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JPS6048115B2 - Method of manufacturing piezoelectric ceramic substrate - Google Patents
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JPS6048115B2 - Method of manufacturing piezoelectric ceramic substrate - Google Patents

Method of manufacturing piezoelectric ceramic substrate

Info

Publication number
JPS6048115B2
JPS6048115B2 JP55137199A JP13719980A JPS6048115B2 JP S6048115 B2 JPS6048115 B2 JP S6048115B2 JP 55137199 A JP55137199 A JP 55137199A JP 13719980 A JP13719980 A JP 13719980A JP S6048115 B2 JPS6048115 B2 JP S6048115B2
Authority
JP
Japan
Prior art keywords
ceramic substrate
powder
piezoelectric ceramic
green sheet
zro2
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55137199A
Other languages
Japanese (ja)
Other versions
JPS5760877A (en
Inventor
庸一 沖中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP55137199A priority Critical patent/JPS6048115B2/en
Publication of JPS5760877A publication Critical patent/JPS5760877A/en
Publication of JPS6048115B2 publication Critical patent/JPS6048115B2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/09Forming piezoelectric or electrostrictive materials
    • H10N30/093Forming inorganic materials
    • H10N30/097Forming inorganic materials by sintering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/853Ceramic compositions
    • H10N30/8548Lead-based oxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

PURPOSE:To stabilize the fabrication of a piezoelectric ceramic substrate by a method wherein a green sheet of piezo-electric ceramics 30mu-300mu thick is laminated and baked by using ZrO2 powders with impurity of 95% or larger and with sizing of 2mu-7mu in particle diameter. CONSTITUTION:A green sheet is produced by adding an organic binder and a plastic agent to Pb(Mg1/3Nb2/3)O3-Pb TiO3-PbZrO3 powder, and then after cutting into a fixed shape, ZrO2 powder sized for 2mu-7mu particle diameter and having the impurity of 95% or larger as an inserting powder for reactive use is superimposed, and this chip is baked as determined. Thus, a ceramic substrate with thin plate, especially 100mu or less thick, is produced with high stability.

Description

【発明の詳細な説明】 本発明は厚み30〜300μの圧電セラミックグリーン
シートを積み重ねする際、反応防止を目的としてシート
相互間に散布する敷粉に関する圧電セラミック基板の製
造方法を提供するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for manufacturing a piezoelectric ceramic substrate that involves spreading powder between sheets for the purpose of preventing reactions when stacking piezoelectric ceramic green sheets having a thickness of 30 to 300 μm. .

圧電セラミック磁器の用途としては、点火栓・超音波振
動子・セラミックフィルター・発音体等々と巾広く、中
でも発音体の用途は目覚ましいものがある。これは一般
に圧電ブザーと呼ばれているものであり、セラミック基
板の厚み分類からみて薄板類に属するものである。従来
、圧電ブザー等発温体に適用されるセラミック基板の厚
みは200〜500μが主であつたが、製品の軽量・小
型化さらには低周波用及び広帯域用等々と性能向上要求
が強くなつてきた。
Piezoelectric ceramics have a wide range of uses, including spark plugs, ultrasonic vibrators, ceramic filters, sounding bodies, etc. Among them, their use as sounding bodies is remarkable. This is generally called a piezoelectric buzzer, and it belongs to the thin plate class based on the thickness classification of ceramic substrates. Conventionally, the thickness of ceramic substrates used in heating elements such as piezoelectric buzzers has mainly been 200 to 500μ, but there has been a growing demand for improved performance, such as making products lighter and smaller, as well as for low frequency and broadband applications. Ta.

これらの要求に対してセラミック材料組成及び製品設計
では対処できなく、従つて従来のセラミック基板よりも
さらに薄い100μ以下のセラミック基板の製造が必要
となり、これらの薄板グリーンシートをいかにして焼成
するかが基板製造上の重要ポイントである。元来薄板セ
ラミック基板の製造における重要課題としてはグリーン
シートの製造もさることながら、焼結過程にて発生する
基板剥離性・基板相互のポイント附着・面附着・反応さ
らには基板表面の平滑性(表面凹凸)・反り等々が挙げ
られ、これらの問題点はグリーンシート厚みが薄くなれ
ばなる程に発覚し易すくなる内容であるといえる。
Ceramic material composition and product design cannot meet these demands, and it is therefore necessary to manufacture ceramic substrates with a thickness of 100 μm or less, which is even thinner than conventional ceramic substrates.How can these thin green sheets be fired? is an important point in board manufacturing. Originally, important issues in the production of thin ceramic substrates include the production of green sheets, as well as the peelability of the substrates that occur during the sintering process, point adhesion, surface adhesion, and reactions between the substrates, as well as the smoothness of the substrate surface ( surface irregularities), warping, etc., and it can be said that these problems are more likely to be discovered as the thickness of the green sheet becomes thinner.

