JPS6148783B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an evaporative cooling device for semiconductor devices that cools semiconductor devices by utilizing a phase change between a liquid phase and a gas phase of a condensable cooling medium.

Generally, this type of boiling cooling device for semiconductor devices is
A condenser is provided above the evaporator in contact with the semiconductor element, and the evaporator and the condenser are communicated with each other through a heat transport pipe to allow a cooling medium to flow therebetween.

When such a boiling cooling device is installed under the floor of an electric car, it is required to be compact due to vehicle limits, the height must be as high as the vehicle limits allow, and the installation area on the car body must be as small as possible. It is required to make it smaller.

As shown in FIG. 1, in the conventional system, evaporators 1 filled with a condensable cooling medium such as fluorocarbons and semiconductor devices 10 are alternately stacked and pressure-welded to form the evaporator 1.
and a condenser 3 are communicated through a heat transport pipe 2. Furthermore, as shown in FIG. 2, a hollow pipe 7 made of an insulating material is provided inside the heat transport pipe 2 and held by a support fitting (not shown), so that the liquid phase cooling medium is transferred to the evaporator 1.
It is designed to circulate at the bottom of the tank. As shown in FIG. 2, the heat transport tube 2 has a bellows 4 connected at one end to the evaporator 1, and an insulating tube 6 connected at each end to the other end of the bellows 4 and the base tube 3A of the condenser 3. It is configured. Although not shown in FIG. 2, since the metal bodies of the cap tube 3A and the bellows 4 are connected to both ends of the insulating tube 6, a metal ring is soldered after metallization treatment. The metal ring and each of the base tube 3A and the bellows 4 are connected by welding.

However, in the above configuration, the evaporator,
Since it is disposed in the height direction of the heat transport pipe and the condenser, the height dimension of this portion becomes long, resulting in a disadvantage that the device becomes large. Additionally, if the height of the heat transport pipe section becomes longer, the height of the condenser cannot be increased due to vehicle limitations, and the width becomes larger, resulting in a reduction in the mounting area to the vehicle body. It also had the disadvantage of being a large device. Moreover, in the above configuration, since it is necessary to provide metal rings at both ends of the insulating tube as described above, the cap tube and the bellows can be connected only in a series direction with the insulating tube.

This invention was made in order to improve the drawbacks of the above-mentioned conventional devices, and a part of the heat transport tube that communicates the evaporator and the condenser is fixed with a metal outer tube and an inner tube through an insulator. By constructing the insulated tube, the height dimension of the heat transport tube can be reduced, and the height of the condenser can be correspondingly increased, making it possible to reduce the installation area on the vehicle body. This paper proposes a device with this configuration.

FIG. 3 is a diagram showing an embodiment of the heat transport tube according to the present invention. Note that parts corresponding to those of the conventional device are given the same reference numerals. In the figure, the insulating tube 6 has an insulator 6 between a metal outer tube 6A and a metal inner tube 6C.
It is constructed by closely fixing B.

In this method, for example, the ridge body 6B is pressure-molded from porcelain such as ceramic, the inner and outer surfaces of the insulator 6B are metallized, and the outer tube 6A and the inner tube 6C are each brazed to the insulator 6B. may be configured. Other manufacturing methods include casting an epoxy resin between the outer tube 6A and the inner tube 6C, or heating and press-molding a raw material mixture of vitreous powder and mica powder to form the outer tube and the inner tube 6C. It may also be manufactured by closely bonding the inner tube. The outer tube 6A of the insulating tube 6 manufactured in this way and the condenser C are welded together, and the inner tube 6C of the insulating tube 6 and one end of the bellows 6 are connected. The other end of the bellows 4 is connected to the evaporator 1, forming a heat transport pipe between the evaporator 1 and the condenser 3. Here, the outer tube 6A and the inner tube 6B are made of an insulator 6.
This is a metal part provided to join B to the metal bodies of the condenser 3 and bellows 4 by welding, and corresponds to the metal ring described above in the conventional device. A structure in which an insulator is interposed between the inner tube and the outer tube can be manufactured easily and inexpensively by casting epoxy resin, etc. as described above, and a structure in which the insulator is sandwiched between the inner tube and the outer tube can be used. Therefore, it is possible to obtain a product with high strength and low risk of breakage. It should be noted that the outer tube 6A, insulator 6B, and inner tube 6C of the insulating tube 6 are not limited to the shapes shown in the embodiments, but may be modified in various ways.

FIG. 4 shows another embodiment, in which a bellows 4 is connected to the upper end of the inner tube 6C of the insulating tube 6, and the condenser 3 and evaporator 1 are further connected compared to the one in FIG. Dimensions can be reduced. The above description has been about the case where the heat transport pipe is connected to the bottom plate of the condenser 3 in which the condensing part and the liquid reservoir part are integrated. In the case of a structure that is separated into a liquid reservoir section for storing the liquid phase of No. 8, a heat transport pipe is connected between the liquid reservoir section and the evaporator 1, so that such a connecting component is required. Of course, the present invention can also be used.

As described above, according to the present invention, a part of the heat transport tube that communicates the evaporator and the condenser is constituted by an insulating tube in which the outer tube and the inner tube of the metal tube are fixed to each other via an insulator. Therefore, the height between the condenser and the evaporator can be shortened. Since the height of the condenser can be increased due to the shortened length, the area of the mounting surface to the vehicle body can be reduced, and a compact and lightweight device can be manufactured.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the configuration of a general evaporative cooling device for semiconductor devices to which the present invention is applied, FIG. 2 is a cross-sectional diagram showing the configuration of a conventional heat transport pipe portion, and FIG.
4 and 4 are sectional views each showing the structure of a heat transport pipe portion in an embodiment of the present invention. In the figure, 1 is an evaporator, 2 is a heat transport tube, 3 is a condenser, 6 is an insulation tube, 6A is an outer tube, 6B is an insulator, 6
C is the inner tube. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] 1. A part of the heat transport tube that communicates the evaporator and the condenser is made of a metal outer tube and an inner tube that are fixed via an insulator, and one of the double tubes is connected to the condenser. A boiling cooling device for semiconductor devices, characterized in that it is constructed of a double insulated tube.