JPS6129974B2 - - Google Patents
Info
- Publication number
- JPS6129974B2 JPS6129974B2 JP15451177A JP15451177A JPS6129974B2 JP S6129974 B2 JPS6129974 B2 JP S6129974B2 JP 15451177 A JP15451177 A JP 15451177A JP 15451177 A JP15451177 A JP 15451177A JP S6129974 B2 JPS6129974 B2 JP S6129974B2
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- diaminodiphenyl ether
- methyl
- group
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004952 Polyamide Substances 0.000 claims description 28
- 229920002647 polyamide Polymers 0.000 claims description 28
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 claims description 5
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 125000004422 alkyl sulphonamide group Chemical group 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 239000012442 inert solvent Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- -1 poly(m-phenylene isophthalamide) Polymers 0.000 description 16
- 238000010521 absorption reaction Methods 0.000 description 14
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 13
- MFQDPUGVRHXCON-UHFFFAOYSA-N CCCCNS(=O)=O Chemical compound CCCCNS(=O)=O MFQDPUGVRHXCON-UHFFFAOYSA-N 0.000 description 11
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 10
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 10
- KCGKYAORRXGWMN-UHFFFAOYSA-N CNS(=O)=O Chemical compound CNS(=O)=O KCGKYAORRXGWMN-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- OZEVNJINVVOGGU-UHFFFAOYSA-N CCCNS(=O)=O Chemical compound CCCNS(=O)=O OZEVNJINVVOGGU-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- JNSAWGNVZMPYJI-UHFFFAOYSA-N CCNS(=O)=O Chemical compound CCNS(=O)=O JNSAWGNVZMPYJI-UHFFFAOYSA-N 0.000 description 6
- 150000004820 halides Chemical class 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000000862 absorption spectrum Methods 0.000 description 5
- 125000003368 amide group Chemical group 0.000 description 5
- 239000004760 aramid Substances 0.000 description 5
- 229920003235 aromatic polyamide Polymers 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 238000000921 elemental analysis Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 125000000565 sulfonamide group Chemical group 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 229930006000 Sucrose Natural products 0.000 description 3
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 3
- OVIZSQRQYWEGON-UHFFFAOYSA-N butane-1-sulfonamide Chemical compound CCCCS(N)(=O)=O OVIZSQRQYWEGON-UHFFFAOYSA-N 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000005720 sucrose Substances 0.000 description 3
- 238000002411 thermogravimetry Methods 0.000 description 3
- USFPMOOHBAAXFQ-UHFFFAOYSA-N CC(C)NS(=O)=O Chemical compound CC(C)NS(=O)=O USFPMOOHBAAXFQ-UHFFFAOYSA-N 0.000 description 2
- LVRCEUVOXCJYSV-UHFFFAOYSA-N CN(C)S(=O)=O Chemical compound CN(C)S(=O)=O LVRCEUVOXCJYSV-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000370 acceptor Substances 0.000 description 2
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000005457 ice water Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- HVCNXQOWACZAFN-UHFFFAOYSA-N 4-ethylmorpholine Chemical compound CCN1CCOCC1 HVCNXQOWACZAFN-UHFFFAOYSA-N 0.000 description 1
- QJCXNZZNOXFVHM-UHFFFAOYSA-N CC(C)CNS(=O)=O Chemical compound CC(C)CNS(=O)=O QJCXNZZNOXFVHM-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- WLJVNTCWHIRURA-UHFFFAOYSA-N Heptanedioic acid Natural products OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 1
- OMXGQMSYWIHRGG-UHFFFAOYSA-N NN(S(=O)=O)N Chemical compound NN(S(=O)=O)N OMXGQMSYWIHRGG-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N Nonanedioid acid Natural products OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- TYFQFVWCELRYAO-UHFFFAOYSA-N Suberic acid Natural products OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- PWAXUOGZOSVGBO-UHFFFAOYSA-N adipoyl chloride Chemical compound ClC(=O)CCCCC(Cl)=O PWAXUOGZOSVGBO-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012210 heat-resistant fiber Substances 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-N hexanedioic acid Natural products OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-N n-Decanedioic acid Natural products OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920000889 poly(m-phenylene isophthalamide) Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/56—Polyamides, e.g. polyester-amides
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polyamides (AREA)
Description
本発明は側鎖にアルキルスルホンアミド基を有
する新規なポリアミドに関する。
芳香族核にアミド結合が直接結合したいわゆる
芳香族ポリアミドは、その分子鎖の剛直な故に、
機械的特性、高温での形状安定性、耐熱分解性、
電気絶縁性などにすぐれ、耐熱性繊維や絶縁用フ
イルムとして工業的にきわめて価値の高いもので
ある。しかし一般に芳香族ポリアミドは有機溶媒
に対する溶解性が悪く、例えばポリ(m−フエニ
レンイソフタルアミド)などはN・N−ジメチル
アセトアミドなどの極性溶媒にも、数%の無機塩
(例えば塩化リチウム、硝酸リチウム、塩化カル
シウムなど)の存在でのみ溶解するにすぎない。
それ故それらのポリアミドからフイルム製造には
制限を免れなかつた。またそれら従来の芳香族ポ
リアミドフイルムを半透膜として使用する際に、
その顕著な疎水性のため透水性が不充分であるな
ど特性上の欠点も指摘された。
本発明は前記従来の芳香族ポリアミドの欠点に
鑑みなされたもので、その目的は、芳香族ポリア
ミドに観られた機械的強度と耐熱性を保持し、有
機溶媒に対する溶解性にすぐれ成膜し易い材料を
提供することにあり、さらに水透過性の良好な半
透膜として有用な材料を提供することである。
本発明の材料は、一般式
〔−NH−Ar−NHCO−Q−CO〕−
(但し、Arは
The present invention relates to a novel polyamide having an alkylsulfonamide group in its side chain. So-called aromatic polyamides, in which amide bonds are directly bonded to aromatic nuclei, have rigid molecular chains, so
Mechanical properties, shape stability at high temperatures, thermal decomposition resistance,
It has excellent electrical insulation properties and is extremely valuable industrially as a heat-resistant fiber and insulating film. However, aromatic polyamides generally have poor solubility in organic solvents; for example, poly(m-phenylene isophthalamide) can be dissolved even in polar solvents such as N.N-dimethylacetamide with a few percent of inorganic salts (e.g. lithium chloride, nitric acid, etc.). It only dissolves in the presence of lithium, calcium chloride, etc.).
