JPS6053119B2 - Partial plating mask device for contacts - Google Patents
Partial plating mask device for contactsInfo
- Publication number
- JPS6053119B2 JPS6053119B2 JP15835178A JP15835178A JPS6053119B2 JP S6053119 B2 JPS6053119 B2 JP S6053119B2 JP 15835178 A JP15835178 A JP 15835178A JP 15835178 A JP15835178 A JP 15835178A JP S6053119 B2 JPS6053119 B2 JP S6053119B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- contacts
- mask device
- belt
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明は流れ生産のため多数連結されたコネクタ等の接
触子の必要部分のみに貴金属、例えば金・銀・およびロ
ジウム等のめつきを施す接触子の部分めつきマスク装置
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a mask for partial plating of contacts in which precious metals such as gold, silver, and rhodium are plated only on the necessary parts of contacts such as connectors connected in large numbers for flow production. Regarding equipment.
コネクタ等接触子は電気的接続の安定さをうるため、そ
の表面導電性を高め、又耐候性あるいは汚染ガス等工業
環境に対する耐性を与へるため、高価な貴金属めつきが
なされる。Contacts such as connectors are plated with expensive precious metals in order to improve the surface conductivity of the contacts in order to ensure stability of the electrical connection, and to provide resistance to weather and industrial environments such as polluted gases.
本発明はかかる接触子の必要部分にのみ限定して均一な
貴金属めつき処理を行なう連続めつき装置を提示するも
のである。The present invention provides a continuous plating apparatus that performs uniform noble metal plating only on the necessary portions of such contacts.
従来、第1図々示例の如き接触子1を部分めつきするに
は、めつき処理要部2を除きその表面を絶縁性プラスチ
ックでコートした後、これをめつき液に浸漬するとか、
或は直線状電極体に被めつき体を多数吊り下げめつき要
部2のみをめつき液に浸漬する等の手段が行われていた
。Conventionally, in order to partially plate a contact 1 as shown in FIG. 1, the surface of the contact 1, except for the main plating part 2, is coated with an insulating plastic, and then it is immersed in a plating solution.
Alternatively, a method has been used in which a large number of bodies to be plated are suspended from a linear electrode body and only the main parts 2 to be plated are immersed in a plating solution.
しカル前者は繁雑な工数を要し、後者はめつき部境界の
画一的コントロールが難しく及び又目的の表面以外例え
ば裏面にも亦めつきがされる事となる。第2図は前記部
分めつき法を改善しこれを機械化する事によりめつき所
要工数を削減する為なされた本発明に係る接触子の部分
めつきにふさはしいマスク装置の断面図である。The former method requires complicated man-hours, and the latter method makes it difficult to uniformly control the boundary of the plating portion, and also causes a restriction to be applied to other than the target surface, such as the back surface. FIG. 2 is a cross-sectional view of a mask device suitable for partial plating of contacts according to the present invention, which is designed to reduce the number of man-hours required for plating by improving the partial plating method and mechanizing it.
該マスク装置の理解を容易とするため第3図にその斜視
図を掲げる。図中、1は被めつき体の接触子、3と4と
は接触子1の前面並に後面し密着し配置しためつきマス
クであり、前後面に密着配置されたマスクの3と4は共
に絶縁性高分子材料からなる。マスク3の上部は第3図
の斜視図の如き開口部8が設けてあり、ここに多数連接
された接触子1、或は一連の接触子打抜きのベルト状リ
ードフレーム5に連結する被めつき体1が通過する様に
し、かつ前方からめつき液を注入して、開口部8に面す
る接触子2のみが部分的にめつきされる。図において6
は前記めつき液注入および環流を、なさしめるスパージ
ヤ、7はめつぎ液噴射ノズルで、該ノズル7の先端はプ
ラス極を成す白金アノード9が取付けてある。In order to facilitate understanding of the mask device, a perspective view thereof is shown in FIG. In the figure, 1 is a contact of the body to be fitted, 3 and 4 are clamping masks that are placed in close contact with the front and rear sides of the contact 1, and 3 and 4 of masks that are placed in close contact with the front and rear surfaces are Both are made of insulating polymer material. The upper part of the mask 3 is provided with an opening 8 as shown in the perspective view of FIG. 3, in which a large number of connected contacts 1 or a series of contacts connected to a belt-shaped lead frame 5 formed by punching are provided. By allowing the body 1 to pass through and injecting the plating liquid from the front, only the contact 2 facing the opening 8 is partially plated. In the figure 6
7 is a spargeer for injecting and circulating the plating liquid, and 7 is a plating liquid injection nozzle. A platinum anode 9 serving as a positive electrode is attached to the tip of the nozzle 7.
