JPS6230496B2 - - Google Patents
Info
- Publication number
- JPS6230496B2 JPS6230496B2 JP54129190A JP12919079A JPS6230496B2 JP S6230496 B2 JPS6230496 B2 JP S6230496B2 JP 54129190 A JP54129190 A JP 54129190A JP 12919079 A JP12919079 A JP 12919079A JP S6230496 B2 JPS6230496 B2 JP S6230496B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- slit
- leads
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明はリードフレームに係り、特に半導体集
積回路（IC）装置用リードフレームに関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead frame, and particularly to a lead frame for a semiconductor integrated circuit (IC) device.
IC装置を作るには例えば第１図の様に複数の
リードを一体に形成してなるリードフレームを使
用し、このリードフレームの各半導体素子（ペレ
ツト）載置部（タブ）にペレツトを接着し、次い
で各ペレツトの電極とインナーリードとを金細線
によりボンデイングし、その後ペレツト及びワイ
ヤボンデイング部を包囲するように樹脂封止する
のである。 To make an IC device, for example, as shown in Figure 1, a lead frame made up of multiple leads formed integrally is used, and pellets are glued to the respective semiconductor element (pellet) placement parts (tabs) of this lead frame. Then, the electrodes and inner leads of each pellet are bonded with a thin gold wire, and then the pellet and the wire bonding portion are sealed with resin so as to surround them.
この樹脂封止において樹脂が凝固する際、収縮
する為リードフレーム全体が反つたり波打つよう
になつてしまう。すなわち第１図のようなリード
フレームを樹脂封止すると変形して、正規のピツ
チがくるつてしまい後工程で外部リードをフレー
ム部から切り離す際に切断金型のガイドピンに入
りにくかつたり、外部リードの長さが違つたりす
るという欠点がある。 In this resin sealing, when the resin solidifies, it contracts, causing the entire lead frame to warp or wave. In other words, when a lead frame like the one shown in Fig. 1 is sealed with resin, it deforms and the regular pitch becomes twisted, making it difficult to fit into the guide pin of the cutting mold when cutting the external lead from the frame part in a later process. There is a drawback that the length of the external lead may be different.
そこで、従来、第２図、第３図のようなリード
を一体的に支持する連結部にスリツトを有するリ
ードフレームを使用してきた。しかし、第２図の
ようなリードフレームの場合、第１図のリードフ
レームに比べ確かに反り防止効果はかなりある
が、リードフレーム全体の強度が極端に落ちる
し、スリツトが長い為他のリードフレームが入り
込んでしまうという欠点があつた。 Therefore, lead frames such as those shown in FIGS. 2 and 3 have been used that have slits in the connecting portions that integrally support the leads. However, in the case of the lead frame shown in Fig. 2, although it is certainly more effective in preventing warping than the lead frame shown in Fig. 1, the strength of the entire lead frame is extremely reduced, and the slits are long, so it is not as good as other lead frames. It had the disadvantage that it got stuck in.
また、第３図のリードフレームの場合、リード
フレーム全体の強度はさほど落ちないが、一方反
り防止効果はほとんどないという欠点があつた。 In addition, in the case of the lead frame shown in FIG. 3, although the strength of the entire lead frame did not decrease so much, it had the disadvantage that it had almost no warping prevention effect.
そこで、本発明の目的は、樹脂封止の際の収縮
による反りを防げ、かつリードフレームの強度
を、保てるリードフレームを提供することにあ
る。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a lead frame that can prevent warping due to shrinkage during resin sealing and maintain the strength of the lead frame.
本発明によるリードフレームは、例えば、複数
のリードとこれらのリードを一体的に支持する連
結部からなるリードフレームにおいて、前記連結
部にスリツトを有し、且つそのスリツトに少なく
とも１ケ所以上の伸び（縮み）可能な形状の接続
部を有することを特徴とする。 The lead frame according to the present invention is, for example, a lead frame consisting of a plurality of leads and a connecting part that integrally supports these leads, and the connecting part has a slit, and the slit has at least one extension ( It is characterized by having a connecting portion in a shape that allows contraction.
以上本発明を実施例により説明する。第４図は
本発明の一実施例を示すもので、１はリード、２
はリードを一体的に支持する連結部、３はスリツ
ト、４は伸び（縮み）可能な形状の接続部であ
る。 The present invention will be described above with reference to Examples. FIG. 4 shows an embodiment of the present invention, in which 1 is a lead, 2 is a lead, and 2 is a lead.