Therefore, there are limitations to the production of films from these polyamides. Also, when using these conventional aromatic polyamide films as semipermeable membranes,
Due to its remarkable hydrophobicity, it was also pointed out that it had insufficient water permeability and other drawbacks in its properties. The present invention was developed in view of the drawbacks of the conventional aromatic polyamides, and its purpose is to maintain the mechanical strength and heat resistance observed in aromatic polyamides, have excellent solubility in organic solvents, and be easy to form into films. Another object of the present invention is to provide a material that is useful as a semipermeable membrane with good water permeability. The material of the present invention has the general formula [-NH-Ar-NHCO-Q-CO]- (where Ar is
【式】
(nは0または1、R1、R2は水素または低級アル
キル基であり、水素原子のみはR1またはR2のい
ずれか一方にのみ置換する)、
(R3がHのときR4はCH3、C2H5、R3がCH3の
ときR4はCH3、C2H5、C3H7、C4H9、R3がC2H5の
ときR4はC2H5である)、
(R5はCH3、R6はHかCH3)、またQはm−フ
エニレン基、p−フエニレン基、O−フエニレン
基、
(Y=−O−、−SO2−)、
−(CH2)n−(nは1、2、4〜8)、
である)
で示される反復単位から成り、且つ0.5dl/g以上
の還元粘度(ジメチルアセトアミド溶媒、0.1g/
dl濃度、30℃)を示す側鎖にアルキルスルホンア
ミド基を有するポリアミドである。
上記した本発明の側鎖にアルキルスルホンアミ
ド基を有するポリアミドは、一般式H2N−Ar−
NH2(式中Arは[Formula] (n is 0 or 1, R 1 and R 2 are hydrogen or a lower alkyl group, only the hydrogen atom is substituted in either R 1 or R 2 ), (When R 3 is H, R 4 is CH 3 , C 2 H 5 , when R 3 is CH 3 , R 4 is CH 3 , C 2 H 5 , C 3 H 7 , C 4 H 9 , R 3 is C 2 H 5 then R 4 is C 2 H 5 ), ( R5 is CH3 , R6 is H or CH3 ), and Q is m-phenylene group, p-phenylene group, O-phenylene group, (Y=-O-, -SO2- ), -( CH2 )n- (n is 1, 2, 4 to 8), ), and has a reduced viscosity of 0.5 dl/g or more (dimethylacetamide solvent, 0.1 g/g)
It is a polyamide with an alkylsulfonamide group in the side chain that exhibits a dl concentration of 30℃). The polyamide having an alkylsulfonamide group in the side chain of the present invention described above has the general formula H 2 N-Ar-
NH 2 (wherein Ar is
【式】
(nは0または1、R1、R2は水素または低級アル
キル基であり、水素原子のみはR1、またはR2の
いずれか一方にのみ置換する)、
(R3がHのときR4はCH3、C2H5、R3がCH3の
ときR4はCH3、C2H5、C3H7、C4H9、R3がC2H5の
ときR4はC2H5である)、
(R5はCH3、R6はHかCH3)、
で示される芳香族ジアミノアルキルスルホンアミ
ドと、一般式XOOC−Q−COOX(式中Qはm−
フエニレン基、p−フエニレン基、O−フエニレ
ン基、
(Y=−O−、−SO2−)、
−(CH2)n−(nは1、2、4〜8)、
である。XはCl、Brである。)
で示される二塩基酸ハロゲン化物とを、不活性溶
媒中25℃以下の温度において、重縮合させること
によつて製造することができる。
本発明の使用される芳香族ジアミノアルキルス
ルホンアミドは、一般式H2N−Ar−NH2(式中
Arは[Formula] (n is 0 or 1, R 1 and R 2 are hydrogen or a lower alkyl group, only the hydrogen atom is substituted in either R 1 or R 2 ), (When R 3 is H, R 4 is CH 3 , C 2 H 5 , when R 3 is CH 3 , R 4 is CH 3 , C 2 H 5 , C 3 H 7 , C 4 H 9 , R 3 is C When 2 H 5 , R 4 is C 2 H 5 ), (R 5 is CH 3 , R 6 is H or CH 3 ), aromatic diaminoalkylsulfonamide represented by the general formula XOOC-Q-COOX (wherein Q is m-
Phenylene group, p-phenylene group, O-phenylene group, (Y=-O-, -SO2- ), -( CH2 )n-(n is 1, 2, 4 to 8), It is. X is Cl or Br. ) can be produced by polycondensing a dibasic acid halide represented by the following in an inert solvent at a temperature of 25° C. or lower. The aromatic diaminoalkylsulfonamide used in the present invention has the general formula H 2 N-Ar-NH 2 (in the formula
