JPS6051994B2 - Wire tool manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for manufacturing a wire tool such as a plated electrode wire for wire cutting.

The wire electrode used in wire-cut electric discharge machining is run under tension between guides, and the workpiece is placed opposite to it and the wire is machined by generating electric discharge between the two, so the diameter of the wire is uniform. must be finished with high precision. In order to obtain high tensile strength, it has been proposed to use a core wire made of carbon steel such as piano wire and plate the surface with a good conductor such as copper, nickel, or aluminum. The present invention aims to finish the production of such tools with high precision.The material is coated with plating by passing through a plating tank, and the surface of the material that comes out after passing through the plating tank is plated. The coating tank is detected, and depending on the inspection results, additional plating or de-plating is controlled.The product is passed through a finishing plating tank for high-precision finishing, and finally washed and dried for finishing. It is characterized by the fact that it is carried out by

The present invention will be explained below with reference to an embodiment of the drawings.

In Fig. 1, 1 is a long material such as a wire or band, which is fed out from a winding frame 2, and the plated part is transferred to another winding frame 3.
Wind it up. The wire 1 moving between the winding frames 2 and 3 is guided by a guide through a plurality of processing tanks and processes, first passing through a degreasing tank 4 and then a cleaning tank 5 as usual. Plating pretreatment is performed. 6 is a plating treatment tank;
Reference numeral 7 denotes main plating electrodes that are disposed close to each other and facing each other with the running wire 1 in between, and a plating solution is supplied in jet form from a pump 8 through a supply nozzle provided at the center of the electrode 7.

9 is a plating power source that passes an intermittent pulsed current between the electrode 7 and the wire 1, and the pulse width (Ton) and pause width (To
ff) is constructed so that the plating state can be easily controlled by controlling the number of repetitions, etc., but it is of course possible to use a steady DC power source, an alternating current power source, a pulsating current power source, or the like.

10 detects the temperature of the liquid in the liquid tank 6 and controls the power supply 9.

For example, when the liquid temperature rises, the pause width of the energization pulse (γ0f
f), the temperature is controlled so that constant plating can be performed. Reference numeral 11 denotes a storage tank that constantly controls the ion concentration of the plating solution supplied to the plating tank by the pump 8. A control circuit 12 is provided which detects current conduction resistance in the solution in the plating tank and uses this as a signal. Ion control is performed by energizing the liquid and controlling electrolysis.

FIG. 2 is an enlarged detailed view of one embodiment of the main plating electrode 7. The electrode 7 has an inlet and an outlet of a predetermined diameter at both ends, and the wire 1 is inserted into the electrode and moves through it. The plating solution supplied by the pump 8 flows out from the supply hole 7a.

The liquid is pressurized and jetted at high speed, and the liquid pressure or flow rate is controlled to be constant, and the liquid is ejected into the plating tank 6 and returned to the storage tank 11 (not shown). 13 is the main plating electrode 7
This is a plating film thickness inspection device installed at a portion where a wire portion on which a plating film has been formed moves and comes out after passing through a plating tank.

Specifically, a dogleg-shaped fixed guide 13a as shown in FIG.
It is possible to use a device in which the wire 1 is held between the wires 1 and the mover is pressed, and the displacement of the mover is detected by a detection device 13c such as a differential transformer.
As shown in the figure, a large number of wires are provided radially around the wire axis. 14
1 is a plating electrode that performs additional plating or deplating on the wire 1 that has passed through the inspection device 13, 15 is an inspection device that performs another inspection, 16 is a plating electrode, and a pump 8 is connected to both the plating electrodes 14 and 16. The plating solution is also supplied in a jet stream.

inspection. Inspection signals from the devices 13 and 15 are applied to a control device 17, which controls switching of energizing switches 18 and 19 for additional plating and deplating. The plating tank 6 was designed to be used as a single tank until the final plating process, but each plating tank was separated and independent! It may be a configuration. 2
0 is a drive motor that controls the running of wire 1, control device 1
7, the drive is controlled so that the final plating process is performed when the portion of the wire 1 that has just passed through the inspection devices 13 and 15 passes through the plating electrodes 14 and 16 portion.

