JPS6040649B2 - Electrical contacts and their manufacturing method - Google Patents
Electrical contacts and their manufacturing methodInfo
- Publication number
- JPS6040649B2 JPS6040649B2 JP53085320A JP8532078A JPS6040649B2 JP S6040649 B2 JPS6040649 B2 JP S6040649B2 JP 53085320 A JP53085320 A JP 53085320A JP 8532078 A JP8532078 A JP 8532078A JP S6040649 B2 JPS6040649 B2 JP S6040649B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- layer
- particles
- contact layer
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000002245 particle Substances 0.000 claims description 24
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 12
- 230000007423 decrease Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 238000000137 annealing Methods 0.000 claims 1
- 239000010931 gold Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 10
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 241000124033 Salix Species 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
Landscapes
- Manufacture Of Switches (AREA)
- Contacts (AREA)
Description
【発明の詳細な説明】
この発明は電気接点およびその製法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrical contact and a method for manufacturing the same.
リレー用およびスイッチング用接点には、従来から金系
接点材料、銀系接点材料および白金系接点材料が用し、
らている。Conventionally, gold-based contact materials, silver-based contact materials, and platinum-based contact materials have been used for relay and switching contacts.
is being used.
金系接点材料を用いた接点は、耐食性および耐雰囲気性
が優れていて、軽負荷(例えば100のV、1肌A)の
使用では、開閉回数が増加しても接触抵抗が増加せず安
定である。しかしながら、金系接点材料の融点および硬
度が比較的低いため、重負荷(例えば30V、IA)で
の使用では、溶着、変形および粘着障害を起こしやすい
。そのため、重負荷での使用には問題があった。銀系接
点材料を用いた接点は、大気中において絶縁皮膜を生じ
やすく、かつ銀系接点材料の融点および硬度が低いため
、重負荷での使用では溶着、変形および粘着障害を起こ
しやすいという問題があった。また、白金系接点材料を
用いた接点は、白金系接点材料の融点および硬度が高い
ため、重負荷で使用しても溶着、変形および粘着障害を
起こすことはない。しかし、軽負荷での使用では、接点
面に絶縁性の有機物(ブラウンパゥダ)を生じ接触下良
を起こしやすい。そのため、軽負荷での使用には問題が
あった。このように、従来の接点は、敬負荷または重負
荷のいずれか一方でのみ正確に動作し、軽負荷でも重負
荷でも正確に動作するものはなかった。この発明者は、
軽負荷でも重負荷でも正確に動作する接点の開発につい
て一連の研究を行った結果、AuおよびAgをAu−A
g合金にすると硬度、融点等が高くなるため、それを用
いて軽負荷における使用はもちろんのこと、重負荷にお
ける使用でも溶着、変形等を起こさない接点を構成でき
ることを見し、出した。Contacts using gold-based contact materials have excellent corrosion resistance and atmospheric resistance, and when used under light loads (for example, 100 V, 1 skin A), the contact resistance does not increase and is stable even when the number of openings and closings increases. It is. However, due to the relatively low melting point and hardness of gold-based contact materials, they are susceptible to welding, deformation, and adhesion failure when used under heavy loads (eg, 30V, IA). Therefore, there was a problem in using it under heavy loads. Contacts using silver-based contact materials tend to form an insulating film in the atmosphere, and because the melting point and hardness of silver-based contact materials are low, they are prone to welding, deformation, and adhesion failure when used under heavy loads. there were. Furthermore, since the platinum-based contact material has a high melting point and hardness, contacts using platinum-based contact materials do not cause welding, deformation, or adhesion failure even when used under heavy loads. However, when used under light loads, insulating organic matter (brown powder) tends to form on the contact surface, causing poor contact. Therefore, there was a problem in using it under light loads. In this way, conventional contacts operate accurately only under either gentle loads or heavy loads, and none operate accurately under either light or heavy loads. This inventor is
As a result of a series of research on the development of contacts that operate accurately under both light and heavy loads, we found that Au-A
Since g-alloys have higher hardness, melting point, etc., they discovered that they could be used to construct contacts that would not cause welding or deformation even when used under light loads as well as heavy loads.