Ar is
【式】
(nは0または1、R1、R2は水素または低級アル
キル基であり、水素原子のみはR1またはR2のい
ずれか一方にのみ置換する)、
(R3がHのときR4はCH3、C2H5、R3がCH3の
ときR4はCH3、C2H5、C3H7、C4H9、R3がC2H5の
ときR4はC2H5である)、で示される化合物であ
る。
そのような芳香族アミノスルホンアミド(H2N
−Ar−NH2)を具体的に示すと次の通りである。
3・5−ジアミノベンゼン−N−メチルスルホ
ンアミド
3・5−ジアミノベンゼン−N・N−ジメチル
スルホンアミド
3・5−ジアミノベンゼン−N−エチルスルホ
ンアミド
3・5−ジアミノベンゼン−N・N−ジエチル
スルホンアミド
3・5−ジアミノベンゼン−(N−メチル、N
−エチルスルホンアミド)
3・5−ジアミノベンゼン−(N−メチル、N
−n−プロピルスルホンアミド)
3・5−ジアミノベンゼン−(N−メチル、N
−n−ブチルスルホンアミド)
3・5−ジアミノベンゼン−(N−エチル、N
−n−プロピルスルホンアミド)
3・5−ジアミノベンゼン−(N−エチル、N
−n−ブチルスルホンアミド)
3・5−ジアミノベンゼン−(N−n−プロピ
ル、N−nブチルスルホンアミド)
4・4′−ジアミノジフエニルエーテル−2−N
−メチルスルホンアミド
4・4′−ジアミノジフエニルエーテル−2−
N・N−ジメチルスルホンアミド
4・4′−ジアミノジフエニルエーテル−2−
(N−メチル、N−エチルスルホンアミド)
4・4′−ジアミノジフエニルエーテル−2−
(N−メチル、N−n−プロピルスルホンアミ
ド)
4・4′−ジアミノジフエニルエーテル−2−
(N−メチル、N−n−ブチルスルホンアミド)
4・4′−ジアミノジフエニルエーテル−2−
(N−エチル、N−n−プロピルスルホンアミ
ド)
4・4′−ジアミノジフエニルエーテル−2−
(N−エチル、N−n−ブチルスルホンアミド)
4・4′−ジアミノジフエニルエーテル−2−
(N−n−プロピル、N−n−ブチルスルホンア
ミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−メチルスルホンアミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N・N−ジメチルスルホンアミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−エチルスルホンアミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N・N−ジエチルスルホンアミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N・N−ジ−n−プロピルスルホンアミ
ド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−イソプロピルスルホンアミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N・N−ジイソプロピルスルホンアミ
ド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−n−ブチルスルホンアミド)
4・4′−ジアミノジフエニルエーテル2・2′−
ジ(N・N−ジ−n−ブチルスルホンアミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ−(N−メチル、N−エチルスルホンアミ
ド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−メチル、N−n−プロピルスルホン
アミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−メチル、N−n−ブチルスルホンア
ミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−エチル、N−n−プロピルスルホン
アミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−エチル、N−n−ブチルスルホンア
ミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−n−プロピル、N−n−ブチルスル
ホンアミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−メチル、N−イソプロピルスルホン
アミド)
4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−イソプロピル、N−イソブチルスル
ホンアミド)
4・4′−ジアミノジフエニルメタン−2・2′−
ジ(N−メチル、N−n−プロピルスルホンアミ
ド)
4・4′−ジアミノジフエニルメタン−2・2′−
ジ(N−エチル、N−n−ブチルスルホンアミ
ド)
4・4′−ジアミノジフエニルメタン−2・2′−
ジ(N−メチルスルホンアミド)
4・4′−ジアミノジフエニルメタン−2・2′−
ジ(N・N−メチルスルホンアミド)
ベンジジン−2−N−メチルスルホンアミド
ベンジジン−2−N・N−ジメチルスルホンア
ミド
ベンジジン−2−N−エチルスルホンアミド
ベンジジン−2−N・N−ジエチルスルホンア
ミド
ベンジジン−2−(N−メチル、N−エチルス
ルホンアミド)
ベンジジン−2−(N−メチル、N−エチルス
ルホンアミド)
ベンジジン−2−(N−メチル、N−n−ブチ
ルスルホンアミド)
4・4′−ジアミノジフエニルメタン−2−N−
メチルスルホンアミド
4・4′−ジアミノジフエニルメタン−2−N・
N−ジメチルスルホンアミド
4・4′−ジアミノジフエニルサルフアイド−2
−N−メチルスルホンアミド
4・4′−ジアミノジフエニルサルフアイド−2
−N・N−ジメチルスルホンアミド
4・4′−ジアミノベンゾフエノン−2−N−メ
チルスルホンアミド
4・4′−ジアミノベンゾフエノン−2−N・N
−ジメチルスルホンアミド
4・4′−ジアミノジフエニルサルフアイド−
2・2′−ジ(N−メチルスルホンアミド)
4・4′−ジアミノジフエニルサルフアイド−
2・2′−ジ(N・N−ジメチルスルホンアミド)
4・4′−ジアミノジフエニルスルホン−2・
2′−ジ(N−メチルスルホンアミド)
4・4′−ジアミノジフエニルスルホン−2・
2′−ジ(N・N−ジメチルスルホンアミド)
4・4′−ジアミノベンゾフエノン−2・2′−ジ
(N−メチルスルホンアミド)
4・4−ジアミノベンゾフエノン−2・2′−ジ
(N・N−ジメチルスルホンアミド)
ベンジジン−2・2′−ジ(N−メチルスルホン
アミド)
ベンジジン−2・2′−ジ(N・N−ジメチルス
ルホンアミド)
3・7−ジアミノナフタレン−1・5−ジ(N
−メチルスルホンアミド)
3・7−ジアミノナフタレン−1・5−ジ
(N・N−ジメチルスルホンアミド)
2・4−ジアミノジフエニル−4′−N−メチル
スルホンアミド
2・4−ジアミノフエニル−4′−N・N−ジメ
チルスルホンアミド
2−〔(4−アミノフエニル)イソプロピル〕−
4−アミノ−N−メチルスルホンアミド