The drive motor 20 can be easily controlled in position, speed, etc. by using a stepping motor such as an electric motor whose rotation angle is controlled to be constant or a stepping motor such as a hydraulic device and driven in a pulsed manner. 21 is a water washing device, 22 is a drying device, and the wire finished through the above process is wound onto the winding frame 3.

The plating process is performed after the raw wire 1 is degreased and passed through cleaning tanks 4 and 5.

The wire 1 is passed through the main plating electrode 7 to be coated with plating, and the plating liquid is controlled to have a jet pressure or a jet flow rate constant, and the plating process is performed while flowing at high speed. Further, the jet liquid is ion-controlled and the liquid temperature is controlled. When the liquid temperature (liquid temperature) rises, pulse control of the current-carrying electrode 9 is carried out so that a plating film of a constant density and a constant thickness is always formed in a constant state. Further, at this time, the traveling speed of the wire 1 is controlled by controlling the drive motor 20. A plating film is formed by moving and passing through the main plating electrode 7, and the plated portion of the wire 1 is then inspected by the inspection device 13. Mainly, the thickness of the plating coating is inspected for excess or deficiency of the plating film, and a detection signal is sent to the control device 17.
When moving through the next final plating electrodes 14 and 16, additional plating and deplating are performed based on the inspection results.
The convex portions are removed by deplating, the concave portions are additionally plated, and when the inspection portion moves and passes the final plating electrodes 14 and 16 under the travel control of the drive motor 20, the switches 18 and 19 are activated.
Appropriate high-precision finishing can be achieved by controlling the position and plating phase for switching and energizing. The finish-plated wire is washed and dried and wound around the winding frame 3, and by continuously performing this process, it is possible to easily manufacture a long wire tool.

As wire electrodes used in wire-cut electric discharge machining, high tensile strength materials such as iron and W are used as the wire material, and C is coated on the surface of the wire.
Wires plated with a good conductor such as U, Ni, Al, etc. can be easily obtained with high accuracy and have the same wire diameter. Therefore, wires can be run with high tension with little disconnection, and high-precision processing is possible. The plating process is performed by pulse plating as shown in the figure, which enables high-density plating, and it is extremely easy to control the wire diameter, such as the plating thickness, and the finish can be achieved with an accuracy of within ±1 μm.

Of course, direct current, alternating current, pulse current, etc. can also be used for plating as appropriate. As described above, according to the present invention, the plated layer formed by plating is inspected after processing, and depending on the inspection results, additional plating is performed or finish plating is performed for de-plating.

By performing this process continuously, a wire cut electrode is manufactured, so a wire tool with high precision can be easily obtained. In both rough plating and finish plating, high-quality plating films can be formed at high speed by performing plating while jetting the plating solution from the electrode jet holes as in the embodiment.

[Brief explanation of drawings]

FIG. 1 shows one embodiment of the present invention, FIG. 2 is a detailed view of the plating electrode portion, and FIGS. 3 and 4 are explanatory views of the inspection portion. 1... Long material, 4... Degreasing treatment tank,
5...Cleaning tank, 6...Plating treatment tank,
7... Main plating electrode, 13, 15...
Inspection device, 14, 16... Finish plating electrode, 1
7...Control device, 20...Traveling drive motor, 21...Water washing device, 22...Drying device.

Claims (1)

[Claims] 1. In a device that continuously finishes a long material that has been pretreated by degreasing, cleaning, etc. by moving it through a plating processing section, an electrode is attached to the long material moving along the movement path of the long material. A main plating processing section is arranged in close proximity to each other so that the plating current passes through the flowing plating solution, and electrodes are arranged opposite to each other on the elongated material that has moved and passed through the main plating processing section, with the plating solution intervening therein. a final plating processing section to which an additional plating current or deplating current is applied below; and forming plating opposite to or in contact with the elongated material that moves between the main plating processing section and the final plating processing section. A wire tool manufacturing device comprising: an inspection device for inspecting the thickness of a coating layer; and a control device for discriminating signals from the inspection device to switch and control additional plating current and deplating current in the final plating processing section.