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JPS609663B2 - Method for forming the exterior part of a light emitting diode - Google Patents
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JPS609663B2 - Method for forming the exterior part of a light emitting diode - Google Patents

Method for forming the exterior part of a light emitting diode

Info

Publication number
JPS609663B2
JPS609663B2 JP54050131A JP5013179A JPS609663B2 JP S609663 B2 JPS609663 B2 JP S609663B2 JP 54050131 A JP54050131 A JP 54050131A JP 5013179 A JP5013179 A JP 5013179A JP S609663 B2 JPS609663 B2 JP S609663B2
Authority
JP
Japan
Prior art keywords
exterior material
light emitting
container
emitting diode
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54050131A
Other languages
Japanese (ja)
Other versions
JPS55141770A (en
Inventor
順治 池田
隆三 宝珍
保 若畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP54050131A priority Critical patent/JPS609663B2/en
Publication of JPS55141770A publication Critical patent/JPS55141770A/en
Publication of JPS609663B2 publication Critical patent/JPS609663B2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Description

【発明の詳細な説明】 本発明は、発光素子を絶縁材料で外装して発光ダイオー
ドを作る際の外装部形成法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming an exterior part when manufacturing a light emitting diode by packaging a light emitting element with an insulating material.

従来、発光ダィオード‘よ、発光素子と熱硬化性ェポキ
シ系液状樹脂を容器内に収納し、同樹脂を加熱硬化させ
た後、容器から離して製品を得ていた。こうした、加熱
硬化処理を要する工程は以下の欠点を有する。【al
ェポキシ系液状樹脂の硬化は、完全硬化するまでに常温
あるいは加熱で長時間を要し生産性が低く、たとえば、
12030で1.5時間加熱した後、さらに100qC
で16時間の加熱を必要とする。
Conventionally, for light emitting diodes, a light emitting element and a thermosetting epoxy liquid resin were stored in a container, and after the resin was heated and cured, the product was removed from the container. Such a process requiring heat curing treatment has the following drawbacks. [al
Curing of epoxy-based liquid resin requires a long time at room temperature or heating until it is completely cured, resulting in low productivity.
After heating at 12030 for 1.5 hours, further heat at 100qC.
16 hours of heating is required.

{bー 加熱硬化の際の長時間加熱によって発光素子の
性能が劣化する。
{b- Long-term heating during heat curing deteriorates the performance of the light emitting element.

‘c’加熱硬化の際の長時間加熱により、樹脂容器の光
択が失われ、かつ容器寿命が短くなる。
'c' Long-term heating during heat curing causes loss of optical selectivity of the resin container and shortens the life of the container.

‘d} 加熱硬化の際の長時間加熱によって、外装材料
であるェポキシ系液状樹脂が焼け、鮮明な色彩(赤、緑
等)又は透明に仕上がりにくい。また、温度のばらつき
によって色調が一定しない。【e} 加熱硬化の際の熱
によって、樹脂材料、金属材料の線膨張係数の差が生じ
てリード線が断線し、歩蟹が悪い。
'd} Due to the long-term heating during heat curing, the epoxy liquid resin that is the exterior material is burned, making it difficult to finish in vivid colors (red, green, etc.) or transparency. Furthermore, the color tone is not constant due to variations in temperature. [e} The heat during heating and curing causes a difference in the coefficient of linear expansion between the resin material and the metal material, leading to breakage of the lead wire and poor walking performance.

‘f)ェポキシ系材料は一般に2液タイプで計量、混合
を必要とし、しかも可能時間(ポットライフ)が短かし
、。
'f) Epoxy materials are generally two-component types that require measuring and mixing, and have a short pot life.

本発明は、透明性の容器に、紫外線照射硬化系の液状の
外装材料を充填し、紫外線の単独照射あるいは紫外線照
射と短時間の加熱との併用によって前記液状の外装材料
を短時間で硬化させて発光ダイオードの外装部を形成す
ることにより、生産性がきわめて高い高品質の発光ダイ
オードを製造することを目的とするものである。
In the present invention, a transparent container is filled with a liquid exterior material that is cured by ultraviolet rays, and the liquid exterior material is cured in a short time by irradiation with UV rays alone or in combination with UV irradiation and short-term heating. The purpose of this invention is to manufacture high-quality light-emitting diodes with extremely high productivity by forming the exterior portion of the light-emitting diode using the same method.