2−〔(4−アミノフエニル)イソプロピル〕−
4−アミノ−N・N−ジメチルスルホンアミド
本発明は製造するための原料のもう一つは二塩
基酸ハロゲン化物である。具体例としては、
イソフタル酸(m−フエニレン)ハロゲン化物
テレフタル酸(p−フエニレン)ハロゲン化物
フタル酸(O−フエニレン)ハロゲン化物
4・4′−ジフエニルエーテルジカルボン酸ハロ
ゲン化物
4・4′ジフエニルスルホンジカルボン酸ハロゲ
ン化物
2・6−ナフタレンジカルボン酸ハロゲン化物
マロン酸ハロゲン化物
XOOC−CH2−COOX、
コハク酸ハロゲン化物
XOOC−(CH2)2−COOX、
グルタミン酸ハロゲン化物
XOOC−CH2−CH2−CH(NH2)
−COOX、
アジピン酸ハロゲン化物
XOOC−(CH2)4−COOX、
ピメリン酸ハロゲン化物
XOOC−(CH2)5−COOX、
スベリン酸ハロゲン化物
XOOC−(CH2)6−COOX、
アゼライン酸ハロゲン化物
XOOC−(CH2)7−COOX、
セバシン酸ハロゲン化物
XOOC−(CH2)8−COOX、
1・3−シクロペンタンカルボン酸ハロゲン化
物
1・4−シクロヘキサジカルボン酸ハロゲン化
物
4・4′−ジフエニルジカルボン酸ハロゲン化物
、などがある。これらの二塩基酸ハロゲン化物も
2種以上併用することができる。
本発明はポリアミドを製造する際に反応媒体と
して、例えばN−メチル−2−ピロリドン、N・
N−ジメチルアセトアミド、N・N−ジメチルホ
ルムアミド、ヘキサメチルホスホルアミド、N・
N−ジエチルホルムアミドなど反応成分に対し不
活性の溶媒が用いられる。
また、発生するハロゲン化水素を捕獲するため
に酸受容体を使用してもよい。酸受容体としては
種々のものがあるが、一般には例えばピリジン、
トリエチルアミン、トリ−n−ブチルアミン、
N・N−ジメチルアニリン、キノリン、N−メチ
ルモルホリン、N−エチルモルホリンなどの3級
アミンが有用である。
本発明のポリアミドは、前記芳香族ジアミノス
ルホンアミドと二塩基酸ハロゲン化物とを、不活
性溶媒中25℃以下の温度において反応させること
によつて製造される。その際両反応成分を実質上
等モルの比率で使用することが望ましく、かくす
ることによつて高分子量の、すなわち高い還元粘
度を示すポリアミドを得ることができる。低分子
量のポリアミドは成膜しがたく、たとえフイルム
にできても機械的性質に劣る。本発明において
は、少くとも0.5dl/g、なるべくは1.0dl/g以上
の還元粘度(溶媒、N・N−ジメチルアセトアミ
ド、濃度0.1g/dl、30℃測定)を有するポリアミ
ドが好適であり、充分に反応させることが望まし
い。
前記に従い得られたポリアミドは、その赤外線
吸収スペクトルの波数3400〜3200cm-1の領域にア
ミド基による吸収、波数1350〜1320および1170〜
1150cm-1の領域にスルホンアミド基による吸収
2960cm-1、2920cm-1、2870cm-1にアルキル基によ
る吸収を示し、元素分析値も計算値に一致した。
本発明のポリアミドは、アミド類などの極性溶
媒に溶け易く、その溶液から慣用の手段により成
膜することができる。またそのフイルムは強靭で
あり、また良好な水透過性、溶質排除率を示し、
半透膜として有用である。次に実施例によつて本
発明を説明する。
実施例 1
温度計、撹拌器、滴下ろう斗および塩化カルシ
ウム管つき空冷管を備えた容量1の四口フラス
コに、4・4′−ジアミノジフエニルエーテル−
2・2′−ジ(N−メチルスルホンアミド)、73.6
g、N−メチル−2−ピロリドン500gおよび塩
化リチウム25gを入れ、内容物を撹拌し、フラス
コを氷浴で冷却する。これにイソフタル酸クロラ
イド40.6gを徐々に加え、内容物の温度を10℃に
保つた。添加終了後、反応温度を7℃に保ち、6
時間反応させた。その間溶液の粘度は上昇した。
この生成物を氷水中に注ぎ、生じたポリアミドの
沈殿を粉砕し、塩の酸性が認められなくなるまで
充分に水で洗浄した。最後にメタノールで洗浄
し、淡灰色をおびた白色の粉末を120℃で減圧乾
燥した。収量は99gであつた。
生成物の元素分析結果(かつこ内は計算値)。
C:51.8%(51.15%)
H:4.0%(3.90%)
S:12.0%(12.41%)
N:10.3%(10.85%)
上記ポリアミドは290℃まで軟化しなかつた。
またその赤外吸収スペクトルは第1図の如くで
ある。波数3300cm-1にアミド基による吸収、波数
1160cm-1および1320cm-1にスルホンアミド基によ
る吸収、2850cm-1にメチル基による吸収が認めら
れる。
実施例 2
実施例1で得たポリアミド粉末はN−メチル−
2−ピロリドン、N・N−ジメチルアセトアミ
ド、N・N−ジメチルホルムアミド、N・N−ジ
エチルホルムアミド、ジメチルスルホンキシドに
可溶である。
このポリアミドの還元粘度は2.0dl/g(溶媒ジ
メチルアセトアミド、濃度0.1g/dl溶液、温度30
℃、以下測定条件は同じ)であつた。
このポリアミドのジメチルアセトアミド20%溶
液をつくり、ガラス板上に200μの厚さに流延
し、140℃、5時間、200℃、24時間乾燥してフイ
ルム(厚さ45μ)を作製した。このフイルムの引
張り強度は9Kg/mm2、伸び率は9%であつた。ま
たこのフイルムは空気中で熱重量分析(昇温速度
5℃/min)したところ、390℃まで減量しなかつ
た。
またポリアミドを硝酸リチウム10%を含むジメ
チルアセトアミドに溶解した10%溶液を、ガラス
板上に250μの厚さに流延し、110℃/15分溶媒を
蒸発された後、氷水中に浸漬してゲル化させ透明
な膜を得た。この膜をろ過器に取りつけ、0.5%
シヨ糖溶液を用い、操作圧力5Kg/cm2の条件で水
およびシヨ糖の透過量測定を行なつた。その結
果、水透過量は0.03ml/cm2・minシユ糖排除率は90
%であつた。
実施例 3
実施例1と同様の装置に、4・4′−ジアミノジ
フエニルエーテル−2・2′−ジ(N・N−ジメチ
ルスルホンアミド)82.90g、N・N−ジメチル
アセトアミド250g、塩化リチウム25gを入れ内
容物を撹拌し、フラスコを氷浴で冷却しておく。
この中にアジピン酸クロライド36.6gを徐々に加
える。添加終了後5℃で5時間反応させた。生成
溶液を実施例1と同様に処理してポリアミド粉末
89gを得た。このポリアミドの還元粘度は0.8dl/
gであつた。また熱重量分析による減量開始温度
は400℃であつた。
元素分析結果(かつこ内は計算値)
C:50.8%(50.37%)
H:5.5%(5.38%)
S:12.0%(12.22%)
N:10.4%(10.68%)
このポリアミドの赤外吸収スペクトルは第2図
に示す如くである。波数3300cm-1にアミド基に基
づく吸収、波数1160cm-1、および1320cm-1スルホ
ンアミド基に基づく吸収、2960cm-1並びに2870cm
-1にメチル基による吸収が認められる。
実施例 4
実施例1と同様の装置に、4・4′−ジアミノジ
フエニルエーテル−2・2′−ジ(N−n−ブチル
スルホンアミド94.06g、N−メチル−2−ピロ
リドン250g、N・N−ジメチルアセトアミド250
g、塩化リチウム25gを入れ、内容物を撹拌し、
