JPS6159530B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a probe card used for testing semiconductor wafers.

Conventional probe cards have an insulating substrate with a hole in the center for microscopic observation, and probes are arranged radially surrounding the hole. Adjust the position of each probe so that the tip of the probe matches the arrangement position of the terminals on the wafer while observing the terminals of the semiconductor wafer to be tested placed on the wafer or the diagram depicting the arrangement position of the terminals. There is a need to do. Not only is this process becoming more and more time-consuming and complex, especially as the number of terminals on wafers increases, but probe cards manufactured in this way are also less difficult to handle. There are disadvantages such as the position of the probe changes due to carelessness, requiring readjustment of the probe position.

The present invention eliminates the above-mentioned drawbacks and prevents the relative positional relationship between the contact pieces to the wafer terminals from shifting during a certain work process regardless of the number of terminals on the wafer or the complexity of the terminal arrangement pattern. ,
Moreover, it is an object of the present invention to provide a method for manufacturing a probe card in which the contacts do not slip even when the terminals are of a bump type.

For the above purpose, the present invention involves baking a terminal pattern of a semiconductor wafer to be tested on a substrate coated with photoresist, then removing the photoresist in the terminal pattern area and depositing metal thereon to a predetermined thickness. a step of attaching the contact to the wafer terminal; a step of electrically connecting a lead wire to the contact; a step of molding the contact with an elastic body with the lead wire pulled out to the outside; After the contact is molded by the body, the method includes a step of removing the substrate, and a step of fixing the elastic body on which the contact is molded to a plate having a predetermined strength.

Embodiments of the present invention will be described below based on the drawings.

First, as shown in Fig. 1, a copper substrate 1 with a thickness of 0.2 mm is coated with, for example, Kodak Microresist 752 as a photoresist 2 whose exposed areas are dissolved in a developer, and a semiconductor wafer to be tested is coated on it. After the terminal pattern 3 is baked, it is developed and the photoresist on the terminal pattern portion is removed.
In this case, the baking is performed in such a way that parts other than the terminal pattern are exposed to light. Figure 2 shows the adhesion state of the photoresist on the copper substrate at this stage.
A cross section taken along line L in the figure is shown.
Next, gold electroplating is applied to the copper substrate 1 from the side with the terminal pattern, as shown in FIG.
After depositing gold 4 to a thickness of 0.01 to 0.005 mm on the terminal pattern part 3 to form a contact 4 to the wafer terminal, the photo remaining on the part other than the terminal pattern part as shown in FIG. Resist 2 with solvent,
For example, it is dissolved and removed using a micro-resist removal solution manufactured by Kodak Co., Ltd., and the lead wire 5 is welded to the contact 4. Thereafter, a frame 6 is assembled around the contact 4, and with the lead wire 5 pulled out, rubber is poured into the frame 6 and solidified, the contact is molded with an elastic body 7, and then The reinforcing plate 8 is solidified by pouring epoxy resin, and then the frame 6
(Figure 6). Next, the elastic body is etched in carbon tetrachloride to the extent that the contact surface of the contact is sufficiently exposed. This is fixed to a glass epoxy resin plate 9 as shown in FIG. 7 to obtain a probe card according to the manufacturing method of the present invention.

As described above, according to the present invention, the contacts to the terminals of the wafer to be tested are obtained through a constant photoprinting process regardless of the number of terminals or the complexity of the arrangement pattern, and the contacts between the contacts are No deviation occurs. Furthermore, by using the probe card manufactured by the method based on the present invention, the two-dimensional positional relationship between the wafer and the probe card can be adjusted even when aligning the positions between the contacts and the wafer terminals during wafer testing. need only be determined once, and there is no need to monitor and adjust the contact between the probe and wafer terminal for each probe using a microscope, as is the case with conventional probe cards.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a state in which the arrangement of terminals of a semiconductor wafer is printed onto a photoresist on a copper substrate in an embodiment of the present invention. Figure 2 is a cross-sectional view showing the developed photoresist on the substrate shown in Figure 1, and Figure 3 shows the developed terminal pattern shown in Figure 2, which will become a contact to the wafer terminal. FIG. 4 shows a state in which metal is attached, and FIG. 4 shows a state in which lead wires are connected to the contacts and the remaining photoresist on the copper substrate is removed. FIG. 5 is a diagram for explaining the process of molding the contact with an elastic body and providing a reinforcing plate. FIG. 6 shows a cross section of a contact unit molded with elastic material and provided with a reinforcing plate. FIG. 7 is a diagram showing a cross section of a probe card manufactured according to this example. DESCRIPTION OF SYMBOLS 1...Copper board, 2...Photoresist, 3...Terminal pattern, 4...Contactor, 5...Lead wire, 6...Frame, 7
... Elastic body, 8... Reinforcement plate, 9... Glass epoxy resin.

Claims (1)

[Claims] 1 After photoprinting the terminal pattern of the semiconductor wafer to be tested on a substrate coated with photoresist, the photoresist of the terminal pattern is removed to expose the surface of the substrate in that area, and a predetermined thickness is applied thereto. A contact to the terminal of the semiconductor wafer is formed by attaching metal to the semiconductor wafer, a lead wire is electrically connected to the contact, and the contact is molded with an elastic material while the lead wire is pulled out. and a method of manufacturing a probe card, which comprises removing the substrate and fixing the elastic body having the contact molded thereon to a plate having a predetermined strength.