以下、本発明の一実施例を図面に従って説明する。An embodiment of the present invention will be described below with reference to the drawings.

第1図に、コムタィプの発光ダイオードの構造を示す。
1はコム、2は発光素子、3は外装材料、4はリード線
を表わしている。
FIG. 1 shows the structure of a COM type light emitting diode.
1 represents a comb, 2 represents a light emitting element, 3 represents an exterior material, and 4 represents a lead wire.

第2図は多数個の発光素子を容器内で、樹脂硬化させた
後、容器から離した状態のダイオード群とコム群の一部
を表わしている。
FIG. 2 shows a part of the diode group and comb group separated from the container after a large number of light emitting elements have been cured with resin in the container.

第3図は、紫外線照射炉で紫外線を照射し、外装材料3
を硬化させる工程の構成を示している。
Figure 3 shows the exterior material 3 exposed to ultraviolet light in an ultraviolet irradiation furnace.
The structure of the process of curing is shown.

ここで、5は紫外線の透過性の大きい容器、6は紫外線
照射ランプ、7は容器5を固定する金属板である。本発
明の製造方法は、まず固定板7にセットされた透明な容
器5に液状の外装材料3を注入し、次に発光素子2がボ
ンディングされ、リード線が連結されたコムーを定位魔
に挿入する。
Here, 5 is a container with high ultraviolet transmittance, 6 is an ultraviolet irradiation lamp, and 7 is a metal plate for fixing the container 5. In the manufacturing method of the present invention, first, a liquid exterior material 3 is injected into a transparent container 5 set on a fixing plate 7, and then a commu with a light emitting element 2 bonded to it and a lead wire connected is inserted into a stereotaxic device. do.

その後、紫外線照射炉の中を通過させ、液状の外装材料
を硬化させる。その時、上面に閉口部を有する透明な容
器の閉口部以外から、たとえば低部から、先に紫外線を
照射する。こうした照射方法をおこなうことによって、
液状の外装材料3の硬化収縮によるひずみを、開□都側
、即ちコム1側の端面で吸収することができ、容器5の
忠実な“ひずみ”の少ない製品を作ることができる。も
し、関口部である上面から紫外線を照射して、液状の外
装材料を硬化させると急激な硬化収縮によって、外装部
の形状が“ひずむ”という問題が生じることがある。紫
外線照射して液状の外装材料を硬化後、容器から離して
製品を得る。本発明に用いる外装材料は、紫外線照射に
よって反応硬化する材料であり、アクリロィル基または
メタアクリロイル基を有する化合物である。
Thereafter, the liquid exterior material is cured by passing through an ultraviolet irradiation oven. At this time, ultraviolet rays are first irradiated from a part other than the closed part of the transparent container having the closed part on the upper surface, for example, from the lower part. By using this irradiation method,
Distortion due to curing shrinkage of the liquid exterior material 3 can be absorbed by the opening side, that is, the end face on the comb 1 side, and a faithful product of the container 5 with less "distortion" can be produced. If the liquid exterior material is cured by irradiating ultraviolet rays from the upper surface, which is the entrance part, the problem may occur that the shape of the exterior part is "distorted" due to rapid curing shrinkage. After curing the liquid exterior material by irradiating it with ultraviolet rays, it is separated from the container to obtain the product. The exterior material used in the present invention is a material that is reactively cured by ultraviolet irradiation, and is a compound having an acryloyl group or a methacryloyl group.

