JPS6139629B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a probing device that conducts an electrical test by probing multiple pins on the terminals of multiple types of semiconductor devices mounted on a printed board.
In particular, the present invention relates to a probing device whose operation is ensured by providing a mechanism for detecting the outer shape of each semiconductor element.

In this type of conventional probing equipment,
A plurality of probing heads each equipped with a probe consisting of a large number of probing pins corresponding to the terminals of each semiconductor element are automatically positioned facing each other on each semiconductor element, and the probing heads are lowered to remove the probing pins. Tests are carried out by contacting the terminals of semiconductor devices, but if the positioning of the probing head is misaligned or if a control error causes probing to occur on an unrelated semiconductor device, the pressing force of the probing head becomes large (for example, due to the number of pins). In the case of 80 probing heads), if the pressure is 100 gr per head, the total is 100 x 80 =
8000gr), which caused problems such as damage to expensive elements and damage to the probing head itself.

The present invention is intended to solve the above-mentioned problems,
It is an object of the present invention to provide a probing device that can prevent damage to semiconductor elements and probing heads caused by misalignment of the probing head, incorrect mounting of semiconductor elements, control errors (probing on unrelated semiconductor elements), etc. The purpose is

Embodiments of the invention will now be described with reference to the drawings.

Fig. 1 is an external perspective view showing an embodiment of the probing device according to the present invention, and Fig. 2 is a front view showing the state in which each semiconductor element is mounted. In the figure, 1 is a printed board and 2 is a probing device. .

Two types of semiconductor elements 3A and 3B having different external shapes are mounted on the printed board 1 in a predetermined arrangement.
The semiconductor element 3A includes a plurality of disc-shaped heat dissipation fins 4, and the semiconductor element 3B includes holes 5.

The probing device 2 includes a probing head 6
An arm 7 that supports A and 6B in a vertically movable manner, a drive mechanism (not shown) that drives the arm 7 in the x and y directions (the y direction is a direction perpendicular to the x direction), and a drive mechanism (not shown) that controls the operation of each part of the device. It consists of a control system and instruments not shown. Probing heads 6A and 6B are for probing semiconductor devices 3A and 3B, respectively, and are provided in the same arrangement as semiconductor devices 3A and 3B. The probing head 6A, as shown in detail in FIG.
A main body 9A is vertically movably supported by a protrusion 8A provided on the end surface of the arm 7, and an external shape detection member 10 is vertically movably supported by a guide portion 20A of the main body 9A.
A, and switches 11A and 12A. The main body 9A includes a cylinder 13 attached to the arm 7.
It is connected to the plunger 14A of A, and is guided by the protrusion 8A to move up and down by operating the cylinder 13A. At the bottom of this main body 9A,
A probe 16A (connected to a meter not shown) is provided in a protruding manner corresponding to each terminal 15A of the semiconductor element 3A. The outer shape detection member 10A has a dog 17A fixed to its upper end, and is integrally provided with four check pins 18A at its lower end, and is biased downward by a spring 19A to detect the dog 17A.
is positioned at the position shown in FIG. 3 where it is locked to the guide portion 20A. The switch 11A is fixed to the arm 7, and a dog 21A that engages with the switch 11A is attached to the main body 9A. The probing device 12A is attached to the main body 9A. The probing head 6B is constructed in substantially the same manner as the probing head 6A, as shown in detail in FIG. 4. In the figure, 8B is a protrusion, 9B is a main body,
10B is an outer shape detection member, 11B and 12B are switches, 13B is a cylinder, 14B is a plunger, 1
6B is probe, 18B is check pin, 19B
20B is a guide portion, and 21B is a dog.

Now, each main body 9A, 9B is used as Example 13A, 13.
B is positioned at a height sufficiently retracted from each semiconductor element 3A, 3B, and the arm 7 is driven by a drive source (not shown), so that each probing head 6A, 6B moves to each semiconductor element as shown in FIGS. When positioned at a position facing elements 3A and 3B,
In this state, each switch 11A, 11B, 12A,
12B is each dog 21A, 21B, 17
A, 17B, and l ₁ , l' ₂ , l ₂ ,
The following relationship holds between l′ ₂ , l ₃ , l ₃ , l ₄ , l ₅ , and l ₆ .

l ₁ + l ₃ = l ₂ + l ₄ l _{' 1} = l ₁ + l ₃ l' ₂ = l ₂ + l ₄ l ₅ = l ₆ However, l ₁ ; Distance between the check pin 18A and the uppermost heat dissipation fin 4 l ₂ ; Distance between check pin 18B and semiconductor element 3B l ₃ ; Length of check pin 18A l ₄ ; Length of check pin 18B l ₅ ; Height of element 3A l ₆ ; Height of element 3B l'₁; Switch 11A and dog 21A Distance from the engagement point of switch 11B and dog 21B to the upper end of dog 21A l'₂; Distance from the engagement point of switch 11B and dog 21B to the upper end of dog 21B From this state, by operating cylinders 13A and 13B, each probing head 6A and 6B
The probe is lowered to perform probing, and the details of this process will be explained next.

