JPS6150159B2 - - Google Patents
Info
- Publication number
- JPS6150159B2 JPS6150159B2 JP19714582A JP19714582A JPS6150159B2 JP S6150159 B2 JPS6150159 B2 JP S6150159B2 JP 19714582 A JP19714582 A JP 19714582A JP 19714582 A JP19714582 A JP 19714582A JP S6150159 B2 JPS6150159 B2 JP S6150159B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- metal
- plated
- strip
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 239000002390 adhesive tape Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 1
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は金属帯の片面メツキ方法の改良に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for plating a metal strip on one side.
金属帯、例えばアルミ帯の片面並びに帯巾両端
面に異種金属、例えば銅を電気メツキする場合、
従来においては、第１図に示すようにアルミ帯
１′の非メツキ面１１′を粘着性シート２′でマス
キングし、このマスキングしたアルミ帯をメツキ
槽に通過させているが、メツキ液に接する粘着性
シートの面積が広く、メツキ液の汚損が問題とな
る。 When electroplating a different metal, such as copper, on one side of a metal strip, such as an aluminum strip, and on both ends of the strip,
Conventionally, as shown in Fig. 1, the non-plated surface 11' of the aluminum strip 1' is masked with an adhesive sheet 2', and the masked aluminum strip is passed through a plating tank, but the masked aluminum strip is passed through a plating tank. Since the area of the adhesive sheet is large, contamination of the plating liquid becomes a problem.
上記した不利は、第２図に示ように２枚のアル
ミ帯１′，１′の片面同志を粘着性テープ２′によ
つて互に重ね合せ、この重合体を電気メツキすれ
ば、メツキ液に接する粘着性テープ部分を巾両端
の端面２１′，２１′のみの僅小面積部分にとどめ
得るから、前記メツキ液の汚損を実質上排除でき
る。更に、２枚のアルミ帯を同時にメツキでき、
作業能率にも秀れている。 The above-mentioned disadvantages can be overcome by overlapping one side of two aluminum strips 1', 1' with adhesive tape 2' and electroplating this polymer, as shown in Fig. 2. Since the portion of the adhesive tape in contact with the plating liquid can be limited to a very small area of only the end faces 21', 21' at both ends of the width, contamination of the plating liquid can be substantially eliminated. Furthermore, it is possible to plate two aluminum strips at the same time.
He also has excellent work efficiency.
ところで、従来、金属帯をメツキするには、金
属帯を両側面において挾持する電極（例えばロー
ル電極）で給電を行つている。しかし、上記のよ
うに２枚のアルミ帯を粘着性テープによつて互に
アルミ帯の片面同志を重ね合わせたものに、第２
図に示すように上記した側面挾持式の電極３′，
３′によつて給電を行うとその挾持力のために粘
着性テープ２′が圧縮を受けて重ね合せ部の端面
からはみ出し、アルミ帯が薄い場合は、そのはみ
出し２０′がアルミ帯端面のメツキに支障となる
ことがある。 By the way, conventionally, when plating a metal strip, power is supplied using electrodes (for example, roll electrodes) that sandwich the metal strip on both sides. However, as mentioned above, when two aluminum strips are stacked one side on the other using adhesive tape, a second
As shown in the figure, the above-mentioned side clamping type electrode 3',
When power is supplied through 3', the adhesive tape 2' is compressed due to its clamping force and protrudes from the end surface of the overlapping part. If the aluminum strip is thin, the protrusion 20' may cause the plating of the end surface of the aluminum strip. It may be a hindrance to
本発明に係る金属帯のメツキ方法は、粘着材に
よつて片面同志を互に重ね合わせた金属帯を上記
の不利なくメツキし得る方法であり、上記の如く
重ね合わされた金属帯のその帯巾端の端面に給
電々極を接触させて電気メツキすることを特徴と
する方法である。 The method for plating metal strips according to the present invention is a method that can plate metal strips that are overlapped on one side with an adhesive material without the above-mentioned disadvantages, and the width of the metal strips that are overlapped as described above can be plated. This method is characterized by electroplating by bringing a power supply electrode into contact with the end face of the end.
以下、図面により本発明を説明する。 The present invention will be explained below with reference to the drawings.
第３図Ａは本発明において使用するメツキ装置
の一例を示している。 FIG. 3A shows an example of a plating device used in the present invention.
第３図Ａにおいて、１はメツキ槽、２はメツキ
液であり、被メツキ体Ａはメツキ槽のスリツト１
１を通つて連続メツキされる。２０は上記スリツ
トから漏出する液でこの漏出液はポンプ（図示せ
ず）によりメツキ槽に返送される。３は水洗槽、
４は水洗槽とメツキ槽との中間室である。 In Fig. 3A, 1 is a plating tank, 2 is a plating solution, and the object to be plated A is the slit 1 of the plating tank.
Continuous plating is performed through 1. Reference numeral 20 indicates liquid leaking from the slit, and this leaking liquid is returned to the plating tank by a pump (not shown). 3 is a washing tank,
4 is an intermediate chamber between the washing tank and the plating tank.
