JPS6057503B2 - Molten Zn-Al-Sn alloy plating method - Google Patents
Molten Zn-Al-Sn alloy plating methodInfo
- Publication number
- JPS6057503B2 JPS6057503B2 JP56093501A JP9350181A JPS6057503B2 JP S6057503 B2 JPS6057503 B2 JP S6057503B2 JP 56093501 A JP56093501 A JP 56093501A JP 9350181 A JP9350181 A JP 9350181A JP S6057503 B2 JPS6057503 B2 JP S6057503B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- molten
- cooling
- alloy
- blast
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 title claims description 27
- 229910045601 alloy Inorganic materials 0.000 title claims description 11
- 239000000956 alloy Substances 0.000 title claims description 11
- 229910018140 Al-Sn Inorganic materials 0.000 title claims description 10
- 229910018564 Al—Sn Inorganic materials 0.000 title claims description 10
- 238000000034 method Methods 0.000 title claims description 10
- 238000001816 cooling Methods 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 5
- 239000013078 crystal Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 229910001128 Sn alloy Inorganic materials 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
Description
【発明の詳細な説明】
本発明は溶融Ｚｎ−Ａｌ−Ｓｎ系合金めつき方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for plating a molten Zn-Al-Sn alloy.
）溶融Ｚｎ−Ａｌ−Ｓｎ系合金めつきは、耐食性及び
加工性に優れためつきとして知られているが、このめつ
き法に特に鋼線材のめつきに適用する場合には、表面光
沢が悪いという問題がある。) Molten Zn-Al-Sn alloy plating is known for its excellent corrosion resistance and workability, but when applied to this plating method, especially for plating steel wire rods, the surface gloss is poor. There is a problem.
本発明は溶融Ｚｎ−Ａｌ−Ｓｎ系合金めつきにおいて表
面光沢の改善を図り、めつき層表面が極めて美麗な溶融
Ｚｎ−Ａｌ−Ｓｎ系合金めつき方法を提供することを目
的としてなされたものである。The present invention was made for the purpose of improving surface gloss in molten Zn-Al-Sn alloy plating and providing a method for molten Zn-Al-Sn alloy plating that provides an extremely beautiful surface of the plating layer. It is.
すなわち本発明は、溶融Ｚｎ−Ａｌ−Ｓｎ系合金めつき
をするに際して、めつき層の金属が凝固した直後、衝風
による急速冷却を行なうことを特徴とする溶融Ｚｎ−Ａ
ｌ−Ｓｎ系合金めつき方法である。本発明のめつき方法
に使用されるＺｎ−Ａｌ−Ｓｎ系のめつき合金は、好適
には本出願人の所有になる特許発明（特許第９６４６２
８号＝特公昭５０一４７２１４）に開示されるＡ１２〜
２０％、５ｎ０．１〜＆５％、残預７ｎからなるめつき
合金である。That is, the present invention provides a method for applying molten Zn-Al-Sn alloy plating, which is characterized in that, immediately after the metal of the plating layer solidifies, rapid cooling is performed by blast air.
This is a l-Sn alloy plating method. The Zn-Al-Sn based plating alloy used in the plating method of the present invention is preferably a patented invention owned by the present applicant (Patent No. 96462).
A12~ disclosed in No. 8 = Special Publication No. 50-147214)
It is a plating alloy consisting of 20%, 5n0.1~&5%, and a balance of 7n.
このＺｎ−Ａｌ−Ｓｎ合金溶融めつき浴に対して被めつ
ぎ金属例えば鋼線材が連続的に浸漬され、ついで引き上
げられる。A metal to be plated, such as a steel wire, is continuously dipped into this Zn--Al--Sn alloy hot-melting bath, and then pulled up.
ここにおいて、鋼線材等が引き上げられてその表面上の
めつき金属が凝固するまでは急冷を避け、凝固時に核の
発生を促がせる。一方凝固が完了した後は直ちに衝風に
よる急冷をして結晶粒の成長を抑制し、表面を平滑化し
、光沢を得るのである。なお急冷手段として水冷法を用
いることは表面酸化により光沢を失なうので望ましくな
い。次に本発明の実施例を比較例と共に説明する。Here, rapid cooling is avoided until the steel wire or the like is pulled up and the plated metal on its surface solidifies, thereby promoting the generation of nuclei during solidification. On the other hand, immediately after solidification is completed, the material is rapidly cooled by blowing air to suppress the growth of crystal grains, smooth the surface, and obtain gloss. Note that it is not desirable to use a water cooling method as a rapid cooling method because the surface oxidizes and loses gloss. Next, examples of the present invention will be described together with comparative examples.
即ち、ＳＷＲＭ６３．２φワイヤを用いて、Ｚｎ−１５
％に−１％Ｓｎ合金の溶融浴温５ル℃の温度において、
２附間浸漬し取上げ直後メッキ層が凝固したらすぐに衝
風および水により冷却した。この場合の冷却水準は、放
冷、衝風（弱）、衝風（強）、水冷の種類として、４個
のめつきワイヤを製造し”た。その結果を第１表に示す
。なお、冷却速度はめつき直後のワイヤ温度が２６℃、
１０（ｆＣになるまでの時間を測つて求めた。この第１
表に示されているように、めつき後の放冷では、めつき
層表面は凹凸があり、結晶粒度は他の冷却のものよりも
粗い。That is, using SWRM63.2φ wire, Zn-15
%-1% Sn alloy melt bath temperature at a temperature of 5 °C,
Immediately after it was immersed for 2 hours and the plated layer solidified, it was immediately cooled with blast air and water. In this case, four plated wires were manufactured with different cooling levels: air cooling, blast (weak), blast (strong), and water cooling.The results are shown in Table 1. The cooling rate is when the wire temperature immediately after plating is 26℃,
10 (obtained by measuring the time until fC is reached.This first
As shown in the table, when the plated layer is allowed to cool after plating, the surface of the plated layer is uneven, and the grain size is coarser than when cooled using other methods.
