JPS6361141B2 - - Google Patents
Info
- Publication number
- JPS6361141B2 JPS6361141B2 JP60163983A JP16398385A JPS6361141B2 JP S6361141 B2 JPS6361141 B2 JP S6361141B2 JP 60163983 A JP60163983 A JP 60163983A JP 16398385 A JP16398385 A JP 16398385A JP S6361141 B2 JPS6361141 B2 JP S6361141B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- long material
- processing section
- abrasive grains
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 99
- 239000000463 material Substances 0.000 claims description 36
- 238000007689 inspection Methods 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 19
- 239000006061 abrasive grain Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005238 degreasing Methods 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 238000004804 winding Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
【発明の詳細な説明】
本発明はワイヤ砥石、帯状砥石、その他任意形
状をした切削、研削用のワイヤ工具の製作装置に
関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a manufacturing device for wire tools for cutting and grinding, such as wire grindstones, belt-shaped grindstones, and other arbitrarily shaped wire tools.
高抗張力を有するピアノ線等の炭素鋼材を芯線
にして表面にダイヤのような炭素系のもの、若し
くは窒化硼素、窒化チタニウムのような金属窒化
物若しくは炭化硼素、炭化タングステン、炭化珪
素、酸化ジルコニウム、酸化アルミニウムのよう
な金属酸化物のような砥粒、硬質粒子をメツキ固
定せしめてワイヤ工具を製作するものを特開昭53
−52243号公報に提示した。 The core wire is made of carbon steel material such as piano wire with high tensile strength, and the surface is made of carbon-based material such as diamond, or metal nitride such as boron nitride or titanium nitride, or boron carbide, tungsten carbide, silicon carbide, zirconium oxide, Japanese Patent Laid-Open No. 53 (1973) describes a method for manufacturing wire tools by plating and fixing abrasive grains and hard particles such as metal oxides such as aluminum oxide.
- Presented in Publication No. 52243.
本発明はこのようなワイヤ工具の製作を高精度
に仕上げるもので、長尺素材に糊料、樹脂接着剤
等による接着、加圧接着、仮メツキ、その他電気
的、磁気的固定法等を利用して砥粒、硬質粒子を
仮付しておき、これにメツキ固定の処理をして研
削、切削用のワイヤ工具を作る場合、又、砥粒等
の固着を、メツキ液中に砥粒を混合分散してお
き、メツキと同時に砥粒を固定する複合メツキを
行なうことができ、このように仮付けした長尺素
材の砥粒、硬質粒子の外径をダイスを通して整え
ながら素材を、メツキするメツキ処理槽を通過さ
せることによりメツキ被覆し、該メツキ処理層を
移動通過して出て来る素材表面のメツキ被覆部の
径を検出し、該検査結果によつて追加メツキする
か脱メツキの制御が行なわれる仕上メツキ処理槽
を通過させて高精度仕上げを行ない、最終的に洗
浄、乾燥して仕上げることを連続して行なうこと
を特徴とする。 The present invention aims to finish the production of such wire tools with high precision, and uses glue, resin adhesive, etc., pressure adhesion, temporary plating, and other electrical or magnetic fixing methods on long materials. When making a wire tool for grinding or cutting by temporarily attaching abrasive grains or hard particles to this and fixing it with plating, it is also possible to prevent the adhesion of abrasive grains, etc. by adding abrasive grains in the plating liquid. Composite plating can be performed by mixing and dispersing the material and fixing the abrasive grains at the same time as plating, and plating the material while adjusting the outer diameter of the abrasive grains and hard particles of the temporarily attached long material through a die. Plating is applied by passing through a plating treatment tank, the diameter of the plating coated portion on the surface of the material that moves through the plating treatment layer and comes out is detected, and depending on the inspection result, additional plating or de-plating is controlled. It is characterized in that it passes through a finishing plating treatment tank in which it is subjected to high-precision finishing, and is finally washed and dried for finishing.