First, the operation of the probing head 6A will be explained. When the main body 9A is lowered by _l1 from the position shown in FIG. 3, the tip of the check pin 18A reaches a position where the tip of the check pin 18A begins to engage with the heat dissipation fin 4 on the semiconductor element 3A. As shown in FIG. 5a, this check pin 18A is arranged so that it can fit around the outer periphery of the heat dissipation fin 4 with a slight gap when the probing head 6A directly faces the semiconductor element 3A. Therefore, if there are no abnormal factors such as misalignment or incorrect mounting of the semiconductor element 3A, misalignment of the probing head, or control error, the check pin 18A will fit into the heat dissipation fin 4 as the main body 9A continues to descend. When the main body 9A is lowered by a total amount of l ₁ +l ₃ , the check pin holding member 22A of the outer shape detection member 10A comes into contact with the uppermost heat dissipation fin 4, and the engagement between the dock 21A and the switch 11A is released (l' ₁ = l ₁ + l ₃ ). That is, the switch 11A detects contact between the check pin holding member 22A and the heat radiation fin 4, and the outer shape of the semiconductor element 3A is confirmed. When the cylinder 13A is subsequently operated, the main body 9A continues to descend while compressing the spring 19A, and the start of relative movement between the main body 9A and the outer shape detection member 10A is detected by the switch 12A, which releases the engagement with the dog 17A. be done. Finally, the probe 16A comes into contact with the terminal 15A, and probing is performed in this state. If the above abnormality factor exists, the tip of the check pin 18A will come into contact with the uppermost heat dissipation fin 4 when the main body 9A is lowered by _l1 , and then the main body 9A will continue to move while the switch 11A remains engaged with the dog 21A. This movement is detected by switch 12A which disengages dog 17A. In this way, when the switch 11A does not operate and the switch 12A operates, the cylinder 13A operates in the opposite manner to that described above based on the detection signal of the switch 12A, raising the main body 9A. This action prevents damage to the semiconductor element 3A and probing head 6A.

The operation of the probing head 6B is similar, and if there is no abnormality as mentioned above, when the main body 9B is lowered by l ₂ , the hole 5 is opened as shown in Fig. 5b.
When the check pin 19B, which has a shape that allows it to fit into the semiconductor element 3B with a slight gap, starts to engage with the hole 5 of the semiconductor element 3B, and the main body 9B is lowered by a total of l ₂ + l ₄ , the check pin holding member 22B touches the top surface of the semiconductor element 3B. and the dog 21B and the switch 11
The engagement with B is released (because l' ₂ =l ₂ +l ₄ ). That is, the outer shape of the semiconductor element 3B is confirmed. After that, only the main body 9B has a spring 19B.
continues to descend while compressing the main body 9B, and the relative movement between the main body 9B and the outer shape detection member 10B starts when the dog 17
Detected by switch 12B, which is disengaged from switch 12B. Finally, the probe 16B comes into contact with the terminal 15B, and probing is performed in this state. If an abnormality exists, the tip of the check pin 18B comes into contact with the top surface of the semiconductor element 3B when the main body 9B is lowered by _l2 , and the subsequent lowering of the main body 9B is a switch that releases the engagement with the dog 17B. 1
Detected by 2B. In this case, switch 12
In response to the detection signal B, the cylinder 13B operates in the opposite direction to raise the main body 9B, and the action of the evacuation means prevents damage to the semiconductor element 3B and probing head 3B.

In the above explanation, an example was explained in which two types of semiconductor devices are probed, but it is also possible to deal with two or more types of semiconductor devices by providing corresponding probing heads, and the shape of the check pin can be adjusted. etc. may be appropriately set according to the external shape of the semiconductor element.

As described above, according to the present invention, the first detection means (switch 1
1A or 11B and dog 21A or 21B), the detection signal of the second detection means (consisting of switch 12A or 12B and dog 17A or 17B) in which only the main body is lowered appears. Perform probing and
If the detection signal from the second detection means is not detected by the second detection means (when there are abnormal factors such as misalignment or incorrect mounting of the semiconductor element, misalignment of the probing head, or control error), Since the probing head stops descending and then rises, it is possible to prevent damage to the semiconductor element and the probing head in the presence of abnormal factors, which is an excellent effect.

[Brief explanation of the drawing]

The drawings show an embodiment of the probing device according to the present invention, and FIG. 1 is a perspective view showing the overall outline;
Figure 2 is a front view showing the mounting state of each semiconductor element;
3 is a front view showing details of one probing head, FIG. 4 is a front view showing details of the other probing head, and FIGS. 5a and 5b are plan views showing the state of engagement between the check pin and each semiconductor element. It is a diagram. In the figure, 1 is a printed board, 2 is a probing device, 3A, 3B are semiconductor elements, 4 is a heat dissipation fin,
5 is a hole, 6A and 6B are probing heads, 9
A, 9B are the main body, 10A, 10B are external detection members, 11A, 11B, 12A, 12B are switches, 13A, 13B are cylinders, 18A, 15B
is a terminal, 16A, 16B are probes, 17A, 1
7B, 21A, 21B are dog, 18A, 18B
is a check pin, 19A, 19B are springs,
22A and 22B are check pin holding members.

Claims (1)

[Claims] 1. A plurality of probing heads supported by an arm so as to be movable up and down in correspondence with a plurality of types of semiconductor elements having different external shapes mounted on a printed circuit board are made to face each of the semiconductor elements by driving the arm. In the probing apparatus, an electrical test is performed by positioning the probing head, lowering each of the probing heads, and bringing the probe of each of the probing heads into contact with the terminal of each of the conductive elements. The outer shape detecting member capable of engaging only the corresponding semiconductor element is attached to the probing head while the outer shape detecting member completes engagement with the semiconductor element while the probing head is lowered together with the outer shape detecting member by a predetermined amount, and then only the probing head is engaged. a first detecting means is provided so that the outer shape detecting members are lowered, and independently detects the completion of engagement between each of the outer shape detecting members and each of the semiconductor elements; a second detection means for independently detecting the relative movement of the two, and further, when the second detection means detects the relative movement without the first detection means detecting the completion of the engagement; 1. A probing apparatus, characterized in that said retracting means is provided for raising each of said probing heads by actuation thereof.