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JPS605395B2 - Laser processing equipment - Google Patents
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JPS605395B2 - Laser processing equipment - Google Patents

Laser processing equipment

Info

Publication number
JPS605395B2
JPS605395B2 JP52042692A JP4269277A JPS605395B2 JP S605395 B2 JPS605395 B2 JP S605395B2 JP 52042692 A JP52042692 A JP 52042692A JP 4269277 A JP4269277 A JP 4269277A JP S605395 B2 JPS605395 B2 JP S605395B2
Authority
JP
Japan
Prior art keywords
workpiece
electrode
lens
laser processing
flying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52042692A
Other languages
Japanese (ja)
Other versions
JPS53128097A (en
Inventor
修身 浅井
博司 山口
幹雄 本郷
建興 宮内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52042692A priority Critical patent/JPS605395B2/en
Publication of JPS53128097A publication Critical patent/JPS53128097A/en
Publication of JPS605395B2 publication Critical patent/JPS605395B2/en
Expired legal-status Critical Current

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  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Description

【発明の詳細な説明】 本発明はしーザ加工装置に関するものである。[Detailed description of the invention] The present invention relates to a scissor processing device.

第1図は通常のレーザ加工装置の概略を示したものであ
る。レーザ発振器1より発振されたレーザビーム2はミ
ラー3により反射され下方に向いレンズ4によって集光
され、その焦点付近に置かれた加工物5に照射され、こ
れを加工する。第2図は加工部分の詳細を示す。レンズ
4により集光されたレーザビーム2は加工物5の一部分
6を加熱、溶融、蒸発させこれを除去する。この際、除
去された物質の蒸気7および粒子状のまま噴出する飛散
物8,9,10が生じる。噴出物の一部は10のように
集光レンズ4に付着する。また噴出物の他の一部9は再
び加工物に付着する。この他にも蒸気7の一部は集光レ
ンズ4および加工物5に付着する。上託したような付着
物は以下の様な悪影響を生じる。‘1ルンズ4に付着し
た物質はしンズ4の汚れとなり集光特性を低下させレー
ザ加工時における加工能力を低下させる。‘2}ICウ
ェハ、抵抗回路等を加工物とするときは、これらについ
た付着物は短絡、絶縁特性の劣化、電極部の接合性の低
下をひき起こし素子としての特性を悪化させる恐れがあ
る。上記のようにレーザ加工法は蒸気および噴出物のレ
ンズ、加工物への付着という欠点を有しているが、これ
に対する対策として、従来は以下のような方法がとられ
て来た。即ち第3図は空気を吹きつけて飛散物の付着を
防止する方法を示す。ノズル11より吹き出した空はし
ンズ4と加工物5の間にェアカーテンを形し、噴出した
蒸気と飛散物を捕え吸込口12にし、込まれる。しかし
ながらこの方法によると空の流れに乱れが生じて完全に
蒸気または飛散物を捕えることは不可能である。更に空
気の温度、度、吹きつけ、圧力等が加工形状、加工除去
量のレーザ加工特性に悪影響を及ぼす欠点があった。ま
た第4図においては、レンズ4と被加工物5の間にレー
ザ光に対して透明な材料で出来たテープ13があり噴出
した空気飛散物はこれによりさえぎられてレンズ4には
到達しない。また、蒸気飛散物の一部はテープ13に付
着するので、被加工物5に付着することはさげられる。
さらにテープ13をローラ14により送り出し、ローラ
15により巻取ることにより付着物のついたテープの部
分はローラに巻取られるので常に清浄な部分が用いられ
ることになりテープに付着した噴出物等は次の加工の障
害とならない。しかしながら透明なテープ13を集光レ
ンズ4と被加工物5との間に挿入すると、レーザ光の集
光性が変化して能率よくしーザ加工することができない
と共に、蒸気飛散物を全てテープに付着させて被加工物
に付着するのを防止することは難しい。またテープの場
合、交換が必要で、例えばテープの巻取り、送出し機構
で順次新しい部分を供給したのでは装置が複雑となる欠
点があった。また加工物から発生する飛散物が加工物に
付着させないように除去する装置としては第5図に示す
如く、特開昭48一29096号において知られている
FIG. 1 shows an outline of a conventional laser processing device. A laser beam 2 oscillated by a laser oscillator 1 is reflected by a mirror 3, directed downward, and condensed by a lens 4, and is irradiated onto a workpiece 5 placed near its focal point to process it. Figure 2 shows the details of the processed part. The laser beam 2 focused by the lens 4 heats, melts, and vaporizes a portion 6 of the workpiece 5 to remove it. At this time, vapor 7 of the removed substance and scattered particles 8, 9, 10 are generated which are ejected in the form of particles. A part of the ejected material adheres to the condenser lens 4 as shown in 10. Further, the other part 9 of the ejected material adheres to the workpiece again. In addition, a portion of the vapor 7 adheres to the condenser lens 4 and the workpiece 5. Such deposits cause the following adverse effects. The substance adhering to the lens 4 contaminates the lens 4, lowering the light focusing property and reducing the processing ability during laser processing. '2} When processing IC wafers, resistance circuits, etc., deposits on them may cause short circuits, deterioration of insulation properties, and deterioration of bonding properties of electrode parts, resulting in deterioration of device characteristics. . As mentioned above, the laser processing method has the disadvantage that vapor and ejected matter adhere to the lens and the workpiece, but as a countermeasure to this problem, the following methods have conventionally been taken. That is, FIG. 3 shows a method for preventing the adhesion of flying objects by blowing air. The air blown out from the nozzle 11 forms an air curtain between the shines 4 and the workpiece 5, catches the blown out steam and scattered objects, and enters the suction port 12. However, according to this method, turbulence occurs in the flow of air, making it impossible to completely capture vapor or flying objects. Furthermore, there was a drawback that the temperature, temperature, blowing, pressure, etc. of the air adversely affected the laser processing characteristics such as the processed shape and the amount removed by processing. Further, in FIG. 4, there is a tape 13 made of a material transparent to the laser beam between the lens 4 and the workpiece 5, and the ejected air particles are blocked by this tape and do not reach the lens 4. Further, since some of the vapor scattering particles adhere to the tape 13, adhesion to the workpiece 5 is avoided.
Further, the tape 13 is sent out by the roller 14 and wound up by the roller 15, so that the part of the tape with the deposits is taken up by the roller, so that the clean part is always used, and the ejected matter that has adhered to the tape is removed. does not interfere with processing. However, if the transparent tape 13 is inserted between the condensing lens 4 and the workpiece 5, the convergence of the laser beam changes, making it impossible to perform laser processing efficiently. It is difficult to prevent the particles from adhering to the workpiece. Further, in the case of tape, it is necessary to replace it, and if, for example, a tape winding and delivery mechanism were used to sequentially supply new parts, the apparatus would be complicated. Further, as shown in FIG. 5, a device for removing scattered substances generated from a workpiece so that they do not adhere to the workpiece is known from Japanese Patent Application Laid-Open No. 48-29096.