以下図面の一実施例によつて本発明を説明す
る。第1図に於て、1は線、帯等の長尺素材で巻
枠2から繰出し、メツキ処理の行なわれた部分を
他の巻枠3に巻き取る。巻枠2,3間の移動する
長尺素材1はガイドによつて複数の各処理槽、工
程を案内通過せしめられ、通常のように先ず脱脂
槽4を通過し、次に洗浄槽5を通過してメツキ前
処理が行なわれる。6はメツキ処理槽で、7は走
行する長尺素材1を挾んで近接して対向配置され
たメツキ電極で、メツキ液はポンプ8より電極7
の中心部分に設けた供給ノズルより噴流供給され
る。9は電極7と長尺素材1間に断続するパルス
電流を通電するメツキ電源で、パルスの幅
(τon)、休止幅(τoff)、繰返し数等制御すること
により、メツキ状態の制御が容易なように構成さ
れたものであるが、勿論定常直流とか、交流、脈
流電源等を用いることができる。10は液槽6内
の液温を検出して電源9を制御する。例えば液温
上昇時には前記通電パルスの休止幅(τoff)を増
大制御する如く、温度制御して一定のメツキが行
なえるよう制御する。11はポンプ8によりメツ
キ槽に供給するメツキ液のイオン濃度を一定制御
する貯蔵槽であり、メツキ槽内液中の通電抵抗を
検出し、これを信号として制御回路12を設け、
これにより貯蔵液の通電、電解制御を行なつてイ
オンコントロールをする。 The present invention will be explained below with reference to an embodiment of the drawings. In FIG. 1, a long material 1 such as a wire or a band is fed out from a winding frame 2, and the plated portion is wound onto another winding frame 3. The long material 1 moving between the winding frames 2 and 3 is guided through a plurality of processing tanks and processes by a guide, first passing through a degreasing tank 4 and then a cleaning tank 5 as usual. Then, plating pretreatment is performed. 6 is a plating treatment tank, 7 is a plating electrode that is placed close to and opposite to the running long material 1, and the plating liquid is supplied to the electrode 7 from a pump 8.
A jet stream is supplied from a supply nozzle located in the center of the . 9 is a plating power source that passes an intermittent pulsed current between the electrode 7 and the long material 1, and the plating state can be easily controlled by controlling the pulse width (τon), pause width (τoff), number of repetitions, etc. However, it is of course possible to use a steady DC power source, an AC power source, a pulsating current power source, or the like. 10 detects the temperature of the liquid in the liquid tank 6 and controls the power source 9. For example, when the liquid temperature rises, the temperature is controlled such that the pause width (τoff) of the energization pulse is increased so that constant plating can be performed. Reference numeral 11 denotes a storage tank that constantly controls the ion concentration of the plating liquid supplied to the plating tank by the pump 8, and a control circuit 12 is provided that detects the current conduction resistance in the liquid in the plating tank and uses this as a signal.
This controls ion control by controlling electricity supply and electrolysis of the stored liquid.
第2図はメツキ電極7の一実施例拡大詳細図
で、電極7は両端にダイス7bが設けられ、この
ダイスを通して長尺素材1が電極内に挿通し移動
通過するようにしており、この電極内に供給孔7
aからポンプ8によつて供給されるメツキ液が噴
流する。噴流は液体加圧して高速噴流し、液体圧
力又は流量が一定になるように制御されて電極7
及びダイス7bからメツキ処理槽6に噴出し、貯
蔵槽11に還流する(図示せず)。 FIG. 2 is an enlarged detailed view of one embodiment of the plating electrode 7. The electrode 7 is provided with dies 7b at both ends, through which the elongated material 1 is inserted into the electrode and moves through. Supply hole 7 inside
The plating liquid supplied by the pump 8 flows out from a. The jet stream is a high-speed jet stream by pressurizing the liquid, and is controlled so that the liquid pressure or flow rate is constant.
Then, it is ejected from the die 7b into the plating treatment tank 6 and flows back into the storage tank 11 (not shown).