本発明はこれら問題点を解決すべく、ジルコニア(Zr
00)敷粉をボールミルにて任意の粒径分布に粉砕し乾
燥後、このジルコニア(Zr00)を所定の粒径分布に
分級したものを使用することにより、常に安定した圧電
セラミック基板を製造することができるものである。以
下、本発明の製造方法を説明する。
The present invention aims to solve these problems by using zirconia (Zr).
00) To produce a constantly stable piezoelectric ceramic substrate by pulverizing bed powder into a desired particle size distribution using a ball mill, drying it, and then classifying this zirconia (Zr00) into a predetermined particle size distribution. It is something that can be done. The manufacturing method of the present invention will be explained below.

まず、セラミック粉末組成としてPb(Mg1l3Nb
213)0。−PbTiO3−PbZr03を用い、そ
れに有機バインダー、可塑剤等を加えてグリーンシート
を作成する。こうして作成されたグリーンシートを30
、Owon・φ×O、090−nrmtの形状に切断し
、それを20〜30枚サヤ内に反応用敷粉として酸化ジ
ルコニウム(ZrO2)を用いて積み重ね、焼成温度1
300℃、保持時間1Hr)昇降温度200゜ClHr
に設定した条件で焼成を行いセラミック基板を得た。こ
の時、使用iした酸化ジルコニウム(Zr00)の違い
による従来方法と本発明方法との比較結果を下記の表−
1に示す。また、下記の表−2は上記実施例のうちグリ
ーンシート形状を26.0Tmφ×0。
First, the ceramic powder composition is Pb (Mg1l3Nb
213) 0. Using -PbTiO3-PbZr03, an organic binder, a plasticizer, etc. are added thereto to create a green sheet. 30 green sheets created in this way
, Owon・φ×O, 090-nrmt, and stacked 20 to 30 sheets in a pod using zirconium oxide (ZrO2) as a reaction powder, and fired at a firing temperature of 1.
300°C, holding time 1Hr) Raising/lowering temperature 200°ClHr
The ceramic substrate was obtained by firing under the following conditions. At this time, the comparison results between the conventional method and the method of the present invention depending on the difference in the zirconium oxide (Zr00) used are shown in the table below.
Shown in 1. In addition, Table 2 below shows the green sheet shape of the above example: 26.0Tmφ×0.

07順tとし、その他*は同じ条件で作成したセラミッ
ク基板の各敷粉による測定結果を示したものである。
07 order t, and others * indicate the measurement results for each type of bedding powder on ceramic substrates prepared under the same conditions.

本発明方法によれば、純度95%以上、粒径2〜7μで
分級された酸化ジルコニウム(ZrO2)をセラミック
グリーンシートを積み重ねて焼成する際の反応防止用敷
粉として用いることにより、上記表から明らかなように
薄板セラミック基板、特に100μ以下の基板製造にお
いて安定して製造することができ、非常に効果が大きい
ものである。
According to the method of the present invention, by using zirconium oxide (ZrO2), which has a purity of 95% or more and is classified with a particle size of 2 to 7μ, as a bed powder for preventing reactions when ceramic green sheets are stacked and fired, As is clear, it is possible to stably manufacture thin ceramic substrates, especially substrates of 100 μm or less, and is extremely effective.

Claims (1)

【特許請求の範囲】[Claims] 1 厚み30〜300μの圧電セラミックグリーンシー
トを所定の形状に切断し、これらを積み重ね焼成する際
の反応防止用敷粉として、純度95%以上、粒径2〜7
μで分級された酸化ジルコニウム(ZrO_2)を用い
ることを特徴とする圧電セラミック基板の製造方法。
1 Piezoelectric ceramic green sheets with a thickness of 30 to 300 μ are cut into a predetermined shape, and used as a powder for preventing reactions when stacking and firing these sheets, with a purity of 95% or more and a particle size of 2 to 7
A method for manufacturing a piezoelectric ceramic substrate, characterized by using μ-classified zirconium oxide (ZrO_2).
JP55137199A 1980-09-30 1980-09-30 Method of manufacturing piezoelectric ceramic substrate Expired JPS6048115B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55137199A JPS6048115B2 (en) 1980-09-30 1980-09-30 Method of manufacturing piezoelectric ceramic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55137199A JPS6048115B2 (en) 1980-09-30 1980-09-30 Method of manufacturing piezoelectric ceramic substrate

Publications (2)

Publication Number Publication Date
JPS5760877A JPS5760877A (en) 1982-04-13
JPS6048115B2 true JPS6048115B2 (en) 1985-10-25

Family

ID=15193102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55137199A Expired JPS6048115B2 (en) 1980-09-30 1980-09-30 Method of manufacturing piezoelectric ceramic substrate

Country Status (1)

Country Link
JP (1) JPS6048115B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100764323B1 (en) * 1998-02-18 2007-10-05 소니 가부시끼 가이샤 Piezo actuators and their manufacturing methods and inkjet printheads

Also Published As

Publication number Publication date
JPS5760877A (en) 1982-04-13

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