他方めつき時のマイナス電極は被めつき体5のベルトに
印加される。スパージヤ6の内部でのめつき液環流は図
示矢;印の方向に流れ、出口10より回収するものであ
る。しかしながら前記構造のマスク装置では被めつき接
触子2の裏側、或はその他の部分てめつき液が回り込み
、貴金属の無駄を生じ、十分なマスク機能が達成されな
かつた。On the other hand, the negative electrode during plating is applied to the belt of the body 5 to be plated. The plating liquid circulation inside the spargeer 6 flows in the direction indicated by the arrow in the figure, and is recovered from the outlet 10. However, in the mask device having the above structure, the plating liquid flows around the back side of the plated contact 2 or other parts, resulting in waste of precious metal, and a sufficient masking function cannot be achieved.
本発明はこれらの不都合な点を除去したもので以下説明
の部分めつきマスク装置を提示するものである。The present invention eliminates these disadvantages and provides a partial plating mask device as described below.
その特徴とするところは、多数連結されたコネクタ接触
子のめつき所要部分に対応する開口部以外をマスクして
めつき液を噴射する部分めつきマスク装置において、前
記接触子に対し、絶縁材料からなる高さの異なる無端ベ
ルト並びに前記ベルトの圧着ローラにより接触子の前後
からベルトを密着させて且つ前記開口部を備えた窓部を
通過させて所要部分めつきする構成になる接触子の部分
めつきマスク装置にある。The feature is that it is a partial plating mask device that sprays plating liquid while masking the openings other than the openings corresponding to the required plating parts of a large number of connected connector contacts. An endless belt of different heights and a pressure roller of the belt are used to bring the belt into close contact with the contact from the front and back, and the part of the contact is configured to pass through a window portion having the opening to plate a required portion. It is in the plating mask device.
本発明になるマスク装置を第4図、第5図に従がい説明
する。The mask device according to the present invention will be explained with reference to FIGS. 4 and 5.
図中前図と同一構成要素には前図同様の番号を付して理
解に便ならしめる。図において11と12は多数連結さ
れた接触子1を前後から密着するそれぞれ高さのことな
る絶縁材料例えばゴム等からなる無端ベルト、13はベ
ルト送りローラで、特にマスク装置内のローラは前後の
ベルト11と12間に挿入された被めつき体の接触子1
に向けて互に強く圧接しながら矢印方向に同一速度で送
りをする構成となつてい−る。Components in the figure that are the same as those in the previous figure are numbered the same as in the previous figure to facilitate understanding. In the figure, reference numerals 11 and 12 are endless belts made of insulating materials, such as rubber, of different heights, which closely contact a large number of connected contacts 1 from the front and back, and 13 is a belt feeding roller, and in particular, the rollers in the mask device are the front and rear belts. Contactor 1 of the mating body inserted between belts 11 and 12
The structure is such that they are fed at the same speed in the direction of the arrow while being strongly pressed against each other.
ただしベルト11は図示されないが、12同様のベルト
構成とローラ13を備える。前記マスク装置に第2図図
示のめつき液噴射のスパージヤ6を結合して、接触子の
めつき処理要部しかも片側面のみに貴金属のめつきが行
われる。かくて従.来の様な裏面へのめつき液のリーク
あるいは他の部分への回込み等生じる事はない。本マス
ク装置によればめつき液噴射強度をさらに向上可能であ
り、豊かなイオン供給が約束され、均一なめつき膜を短
時間に行なう事が可能となる。Although the belt 11 is not shown, it includes a belt structure similar to that of the belt 12 and a roller 13. A spargeer 6 for spraying plating liquid shown in FIG. 2 is connected to the mask device, and precious metal plating is performed on only the main part of the contact and one side of the contact. Thus obey. There is no possibility of the plating liquid leaking to the back side or flowing into other parts as in the past. According to this mask device, it is possible to further improve the plating liquid jetting strength, a rich supply of ions is guaranteed, and a uniform plating film can be formed in a short time.