そして、さらに研究を重ねた結果、Au−Ag合金中に
高硬度のWC粒子を分散させると、重負荷における使用
において、一層優れた特性をもつ接点が得られることを
見し、出し、この発明を完成した。すなわち、この発明
は、Au−Ag合金中にWC粒子を分散してなる接点層
を有する電気接点を第1の要旨とし、Ag中にWC粒子
を分散してなるAg−WC層の上に、Au中にWC粒子
を分散してなるAu−WC層を重ね、その状態でAg−
WC層およびAu−WC層を拡散競鈍することによりA
u−Ag合金中にWCを分散してなる接点層を形成する
ことを特徴とする電気接点の製法を第2の要旨とするも
のである。As a result of further research, it was discovered that dispersing highly hard WC particles in an Au-Ag alloy would provide a contact with even better characteristics when used under heavy loads. completed. That is, the first gist of the present invention is an electrical contact having a contact layer formed by dispersing WC particles in an Au-Ag alloy, and on the Ag-WC layer formed by dispersing WC particles in Ag, Au-WC layers made by dispersing WC particles in Au are stacked, and in that state Ag-
By slowing down the diffusion of the WC layer and the Au-WC layer, A
The second subject matter is a method for manufacturing an electrical contact characterized by forming a contact layer made by dispersing WC in a u-Ag alloy.
つぎに、この発明を詳しく説明する。Next, this invention will be explained in detail.
この発明の電気接点は、Au、Agよりも硬度、融点の
大きいAu−Ag合金中にWC粒子を分散してなる接点
層を有するものである。The electrical contact of the present invention has a contact layer formed by dispersing WC particles in an Au-Ag alloy which has a higher hardness and melting point than Au and Ag.
すなわち、この電気接点は、硬度、融点の大きい接点層
構成用のAu−Ag合金中に、下記のような特性をもつ
WC粒子を分散したため、軽負荷でも重負荷でも正確に
動作する。That is, this electrical contact operates accurately under both light and heavy loads because WC particles having the following characteristics are dispersed in the Au-Ag alloy for the contact layer, which has high hardness and melting point.
JWC粒子の特性{1} 硬度が極め
て高い。Characteristics of JWC particles {1} Extremely high hardness.
‘2) 融点が高い。‘2) High melting point.
{3’ 大気中で種々の腐食性ガスに対し安定である。{3' Stable against various corrosive gases in the atmosphere.
【4’導電性がある。{5)耐酸化性が大である。[4' Conductive. {5) High oxidation resistance.
より詳しく述べると、この電気接点は、軽負荷による使
用では、殆んどがAu−Ag合金からなる接点層表面部
(WCは接点層の内部に分散していて表面に袷んと露呈
していない)で開閉動作をする。To be more specific, when this electrical contact is used under light loads, the surface of the contact layer made of mostly Au-Ag alloy (WC is dispersed inside the contact layer and is not exposed on the surface). Opening/closing operation is performed with (no).