フラスコを氷浴で冷却しておく。この中にイソフ
タル酸クロライド28.4gとテレフタル酸クロライ
ド12.18gを徐々に加える。添加終了後、5℃で
5時間反応させた。生成溶液を実施例1と同様に
処理してポリアミド粉末120gを得た。このポリ
アミドの還元粘度は1.5dl/gであつた。また熱重
量分析による減量開始温度は320℃であつた。
元素分析結果(かつこ内は計算値)
C:56.1%(55.98%)
H:5.4%(5.38%)
S:10.2%(10.67%)
N:9.1%(9.33%)
このポリアミドの赤外吸収スペクトルは第3図
に示す如くである。波数3300cm-1にアミド基によ
る吸収、波数1160cm-1、および1320cm-1にスルホ
ンアミド基による吸収、2960cm-1並びに2870cm-1
にメチル基による吸収、2920cm-1にメチレン基に
よる吸収が認められる。またこのポリアミドはN
−メチル−2−ピロリドン、N・N−ジメチルア
セトアミド、N・N−ジメチルホルムアミド、
N・N−ジエチルホルムアミド、ジメチルスルホ
キサイドに可溶である。
実施例 5
実施例1と同様の装置を2組用意し、その各々
に4・4′−ジアミノジフエニルエーテル−2・
2′−ジ(N−ブチルスルホンアミド)94.06g、
N−メチル−2−ピロリドン500gおよび塩化リ
チウム25gを入れ、内容物を撹拌し、一つのフラ
スコは25℃、他のフラスコは50℃に保温する。こ
のフラスコ各々にイソフタル酸クロライド40.6g
を徐々に加え、6時間所定の温度に保つて反応を
完結させる。以下実施例1、並びに実施例2と同
様にして、上記合成ポリアミドの還元粘度、並び
に形成させた乾燥フイルムの引張り強度、伸びを
測定した。その結果を表に示す。[Formula] (n is 0 or 1, R 1 and R 2 are hydrogen or a lower alkyl group, only the hydrogen atom is substituted in either R 1 or R 2 ), (When R 3 is H, R 4 is CH 3 , C 2 H 5 , when R 3 is CH 3 , R 4 is CH 3 , C 2 H 5 , C 3 H 7 , C 4 H 9 , R 3 is C 2H5 , R4 is C2H5 ) . Such aromatic aminosulfonamides (H 2 N
-Ar-NH 2 ) is specifically shown as follows. 3,5-diaminobenzene-N-methylsulfonamide 3,5-diaminobenzene-N/N-dimethylsulfonamide 3,5-diaminobenzene-N-ethylsulfonamide 3,5-diaminobenzene-N/N-diethylsulfonamide 3,5-diaminobenzene-(N-methyl, N
-ethylsulfonamide) 3,5-diaminobenzene-(N-methyl, N
-n-propylsulfonamide) 3,5-diaminobenzene-(N-methyl, N
-n-butylsulfonamide) 3,5-diaminobenzene-(N-ethyl, N
-n-propylsulfonamide) 3,5-diaminobenzene-(N-ethyl, N
-n-butylsulfonamide) 3,5-diaminobenzene-(N-n-propyl, N-butylsulfonamide) 4,4'-diaminodiphenyl ether-2-N
-Methylsulfonamide 4,4'-diaminodiphenyl ether-2-
N・N-dimethylsulfonamide 4,4'-diaminodiphenyl ether-2-
(N-methyl, N-ethylsulfonamide) 4,4'-diaminodiphenyl ether-2-
(N-methyl, N-n-propylsulfonamide) 4,4'-diaminodiphenyl ether-2-
(N-methyl, N-n-butylsulfonamide) 4,4'-diaminodiphenyl ether-2-
(N-ethyl, N-n-propylsulfonamide) 4,4'-diaminodiphenyl ether-2-
(N-ethyl, N-n-butylsulfonamide) 4,4'-diaminodiphenyl ether-2-
(N-n-propyl, N-butylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N-methylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N・N-dimethylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N-ethylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N・N-diethylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N・N-di-n-propylsulfonamide) 4.4'-diaminodiphenyl ether-2.
2'-di(N-isopropylsulfonamide) 4.4'-diaminodiphenyl ether-2.
2'-di(N・N-diisopropylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N-n-butylsulfonamide) 4,4'-diaminodiphenyl ether 2,2'-
Di(N・N-di-n-butylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di-(N-methyl, N-ethylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N-methyl, N-n-propylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N-methyl, N-n-butylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N-ethyl, N-n-propylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N-ethyl, N-n-butylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N-n-propyl, N-n-butylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N-methyl, N-isopropylsulfonamide) 4.4′-diaminodiphenyl ether-2.