3 is a connecting portion that integrally supports the lead, 3 is a slit, and 4 is a connecting portion having an expandable (shrinkable) shape.
このようにリードフレームのリードを一体的に
支持する連結部のスリツトに歪吸収用接続部を設
けることにより下記に示す理由によつて樹脂封止
時のリードフレームの収縮を吸収することができ
る。すなわち、樹脂が凝固する際、収縮しようと
した場合第５図に破線で示すようにスリツトの接
続部が変形し、収縮歪が生じても接続部４の存在
によつてその歪は吸収される。したがつてフレー
ム全体が反ることはない。 By providing the strain-absorbing connecting portion in the slit of the connecting portion that integrally supports the leads of the lead frame in this manner, it is possible to absorb the shrinkage of the lead frame during resin sealing for the reasons described below. In other words, when the resin solidifies and attempts to contract, the connecting portion of the slit deforms as shown by the broken line in FIG. 5, and even if shrinkage strain occurs, the strain is absorbed by the presence of the connecting portion 4. . Therefore, the entire frame will not warp.
また、前記接続部がある為リードフレーム全体
の強度が落ちることもなく、スリツトに他のリー
ドフレームが入り込むことも少なくできる。 Furthermore, because of the connection portion, the overall strength of the lead frame does not decrease, and it is possible to reduce the possibility that other lead frames will enter the slit.
なお、スリツトの接続部の形状は、上記実施例
のような形状と同一であることを要しない。すな
わち逃げを吸収できるものであり線対称形であれ
ば形状の如何を問わない。 Note that the shape of the connecting portion of the slit does not need to be the same as the shape of the above embodiment. In other words, the shape does not matter as long as it can absorb runout and is line symmetrical.
本発明は、樹脂封止型半導体装置に使用する各
種形状のリードフレームに適用できる。 The present invention can be applied to lead frames of various shapes used in resin-sealed semiconductor devices.
第１図、第２図及び第３図はそれぞれ従来のリ
ードフレームを示す平面図であり、第４図は本発
明の一実施例を示す平面図である。第５図は本発
明の作用効果を示すために部分的に拡大した第４
図の平面図である。
尚、図において、１……リード、２……連結
部、３……スリツト、４……スリツト接続部。
1, 2, and 3 are plan views showing conventional lead frames, respectively, and FIG. 4 is a plan view showing an embodiment of the present invention. Figure 5 is a partially enlarged view of the fourth figure to show the effects of the present invention.
FIG. In the drawings, 1...Lead, 2...Connection part, 3...Slit, 4...Slit connection part.
Claims (1)
的に支持する連結部とを備えたリードフレームに
おいて、前記連結部にスリツトを有し、そのスリ
ツトの両側を連結し、かつ伸び縮みする形状を有
する部分を該スリツトに少なくとも一箇所備えた
ことを特徴とするリードフレーム。1. In a lead frame equipped with a plurality of leads and a connecting part that integrally supports these leads, the connecting part has a slit, both sides of the slit are connected, and the lead frame has a shape that expands and contracts. 1. A lead frame comprising at least one portion in the slit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12919079A JPS5651850A (en) | 1979-10-05 | 1979-10-05 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12919079A JPS5651850A (en) | 1979-10-05 | 1979-10-05 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5651850A JPS5651850A (en) | 1981-05-09 |
| JPS6230496B2 true JPS6230496B2 (en) | 1987-07-02 |
Family
ID=15003361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12919079A Granted JPS5651850A (en) | 1979-10-05 | 1979-10-05 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5651850A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58142937U (en) * | 1982-03-18 | 1983-09-27 | 三洋電機株式会社 | lead frame |
| JPS6252951A (en) * | 1985-09-02 | 1987-03-07 | Kyosei:Kk | Flexible bridge structure for eliminating pitch error |
| KR20010108539A (en) * | 2000-05-29 | 2001-12-08 | 마이클 디. 오브라이언 | A device loading a semiconductor chip |
| JP6113339B1 (en) | 2016-08-01 | 2017-04-12 | 出光ユニテック株式会社 | Tape and bag |
-
1979
- 1979-10-05 JP JP12919079A patent/JPS5651850A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5651850A (en) | 1981-05-09 |
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