そのため、従来例のようなブラウンパウダおよび絶縁皮
膜の形成も殆んどなく、正確に開閉動作をする。また、
重負荷による使用では、開閉動作によって生ずるアーク
熱により接点層が加熱されるが、接点層を構成するAu
−Ag合金は、AuまたはAg単独に比べて硬度および
融点が高いため、溶着、変形および粘着障害の発生が抑
制される。そして、重負荷による使用によって接点層の
表面部分が摩耗すると、それによって硬度おび融点が極
めて高いWC粒子が接点層の表面から突出して開閉に参
加するようになるため、重負荷における使用において接
点寿命が長くなる。この場合、WC粒子の分散量は、全
体の15〜45重量%(以下%と略す)の範囲内に設定
することが好ましい。分散量がその範囲を下まわると効
果が少なく、分散量がその範囲を上まわると接点層の加
工性の点で問題が生ずる。特に、この発明の電気接点に
おいて、Au濃度が、接点層の表面部分で大になり、接
点層の内部に向うに従って小さくなるようにAuの濃度
勾配をつけると、軽負荷における使用において接点面と
して作用する接点層の表面部分が、耐食性、耐雰囲気性
に優れていて初期抵抗の少ないAuに富むようになり、
絶縁皮膜を生じやすいAgは少なくなる。Therefore, there is almost no formation of brown powder or insulating film as in the conventional example, and the opening/closing operation is accurate. Also,
When used under heavy loads, the contact layer is heated by the arc heat generated by the opening/closing operation, but the Au constituting the contact layer
-Ag alloy has higher hardness and melting point than Au or Ag alone, so it suppresses the occurrence of welding, deformation, and adhesion failure. When the surface portion of the contact layer wears out due to use under heavy loads, WC particles with extremely high hardness and melting point protrude from the surface of the contact layer and participate in opening and closing. becomes longer. In this case, the amount of dispersed WC particles is preferably set within the range of 15 to 45% by weight (hereinafter abbreviated as %) of the total weight. If the amount of dispersion is below this range, the effect will be small, and if the amount of dispersion is above this range, problems will arise in terms of workability of the contact layer. In particular, in the electrical contact of the present invention, if the concentration gradient of Au is increased so that the Au concentration increases at the surface of the contact layer and decreases toward the inside of the contact layer, the contact surface can be used under light loads. The surface part of the contact layer that acts becomes rich in Au, which has excellent corrosion resistance and atmosphere resistance and has low initial resistance.
The amount of Ag that tends to form an insulating film is reduced.
そのため、軽負荷時の開閉において、開閉回数が進んで
も接触抵抗が一層安定になり、軽負荷における使用にお
いて接点寿命が一層長くなる。このような効果は、接点
層の表面部分がAuloo%になり、内部に向って徐々
にその濃度が小さくなるようにしたときに最も顕著に表
われる。このように接点層にAuの濃度勾配を設けた場
合、接点層の表面にAgが析出し、それによって絶縁皮
膜が形成されることが予想される。Therefore, when switching at light loads, the contact resistance becomes more stable even as the number of switches increases, and the life of the contacts becomes longer when used at light loads. Such an effect is most noticeable when the surface portion of the contact layer has a concentration of 100% and the concentration gradually decreases toward the inside. When a concentration gradient of Au is provided in the contact layer in this way, it is expected that Ag will precipitate on the surface of the contact layer, thereby forming an insulating film.
すなわち、Agは極めて浸透性に富む金属であるからで
ある。しかしながら、この発明の接点では、Agは合金
化され、Au−Ag固溶体となっているため、そのよう
なことは起らない。つぎに、Au−Ag合金中にWC粒
子を分散してなる接点層を有し、かつ接点層の表面部分
ではAu濃度が大になり、内部に向うに従ってA叫農度
が小さくなっている接点の製造方法の一例について説明
する。That is, this is because Ag is a metal with extremely high permeability. However, in the contact of the present invention, such a problem does not occur because Ag is alloyed to form an Au-Ag solid solution. Next, we will introduce a contact layer that has a contact layer formed by dispersing WC particles in an Au-Ag alloy, and in which the Au concentration increases at the surface portion of the contact layer, and the A concentration decreases toward the inside. An example of a manufacturing method will be described.