2'-di(N-isopropyl, N-isobutylsulfonamide) 4,4'-diaminodiphenylmethane-2,2'-
di(N-methyl, N-n-propylsulfonamide) 4,4'-diaminodiphenylmethane-2,2'-
di(N-ethyl, N-n-butylsulfonamide) 4,4'-diaminodiphenylmethane-2,2'-
di(N-methylsulfonamide) 4,4'-diaminodiphenylmethane-2,2'-
Di(N・N-methylsulfonamide) Benzidine-2-N-methylsulfonamide Benzidine-2-N・N-dimethylsulfonamide Benzidine-2-N-ethylsulfonamide Benzidine-2-N・N-diethylsulfonamide Benzidine-2-(N-methyl, N-ethylsulfonamide) Benzidine-2-(N-methyl, N-ethylsulfonamide) Benzidine-2-(N-methyl, N-n-butylsulfonamide) 4,4'-diaminodiphenylmethane-2-N-
Methylsulfonamide 4,4'-diaminodiphenylmethane-2-N.
N-dimethylsulfonamide 4,4'-diaminodiphenyl sulfide-2
-N-methylsulfonamide 4,4'-diaminodiphenyl sulfide-2
-N・N-dimethylsulfonamide 4,4'-diaminobenzophenone-2-N-methylsulfonamide 4,4′-diaminobenzophenone-2-N・N
-dimethylsulfonamide 4,4'-diaminodiphenyl sulfide-
2,2'-di(N-methylsulfonamide) 4,4'-diaminodiphenyl sulfide-
2,2'-di(N,N-dimethylsulfonamide) 4.4'-diaminodiphenylsulfone-2.
2'-di(N-methylsulfonamide) 4.4'-diaminodiphenylsulfone-2.
2'-di(N・N-dimethylsulfonamide) 4,4'-diaminobenzophenone-2,2'-di(N-methylsulfonamide) 4,4-diaminobenzophenone-2,2'-di(N/N-dimethylsulfonamide) Benzidine-2,2'-di(N-methylsulfonamide) Benzidine-2,2'-di(N/N-dimethylsulfonamide) 3,7-diaminonaphthalene-1,5-di(N
-methylsulfonamide) 3,7-diaminonaphthalene-1,5-di(N/N-dimethylsulfonamide) 2,4-diaminodiphenyl-4'-N-methylsulfonamide 2,4-diaminophenyl-4'-N,N-dimethylsulfonamide 2-[(4-aminophenyl)isopropyl]-
4-amino-N-methylsulfonamide 2-[(4-aminophenyl)isopropyl]-
4-amino-N・N-dimethylsulfonamide Another raw material for the production of the present invention is a dibasic acid halide. Specific examples include isophthalic acid (m-phenylene) halide. Terephthalic acid (p-phenylene) halide Phthalic acid (O-phenylene) halide 4,4'-diphenyl ether dicarboxylic acid halide 4,4' diphenylsulfonedicarboxylic acid halide 2,6-naphthalene dicarboxylic acid halide Malonic acid halide XOOC−CH 2 −COOX, Succinic acid halide XOOC−(CH 2 ) 2 −COOX, Glutamic acid halide XOOC−CH 2 −CH 2 −CH(NH 2 ) −COOX, Adipic acid halide XOOC− (CH 2 ) 4 −COOX, pimelic acid halide XOOC− (CH 2 ) 5 −COOX, suberic acid halide XOOC− (CH 2 ) 6 −COOX, azelaic acid halide XOOC− (CH 2 ) 7 −COOX, Sebacic acid halide XOOC-(CH 2 ) 8 -COOX, 1,3-cyclopentanecarboxylic acid halide 1,4-cyclohexadicarboxylic acid halide 4,4'-diphenyldicarboxylic acid halide ,and so on. Two or more of these dibasic acid halides can also be used in combination. The present invention uses N-methyl-2-pyrrolidone, N.
N-dimethylacetamide, N・N-dimethylformamide, hexamethylphosphoramide, N・
A solvent inert to the reaction components is used, such as N-diethylformamide. An acid acceptor may also be used to capture the hydrogen halide generated. There are various types of acid acceptors, but generally, for example, pyridine,
triethylamine, tri-n-butylamine,
Tertiary amines such as N.N-dimethylaniline, quinoline, N-methylmorpholine, N-ethylmorpholine are useful. The polyamide of the present invention is produced by reacting the aromatic diaminosulfonamide and a dibasic acid halide in an inert solvent at a temperature of 25° C. or lower. In this case, it is desirable to use both reaction components in a substantially equimolar ratio, whereby a polyamide having a high molecular weight, ie, a high reduced viscosity, can be obtained. Low molecular weight polyamides are difficult to form into films, and even if they can be made into films, they have poor mechanical properties. In the present invention, polyamides having a reduced viscosity of at least 0.5 dl/g, preferably 1.0 dl/g or more (solvent, N·N-dimethylacetamide, concentration 0.1 g/dl, measured at 30°C) are suitable; It is desirable to allow a sufficient reaction. The polyamide obtained according to the above has absorption by amide groups in the wave number region of 3400 to 3200 cm -1 of its infrared absorption spectrum, and absorption by the amide group in the wave number region of 1350 to 1320 and 1170 to 3200 cm -1.
Absorption by sulfonamide group in the region of 1150 cm -1
Absorption due to alkyl groups was shown at 2960 cm -1 , 2920 cm -1 , and 2870 cm -1 , and the elemental analysis values also agreed with the calculated values. The polyamide of the present invention is easily soluble in polar solvents such as amides, and can be formed into a film from its solution by conventional means. In addition, the film is strong and exhibits good water permeability and solute exclusion rate.