そして、衝風冷却の強、弱何れの場も、めつき層表面は
平滑で光沢があり、結晶粒度も放冷よりも細かくなつて
いる。また、水冷の場合は、結晶粒度は非常に微細では
あるが、めつき層表面は平滑であるけれども灰色をして
いる。このことからも、めつき層の凝固直後の冷却は衝
風冷却によるのが、めつき層の結晶粒度および外観は極
めて優れたものとなるものである。次に、この各種の冷
却法によるめつき層の顕微鏡写真を第１図に示す。In both cases of strong and weak blast cooling, the surface of the plated layer is smooth and shiny, and the crystal grain size is finer than when air cooling is applied. In addition, in the case of water cooling, although the crystal grain size is very fine, the surface of the plating layer is smooth but gray in color. For this reason, the crystal grain size and appearance of the plated layer are extremely excellent when the plated layer is cooled by blast cooling immediately after solidification. Next, FIG. 1 shows micrographs of plated layers obtained by these various cooling methods.
即ち、第１図ａは放冷の場合、第１図ｂは衝風（弱）の
場合、第１図ｃは衝風（強）の場合で、第１図ｄは水冷
の場合である。この顕微鏡写真よりも明瞭であるが、第
１図ａの放冷では、第１図Ｂ，第１図ｃの衝風冷却に比
．して結晶粒度が非常に粗く、かつ、めつき層表面も著
しい凹凸のあることが観察できる。That is, FIG. 1a shows the case of air cooling, FIG. 1b shows the case of wind blast (weak), FIG. 1c shows the case of wind blast (strong), and FIG. 1d shows the case of water cooling. It is clearer from this photomicrograph that the air cooling shown in Figure 1a has a higher temperature than the blast cooling shown in Figures 1B and 1c. It can be observed that the crystal grain size is very coarse, and the surface of the plating layer is also extremely uneven.
第１図ｄの水冷の場合は結晶粒度が細かく、めつき層表
面も平滑であることがわかるが、上記したようにめつき
層表面は灰色である（第１図ｄの顕微鏡写真ではよくわ
からない。）。以上説明したように、本発明に係る溶融
Ｚｎ−Ｎ−Ｓｎ系合金のめつき方法は上記の構成を有し
ているものであるから、Ｚｎ−Ｎ−Ｓｎ系合金溶融浴か
ら取出された、例えば、ワイヤのめつき層金属が凝固し
た直後に、衝風冷却することによつて、放冷や水冷に比
してめつき層の結晶粒度が小さくなり、顕微鏡写真より
も観察されるように、結晶粒度の小さい方がめつき層表
面が平滑であり、従つて、優れた光沢を有しているＺｎ
−Ａｌ−Ｓｎ合金のめつき層を得ることができるという
効果を奏するものである。In the case of water cooling in Figure 1 d, the crystal grain size is fine and the surface of the plating layer is smooth, but as mentioned above, the surface of the plating layer is gray (this is not clearly visible in the micrograph in Figure 1 d). ). As explained above, since the method for plating a molten Zn-N-Sn alloy according to the present invention has the above configuration, For example, by blast cooling immediately after the plating layer metal of a wire solidifies, the crystal grain size of the plating layer becomes smaller than when cooling by air or water, as observed in micrographs. Zn with a smaller crystal grain size has a smoother surface of the plating layer and therefore has superior gloss.
- It is possible to obtain a plated layer of Al-Sn alloy.
第１図は溶融Ｚｎ−Ａ１−Ｓｎ系合金のめつき層の異な
る冷却による顕微鏡写真である。FIG. 1 is a photomicrograph of a plated layer of a molten Zn-A1-Sn alloy at different cooling times.
Claims (1)
、めつき層の金属が凝固した直後、衝風による急速冷却
を行なうことを特徴とする溶融Ｚｎ−Ａｌ−Ｓｎ系合金
めつき方法。1. A method for plating a molten Zn-Al-Sn alloy, which is characterized in that, when plating the molten Zn-Al-Sn alloy, immediately after the metal of the plating layer solidifies, rapid cooling is performed using blast air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56093501A JPS6057503B2 (en) | 1981-06-17 | 1981-06-17 | Molten Zn-Al-Sn alloy plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56093501A JPS6057503B2 (en) | 1981-06-17 | 1981-06-17 | Molten Zn-Al-Sn alloy plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57210964A JPS57210964A (en) | 1982-12-24 |
| JPS6057503B2 true JPS6057503B2 (en) | 1985-12-16 |
Family
ID=14084090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56093501A Expired JPS6057503B2 (en) | 1981-06-17 | 1981-06-17 | Molten Zn-Al-Sn alloy plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6057503B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0660381B2 (en) * | 1985-08-30 | 1994-08-10 | 住友電気工業株式会社 | Manufacturing method of metal composite |
| JP4777158B2 (en) * | 2006-06-19 | 2011-09-21 | 新日本製鐵株式会社 | Hot-dip galvanized wire and its cooling device |
-
1981
- 1981-06-17 JP JP56093501A patent/JPS6057503B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57210964A (en) | 1982-12-24 |
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