すなわち、金型に、まずAg+WC粒子を入れ、つづい
てAu十WC粒子を入れ、4ton′地の圧力で加圧成
形する。つぎに、それを水素気流中において920q○
で1時間加熱し、焼結させる。暁給を終えたのち、それ
を1仇on/地の圧力で再び加圧成形して高密度化する
。ついで、高密度化したものを冷間圧延して板厚0.5
柳とし、これを所定の寸法に打抜く。その打抜体の側断
面図を第1図に示す。図において、1はAg、2はAu
、3はWC粒子である。すなわち、この打抜体は、2層
構造となっていて、下層4がAg−WC粒子層からなり
、上層5がAu−WC粒子層からなっている。つぎに、
この打抜体に対して水素気流中において、550ご0で
4時間拡散焼錨を施こす。その結果、第2図に示すよう
な接点層6をもつ接点が得られる。この接点層6は、A
u−Ag合金7と、そのなかに分散されたWC粒子3と
から構成されていて、第3図を示すように、表面ではA
uloo%で底面に向うに従ってAu濃度が小さくなる
ような濃度勾配をもっている。このように、この製造方
法によれば、上記のようなAu濃度勾配をもつ接点層を
備えた接点を極めて簡単に製造することができる。つぎ
に、この発明の電気接点の製造例について説明する。That is, Ag+WC particles were first put into a mold, followed by Au and WC particles, and the molding was carried out under a pressure of 4 tons. Next, it was heated to 920q○ in a hydrogen stream.
Heat for 1 hour to sinter. After finishing the drying process, it is again press-molded at a pressure of 1 kg/kg to make it denser. Then, the densified material is cold rolled to a plate thickness of 0.5
Willow will be punched out to the specified dimensions. A side sectional view of the punched body is shown in FIG. In the figure, 1 is Ag, 2 is Au
, 3 are WC particles. That is, this punched body has a two-layer structure, with the lower layer 4 consisting of an Ag-WC particle layer and the upper layer 5 consisting of an Au-WC particle layer. next,
This punched body was subjected to diffusion sintering at 550° C. for 4 hours in a hydrogen stream. As a result, a contact having a contact layer 6 as shown in FIG. 2 is obtained. This contact layer 6 is A
It is composed of a u-Ag alloy 7 and WC particles 3 dispersed therein, and as shown in FIG.
It has a concentration gradient such that the Au concentration decreases toward the bottom surface at uloo%. As described above, according to this manufacturing method, a contact having a contact layer having the above-mentioned Au concentration gradient can be manufactured extremely easily. Next, an example of manufacturing the electrical contact of the present invention will be described.
製造例 1〜3
金型に、まずAg+WC粒子を入れ、ついでAu+WC
粒子を入れて4ton′係の圧力で加圧成形した。Production examples 1 to 3 First, put Ag+WC particles into a mold, then Au+WC particles.
Particles were added and pressure molded at a pressure of 4 tons.
このとき、WC粒子の使用量は後記の第1表に示すよう
に調節した。つぎに、その加圧成形体を水素気流中にお
いて92000で1時間加熱し、競結させた。この凝結
体を1肌n′地の圧力で加圧成形して高密度化したのち
、袷間圧延し所定の寸法に打抜いた。つぎに、この打抜
体を水素気流中において55000で4時間拡散焼鈍し
電気接点を得た。参考例
製造例1〜3で得られた打抜体を拡散焼鎚せずにそのま
ま電気接点とした。At this time, the amount of WC particles used was adjusted as shown in Table 1 below. Next, the press-molded body was heated at 92,000 for 1 hour in a hydrogen stream to cause competitive bonding. This aggregate was press-molded at a pressure of 1 skin n' to make it denser, then rolled between the sleeves and punched into a predetermined size. Next, this punched body was diffusion annealed in a hydrogen stream at 55,000 ℃ for 4 hours to obtain an electrical contact. Reference Example The punched bodies obtained in Production Examples 1 to 3 were used as electrical contacts without being subjected to diffusion hammering.
第1表
以上の製造例および参考例で得た電気接点の重負荷(3
0V、IA)および軽負荷(100のV、1のA)の使
用における接点寿命をそれぞれ測定した。Heavy load (3
The contact life in use at 0 V, IA) and light load (100 V, 1 A) was measured, respectively.
