conventionally used cable frame is shown in FIG.
このようなりードフレームを用いてＩＣを製造した場合
、次のような問題があった。When ICs were manufactured using such a board frame, the following problems occurred.
レジンモールド直後の高い温度の状態から常温に冷却さ
れる間にリードフレームとしジンの熱膨張係数の不一致
（レジンの方が熱膨張係数が大きい）に基づきリードフ
レームの各モールド部でレジンの収縮力によってリード
が収縮する現象が生じ、それに起因してリードフレーム
に歪み、反りが発生し、いよいよレジンがリードフレー
ムから剥離するという問題があった。While the resin mold is being cooled from a high temperature state to room temperature, the shrinkage force of the resin is applied to each mold part of the lead frame due to the mismatch in the thermal expansion coefficients of the resin (resin has a larger thermal expansion coefficient). This causes a phenomenon in which the leads shrink, which causes the lead frame to become distorted and warped, leading to the problem that the resin eventually peels off from the lead frame.
本発明はしジンモールドに際してのパッケージの反り、
歪みを少なくすることを目的とするものである。Warpage of the package when molding according to the present invention,
The purpose is to reduce distortion.
このような目的を達成するために、本発明の一実施例は
、枠体（第１の枠体）間にタブがつられたＤＩＬタイプ
のリードフレームの外枠のタブリード接続部にスリット
を設けることにより、レジン封止時の応力を吸収しよう
とするものである。In order to achieve such an object, one embodiment of the present invention is to provide a slit in the tab lead connection portion of the outer frame of a DIL type lead frame in which a tab is suspended between the frame bodies (first frame body). This is intended to absorb stress during resin sealing.
以下本発明を図示した実施例により説明する。第１図は
本発明の一実施例を示す。１は半導体べレット接続用タ
ブの周囲にビーム状に配列されたりード、２は半導体べ
レット接続用タブ、３はタブ２を保持するためのタブリ
ード、これらリード１、タブ２及びタプリード３を含め
てリード部と称する。The present invention will be explained below with reference to illustrated embodiments. FIG. 1 shows an embodiment of the invention. Reference numeral 1 denotes a lead arranged in a beam shape around a tab for connecting a semiconductor pellet, 2 a tab for connecting a semiconductor pellet, 3 a tab lead for holding tab 2, and these leads 1, tab 2, and tape lead 3. This is collectively referred to as the lead section.
４はしジンモールドの際モールド部からしジンが流出す
るのを防止するためのタィバー、５は長手方向の両側面
部、６はその側面部に形成されたスリット、７は相隣接
するリード部相互間を仕切る枠体である。4 is a tie bar for preventing the gin from flowing out from the mold part when molding, 5 is both side surfaces in the longitudinal direction, 6 is a slit formed in the side surface, 7 is a tie bar between adjacent lead parts. It is a frame that divides the space.
この枠体７はリードフレームの剛性を保つ等のために必
要なもので、これがないとりードの先端部が弱くなり、
製造工程中に折れたりするので設けられている。This frame body 7 is necessary to maintain the rigidity of the lead frame, and without it, the tip of the lead becomes weak.
This is provided because it can break during the manufacturing process.
そして、この枠体７には幅０．１〜０．６肋のスリット
が設けられている。スリットを設けた理由は前述の如く
、リードフレームの各モールド部においてレジンの収縮
力によってリードが収縮する現象が生じ、それに起因し
てリードフレームに歪が生じるので、スリットによって
リードフレーム自体の剛性を弱め、その歪を吸収できる
ようにするためである。This frame body 7 is provided with a slit having a width of 0.1 to 0.6 ribs. As mentioned above, the reason for providing the slits is that the leads contract due to the contraction force of the resin in each mold part of the lead frame, which causes distortion in the lead frame, so the slits reduce the rigidity of the lead frame itself. This is to weaken the distortion so that it can absorb the distortion.
すなわち、リードフレームの両側面５に設けたスリット
６は、リードフレームの長手方向に生ずる歪を吸収する
。That is, the slits 6 provided on both side surfaces 5 of the lead frame absorb strain occurring in the longitudinal direction of the lead frame.
