JPS6054787B2 - semiconductor equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improved structure of a semiconductor element sealed package to facilitate replacement of a semiconductor device mounted on a mounting board.

When a semiconductor device is mounted in a device that requires high reliability, screening is performed to eliminate initial defects such as high-temperature operation aging in the mounted state.

Until now, it has been extremely difficult to remove defective products generated during the screening process from the mounting board when the semiconductor device is fixed to the mounting board by soldering or the like.
For this reason, there was the inconvenience of mounting on a mounting printed board via a socket. When the semiconductor device 1 fixed on the mounting board 2 with solder 3 in FIG. 1 is removed from the board, the gap between the bottom of the semiconductor device and the board surface is extremely small, so the soldered portion is removed from below as shown in the figure. It is necessary to heat the side surface of the semiconductor device and hold the side surface of the semiconductor device with the jig 4 to separate it from the mounting surface.

The separation force applied by the jig is generated by the frictional force between the side surface of the semi-semiconductor device and the jig.

Therefore, when separating the semiconductor device from the mounting surface, it is necessary to apply a large amount of pressure to the side surface of the semiconductor device. Semiconductor devices are usually mounted at high density on mounting boards, so it is necessary to design a jig with small dimensions that can apply a large amount of pressure to the semiconductor device, and it is necessary to design a jig with a small size that can apply a large amount of pressure to the semiconductor device. It was difficult to design a jig for detachment. The present invention provides a novel semiconductor element encapsulation package to solve the above-mentioned drawbacks.

The present invention is characterized by a sealed package structure in which a cut or protrusion is provided on the side, top, or bottom surface of the semiconductor element sealed package to facilitate removal of the semiconductor device from the mounting surface.

FIG. 2 shows an embodiment of the present invention. A notch 5 is formed in the side surface of the semiconductor element sealed package 1, and the tip 8 of the semiconductor device separation tool 4 is formed as shown in FIG.
The structure is such that it can be easily inserted into the notch 5. In this way, the semiconductor device can be easily removed from the mounted printed board using simple jigs and tools. The jig shown in FIG. 5 is an example of a jig for removing the semiconductor device, and 9 is a spring for holding down the semiconductor device with the jig. 3 and 4 are reference examples related to the present invention, which allow the tip 8 of the jig 4 to be inserted between a semiconductor device and a mounting printed board. In FIG. 3, the lead part A of the semiconductor device
1? By designing the front and back, the tip 8 of the jig 4 can be inserted between the mounting printed board and the bottom of the semiconductor device. FIG. 4 shows a structure in which a projection is provided on a part of the bottom surface of the semiconductor device to secure a space between the mounting printed board and the bottom surface of the semiconductor device. The above-described sealed package can be easily realized by making slight changes in design dimensions during the manufacturing process of ceramic packages, resin mold packages, and the like.

As described above, according to the present invention, a semiconductor device on a mounted printed board can be easily removed from the mounted printed board using a jig.

[Brief explanation of the drawing]

FIG. 1 is a conceptual diagram for detaching a conventionally structured semiconductor device from a mounted printed board, and FIG. 2a is a front view of a sealed package structure for a semiconductor device according to an embodiment of the present invention. Figure b is a side view thereof. 3 and 4 are main part front views for explaining a package structure according to a reference example related to the present invention, and FIG. 5 shows a semiconductor device having the structure shown in FIG. 2 from a mounted printed board. It is a conceptual diagram when removing using a jig. 1...
... Semiconductor device, 2... Mounting board, 3...
... Solder, 4... Separation jig, 5.
...Notch (recess), 6...External lead-out lead, 7...Protrusion, 8...Tip of jig, 9... ···spring.

Claims (1)

[Claims] 1. A substantially box-shaped package in which a semiconductor element is sealed; a plurality of leads protruding from opposing side surfaces of the package and having at least their tip portions bent downward; and opposing end surfaces of the package; A semiconductor device comprising a notch provided at a boundary on a lower surface.