Useful as a semipermeable membrane. Next, the present invention will be explained with reference to Examples. Example 1 4,4'-diaminodiphenylether-
2,2'-di(N-methylsulfonamide), 73.6
g, 500 g of N-methyl-2-pyrrolidone and 25 g of lithium chloride, the contents are stirred and the flask is cooled in an ice bath. 40.6 g of isophthalic acid chloride was gradually added to this, and the temperature of the contents was maintained at 10°C. After the addition was completed, the reaction temperature was kept at 7°C and
Allowed time to react. During this time, the viscosity of the solution increased.
The product was poured into ice water, and the resulting polyamide precipitate was crushed and thoroughly washed with water until the acidity of the salt was no longer observed. Finally, it was washed with methanol, and the pale gray white powder was dried under reduced pressure at 120°C. The yield was 99g. Elemental analysis results of the product (calculated values are shown in brackets). C: 51.8% (51.15%) H: 4.0% (3.90%) S: 12.0% (12.41%) N: 10.3% (10.85%) The above polyamide did not soften up to 290°C. Moreover, its infrared absorption spectrum is as shown in FIG. Absorption by amide group at wave number 3300 cm -1 , wave number
Absorption due to sulfonamide groups is observed at 1160 cm -1 and 1320 cm -1 and absorption due to methyl group is observed at 2850 cm -1 . Example 2 The polyamide powder obtained in Example 1 was N-methyl-
It is soluble in 2-pyrrolidone, N·N-dimethylacetamide, N·N-dimethylformamide, N·N-diethylformamide, and dimethylsulfonoxide. The reduced viscosity of this polyamide is 2.0 dl/g (solvent dimethylacetamide, concentration 0.1 g/dl solution, temperature 30
℃ (hereinafter the measurement conditions are the same). A 20% solution of this polyamide in dimethylacetamide was prepared and cast onto a glass plate to a thickness of 200 μm, and dried at 140° C. for 5 hours and at 200° C. for 24 hours to produce a film (45 μm thick). This film had a tensile strength of 9 Kg/mm 2 and an elongation rate of 9%. Further, when this film was subjected to thermogravimetric analysis in air (heating rate: 5°C/min), it did not lose weight up to 390°C. In addition, a 10% solution of polyamide in dimethylacetamide containing 10% lithium nitrate was cast onto a glass plate to a thickness of 250 μm, and after the solvent was evaporated at 110°C for 15 minutes, it was immersed in ice water. A transparent film was obtained by gelation. Attach this membrane to a filter and remove 0.5%
Using a sucrose solution, the amount of permeation of water and sucrose was measured at an operating pressure of 5 kg/cm 2 . As a result, the water permeation rate was 0.03ml/ cm2・min, and the sucrose rejection rate was 90.
It was %. Example 3 Into the same apparatus as in Example 1, 82.90 g of 4,4'-diaminodiphenyl ether-2,2'-di(N,N-dimethylsulfonamide), 250 g of N,N-dimethylacetamide, and lithium chloride were added. Add 25g of flask, stir the contents, and cool the flask in an ice bath.
Gradually add 36.6 g of adipic acid chloride to this. After the addition was completed, the reaction was carried out at 5° C. for 5 hours. The resulting solution was treated in the same manner as in Example 1 to obtain polyamide powder.
Obtained 89g. The reduced viscosity of this polyamide is 0.8dl/
It was hot at g. Furthermore, the temperature at which weight loss started was 400°C as determined by thermogravimetric analysis. Elemental analysis results (calculated values in brackets) C: 50.8% (50.37%) H: 5.5% (5.38%) S: 12.0% (12.22%) N: 10.4% (10.68%) The infrared absorption spectrum of this polyamide is As shown in FIG. Absorption based on amide group at wave number 3300 cm -1 , absorption based on sulfonamide group at wave number 1160 cm -1 and 1320 cm -1 , 2960 cm -1 and 2870 cm
-1 shows absorption due to methyl group. Example 4 Into the same apparatus as in Example 1, 94.06 g of 4,4'-diaminodiphenyl ether-2,2'-di(N-n-butylsulfonamide, 250 g of N-methyl-2-pyrrolidone, N. N-dimethylacetamide 250
g, add 25 g of lithium chloride, stir the contents,
Cool the flask in an ice bath. Gradually add 28.4 g of isophthalic acid chloride and 12.18 g of terephthalic acid chloride to this. After the addition was completed, the reaction was carried out at 5° C. for 5 hours. The resulting solution was treated in the same manner as in Example 1 to obtain 120 g of polyamide powder. The reduced viscosity of this polyamide was 1.5 dl/g. Furthermore, the temperature at which weight loss started was 320°C as determined by thermogravimetric analysis. Elemental analysis results (calculated values in brackets) C: 56.1% (55.98%) H: 5.4% (5.38%) S: 10.2% (10.67%) N: 9.1% (9.33%) The infrared absorption spectrum of this polyamide is As shown in FIG. Absorption by amide group at wave number 3300 cm -1 , absorption by sulfonamide group at wave number 1160 cm -1 and 1320 cm -1 , 2960 cm -1 and 2870 cm -1
Absorption due to methyl groups is observed at 2920 cm -1 and absorption due to methylene groups is observed at 2920 cm -1 . Also, this polyamide is N
-Methyl-2-pyrrolidone, N/N-dimethylacetamide, N/N-dimethylformamide,
Soluble in N.N-diethylformamide and dimethyl sulfoxide. Example 5 Two sets of the same apparatus as in Example 1 were prepared, and 4,4'-diaminodiphenyl ether-2,
2'-di(N-butylsulfonamide) 94.06g,
Add 500 g of N-methyl-2-pyrrolidone and 25 g of lithium chloride, stir the contents, and keep one flask at 25°C and the other at 50°C. 40.6 g of isophthaloyl chloride in each flask.
was gradually added and kept at the specified temperature for 6 hours to complete the reaction. Thereafter, in the same manner as in Example 1 and Example 2, the reduced viscosity of the synthetic polyamide and the tensile strength and elongation of the formed dry film were measured. The results are shown in the table.
