JPS6115157B2 - - Google Patents
Info
- Publication number
- JPS6115157B2 JPS6115157B2 JP5091778A JP5091778A JPS6115157B2 JP S6115157 B2 JPS6115157 B2 JP S6115157B2 JP 5091778 A JP5091778 A JP 5091778A JP 5091778 A JP5091778 A JP 5091778A JP S6115157 B2 JPS6115157 B2 JP S6115157B2
- Authority
- JP
- Japan
- Prior art keywords
- photoresist
- circuit board
- electric circuit
- alloy foil
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Description
【発明の詳細な説明】
本発明は電気回路板の製造方法の改良に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method of manufacturing an electrical circuit board.
従来、Au合金箔を張つた絶縁板から電気回路
板を作るには、絶縁板にフオトレジストにてパタ
ーンを形成した後、塩酸（HCl）：硝酸
（HNO3）＝３：１の王水液でエツチングしていた
が、エツチングが完全に行われる前にフオトレジ
ストが剥れるという欠点があつた。また前記絶縁
板に張つたAu合金箔にAgを含んでいる場合には
エツチングの際表面にAgClが生成し、反応が進
展しなくなるという欠点があつた。 Conventionally, in order to make an electric circuit board from an insulating board covered with Au alloy foil, a pattern is formed on the insulating board using photoresist, and then aqua regia solution of hydrochloric acid (HCl):nitric acid (HNO 3 )=3:1 is applied. However, the drawback was that the photoresist peeled off before the etching was completed. Furthermore, when the Au alloy foil stretched over the insulating plate contains Ag, AgCl is generated on the surface during etching, resulting in a drawback that the reaction does not proceed.
本発明は、かかる欠点を解消すべくなされたも
のであり、エツチングの際フオトレジストが剥れ
ることがなく、また絶縁板に張つたAu合金箔に
Agを含んでいても表面にAgClが生成せず、反応
が進展して良好な電気回路板を得ることのできる
電気回路板の製造方法を提供せんとするものであ
る。 The present invention has been made to eliminate these drawbacks, and the photoresist does not peel off during etching, and the Au alloy foil attached to the insulating plate does not peel off during etching.
The object of the present invention is to provide a method for manufacturing an electric circuit board in which AgCl is not generated on the surface even if Ag is contained, and the reaction progresses to produce a good electric circuit board.
本発明による電気回路板の製造方法は、Au合
金箔を張つた絶縁板から電気回路を製造する方法
において、フオトレジストによりパターンを形成
した後に、塩酸：硝酸＝７〜15：１の比率の溶液
により且つ温度55〜80℃の条件で化学エツチング
を行うことを特徴とするものである。 The method of manufacturing an electric circuit board according to the present invention is a method of manufacturing an electric circuit from an insulating board covered with an Au alloy foil, in which a pattern is formed using a photoresist, and then a solution of hydrochloric acid:nitric acid in a ratio of 7 to 15:1 is added. This method is characterized in that chemical etching is carried out at a temperature of 55 to 80°C.
本発明の電気回路板の製造方法において、塩
酸：硝酸＝７〜15：１なる比率の溶液を使用する
理由は、塩酸：硝酸＝５：１より塩酸の濃度が低
いと、フオトレジストが剥れ易くなり、しかも絶
縁板に張つたAu合金箔にAgを含んでいる場合、
表面にAgClが生成され、反応が進展しなくなる
からであり、また塩酸：硝酸＝15：１より塩酸の
濃度が高いと、Au合金箔の化学エツチングの反
応が起りにくいからである。 The reason for using a solution with a ratio of hydrochloric acid: nitric acid = 7 to 15:1 in the method of manufacturing an electric circuit board of the present invention is that if the concentration of hydrochloric acid is lower than the ratio of hydrochloric acid: nitric acid = 5:1, the photoresist will peel off. Moreover, if the Au alloy foil stretched on the insulating plate contains Ag,
This is because AgCl is generated on the surface and the reaction does not proceed. Also, if the concentration of hydrochloric acid is higher than 15:1 of hydrochloric acid:nitric acid, the chemical etching reaction of the Au alloy foil is difficult to occur.