しかして上記両ダイス7bは電極7と一体に、
又は別個に設けられ、入口側のダイス7bによつ
て仮付けされた砥粒、硬質粒子の中、余分に突出
したものを扱かれた長尺素材1をメツキすること
により一応均一に砥粒、硬質粒子を含むメツキ被
覆層の形成が行なわれ、他方出口側のダイス7b
によつて更に扱くことにより、メツキ中に浮上つ
た砥粒、硬質粒子を除いたり、押圧することによ
つて外径の均一化を計つて次段のメツキ被覆部検
査の検査精度を確保すると共に製作される工具の
精度を保つて、後段の追加又は脱メツキを仕上条
件として精度の良いワイヤ工具を得ることを可能
とする。13は、メツキ電極、即ちメツキ処理部
を通過し、且つダイス7bで扱かれ、外周に砥
粒、硬質粒子メツキ固着するメツキ被膜の形成処
理された長尺素材1部分が移動して出て来る部分
に設けられたメツキ被覆部検査装置である。具体
的には第3図のようにくの字状の固定ガイド13
aに長尺素材1を挾んで可動子を押付け、可動子
の移動変位を例えば差動変圧器等の検出装置13
cで検出するようにしたものが利用でき、これを
十字軸に設けるか、第4図のようにワイヤ軸を中
心に放射状に多数設ける。又、図示していない
が、超音波を利用した非接触の検出装置を用いる
こともできる。 Therefore, both the dice 7b are integrated with the electrode 7,
Alternatively, the abrasive grains and hard particles which are provided separately and temporarily attached by the die 7b on the inlet side and which are extra protruded from the elongated material 1 are plated, so that the abrasive grains and hard particles are uniformly formed. A plating coating layer containing hard particles is formed, and the die 7b on the other exit side
By further handling the material, the abrasive grains and hard particles that floated during plating are removed, and by pressing, the outer diameter is made uniform and the inspection accuracy of the next step of the plating coating inspection is ensured. It is possible to maintain the precision of the tool manufactured at the same time, and to obtain a wire tool with high precision by adding or removing plating at a later stage as a finishing condition. 13 passes through a plating electrode, that is, a plating processing section, is handled by a die 7b, and a portion of a long material 1 is moved and treated to form a plating film on which abrasive grains and hard particles are adhered to the outer periphery. This is a plating coating inspection device installed on a section. Specifically, as shown in Fig. 3, there is a dogleg-shaped fixed guide 13.
A, the long material 1 is held in between and the movable element is pressed, and the displacement of the movable element is detected by a detection device 13 such as a differential transformer.
It is possible to use a device that detects the wire by using a wire, which can be installed on a cross axis, or a large number of devices can be installed radially around the wire axis as shown in Fig. 4. Although not shown, a non-contact detection device using ultrasonic waves may also be used.
14は検査装置13を通過した長尺素材1に追
加メツキ又は脱メツキの仕上処理をするメツキ電
極、15は再び検査をする検査装置、16はメツ
キ電極で何れのメツキ電極14,16にもポンプ
8を兼用してメツキ液が噴流供給される。検査装
置13,15の検査信号は制御装置17に加えら
れ、これにより追加メツキ、脱メツキの通電スイ
ツチ18,19が切換制御される。尚、メツキ槽
6は仕上メツキ処理するまで1槽兼用する構成を
とつたが、各々のメツキ処理槽は分離独立した構
成であつてもよい。20は長尺素材1の走行制御
をする駆動モータ、制御装置17により制御さ
れ、丁度検査装置、13,15を通過した部分の
長尺素材1がメツキ電極14,16部分を通過す
るとき仕上メツキの処理が行なわれるよう駆動制
御する。駆動モニタ20は、例えば回転角が一定
に制御される電動機、油圧装置等のステツピング
モータを使用してパルス的駆動を行なえば位置制
御、速度制御等が容易にできる。21は水洗装
置、22は乾燥装置で、以上の工程処理により仕
上げられた長尺素材が巻枠3に巻取られる。 Reference numeral 14 denotes a plating electrode that performs additional plating or de-plating on the long material 1 that has passed through the inspection device 13, 15 an inspection device that performs the inspection again, 16 a plating electrode, and a pump for both plating electrodes 14 and 16. 8 is also used to supply plating liquid in a jet stream. Inspection signals from the inspection devices 13 and 15 are applied to the control device 17, thereby controlling the energization switches 18 and 19 for additional plating and deplating. Although the plating tank 6 is configured to be used as one tank until the final plating process is performed, each plating tank may be configured to be separate and independent. Reference numeral 20 denotes a drive motor for controlling the traveling of the long material 1, which is controlled by the control device 17, and finishes plating when the portion of the long material 1 that has just passed through the inspection device 13 and 15 passes through the plating electrodes 14 and 16. The drive is controlled so that the processing is performed. The drive monitor 20 can easily perform position control, speed control, etc. by performing pulse drive using, for example, a stepping motor such as an electric motor whose rotation angle is controlled to be constant or a stepping motor such as a hydraulic device. 21 is a water washing device, 22 is a drying device, and the long material finished through the above process is wound onto the winding frame 3.