これによって、レジンの収縮力によってリードフレーム
が長手方向に収縮してリードフレーム全体が長手方向に
反ることを防止できる。これはＩＣの信頼性や製造上の
作業性の向上に寄与する。また、枠体部７に設けたスリ
ット８は、リードフレームの幅員方向に生ずる歪を吸収
する。This prevents the lead frame from shrinking in the longitudinal direction due to the shrinkage force of the resin and warping the entire lead frame in the longitudinal direction. This contributes to improving IC reliability and manufacturing workability. Furthermore, the slit 8 provided in the frame body portion 7 absorbs distortion occurring in the width direction of the lead frame.
これによって、パッケージの反りを防止できる。以上説
明したように、本発明によれば、レジンモールドに際し
てのパッケージの反り、歪みを少なくすることができる
ものである。This prevents the package from warping. As described above, according to the present invention, it is possible to reduce warpage and distortion of the package during resin molding.
第１図は本発明の実施例に用いるリードフレームの平面
図である。
第２図は従来例を示すリードフレームの平面図である。
１……リード、２……タブ、３……タブリード、４・・
・・・・タィバー、５・・・・・・側面部、６…・・・
スリット、７・・・・・・枠体部、８・・・・・・スリ
ット。
第１図第２図FIG. 1 is a plan view of a lead frame used in an embodiment of the present invention. FIG. 2 is a plan view of a lead frame showing a conventional example.
1...Lead, 2...Tab, 3...Tab lead, 4...
...Tie bar, 5...Side part, 6...
Slit, 7...Frame body part, 8...Slit. Figure 1 Figure 2
Claims (1)
間のほぼ中央に設けられた集積回路ペレツトを載置する
ためのタブと、前記タブを前記第１の枠体に直接又は間
接に支持するためのタブリードと、前記タブにその自由
端が近接されてなる複数のリードと、前記複数のリード
を一体的に前記第１の枠体に支持する連結片と、前記第
１の枠体の前記タブに対応する位置に長手方向に配設さ
れたスリツトよりなる単位フレームを複数個設けたリー
ドフレームを準備し、前記タブ上に集積回路ペレツトを
固着し、その後、前記各リードと集積回路ペレツトの各
端子を電気的に接続し、前記集積回路ペレツト、タブお
よび複数のリードとタブリードの１部をレジンによりモ
ールドすることを特徴とするレジン封止集積回路装置の
製造方法。1 A pair of first frames parallel to each other, a tab for placing an integrated circuit pellet provided approximately in the center between the first frames, and a tab that is placed directly on the first frame. or a tab lead for indirect support, a plurality of leads whose free ends are close to the tab, a connecting piece that integrally supports the plurality of leads on the first frame, and the first A lead frame having a plurality of unit frames made of slits arranged in the longitudinal direction at positions corresponding to the tabs of the frame body is prepared, an integrated circuit pellet is fixed on the tabs, and then each of the leads is fixed. 1. A method of manufacturing a resin-sealed integrated circuit device, which comprises electrically connecting terminals of an integrated circuit pellet and molding the integrated circuit pellet, a tab, a plurality of leads, and a portion of the tab lead with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58016068A JPS6035828B2 (en) | 1983-02-04 | 1983-02-04 | Manufacturing method for resin-encapsulated integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58016068A JPS6035828B2 (en) | 1983-02-04 | 1983-02-04 | Manufacturing method for resin-encapsulated integrated circuit device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1033476A Division JPS5294074A (en) | 1976-02-04 | 1976-02-04 | Leading-in frame |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61188411A Division JPS6249648A (en) | 1986-08-13 | 1986-08-13 | Manufacture of resin molded semiconductor device with lead frame |
| JP61188410A Division JPS6249647A (en) | 1986-08-13 | 1986-08-13 | Manufacture of resin-molded semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58151050A JPS58151050A (en) | 1983-09-08 |
| JPS6035828B2 true JPS6035828B2 (en) | 1985-08-16 |
Family
ID=11906248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58016068A Expired JPS6035828B2 (en) | 1983-02-04 | 1983-02-04 | Manufacturing method for resin-encapsulated integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6035828B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61264745A (en) * | 1985-05-20 | 1986-11-22 | Shinko Electric Ind Co Ltd | Lead frame |
| US5168337A (en) * | 1988-02-19 | 1992-12-01 | Nippondenso Co., Ltd. | Polycrystalline diode and a method for making the same |
-
1983
- 1983-02-04 JP JP58016068A patent/JPS6035828B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58151050A (en) | 1983-09-08 |
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