JPS6113370B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-shaped solid electrolytic capacitor and a method for manufacturing the same.

As electronic devices become smaller, thinner, and more resource-saving, electronic components are increasingly being made into chips, and they are already being used in VCRs, radios, audio, etc. These chip components are temporarily bonded and fixed to the circuit board before face bonding, and then reflow soldered or dip soldered, etc.
Mounting is performed by soldering the land, which is the circuit pattern on the board, to the terminals of the chip component. This chip component is exactly the same in chip-shaped tantalum solid electrolytic capacitors, and this type of solid electrolytic capacitor A has many advantages in terms of thermal shock resistance and heat resistance, as shown in Figures 1 to 3. In this case, the exterior is made of silicone resin 1, and the metal terminal plates 2 and 3 are pulled out from both sides of the exterior, and the tip portions 2a and 2a are
It is formed by bending it at approximately right angles along both side surfaces, and then bending it inward at approximately right angles along the bottom surface 1a. Then, for mounting, epoxy resin adhesive is placed on the circuit board 4 between the lands 5 and 5' using a syringe needle, etc., and the chip part A is placed on top of it, and it is cured and temporarily bonded. Next, the lands 5, 5' and the tips 2a, 3a of the terminal plates 2, 3 are connected by the soldering described above.

However, this chip-shaped solid electrolytic capacitor A
is temporarily glued with adhesive 6 in spots, so
It has the disadvantage of weak adhesive strength. Also, compared to other resistance chips and ceramic chips, they are larger in size and heavier, so even if they are fixed with adhesive 6, they may be damaged by the solder during the dip work in the soldering process due to vibrations and shocks during the subsequent transportation process. The drawback was that it could fall due to surface tension. Furthermore, when a silicone-based molding compound is used as the exterior material, there is a drawback that the adhesive force with the substrate is weak.

On the other hand, increasing the bonding area with the adhesive 6 will improve the overall strength, but if the adhesive 6 is too large, the resin will spread to the metal terminal plate and the lands 5 and 5' on the board side, making it difficult to solder. It cannot be used in large quantities because it will damage the

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a chip-shaped solid electrolytic capacitor that can ensure temporary adhesion during mounting and a method for manufacturing the same.

An embodiment of this invention is shown in FIGS. 4 and 5. That is, this chip-shaped solid electrolytic capacitor is characterized in that an epoxy resin layer 7 made of epoxy resin or epoxy modified resin is formed on the bottom surface 1a' of the main body molded with silicone exterior resin 1'. The other parts are the same as those in FIGS. 1 to 3. By providing the epoxy resin layer 7 with good adhesive properties over the entire bottom surface 1'a, this layer is of the same type as the adhesive 6, so that the adhesive 6 can be applied in spots when bonding to the substrate 4. Even if there is a problem, the area of adhesion to the main body is substantially increased by about 2 to 3 times, so it is possible to secure strength 2 to 3 times as much as in the past. Furthermore, since the epoxy resin layer 7 and the adhesive 6 have good "wettability", adhesion can be improved.

The manufacturing method of the present invention will be explained with reference to FIGS. 6 and 7. That is, after molding the capacitor element with silicone resin 10 so as to pull out the metal terminal plates 8 and 9 from both sides of the capacitor element, the bottom surface 11 or the entire surface is blasted to roughen the surface, and at the same time, the surface is released from the mold. After removing the agent, an epoxy resin layer 12 is formed on the bottom surface 11 by screen printing, spraying, coating, etc. (FIG. 6), and then both ends of the metal terminal plates 8 and 9 are cut to a predetermined length. , and the bottom surface 11 is bent at a substantially right angle along both sides.
(Figure 7).

With this configuration, this method facilitates productivity.

As described above, the chip-shaped solid electrolytic capacitor of the present invention has the effect that temporary adhesion can be ensured because the resin layer of the same type as the adhesive is formed on the bottom surface. In addition, the manufacturing method has the effect of high productivity because the surface of the exterior resin is blasted to form a resin layer on the bottom surface, and then the terminal board is bent.

[Brief explanation of the drawing]

Fig. 1 is a side view of the conventional example, Fig. 2 is a bottom view thereof, Fig. 3 is a side view of the mounted state, Fig. 4 is a side view of an embodiment of the present invention, and Fig. 5 is its mounted state. The side view, FIGS. 6 and 7 are perspective views showing the manufacturing process. 1,10...Silicone resin, 1'a...Bottom surface,
2, 3, 8, 9...metal terminal board, 4...board,
5, 5'... Land, 6... Adhesive, 7, 12...
...resin layer.

Claims (1)

[Scope of Claims] 1. A chip-shaped solid electrolytic capacitor that is molded and exteriorized with resin and has metal terminal plates pulled out from both sides bent toward the bottom side, which is the board mounting surface, and the bottom surface is coated with an adhesive for temporary bonding. A chip-shaped solid electrolytic capacitor characterized by forming a resin layer of the same type. 2. An exterior process in which the surface of the capacitor element with metal terminal plates extending outward from both sides is molded with resin, and a blasting process in which the entire surface formed by this exterior process or the bottom surface, which will be the board mounting surface, is blasted. and a layer forming step of forming and curing a resin layer of the same type as the temporary bonding adhesive on the bottom surface,
A method for manufacturing a chip-shaped solid electrolytic capacitor, including a bending step of bending the metal terminal plate onto the resin layer.