以上説明したように、本発明によればポリアミ
ドが本来有する機械的強度と耐熱性を保持し、有
機溶媒に対する溶解性に優れ成膜し易い材料が得
られるという効果がある。
As explained above, according to the present invention, it is possible to obtain a material that maintains the mechanical strength and heat resistance inherent to polyamide, has excellent solubility in organic solvents, and is easy to form into a film.
第1図ないし第3図は、本発明のポリアミドの
赤外吸収スペクトル図である。
1 to 3 are infrared absorption spectra of the polyamide of the present invention.
Claims (1)
アルキル基であり、水素原子のみはR1またはR2
のいずれか一方にのみ置換する)、 (R3がHのときR4はCH3、C2H5、R3がCH3の
ときR4はCH3、C2H5、C3H7、C4H3、R3がC2H5の
ときR4はC2H5である)、 (R5はCH3、R6はHかCH3)、またQはm−フ
エニレン基、p−フエニレン基、O−フエニレン
基、 (Y=−O−、−SO2−)、 −(CH2)n− (nは1、2、4〜8)、 である) で示される反復単位から成り、且つ0.5dl/g以上
の還元粘度(ジメチルアセトアミド溶媒、0.1g/
dl濃度、30℃)を示す側鎖にアルキルスルホンア
ミド基を有するポリアミド。 2 (a) 一般式H2N−Ar−NH2(式中Arは 【式】 【式】 (nは0または1、R1、R2は水素または低級ア
ルキル基であり、水素原子のみはR1またはR2
のいずれか一方にのみ置換する)、 (R3がHのときR4はCH3、C2H5、R3がCH3のと
きR4はCH3、C2H5、C3H7、C4H9、R3がC2H5の
ときR4はC2H5である)、 (R5はCH3、R5はHかCH3)、 で示される芳香族ジアミノアルキルスルホンア
ミドと、 (b) 一般式XOOC−Q−COOX(式中Qはm−フ
エニレン基、p−フエニレン基、O−フエニレ
ン基、 (Y=−O−、−SO2−)、 −(CH2)n−(nは1、2、4〜8)、 である。XはCl、Brである。) で示される二塩基酸ハロゲン化物とを、不活性
溶媒中、25℃以下で重縮合させ、0.5dl/g以上
の還元粘度(ジメチルアセトアミド溶媒、0.1
g/dl濃度、30℃)を示す側鎖にアルキルスル
ホンアミド基を有するポリアミドの製法。[Claims] 1. General formula [-NH-Ar-NHCO-Q-CO]- (However, Ar is [Formula] [Formula] (n is 0 or 1, R 1 and R 2 are hydrogen or lower alkyl groups, and the only hydrogen atom is R 1 or R 2
), (When R 3 is H, R 4 is CH 3 , C 2 H 5 , when R 3 is CH 3 , R 4 is CH 3 , C 2 H 5 , C 3 H 7 , C 4 H 3 , R 3 is C 2 H 5 then R 4 is C 2 H 5 ), ( R5 is CH3 , R6 is H or CH3 ), and Q is m-phenylene group, p-phenylene group, O-phenylene group, (Y=-O-, -SO2- ), -( CH2 )n- (n is 1, 2, 4 to 8), ), and has a reduced viscosity of 0.5 dl/g or more (dimethylacetamide solvent, 0.1 g/g)
Polyamide with alkylsulfonamide groups in the side chain. 2 (a) General formula H 2 N−Ar−NH 2 (Ar is [formula] [Formula] (n is 0 or 1, R 1 and R 2 are hydrogen or lower alkyl groups, and the only hydrogen atom is R 1 or R 2
), (When R 3 is H, R 4 is CH 3 , C 2 H 5 , when R 3 is CH 3 , R 4 is CH 3 , C 2 H 5 , C 3 H 7 , C 4 H 9 , R 3 is C 2 H 5 then R 4 is C 2 H 5 ), (R 5 is CH 3 , R 5 is H or CH 3 ), (b) an aromatic diaminoalkylsulfonamide represented by the general formula XOOC-Q-COOX (wherein Q is m-phenylene group, p-phenylene group); group, O-phenylene group, (Y=-O-, -SO2- ), -( CH2 )n- (n is 1, 2, 4 to 8), It is. X is Cl or Br. ) in an inert solvent at 25°C or below to obtain a reduced viscosity of 0.5 dl/g or more (dimethylacetamide solvent, 0.1
A method for producing a polyamide having an alkylsulfonamide group in the side chain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15451177A JPS5486596A (en) | 1977-12-23 | 1977-12-23 | Polyamide having alkyl sulfonamide group side chain |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15451177A JPS5486596A (en) | 1977-12-23 | 1977-12-23 | Polyamide having alkyl sulfonamide group side chain |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5486596A JPS5486596A (en) | 1979-07-10 |
| JPS6129974B2 true JPS6129974B2 (en) | 1986-07-10 |
Family
ID=15585839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15451177A Granted JPS5486596A (en) | 1977-12-23 | 1977-12-23 | Polyamide having alkyl sulfonamide group side chain |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5486596A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3012800A1 (en) * | 1980-04-02 | 1981-10-08 | Bayer Ag, 5090 Leverkusen | AROMATIC DIAMINES CONTAINING SULFONAMID GROUPS |
| US4471110A (en) * | 1982-08-02 | 1984-09-11 | E. I. Dupont De Nemours And Company | Polyamide of disulfonated diamine and permselective membrane thereof |
| US6075166A (en) * | 1995-03-31 | 2000-06-13 | Smithkline Beecham Corporation | Photolytically cleavable encoding and linking agents for use in combinatorial chemistry |
| CN112473398B (en) * | 2020-12-25 | 2022-12-27 | 湖南澳维膜科技有限公司 | High-desalination and anti-pollution reverse osmosis membrane and preparation method thereof |
-
1977
- 1977-12-23 JP JP15451177A patent/JPS5486596A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5486596A (en) | 1979-07-10 |
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