その結果を第2表に示す。第2表
なお、第2表において、測定はそれぞれつぎのようにし
て行った。The results are shown in Table 2. Table 2 In addition, in Table 2, the measurements were performed as follows.
く重負荷テスト>
30V、IAの負荷において、毎秒2.8回の頻度で援
点を開閉させ、接触抵抗が40以上になったときまたは
溶着を生じて開離不能になったときまでの開閉回数で接
点寿命を表わした。Heavy load test > Under a load of 30V and IA, the reinforcement point is opened and closed at a frequency of 2.8 times per second, and the opening and closing is continued until the contact resistance becomes 40 or more or welding occurs and it becomes impossible to separate. The contact life is expressed by the number of times.
<軽負荷テスト>
100mV、lmAの負荷において、毎秒100回の頻
度で接点を開閉させ、開閉動作中の接触抵抗が300以
上になったときこれを接触ミスとして検知し、この初期
接触ミスが生じたときまでの開閉回数で接点寿命を表わ
した。<Light load test> At a load of 100 mV and lmA, the contacts are opened and closed at a frequency of 100 times per second, and when the contact resistance during the opening and closing operation becomes 300 or more, this is detected as a contact error, and this initial contact error occurs. Contact life is expressed as the number of times the contact is opened and closed.
第1図はこの発明の電気接点の製造説明用の側断面図、
第2図はこの発明の電気援点の接点層の側断面図、第3
図はそのAu濃度勾配曲線図である。
3・・・・・・WC粒子、6・・・・・・接点層、7・
・・…Au−Ag合金。
第1図
第2図
第3図FIG. 1 is a side sectional view for explaining the manufacture of the electrical contact of the present invention;
Figure 2 is a side sectional view of the contact layer of the electrical support point of this invention;
The figure is the Au concentration gradient curve diagram. 3...WC particles, 6...contact layer, 7.
...Au-Ag alloy. Figure 1 Figure 2 Figure 3
Claims (1)
を有する電気接点。 2 接点層の表面部分ではAu濃度が大になり、接点層
の内部に向うに従つてAu濃度が小さくなつてAg濃度
が大になる特許請求の範囲第1項記載の電気接点。 3 Ag中にWC粒子を分散してなるAg−WC層の上
に、Au中にWC粒子を分散してなるAu−WC層を重
ね、その状態でAg−WC層およびAu−WC層を拡散
焼鈍することによりAu−Ag合金中にWCを分散して
なる接点層を形成することを特徴とする電気接点の製法
。[Scope of Claims] 1. An electrical contact having a contact layer formed by dispersing WC particles in an Au-Ag alloy. 2. The electrical contact according to claim 1, wherein the Au concentration is high in the surface portion of the contact layer, and the Au concentration decreases and the Ag concentration increases toward the inside of the contact layer. 3 Overlay the Au-WC layer made of WC particles dispersed in Au on top of the Ag-WC layer made of WC particles dispersed in Ag, and then diffuse the Ag-WC layer and Au-WC layer in this state. A method for manufacturing an electrical contact, which comprises forming a contact layer in which WC is dispersed in an Au-Ag alloy by annealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53085320A JPS6040649B2 (en) | 1978-07-12 | 1978-07-12 | Electrical contacts and their manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53085320A JPS6040649B2 (en) | 1978-07-12 | 1978-07-12 | Electrical contacts and their manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5512649A JPS5512649A (en) | 1980-01-29 |
| JPS6040649B2 true JPS6040649B2 (en) | 1985-09-12 |
Family
ID=13855315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53085320A Expired JPS6040649B2 (en) | 1978-07-12 | 1978-07-12 | Electrical contacts and their manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6040649B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101707147B (en) | 2009-12-08 | 2012-08-08 | 浙江省冶金研究院有限公司 | Cu WC/Cu composite material and preparation technology |
-
1978
- 1978-07-12 JP JP53085320A patent/JPS6040649B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5512649A (en) | 1980-01-29 |
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