メツキ処理は、長尺素材1が脱脂、洗浄槽4,
5を通過処理され、研削刃を形成する砥粒、硬質
粒子の接着、固着を行なつて仮付した後メツキ処
理をする。このような長尺素材1をメツキ電極7
を通過してメツキ被覆の処理をするが、メツキ液
は噴流圧力、又は噴流流量が一定に制御され、高
速流動しながらメツキ処理が行なわれる。又、噴
流液はイオンコントロールされ、液温制御が行な
われる。液温が上つたときは通電電源9のパルス
制御を行ない常に一定の状態で、一定密度の一定
膜厚のメツキ被膜が形成されるようにする。又、
このとき駆動モータ20の制御によつて長尺素材
1の走行速度が制御される。かくしてメツキ電極
7を移動通過することによつてメツキ被膜が形成
され、仮付した砥粒がメツキ固定され、メツキ処
理された長尺素材1の部分は次にダイス装置7b
によつて扱かれた後に検査装置13による検査が
行なわれる。メツキ被覆部の径の検出信号が制御
装置17に加わり、次の仕上メツキ電極14,1
6を移動通過するとき前記検査結果に基づく追加
メツキ、脱メツキが行なわれる。凸部は脱メツキ
除去され、凹部は追加メツキされ、駆動モータ2
0の走行制御によつて検査部分が仕上メツキ電極
14,16を移動し通過するときスイツチ18,
19の切換、通電を行なうよう位置とメツキの位
相制御によつて適正な高精度の仕上をすることが
できる。 In the plating process, the long material 1 is degreased, the cleaning tank 4 is
5, the abrasive grains and hard particles forming the grinding blade are adhered and fixed, and then tackified and then plated. Such a long material 1 is plated with an electrode 7.
The plating liquid is controlled to have a constant jet pressure or jet flow rate, and the plating process is performed while flowing at high speed. Further, the jet liquid is ion-controlled and the liquid temperature is controlled. When the liquid temperature rises, pulse control of the energizing power source 9 is carried out so that a plating film of a constant density and a constant thickness is always formed in a constant state. or,
At this time, the traveling speed of the long material 1 is controlled by controlling the drive motor 20. A plating film is formed by moving and passing through the plating electrode 7, and the temporarily applied abrasive grains are fixed in plating, and the plated portion of the long material 1 is then passed through the die device 7b.
After being handled by the inspection device 13, the inspection device 13 performs an inspection. A detection signal of the diameter of the plating covering part is applied to the control device 17, and the next finishing plating electrode 14,1
6, additional plating and de-plating are performed based on the inspection results. The convex portions are removed by plating, the concave portions are additionally plated, and the drive motor 2
When the inspection part moves and passes the finish plating electrodes 14 and 16 by the travel control of 0, the switch 18,
Appropriate high-precision finishing can be achieved by controlling the position and plating phase for switching and energizing 19.
仕上メツキされた長尺素材は洗浄、乾燥されな
がら巻枠3に巻取られ、これが連続して行なわれ
ることによつて容易に長尺素材のワイヤ工具の製
作ができる。長尺素材に鉄系、W系の高抗張力材
のワイヤを使用し、この表面にCu、Ni、Al等の
良導電体をメツキ被覆したワイヤ工具が容易に線
径等しく高精度に得られ、従つて断線の少ない、
高い張力で走行でき、高精度の加工を可能ならめ
る。 The finish-plated long material is washed and dried and wound onto the winding frame 3, and by continuously performing this process, it is possible to easily manufacture a wire tool of the long material. Using high tensile strength wire such as iron or tungsten as a long material, a wire tool whose surface is plated with a good conductor such as Cu, Ni, or Al can be easily obtained with high accuracy and equal wire diameter. Therefore, there are fewer disconnections,
It can run with high tension and enables high precision machining.