即ち、レンズ4と被加工物5との中間に電極16を設け
、被加工物5と電極16との間に保護抵抗17を介して
、直流電圧源18の電圧を印加し、被加工物5と電極1
6との間に空間19に被加工物5から電極16へ向う電
界を作り、加工部6から飛出す正に帯電した飛散物20
,21,22をこの電界によりその飛散する方向を曲げ
、電極16に捕獲するものである。
That is, an electrode 16 is provided between the lens 4 and the workpiece 5, and a voltage from a DC voltage source 18 is applied between the workpiece 5 and the electrode 16 via a protective resistor 17. and electrode 1
An electric field from the workpiece 5 to the electrode 16 is created in the space 19 between the workpiece 6 and the positively charged flying object 20 flying out from the processing section 6.
, 21, 22 are bent in the scattering direction by this electric field and captured by the electrode 16.

すなわち被加工物5から発生した電気力線は電極16に
終端しているので、加工部6からしンズ4に向って飛び
出した飛散物21は、この電界に沿って、その飛散する
方向を曲げられ、電極16に達し、これに付着する。よ
ってレンズ4に付着する飛散物2川ま減少し、また飛散
物はこの電界により加速されるので加工部6付近に付着
する飛散物22も減少する。しかし、この装置ではある
飛び出しの角度と初速度を満した飛散物は加速電界に乗
ってそのままレンズ4に到達してしまうという問題点が
生じる。
In other words, since the electric lines of force generated from the workpiece 5 terminate at the electrode 16, the scattered objects 21 flying out from the processing section 6 toward the lenses 4 bend their flying direction along this electric field. and reaches the electrode 16 and adheres thereto. Therefore, the amount of flying debris adhering to the lens 4 is reduced by two rivers, and since the flying debris is accelerated by this electric field, the amount of flying debris 22 adhering to the vicinity of the processed portion 6 is also reduced. However, this device has a problem in that flying objects that meet a certain launch angle and initial velocity are carried by the accelerating electric field and reach the lens 4 as they are.

