JPS6318333B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an evaporative cooling device for a semiconductor device that cools a semiconductor device by utilizing a phase change between a liquid phase and a gas phase of a condensable cooling medium.

In general, a boiling cooling device for semiconductor devices is configured such that a condenser is provided above an evaporator that is in contact with a semiconductor element, and the evaporator and condenser are communicated with each other through a heat transport pipe to circulate a cooling medium. be.

For example, when the above-mentioned evaporative cooling device for semiconductor devices is mounted under the floor of an electric car, there is a limit to the vehicle limit, and miniaturization is required, and in particular, the height must be up to the maximum allowable by the vehicle limit. Moreover, it is required that the mounting area on the vehicle body be made as small as possible.

As shown in FIG. 1, the conventional type includes an evaporator 1 in which a condensable cooling medium such as fluorocarbon is sealed and is alternately stacked and pressure-contacted with semiconductor elements 10 to cool the semiconductor elements 10; The cooling medium that absorbs heat and becomes a vapor phase and condenses into a liquid phase are communicated with the condenser 3 through a straight heat transport pipe 2 that transports the cooling medium that has become a vapor phase and a liquid phase.
Note that the hollow pipe 7 made of an insulator provided inside the heat transport tube 2 is for circulating a liquid phase cooling medium to the bottom of the evaporator 1.

As shown in FIG. 2, such a heat transport tube 2 is composed of an insulating tube 6 provided on the evaporator 1 side and a bellows 4 provided on the condenser 3 side. The insulating tube 6 is for electrically insulating the semiconductor element 10 and the condenser 3, and the bellows 4 is used to keep the heat transport tube 2 in the left-right direction in FIG. 1 when the semiconductor element 10 breaks down and is replaced. The insulating tube 6 and the bellows 4 each require a certain length. It is.

However, in the conventional configuration as described above, the evaporator, heat transport pipe, and condenser are arranged in the height direction. It may not be possible to take the entire height of the evaporator, etc., and as a result,
The height of the condenser has to be sacrificed in exchange for a larger installation area on the vehicle body, which has the disadvantage that the evaporative cooling device for semiconductor devices has to be larger.

In order to improve the above-mentioned drawbacks of the conventional device, the present invention has the following features:
The purpose of the present invention is to provide a small and lightweight evaporative cooling device for a semiconductor device in which the actual dimension in the height direction of a heat transport pipe is reduced and the height of a condenser is correspondingly increased to reduce the mounting area on a vehicle body.

FIG. 3 is a diagram showing an embodiment of the heat transport tube according to the present invention. In this figure, the heat transport pipe 2 is an insulated pipe 6 of a predetermined length, one end of which is connected to the condenser 3.
and a bellows 4 of a predetermined length, each end of which is connected to the other end of the insulating tube 6 and the mouthpiece 1A of the evaporator 1, and the relationship between the insulating tube 6 and the bellows 4 is shown in FIG. A bellows 4 is installed inside the insulating tube 6.
is arranged in a double pipe structure, and the insulating pipe 6
Both the bellows 4 and the bellows 4 have the same length as the conventional one.

As described above, in the present invention, the bellows 4 is arranged inside the insulating tube 6 in a double tube structure, so the actual dimensions in the height direction of the entire heat transport tube are as follows: Although the length is the same as the conventional dimensions, it is shorter by the overlapping dimension of the insulating tube 6 and the bellows 4 compared to the conventional straight tube shape. Therefore, although the lengths of the insulating tube 6 and the bellows 4 are the same as those of the conventional device, the actual height of the condenser is shorter than that of the heat transport tube. As a result, the installation area of the vehicle body, that is, the lateral or depth dimensions of the condenser, can be reduced, which has the effect of making it possible to downsize the evaporative cooling device for semiconductor devices. have.

FIG. 4 is a diagram showing another embodiment of the present invention.
The difference from the figure is that a connecting tube 5 is interposed between the bellows 4 and the insulating tube 6 in order to join the bellows 4 and the insulating tube 6. FIG. 5 shows another embodiment in which the connecting pipe 5 is constructed of a conical pipe.

When replacing a semiconductor element, the evaporator 1 shown in FIG. 4 is moved left and right to remove and install the semiconductor element to be replaced. However, moving the evaporator 1 left and right causes the bellows 4 to deform. It is carried out by. The amount of deformation of the bellows 4 is limited at the position where the outside of the bellows 4 and the connecting tube 5 abut, but by making the connecting tube 5 a conical tube as shown in FIG. The amount of deformation of the bellows can be greatly improved compared to the conventional one.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the configuration of a cooling device for semiconductor devices, FIG. 2 is a diagram showing a cross section of a conventional heat transport pipe, and FIG. 3 is a diagram showing a cross section of a heat transport pipe according to an embodiment of the present invention. FIGS. 4 and 5 are cross-sectional views of heat transport tubes showing other embodiments of the present invention. In the figure, 1 is an evaporator, 2 is a heat transport pipe, 3 is a condenser, 4 is a bellows, 5 is a connecting pipe, 6 is an insulation pipe, 7
is a hollow pipe, and 8 is a cooling medium.

Claims (1)

[Scope of Claims] 1. A heat transport tube that communicates an evaporator and a condenser is composed of an insulating tube whose one end is connected to the condenser and a bellows whose one end is connected to the evaporator, and A boiling cooling device for a semiconductor device, characterized in that the bellows is disposed inside the device. 2. The boiling cooling device for a semiconductor device according to claim 1, wherein the bellows and the insulating tube are connected by a connecting tube. 3 Claim 2 in which the connecting pipe is conical
The evaporative cooling device for semiconductor devices as described in 2.