JPS6114656B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cleaning jig for semiconductor chips.

Usually, several dozen or more semiconductor elements are formed on a single wafer, and then cut into a predetermined size using a diamond jig or the like. This cut piece is called a semiconductor chip. Since the cut chips have debris such as chips attached to them, they must be thoroughly cleaned using an ultrasonic cleaner or the like. When cleaning these chips, if a cleaning jig that separates and stores the chips one by one is not used, the chips may hit each other and break the aluminum wiring formed on the chip surface.

FIG. 1 shows a cross-sectional view of a conventional cleaning jig for storing a plurality of semiconductor chips separately and cleaning them by immersing them in a cleaning solution of an ultrasonic cleaner. As shown in the figure, this cleaning jig consists of an upper lid 12 for preventing the chips 11 from jumping out into the cleaning solution during cleaning, and a lower chip accommodating body 13. A partition 14 is provided for separate storage. Further, through holes 15 are provided in the top lid 12 and the bottom 14 of the chip storage chamber of the main body 13, respectively, so that the cleaning liquid for each chip passes through these holes. The cleaning jig is placed in a container containing a cleaning liquid such as Triclean, and the cleaning liquid is vibrated ultrasonically to clean the chip. However, this conventional cleaning jig has drawbacks such as damage to aluminum wiring formed on the surface of the chip when the chip hits the jig. In particular, the aluminum used for the light shield of optical sensors has the disadvantage of leaking light even when it is thinned, so when cleaning chips, the output of the ultrasonic cleaning equipment must be lowered, and the boiling temperature of the cleaning solution must be lowered. Cleaning was carried out in such a way that the surface of the chip and the jig were not brought into sudden contact as much as possible.

However, this method has problems, such as not being able to sufficiently remove dust adhering to the chips, and requiring control of boiling temperature and ultrasonic output, which complicates process management. .

The present invention solves the above problems by forming the bottom surface of the chip storage chamber, which is composed of a jig main body and an upper lid, each having a partition wall, or the inner surface of the upper lid opposite thereto into a curved surface. An object of the present invention is to provide a novel semiconductor chip cleaning jig characterized in that the patterned surface of the chip does not come into direct contact with the jig. Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a sectional view showing one embodiment of the cleaning jig according to the present invention, and basically the upper lid 2 is similar to the conventional one.
1 and a cleaning jig main body 22, the cleaning jig main body is provided with a partition 24 that can separate and accommodate chips 23 one by one. However, the bottom surface of the chip accommodating chamber 25 formed by the partition 24 is curved unlike the conventional one. Therefore, the chips accommodated in each accommodation chamber 25 are supported by the two sides corresponding to the curved surfaces, creating a gap between the pattern surface and the bottom surface of the jig.
A through hole 26 is formed in the bottom surface and the top lid of each chip storage chamber, and cleaning liquid for the chips passes through this hole.

When cleaning a chip, the chip is placed with the patterned surface of the chip facing the curved surface of the chip storage chamber described above. In this way, the pattern-forming surface of the chip will be supported by the curved surface of the bottom of the cleaning jig at its edges, and the pattern-forming surface will not come into direct contact with the cleaning jig, preventing scratches on the pattern-forming surface. This can be prevented from occurring. Therefore, the temperature of the cleaning liquid can be sufficiently raised to boil it for cleaning, and the output of the ultrasonic generator can be increased sufficiently to perform ultrasonic cleaning, making it possible to completely remove dust etc. attached to the chips. . At the same time, it becomes easier to manage processes such as controlling the output of the ultrasonic generator and controlling the boiling temperature of the cleaning liquid during cleaning. Although the curvature of the curved surface formed at the bottom of the main body of the chip accommodating part of the jig differs depending on the size of the chip, it is not necessary to strictly control the dimensions during processing. Of course, the same effect can also be obtained by forming a curved recess on the upper lid side of each chip storage chamber and storing the chips with the pattern surface facing upward.

As described above, according to the present invention, in the process of cleaning semiconductor chips cut out from a semiconductor wafer, the bottom surface of the chip storage chamber of the cleaning jig is made into a curved surface, so that the pattern surface formed on the surface of the chip is Since there is no contact with other people, there is no risk of scratches during cleaning. Therefore, by cleaning using such a jig, the reliability of the completed semiconductor device is greatly improved.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a conventional semiconductor chip cleaning jig, and FIG. 2 is a sectional view showing a semiconductor chip cleaning jig according to the present invention. 11...Semiconductor chip, 12...Upper lid, 13
... Cleaning jig main body, 14 ... Partition, 15 ... Through hole, 21 ... Cleaning jig main body, 23 ... Semiconductor chip, 24 ... Partition, 25 ... Chip storage chamber,
26...Through hole.

Claims (1)

[Claims] 1 Consists of a main body having a chip storage chamber partitioned to individually accommodate a plurality of semiconductor chips to be cleaned, and an upper lid that covers the top surface of the chip storage chamber. In a cleaning jig with a through hole through which cleaning liquid passes,
A cleaning jig for semiconductor chips, characterized in that either the bottom surface of the chip storage chamber or the inner surface of the upper lid facing thereto is curved.