例えばアクリル酸またはメタアクリル酸;アルキル、シ
クロアルキル、グリシジル、テトラヒドロフルフリル、
アリル、ヒドロキシアルキル等のアクリレート;アルキ
レングリコール、ポリオキシアルキレングリコール、ト
リメチロールプロ/ゞン、ベンタェリスリトール等のモ
ノまたはポリ(メタ)アクリレ−ト等が挙げられる。ま
た、ェポキシ(メタ)アクリレート樹脂、オリゴヱステ
ル(メタ)アクリレート、ウレタン(メタ)アクリレー
ト樹脂等が挙げられる。ここで(メタ)アクリレートは
アクリレートとメタアクリレートのどちらか、あるいは
両方を表わす。次にこれらの樹脂の硬化触媒として、ベ
ンゾィン、ベンゾィンアルキルェーテル、Q−置換ペン
ゾィン、ァントラキノン、アルキル置換アントラキノン
、ベンジル、ベンゾフェノン等の光重合関。
For example, acrylic acid or methacrylic acid; alkyl, cycloalkyl, glycidyl, tetrahydrofurfuryl,
Examples include acrylates such as allyl and hydroxyalkyl; mono- or poly(meth)acrylates such as alkylene glycol, polyoxyalkylene glycol, trimethylolpropylene, bentaerythritol, and the like. Further examples include epoxy (meth)acrylate resin, oligoestel (meth)acrylate, urethane (meth)acrylate resin, and the like. Here, (meth)acrylate represents either acrylate or methacrylate, or both. Next, photopolymerization catalysts such as benzoine, benzoine alkyl ether, Q-substituted penzoin, anthraquinone, alkyl-substituted anthraquinone, benzyl, and benzophenone are used as curing catalysts for these resins.

lおよび州重合 始りとしてペンゾイルパーオキサイド
、メチルエチルケトンパーオキサイド、tーブチルハイ
ドロパーオキサイド、クメンハイドロ′ぐーオキサイド
、ジクミル/ぐーオキサイド、tーブチルパーオキシベ
ンゾェート等の有機過酸化物あるいは、アゾビスィソプ
チロニトリル等のアゾ化合物が挙げられる。これらの外
装材料、硬化触媒から発光ダイオードの各々の用途に応
じて適正な材料を選定する。
As a starting point, organic peroxides such as penzoyl peroxide, methyl ethyl ketone peroxide, t-butyl hydroperoxide, cumene hydro'g oxide, dicumyl/g oxide, t-butyl peroxybenzoate, etc. or azobis Examples include azo compounds such as isoptilonitrile. Appropriate materials are selected from these exterior materials and curing catalysts according to each use of the light emitting diode.

たとえば、透明な外装材料を作る場合には、透視性のす
ぐれた外装材料および硬化触媒を選定する。透明な外装
部を形成する場合には、紫外線のみで外装材料を硬化で
きるため硬化触媒は光重合開始剤のみを用いればよい。
着色した外装部を形成する場合には、顔料、染料、充填
剤などを、外装材料に配合する必要がある。
For example, when making a transparent exterior material, select an exterior material and a curing catalyst with excellent transparency. When forming a transparent exterior part, it is sufficient to use only a photopolymerization initiator as a curing catalyst since the exterior material can be cured only with ultraviolet rays.
When forming a colored exterior part, it is necessary to blend pigments, dyes, fillers, etc. into the exterior material.

この場合、外装材料は紫外線に対して非透過性になるこ
とが多くなるため、光重合開始剤のみでは十分な硬化を
得ることができない。そのため、光重合開始剤と熱重合
開始剤とを併用し、紫外線照射と加熱の併用で硬化させ
る。また、外装部の形状を決定する容器は、紫外線や電
子線に対して透過性の大きい材料、たとえばアクリル樹
脂、塩化ビニル樹脂、メチルベンテンポリマー(TPX
)を用いる。次に、実施例を挙げ、本発明を具体的に説
明する。
In this case, the exterior material often becomes non-transparent to ultraviolet rays, and therefore sufficient curing cannot be achieved with the photopolymerization initiator alone. Therefore, a photopolymerization initiator and a thermal polymerization initiator are used in combination, and the material is cured by a combination of ultraviolet irradiation and heating. In addition, the container that determines the shape of the exterior part is made of materials that are highly transparent to ultraviolet rays and electron beams, such as acrylic resin, vinyl chloride resin, and methylbentene polymer (TPX).
) is used. Next, the present invention will be specifically explained with reference to Examples.