また温度55℃〜80℃で化学エツチングを行なう
理由は、55℃未満では反応時間が長くなつてフオ
トレジストが剥れ易くなり、しかもAu合金箔に
Agを含んでいる場合表面にAgClが生成され、反
応が進展しなくなるからであり、また80℃を超え
ると、突沸が起つて甚だ危険であり、しかもフオ
トレジストが高温でもたなく剥れ易くなるからで
ある。 Also, the reason why chemical etching is performed at a temperature of 55°C to 80°C is that if the temperature is lower than 55°C, the reaction time will be longer and the photoresist will easily peel off.
If it contains Ag, AgCl will be generated on the surface and the reaction will not progress.If the temperature exceeds 80℃, bumping will occur, which is extremely dangerous, and the photoresist will not hold up at high temperatures and will easily peel off. It is from.
かかる理由により、塩酸：硝酸＝７〜15：１な
る比率の溶液で温度55℃〜80℃の条件で化学エツ
チングを行なう本発明の電気回路板の製造方法に
よれば、エツチングの際フオトレジストが剥れる
ことがなく、また絶縁板に張つたAu合金箔にAg
を含んでいてもAgClが生成せず、反応が進展し
て良好な電気回路板を得ることができるものであ
る。 For this reason, according to the method of manufacturing an electric circuit board of the present invention, in which chemical etching is carried out at a temperature of 55°C to 80°C with a solution having a ratio of hydrochloric acid: nitric acid = 7 to 15:1, the photoresist is removed during etching. It does not peel off, and the Au alloy foil attached to the insulating plate is coated with Ag.
Even if it contains, AgCl is not produced, the reaction progresses, and a good electric circuit board can be obtained.
以下本発明による電気回路板の製造方法の効果
を明瞭ならしめる為にその具体的な実施例と従来
例について説明する。 In order to clarify the effects of the method of manufacturing an electric circuit board according to the present invention, specific examples and conventional examples thereof will be described below.
実施例 １
Au90w/o、Ni10w/oよりなるAu合金箔を30μ
ｍ張つたガラスエポキシの絶縁板にフオトレジス
トにて所要のパターンを形成した後、塩酸：硝酸
＝７：１なる比率の溶液で温度65℃の条件で５分
間化学エツチングを行つたところ、フオトレジス
トが剥れることなく、エツチングが完全に行なわ
れて良好な電気回路板が得られた。Example 1 30μ Au alloy foil consisting of Au90w/o and Ni10w/o
After forming a desired pattern with photoresist on a glass epoxy insulating plate, chemical etching was performed for 5 minutes at a temperature of 65°C using a solution with a ratio of hydrochloric acid: nitric acid = 7:1. The etching was completed without any peeling, and a good electric circuit board was obtained.
実施例 ２
Pt5w/o、Au70w/o、Ag10w/o、Cu14w/o、Ni1
w/oよりなる合金箔を70μｍ張つたガラスエポキ
シの絶縁板にフオトレジストにて所要のパターン
を形成した後、塩酸：硝酸＝10：１なる比率の溶
液で温度65℃の条件で10分間化学エツチングを行
なつたところ、フオトレジストが剥れることがな
く、また表面にAgClが生成することなく反応が
進展してエツチングが完全に行なわれ、良好な電
気回路板が得られた。Example 2 Pt5w/o, Au70w/o, Ag10w/o, Cu14w/o, Ni1
After forming the desired pattern with photoresist on a glass epoxy insulating plate covered with 70 μm thick alloy foil made of w/o, chemical treatment was performed for 10 minutes at a temperature of 65°C in a solution with a ratio of hydrochloric acid: nitric acid = 10:1. When etching was carried out, the photoresist did not peel off, and the reaction progressed without AgCl being produced on the surface, and the etching was completed, resulting in a good electric circuit board.