本発明の目的は、従来技術の問題点を解決して、レーザ
加工の際、加工部から発生する飛散物を除去し、レンズ
、加工物へこれら飛散物が付着することを精度良く防ぐ
ようにしたレーザ加工装置を提供することにある。
The purpose of the present invention is to solve the problems of the prior art, to remove flying debris generated from the processing area during laser processing, and to accurately prevent these flying debris from adhering to lenses and workpieces. The object of the present invention is to provide a laser processing device that achieves the following.

即ち本発明は集光レンズによって被加工物へレーザ光を
集光させてレーザ加工する装置において、被加工物から
飛び出す飛散物の帯電に対して逆極性の高電位が被加工
物との間に印加された第1の電極と、飛散物の帯電に対
して同極性の電位が被加工物との間に印加された第2の
電極と、飛散物の帯電に対して逆極性の電位が被加工物
との間に印加された第3の電極とを上記集光レンズ側か
ら順次対物集光レンズと被加工物との間に設置し、上記
第1の電極により被加工物から発生した飛散物をとらえ
、上記第2の電極により第1の電極にとらえられる飛散
物を減速させて対物集光レンズに付着されないようにし
、上記第3の電極により第2の電極で追い返される飛散
物をとらえるようにして飛散物が対物集光レンズ及び被
加工物へ付着することを防ぐようにしたことを特徴とす
るものである。
That is, the present invention is an apparatus for laser processing by focusing a laser beam onto a workpiece using a condensing lens, in which a high potential having a polarity opposite to the charge of scattered particles flying out from the workpiece is generated between the workpiece and the workpiece. A second electrode is applied between the first electrode to which a potential of the same polarity with respect to the charge of the flying object is applied to the workpiece, and a potential of the opposite polarity to the charging of the flying object is applied. A third electrode applied between the workpiece and the objective condenser lens is installed in sequence from the condenser lens side between the objective condenser lens and the workpiece, and the scattering generated from the workpiece is removed by the first electrode. The second electrode decelerates the flying object caught by the first electrode so that it does not adhere to the objective condenser lens, and the third electrode catches the flying object that is repelled by the second electrode. The present invention is characterized in that in this way, flying objects are prevented from adhering to the objective condenser lens and the workpiece.

以下本発明を図に示す実施例にもとづいて、具体的に説
明する。
The present invention will be specifically described below based on embodiments shown in the drawings.

第6図は本発明のレーザ加工装置の一実施例を示した図
である。
FIG. 6 is a diagram showing an embodiment of the laser processing apparatus of the present invention.

即ちレンズ4と被加工物5との間のレンズ側に電極16
を設け、被加工物5と電極16との間に保護抵抗17を
介して直流電圧源18の電圧を印加し、被加工物5と電
極16の間の空間19に被加工物5から電極16へ向う
電界を作り、加工部6から飛出す飛散物をこの電界によ
り電極16に捕獲しようとする。しかしある飛び出しの
角度と初速度を満した飛散物は加速電界に乗ってそのま
まレンズ4に到達してしまう。そこでレンズ4に付着す
る飛散物の軽減をねらつ、電極16の中央穴の内側もし
くはその少し前加工物側にやはり中央部にレーザ光2を
通す穴をもったドーナツ型の金属板すなわち補助電極2
3を配置し、これを保護抵抗24を介して直流電圧25
によって被加工物5に対して負電位(飛散物の帯電と同
棲性の電位)に保ったものである。これにより加工部6
の上方空間11には補助電極23により形成された補助
電極23から被加工物4へ向う逆襲界が存在し、加工部
6の斜め上方空間26には電極16により形成された被
加工物5から電極16へ向う電界が存在する。すなわち
、加工部6から飛び出した飛散物のうち、レンズ4へ向
う飛散物は逆電界の中を進むことになり、減速されレン
ズ4に到し得ない。よってレンズ4に付着する飛散物は
減少する。更にこの補助電極23の下方被加工物側に補
助電極23の中央の穴よりやや大き目の穴をもったドー
ナツ型金属板すなわち補助電極27を設け、これを保護
抵抗28を介して直流電圧29をもって被加工物5に対
して正電位(飛散物の帯電と逆極性の電位)に保ったも
のである。
That is, the electrode 16 is placed on the lens side between the lens 4 and the workpiece 5.
A voltage from a DC voltage source 18 is applied between the workpiece 5 and the electrode 16 via the protective resistor 17, and a voltage from the workpiece 5 to the electrode 16 is applied to the space 19 between the workpiece 5 and the electrode 16. An electric field is created toward the electrode 16, and the scattered objects flying out from the processing section 6 are captured by the electrode 16 by this electric field. However, the flying objects that meet a certain launch angle and initial velocity will be carried by the accelerating electric field and will reach the lens 4 as they are. Therefore, in order to reduce the scattered particles adhering to the lens 4, a donut-shaped metal plate, that is, an auxiliary electrode, has a hole on the inside of the center hole of the electrode 16, or slightly ahead of the center hole on the side of the workpiece, through which the laser beam 2 passes. 2
3 is placed and connected to a DC voltage 25 via a protective resistor 24.
The workpiece 5 is kept at a negative potential (a potential coexisting with the charge of the flying object). As a result, the processing section 6
In the upper space 11, there is a counterattack field formed by the auxiliary electrode 23 toward the workpiece 4, and in the obliquely upper space 26 of the processing section 6, there is a counterattack field formed by the electrode 16 from the workpiece 5. There is an electric field directed towards electrode 16. That is, among the scattered objects flying out from the processing section 6, those heading towards the lens 4 will travel in the reverse electric field and will be decelerated and will not reach the lens 4. Therefore, the number of flying objects adhering to the lens 4 is reduced. Further, a donut-shaped metal plate, that is, an auxiliary electrode 27 having a hole slightly larger than the center hole of the auxiliary electrode 23 is provided below the auxiliary electrode 23 on the side of the workpiece, and this is connected to a DC voltage 29 via a protective resistor 28. The workpiece 5 is kept at a positive potential (a potential of opposite polarity to the charge of the flying object).