尚、メツキ加工は図示したようにパルスメツキ
することにより高密度のメツキができ、メツキ厚
さ等、線径のコントロールも極めて容易となり±
1μ以内の精度で仕上げられる。勿論メツキは直
流通電、交流通電、脈動通電等も適宜利用でき、
何れもメツキ加工がメツキ膜の検査と、次に追加
メツキ、脱メツキの仕上メツキの連続処理によつ
て容易に高精度な工具製作ができる。例えば直径
0.6mmφのピアノ線に、ほぼ60μφの硬質粒子を接
着したとき、メツキ層の凹凸の精度は、最大と最
小の径の差で0.68〜0.69mmであつた。 As shown in the figure, pulse plating allows for high-density plating, and it is extremely easy to control the wire diameter, including the plating thickness.
Finished with accuracy within 1μ. Of course, Metsuki can also use DC current, AC current, pulsating current, etc. as appropriate.
In either case, the plating process is a continuous process of inspecting the plating film, then additional plating, and finishing plating to remove plating, making it easy to manufacture highly accurate tools. For example the diameter
When hard particles of approximately 60μφ were adhered to a piano wire of 0.6mmφ, the accuracy of the unevenness of the plating layer was 0.68 to 0.69mm in terms of the difference between the maximum and minimum diameters.
以上のように本発明によればメツキ加工による
メツキ被覆部を加工後に検査をし、検査結果によ
つて追加メツキするか脱メツキの仕上メツキをす
る。この工程を連続して行なうことにより切削、
研削のワイヤ工具の製作を行なうものであるから
精度の良いワイヤ工具が容易に得られる。メツキ
加工は荒加工、仕上メツキ、何れも実施例のよう
にメツキ液を電極噴流孔から噴流流動させながら
メツキすることによつて高スピードで良質のメツ
キ膜形成ができる。 As described above, according to the present invention, the plating covered portion by plating is inspected after processing, and depending on the inspection results, additional plating is performed or finish plating is performed to remove the plating. By performing this process continuously, cutting,
Since wire tools for grinding are manufactured, wire tools with good precision can be easily obtained. In both rough plating and finish plating, a high-quality plating film can be formed at high speed by plating while jetting the plating liquid from the electrode jet hole as in the embodiment.
第1図は本発明の一実施例図で、第2図はその
メツキ電極部の詳細図、第3図、第4図は検査部
分の説明図である。
1……長尺素材、4……脱脂処理槽、5……洗
浄槽、6……メツキ処理槽、7……メツキ電極、
13,15……検査装置、14,16……仕上メ
ツキ電極、17……制御装置、20……走行駆動
モータ、21……水洗装置、22……乾燥装置。
FIG. 1 is a diagram showing one embodiment of the present invention, FIG. 2 is a detailed diagram of the plating electrode part, and FIGS. 3 and 4 are explanatory diagrams of the inspection part. 1... Long material, 4... Degreasing tank, 5... Cleaning tank, 6... Plating tank, 7... Plating electrode,
13, 15... Inspection device, 14, 16... Finish plating electrode, 17... Control device, 20... Travel drive motor, 21... Water washing device, 22... Drying device.