実施例 1 ここでは、以下の組成の外装材料を用いた。Example 1 Here, an exterior material with the following composition was used.

ビスフェノールA型ヱポキシアクリレート6の重量% エチレングリコ一ルジメタアクリレート2の重量%メチ
ルメタアクリレート 1頚重量%光重合
開始剤 1重量%熱重合開始剤
1重量%上記の組成を有する硬
化性樹脂組成物(外装材料)をTPX材料で作った透明
な容器5の中に充填して発光素子2を外装材料3の中の
定位暦に挿入し、容器5を第3図の金属板7に取付けた
Weight% of bisphenol A type epoxy acrylate 6 Weight% of ethylene glycol dimethacrylate 2 Methyl methacrylate 1% by weight Photopolymerization initiator 1% by weight thermal polymerization initiator
A curable resin composition (exterior material) having the above composition of 1% by weight is filled into a transparent container 5 made of TPX material, and the light emitting element 2 is inserted into the orientation calendar inside the exterior material 3. 5 was attached to the metal plate 7 shown in FIG.

80W/肌の高圧水銀灯6より、容器の底面および側面
から、4の砂間紫外線を照射し、上記の液状の外装材料
を硬化させた。
A high-pressure mercury lamp 6 of 80 W/skin was used to irradiate ultraviolet rays 4 from the bottom and side surfaces of the container to harden the liquid exterior material.

この場合、光重合開始剤のみで硬化させることがあるが
、熱重合開始剤を併用することにより光重合開始剤の促
進剤として作用し、短時間に硬化反応を完了させられる
。外装材料3が透過性の場合には、紫外線照射のみで十
分硬化させることができるが、発光ダイオードの用途に
応じて着色物質として顔料、染料あるいは充填剤を配合
した外装材料を用いる場合には、紫外線と熱との併用に
よって硬化させる。なお、紫外線照射に用いる紫外線発
生源6は、通常の超高圧水銀灯、高圧水銀灯、低圧水銀
灯、メタルハラィドランプ、キセノン灯、ケミカルラン
プ等を使用する。また、加熱源としては、熱風ニクロム
ヒータ線、赤外線ランプ、遠赤外線ヒータ等を使用する
。実施例 2 ここでは、以下の組成の外装材料を用いた。
In this case, curing may be carried out using only a photopolymerization initiator, but by using a thermal polymerization initiator in combination, it acts as an accelerator for the photopolymerization initiator, and the curing reaction can be completed in a short time. If the exterior material 3 is transparent, it can be sufficiently cured by UV irradiation alone, but if the exterior material contains a pigment, dye, or filler as a coloring substance depending on the application of the light emitting diode, It is cured using a combination of ultraviolet light and heat. Note that the ultraviolet light generation source 6 used for ultraviolet irradiation is a normal ultra-high pressure mercury lamp, high pressure mercury lamp, low pressure mercury lamp, metal halide lamp, xenon lamp, chemical lamp, or the like. Further, as a heating source, a hot air nichrome heater wire, an infrared lamp, a far infrared heater, etc. are used. Example 2 Here, an exterior material having the following composition was used.

ビスフェノールA型ェポキシアクリレート6の重量% ポリエステルアクリレート 4の重量%顔料
0.5重量%これ
らの成分を均一に混合し、硬化性樹脂組成物とした。
Bisphenol A type epoxy acrylate 6% by weight Polyester acrylate 4% by weight Pigment
0.5% by weight of these components were uniformly mixed to prepare a curable resin composition.

この樹脂組成物を実施例1と同様の方法で用いた。This resin composition was used in the same manner as in Example 1.

金属板5にセット後、500KV出力の電子線加速器に
より樹脂組成物を瞬時に硬化させた。以上説明したこと
により明らかなように、本発明は以下に示す多くの効果
を有する。御 外装材料を紫外線照射、電子線照射など
によって数秒から数分の短時間で硬化できるため生産性
が高い。
After setting on the metal plate 5, the resin composition was instantly cured using an electron beam accelerator with an output of 500 KV. As is clear from the above explanation, the present invention has many effects shown below. Productivity is high because the exterior material can be cured in a short time, from several seconds to several minutes, by irradiation with ultraviolet rays or electron beams.