すなわち、この補助電極27は、補助電極23によって
形成される逆電界によって押しもどされ、被加工物5に
再び付着する飛散物を軽減するために設けられたもので
ある。このように電極16の下に補助電極23及び27
を設けたことにより飛散物が加速されてレンズ4に向う
飛散物を著しく軽減できると共に逆に補助電極23で押
しもどされる飛散物を軽減させて被加工物5に付着する
のも防止することができる。
In other words, the auxiliary electrode 27 is provided to reduce the amount of scattered matter that is pushed back by the reverse electric field formed by the auxiliary electrode 23 and reattaches to the workpiece 5 . In this way, the auxiliary electrodes 23 and 27 are placed under the electrode 16.
By providing the auxiliary electrode 23, it is possible to significantly reduce the amount of scattered objects that are accelerated toward the lens 4, and conversely, it is possible to reduce the amount of scattered objects that are pushed back by the auxiliary electrode 23 and prevent them from adhering to the workpiece 5. can.

ところで、補助電極23は場合によってはドーナツ型の
メッシュのもの又は中央部に穴を有しない円板状のメッ
シュのものも可能である。
Incidentally, the auxiliary electrode 23 may be a doughnut-shaped mesh or a disc-shaped mesh without a hole in the center depending on the case.

また、第7図は本発明の他の一実施例を示した図である
Further, FIG. 7 is a diagram showing another embodiment of the present invention.

即ち、電極としてメッシュ電極I6′,23′,27′
を利用することにより、メッシュによる光散乱でレーザ
光は一部加工部に到着しないが、飛散物の捕捉性を著し
く向上させることができる。特にこのような実施例によ
れば、印加する電界強度を上げれば、飛散物の除去効率
はいくらでも大きくすることができる。
That is, mesh electrodes I6', 23', 27' are used as electrodes.
Although some of the laser light does not reach the processing area due to light scattering by the mesh, it is possible to significantly improve the ability to capture scattered objects. Particularly, according to such an embodiment, the removal efficiency of scattered objects can be increased as much as possible by increasing the applied electric field strength.