従来例 １
Au90w/o、Ni10w/oよりなるAu合金箔を30μ
ｍ張つたガラスエポキシの絶縁板にフオトレジス
トにて所要のパターンを形成した後、塩酸：硝酸
＝３：１の王水液で温度65℃の条件で５分間化学
エツチングを行なつたところ、エツチングが完全
に行なわれる前にフオトレジストが剥れてしまつ
た。Conventional example 1 30μ Au alloy foil consisting of Au90w/o and Ni10w/o
After forming a desired pattern with photoresist on a glass epoxy insulating plate, chemical etching was performed for 5 minutes at a temperature of 65°C using an aqua regia solution containing hydrochloric acid: nitric acid = 3:1. The photoresist peeled off before the process was completed.
従来例 ２
Pt5w/o、Au70w/o、Ag10w/o、Cu14w/o、Ni1
w/oよりなる合金箔を70μｍ張つたガラスエポキ
シの絶縁板にフオトレジストにて所要のパターン
を形成した後、塩酸：硝酸＝３：１の王水液で温
度30℃の条件で10分間化学エツチングを行なつた
ところ、エツチングが完全に行なわれる前にフオ
トレジストが剥れ、しかも表面にAgClが生成さ
れて途中でエツチングの反応が進展しなくなつ
た。Conventional example 2 Pt5w/o, Au70w/o, Ag10w/o, Cu14w/o, Ni1
After forming the required pattern with photoresist on a glass epoxy insulating plate covered with 70 μm thick alloy foil made of w/o, chemical treatment was carried out using aqua regia with hydrochloric acid: nitric acid = 3:1 at a temperature of 30°C for 10 minutes. When etching was carried out, the photoresist peeled off before the etching was completed, and AgCl was formed on the surface, causing the etching reaction to stop progressing.
以上詳記した通り本発明の電気回路板の製造方
法によれば、エツチングの際フオトレジストが剥
れることがなく、また絶縁板に張つたAu合金箔
にAgを含んでいても表面にAgClが生成せず、エ
ツチングの反応が完全に行なわれて極めて良好な
電気回路板を得ることができるという優れた効果
がある。 As detailed above, according to the method of manufacturing an electric circuit board of the present invention, the photoresist does not peel off during etching, and even if the Au alloy foil stretched on the insulating board contains Ag, AgCl remains on the surface. This has the excellent effect that the etching reaction is completely carried out without any formation, and an extremely good electrical circuit board can be obtained.
Claims (1)
製造する方法において、フオトレジストによりパ
ターンを形成した後に、塩酸：硝酸＝７〜15：１
の比率の溶液により且つ温度55〜80℃の条件で化
学エツチングを行うことを特徴とする、電気回路
板の製造方法。 ２ Au合金箔がAgを含有しているものであるこ
とを特徴とする、特許請求の範囲第１項に記載の
製造方法。[Claims] 1. In a method for manufacturing an electric circuit board from an insulating board covered with Au alloy foil, after forming a pattern with a photoresist, hydrochloric acid: nitric acid = 7 to 15:1
1. A method for manufacturing an electric circuit board, characterized in that chemical etching is carried out using a solution having a ratio of 100 to 100°C and at a temperature of 55 to 80°C. 2. The manufacturing method according to claim 1, wherein the Au alloy foil contains Ag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5091778A JPS54142145A (en) | 1978-04-28 | 1978-04-28 | Production of electric circuit plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5091778A JPS54142145A (en) | 1978-04-28 | 1978-04-28 | Production of electric circuit plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54142145A JPS54142145A (en) | 1979-11-06 |
| JPS6115157B2 true JPS6115157B2 (en) | 1986-04-22 |
Family
ID=12872133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5091778A Granted JPS54142145A (en) | 1978-04-28 | 1978-04-28 | Production of electric circuit plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54142145A (en) |
-
1978
- 1978-04-28 JP JP5091778A patent/JPS54142145A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54142145A (en) | 1979-11-06 |
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