Claims (1)
ツキ処理部を移動通過させて連続して仕上げる装
置に於て、前記長尺素材の移動通路に沿つて移動
する長尺素材に砥粒、硬質粒子を仮付けし、該長
尺素材に電極を近接して対向配置し、流通メツキ
液介在の下にメツキ電流を通電するようにしたメ
ツキ処理部と、該メツキ処理部を移動通過した長
尺素材を抜くダイス装置と、該ダイス装置を移動
通過した長尺素材に電極を対向配置してメツキ液
介在の下に追加メツキ電流又は脱メツキ電流を通
電するようにした仕上メツキ処理部と、前記ダイ
ス装置と仕上メツキ処理部との間を移動する前記
長尺素材に対向して砥粒、硬質粒子を固着した形
成メツキ被覆部の径を検査する検査装置を設け、
該検査装置による信号を判別して前記仕上メツキ
処理部の追加メツキ電流と脱メツキ電流を切換制
御する制御装置を設けたワイヤ工具の製作装置。 2 砥粒、硬質粒子をメツキ液中に混合してお
き、複合メツキをすることを特徴とする特許請求
の範囲第1項に記載するワイヤ工具の製作装置。 3 メツキ加工はメツキ電極を対向した間隙にメ
ツキ液を噴流流動させながら行なうことを特徴と
する特許請求の範囲第1項に記載のワイヤ工具の
製作装置。 4 長尺素材の走行通過はパルス的にステツプ通
過させることを特徴とする特許請求の範囲第1項
に記載のワイヤ工具の製作装置。[Claims] 1. In an apparatus that continuously finishes a long material that has been pretreated such as degreasing and cleaning by moving it through a plating processing section, moving the long material along a movement path. A plating processing section in which abrasive grains and hard particles are temporarily attached to a long material, electrodes are arranged close to and facing the long material, and a plating current is applied through a circulating plating solution; A die device for removing the long material that has moved and passed through the processing section, and electrodes that are arranged opposite to the long material that has moved and passed through the die device to apply additional plating current or deplating current to the long material that has moved and passed through the processing section. and an inspection device for inspecting the diameter of the formed plating coating portion to which abrasive grains and hard particles are fixed, facing the elongated material that moves between the die device and the final plating processing portion. ,
A wire tool manufacturing device comprising a control device that discriminates a signal from the inspection device and switches and controls the additional plating current and the de-plating current of the finish plating processing section. 2. The wire tool manufacturing apparatus according to claim 1, wherein abrasive grains and hard particles are mixed in a plating liquid to perform composite plating. 3. The wire tool manufacturing apparatus according to claim 1, wherein the plating process is performed while jetting a plating liquid into the gap where the plating electrodes face each other. 4. The wire tool manufacturing apparatus according to claim 1, wherein the long material is passed in steps in a pulse manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60163983A JPS61182773A (en) | 1985-07-26 | 1985-07-26 | Manufacturing device for wire tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60163983A JPS61182773A (en) | 1985-07-26 | 1985-07-26 | Manufacturing device for wire tool |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52010530A Division JPS6051994B2 (en) | 1977-02-02 | 1977-02-02 | Wire tool manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182773A JPS61182773A (en) | 1986-08-15 |
| JPS6361141B2 true JPS6361141B2 (en) | 1988-11-28 |
Family
ID=15784523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60163983A Granted JPS61182773A (en) | 1985-07-26 | 1985-07-26 | Manufacturing device for wire tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61182773A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012124547A1 (en) * | 2011-03-15 | 2012-09-20 | 株式会社中村超硬 | Method and device for manufacturing saw wire |
| JP2012192465A (en) * | 2011-03-15 | 2012-10-11 | Nakamura Choko:Kk | Method and device for manufacturing wire saw |
| JP2012232389A (en) * | 2011-05-06 | 2012-11-29 | Nakamura Choko:Kk | Method and device for manufacturing saw wire |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6420972A (en) * | 1987-07-17 | 1989-01-24 | Japan Steel Works Ltd | Manufacture of electrodeposition type grindstone |
| JPS6420971A (en) * | 1987-07-17 | 1989-01-24 | Japan Steel Works Ltd | Manufacture of electrodeposition type grindstone and device therefor |
| JP2006055952A (en) * | 2004-08-20 | 2006-03-02 | Asahi Diamond Industrial Co Ltd | Apparatus and method for manufacturing ultra-long tool |
| JP5343723B2 (en) * | 2009-06-15 | 2013-11-13 | 株式会社Sumco | Wire saw |
| JP6130247B2 (en) * | 2013-07-01 | 2017-05-17 | ワイヤーエンジプロ合同会社 | Abrasive electrodeposition liquid, method for producing fixed abrasive saw wire, and fixed abrasive saw wire |
-
1985
- 1985-07-26 JP JP60163983A patent/JPS61182773A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012124547A1 (en) * | 2011-03-15 | 2012-09-20 | 株式会社中村超硬 | Method and device for manufacturing saw wire |
| JP2012192465A (en) * | 2011-03-15 | 2012-10-11 | Nakamura Choko:Kk | Method and device for manufacturing wire saw |
| JP2012232389A (en) * | 2011-05-06 | 2012-11-29 | Nakamura Choko:Kk | Method and device for manufacturing saw wire |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61182773A (en) | 1986-08-15 |
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