‘b} 短時間、低温度で外装材料を硬化させることに
より発光素子の性能劣化がなく、又樹脂型の寿命も長い
'b} By curing the exterior material at a low temperature for a short time, there is no deterioration in the performance of the light emitting element, and the life of the resin mold is also long.

【c} 短時間、低温で外装材料を硬化できるため硬化
中に変色がなく、色調の安定した製品が得られる。
[c} Because the exterior material can be cured at low temperatures in a short period of time, there is no discoloration during curing, resulting in products with stable color tone.

肌 低温で外装材料を硬化できるため、線膨張係数の差
による断線がなく歩留が良い。
Skin Since the exterior material can be cured at low temperatures, there is no disconnection due to differences in linear expansion coefficients, resulting in a high yield.

{e} 一液タイプで計量、混合の必要がなく、しかも
可使時間が長いため作業がしやすい。
{e} As it is a one-component type, there is no need for measuring or mixing, and it has a long pot life, making it easy to work with.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は発光ダイオードの断面図、第2図は多数の発光
ダイオードがコムに連結されている断面図の一部分、第
3図はこの方法発明で使用する装置の概略を示す構成図
をそれぞれ示す。 1……コム、2……発光素子、3・・…・外装材料、4
・・・・・・リード線、5・・・・・・容器、6・・・
・・・紫外線照射ランプ、7…・・・容器を固定する金
属板。 第1図第2図 第3図
Fig. 1 is a cross-sectional view of a light emitting diode, Fig. 2 is a partial cross-sectional view showing a number of light emitting diodes connected to a comb, and Fig. 3 is a block diagram schematically showing the apparatus used in this method invention. . 1... Comb, 2... Light emitting element, 3... Exterior material, 4
...Lead wire, 5...Container, 6...
...Ultraviolet irradiation lamp, 7...Metal plate for fixing the container. Figure 1 Figure 2 Figure 3

Claims (1)

【特許請求の範囲】[Claims] 1 少なくとも発光素子と、同発光素子を覆う外装材料
とを具備する発光ダイオードを製造するに当り、紫外線
あるいは電子線に対して透過性の大きい材料よりなる容
器に液状の外装材料を充填した後発光ダイオードを同外
装材料中に埋設せしめ、その後、上記液状の外装材料を
容器の開口部から最も遠い底部から先に紫外線照射ある
いは電子線照射あるいは、そのいずれかと加熱の併用に
よつて硬化させることを特徴とする発光ダイオードの外
装部形成法。
1. When manufacturing a light-emitting diode that includes at least a light-emitting element and an exterior material that covers the light-emitting element, the liquid exterior material is filled into a container made of a material that is highly transparent to ultraviolet rays or electron beams, and then the light emitting device is emitted. The diode is embedded in the exterior material, and the liquid exterior material is then cured by UV irradiation, electron beam irradiation, or a combination of both and heating, starting from the bottom farthest from the opening of the container. Characteristic method for forming the exterior part of a light emitting diode.
JP54050131A 1979-04-23 1979-04-23 Method for forming the exterior part of a light emitting diode Expired JPS609663B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54050131A JPS609663B2 (en) 1979-04-23 1979-04-23 Method for forming the exterior part of a light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54050131A JPS609663B2 (en) 1979-04-23 1979-04-23 Method for forming the exterior part of a light emitting diode

Publications (2)

Publication Number Publication Date
JPS55141770A JPS55141770A (en) 1980-11-05
JPS609663B2 true JPS609663B2 (en) 1985-03-12

Family

ID=12850576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54050131A Expired JPS609663B2 (en) 1979-04-23 1979-04-23 Method for forming the exterior part of a light emitting diode

Country Status (1)

Country Link
JP (1) JPS609663B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69428578T2 (en) * 1993-12-16 2002-06-27 Sharp K.K., Osaka Manufacturing method for semiconductor light emitting devices
JP3074112B2 (en) * 1994-06-08 2000-08-07 シャープ株式会社 Semiconductor device and manufacturing method thereof

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JPS55141770A (en) 1980-11-05

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