また被加工物をレンズとの間に何ら大きな影響を与える
物質を挿入する必要もなく、また空気等の乱れも存在し
ないから、レーザ光の集光性には影響を与えず、加工能
率はほとんど、またはまったく低下しない。また騒音発
生をなく、機構も簡単にすることができる。以上説明き
たように本発明によれば、被加工物から飛び出した飛散
物を確実に捕獲してレンズや被加工物に付着するのを著
しく軽減させることができる効果を奏する。図面の簡単
な説明第1図はしーザ加工装置を示す説明図、第2図は
第1図に示すレーザ加工装置において加工部周辺の飛散
物と蒸気の発生を示す説明図、第3図はエアーカーテン
により飛散物を除去する従来技術の説明図、第4図は透
明なテープを加工物としンズの間に挿入して飛散物を除
去する従釆技術の説明図、第5図はしンズと加工物との
間に電極を設けて飛散物を除去する従釆技術を示す構成
図、第6図は本発明のレーザ加工装置の一実施例を示す
構成図、第7図は本発明の他の一実施例を示した図であ
る。
In addition, there is no need to insert any substance between the workpiece and the lens that would have a significant effect, and there is no turbulence such as air, so the focusing ability of the laser beam is not affected, and the processing efficiency is almost negligible. , or not at all. Further, no noise is generated and the mechanism can be simplified. As explained above, according to the present invention, it is possible to reliably capture the scattered objects flying out from the workpiece and significantly reduce the amount of the objects sticking to the lens or the workpiece. Brief Description of the Drawings Fig. 1 is an explanatory diagram showing the laser processing device, Fig. 2 is an explanatory diagram showing the generation of scattered objects and steam around the processing section in the laser processing device shown in Fig. 1, and Fig. 3 Figure 4 is an explanatory diagram of a conventional technique in which flying debris is removed using an air curtain, Figure 4 is an explanatory diagram of a secondary technology in which a transparent tape is inserted between the workpiece and the lens to remove flying debris, and Figure 5 is an illustration of a conventional technology in which flying debris is removed by using an air curtain. FIG. 6 is a configuration diagram showing an embodiment of the laser processing apparatus of the present invention, and FIG. It is a figure showing another example.

2…・・・レーザピーム、4……レンズ、5……被加工
物、16・・・・・・電極、17,24,28・・・・
・・保護抵抗、18,25,29・・・・・・直流電圧
源、23,27・・・・・・補助電極。
2... Laser beam, 4... Lens, 5... Workpiece, 16... Electrode, 17, 24, 28...
...Protection resistor, 18,25,29...DC voltage source, 23,27...Auxiliary electrode.

オ/図 矛2図 外3函 次4図 麓5図 峯ら図 宅7図O/Figure Spear 2 3 outside boxes Next 4 figures Footprint 5 Mine et al. House 7

Claims (1)

【特許請求の範囲】 1 集光レンズによって被加工物へレーザ光を集光させ
てレーザ加工する装置において、被加工物から飛び出る
飛散物の帯電に対して逆極性の高電位が被加工物との間
に印加された第1の電極と、飛散物の帯電に対して同極
性の電位が被加工物との間に印加された第2の電極と、
飛散物の帯電に対して逆極性の電位が被加工物との間に
印加された第3の電極とを、上記集光レンズ側から順次
対物集光レンズと被加工物との間に設置したことを特徴
とするレーザ加工装置。 2 第1、2、3の電極の内、少なくとも1つの電極を
導電材料で形成された網状電極でもって構成したことを
特徴とする特許請求の範囲第1項記載のレーザ加工装置
[Claims] 1. In a device that performs laser processing by concentrating a laser beam onto a workpiece using a condenser lens, a high potential with a polarity opposite to the charging of scattered particles flying out from the workpiece is applied to the workpiece. a first electrode applied between the workpiece and the workpiece, and a second electrode to which a potential of the same polarity as the charge of the flying object is applied between the workpiece and the workpiece;
A third electrode, to which a potential of opposite polarity to the charge of the flying object was applied between the third electrode and the workpiece, was installed between the objective condenser lens and the workpiece in order from the condenser lens side. A laser processing device characterized by the following. 2. The laser processing apparatus according to claim 1, wherein at least one of the first, second, and third electrodes is a mesh electrode made of a conductive material.
JP52042692A 1977-04-15 1977-04-15 Laser processing equipment Expired JPS605395B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52042692A JPS605395B2 (en) 1977-04-15 1977-04-15 Laser processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52042692A JPS605395B2 (en) 1977-04-15 1977-04-15 Laser processing equipment

Publications (2)

Publication Number Publication Date
JPS53128097A JPS53128097A (en) 1978-11-08
JPS605395B2 true JPS605395B2 (en) 1985-02-09

Family

ID=12643086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52042692A Expired JPS605395B2 (en) 1977-04-15 1977-04-15 Laser processing equipment

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JP (1) JPS605395B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245989U (en) * 1985-09-11 1987-03-20
JPS6353282U (en) * 1986-09-26 1988-04-09

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4551690B2 (en) * 2004-04-28 2010-09-29 日立造船株式会社 Dust collector in laser processing
JP6795472B2 (en) * 2017-08-28 2020-12-02 ファナック株式会社 Machine learning device, machine learning system and machine learning method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245989U (en) * 1985-09-11 1987-03-20
JPS6353282U (en) * 1986-09-26 1988-04-09

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JPS53128097A (en) 1978-11-08

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