これは工程能力を著るしく改善すると共に貴金属の無用
の消耗が避けられる。This significantly improves process performance and avoids unnecessary wastage of precious metals.
これにともないめつきコストの低減化に寄与するは勿論
、めつき液・噴射量を適宜選択することにより、従来に
おける電流密度の不均一による外観、並にめつき面密着
性の不具合等生じる事もない。前記説明に用いた実施例
はコネクタ接触子を例示したが、本発明のマスク装置は
これに限らず多数連接されてなるかかる接触子等に広く
適用可能である。This not only contributes to a reduction in plating costs, but by appropriately selecting the plating liquid and spray amount, it is possible to eliminate defects in appearance and adhesion to the plating surface caused by non-uniform current density. Nor. Although the embodiments used in the above description have exemplified connector contacts, the mask device of the present invention is not limited to this, and can be widely applied to a large number of such contacts etc. that are connected together.
第1図は被めつき体の接触子形状を示し、第2図は本発
明に係る接触子の部分めつき用マスク装置の断面図、第
3図は第2図のマスク装置要部の斜視図である。
又第4図は本発明の改良された部分めつきマスク装置、
第5図は第4図マスク装置要部の斜視図である。図中、
1・・・・・・コネクタの接触子、2・・・・・・1の
部分めつきする所、3と4・・・・・・マスク、5・・
・・・・リードフレーム、6・・・・・・スパージヤ、
7・・・・・・めつき噴射口、8・・・・・・マスク開
口部、9・・・・・・白金電極、11と12・・・・・
・フープ状ゴムベルト、13・・・・・・圧着ローラ。Fig. 1 shows the shape of a contact of a body to be plated, Fig. 2 is a sectional view of a mask device for partial plating of a contact according to the present invention, and Fig. 3 is a perspective view of the main part of the mask device of Fig. 2. It is a diagram. FIG. 4 also shows the improved partial plating mask device of the present invention,
FIG. 5 is a perspective view of the main parts of the mask device shown in FIG. 4. In the figure,
1...Connector contact, 2...Part 1 is to be plated, 3 and 4...Mask, 5...
...Lead frame, 6...Spur gear,
7...Plating injection port, 8...Mask opening, 9...Platinum electrode, 11 and 12...
- Hoop-shaped rubber belt, 13... pressure roller.
Claims (1)
対応する開口部以外をマスクしてめつき液を噴射する部
分めつき装置において、前記接触子に対し、絶縁材料か
らなる高さの異なる無端ベルト並びに前記ベルトの圧着
ローラにより接触子の前後からベルトを密着させて且つ
前記開口部を備えた窓部を通過させて所要部分をめつき
することを特徴とする接触子の部分めつきマスク装置。1. In a partial plating device that sprays plating liquid while masking the openings other than the openings corresponding to the required plating parts of a large number of connected connector contacts, an endless plate of different heights made of an insulating material is attached to the contacts. A mask device for partial plating of a contact, characterized in that the belt is brought into close contact with the contact from the front and back using a belt and a pressure roller of the belt, and the desired portion is plated by passing the belt through the window having the opening. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15835178A JPS6053119B2 (en) | 1978-12-19 | 1978-12-19 | Partial plating mask device for contacts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15835178A JPS6053119B2 (en) | 1978-12-19 | 1978-12-19 | Partial plating mask device for contacts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5583180A JPS5583180A (en) | 1980-06-23 |
| JPS6053119B2 true JPS6053119B2 (en) | 1985-11-22 |
Family
ID=15669744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15835178A Expired JPS6053119B2 (en) | 1978-12-19 | 1978-12-19 | Partial plating mask device for contacts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6053119B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3108358C2 (en) * | 1981-03-05 | 1985-08-29 | Siemens AG, 1000 Berlin und 8000 München | Device for the partial electroplating of electrically conductive bands, strips or the like. Parts combined in a continuous process |
| JPS61250191A (en) * | 1985-04-26 | 1986-11-07 | Electroplating Eng Of Japan Co | Brush plating method of connector terminal |
-
1978
- 1978-12-19 JP JP15835178A patent/JPS6053119B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5583180A (en) | 1980-06-23 |
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