５は中間室４に設けた給電電極であり、金属帯
Ａの下端々面が摺動接触する電極（例えば銅製）
５１を絶縁台５２上にスプリング５３……によつ
て支持した構成である。５４は給電リード線であ
る。 Reference numeral 5 denotes a power supply electrode provided in the intermediate chamber 4, which is an electrode (made of copper, for example) that the lower ends of the metal band A come into sliding contact with.
51 is supported on an insulating stand 52 by springs 53... 54 is a power supply lead wire.
６は金属帯ガイドロールであり、被メツキ体を
損傷することのないようゴム製でできている。 A metal band guide roll 6 is made of rubber so as not to damage the body to be plated.
上記において、給電々極５はメツキ槽の入口側
に設けたが、出口側または入口側と出口側の双方
に設けることもできる。 In the above description, the power supply electrode 5 is provided on the inlet side of the plating tank, but it can also be provided on the outlet side or both the inlet and outlet sides.
本発明を実施するには第３図Ｂに示すように２
枚の金属帯ａ，ａ例えばアルミ帯を粘着テープｂ
によつて互にその片面同志を重ね合せて一体化
し、この一体化された金属帯Ａを上記メツキ装置
に通過させ、一体化された金属帯Ａの帯巾端の端
面に給電電極５を接触させて電気メツキを行つて
いく。 To carry out the present invention, as shown in FIG.
A piece of metal strip a, a for example an aluminum strip with adhesive tape b
The integrated metal strip A is passed through the plating device, and the power supply electrode 5 is brought into contact with the end face of the band width of the integrated metal strip A. Let's do the electric plating.
この場合、金属帯Ａはその帯巾端の端面におい
て給電電極５に接触するだけであり、両側面間に
おいては圧縮されることがないから、金属帯Ａの
端面からの既述した粘着テープのはみ出しをよく
排除できる。 In this case, the metal band A only contacts the power supply electrode 5 at the end face of the band width, and is not compressed between both sides, so that the above-mentioned adhesive tape from the end face of the metal band A contacts the power supply electrode 5. Extrusion can be effectively eliminated.
従つて、金属帯Ａは両側面と共に両端面も良好
にメツキされていき、メツキ後、金属帯Ａから粘
着テープを剥離すれば片面並びに巾両端の端面と
もが良好に銅メツキされたアルミ帯を得ることが
できる。 Therefore, the metal strip A is well plated on both sides as well as both end faces, and after plating, when the adhesive tape is peeled off from the metal strip A, an aluminum strip with both one side and the end faces on both ends of the width plated with copper is obtained. Obtainable.
このように本発明によれば、両端面をも良好に
メツキした片面メツキ金属帯を得ることができ
る。また、図示の実施例においては、被メツキ体
の下端端面に給電々極を接触させているから、そ
の接触摩擦のために摩耗粉が発生しても、その摩
耗粉の被メツキ体への付着をよく防止でき、かゝ
る面からもメツキ品質の向上に有利である。 As described above, according to the present invention, it is possible to obtain a single-sided plated metal strip in which both end faces are well plated. In addition, in the illustrated embodiment, since the power supply electrode is brought into contact with the lower end face of the object to be plated, even if abrasion powder is generated due to the contact friction, the abrasion powder will not adhere to the object to be plated. This method is advantageous in improving the plating quality.
第１図並びに第２図はそれぞれ、従来の金属帯
の片面メツキ方法を示す説明図、第３図Ａは本発
明において使用するメツキ装置を示す説明図、第
３図Ｂは第３図Ａにおけるｂ―ｂ断面説明図であ
る。
図において、ａ，ａは被メツキ金属帯、ｂは粘
着材、５は給電々極である。
1 and 2 are explanatory diagrams showing a conventional single-sided plating method for a metal strip, FIG. 3A is an explanatory diagram showing a plating device used in the present invention, and FIG. 3B is an explanatory diagram showing a plating device used in the present invention. It is a bb cross-sectional explanatory diagram. In the figure, a and a are metal strips to be plated, b is an adhesive material, and 5 is a power supply electrode.
Claims (1)
よつて互に重ね合せて一体化し、この一体化され
た金属帯の帯巾端の端面に給電々極を接触させて
電気メツキすることを特徴とする金属帯のメツキ
方法。1. One side of two metal strips to be plated are stacked on top of each other with an adhesive and integrated, and electroplating is performed by contacting a power supply electrode to the end face of the band width of this integrated metal strip. A metal band plating method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19714582A JPS5985894A (en) | 1982-11-09 | 1982-11-09 | Plating method of metallic strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19714582A JPS5985894A (en) | 1982-11-09 | 1982-11-09 | Plating method of metallic strip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5985894A JPS5985894A (en) | 1984-05-17 |
| JPS6150159B2 true JPS6150159B2 (en) | 1986-11-01 |
Family
ID=16369502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19714582A Granted JPS5985894A (en) | 1982-11-09 | 1982-11-09 | Plating method of metallic strip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5985894A (en) |
-
1982
- 1982-11-09 JP JP19714582A patent/JPS5985894A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5985894A (en) | 1984-05-17 |
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