JPS6161243B2 - - Google Patents
Info
- Publication number
- JPS6161243B2 JPS6161243B2 JP14334978A JP14334978A JPS6161243B2 JP S6161243 B2 JPS6161243 B2 JP S6161243B2 JP 14334978 A JP14334978 A JP 14334978A JP 14334978 A JP14334978 A JP 14334978A JP S6161243 B2 JPS6161243 B2 JP S6161243B2
- Authority
- JP
- Japan
- Prior art keywords
- metal case
- solder
- jig
- thermistor element
- thermistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000006866 deterioration Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Thermistors And Varistors (AREA)
Description
【発明の詳細な説明】
本発明はサーミスタ素子を金属ケース内に収納
してなるサーミスタセンサーの製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a thermistor sensor in which a thermistor element is housed in a metal case.
この種のサーミスタセンサーの製造方法とし
て、金属ケー内にデイスク形半田、サーミスタ素
子および治具を順次挿入配置し、前記金属ケース
を外部から加熱して前記デイスク形半田を溶融
し、前記治具または金属ケースの重量を利用して
前記サーミスタ素子を前記金属ケースの内底面に
固着することが提案されている。 As a method for manufacturing this type of thermistor sensor, a solder disk, a thermistor element, and a jig are sequentially inserted into a metal case, the metal case is heated from the outside to melt the solder disk, and the jig or It has been proposed to use the weight of the metal case to fix the thermistor element to the inner bottom surface of the metal case.
しかし、この製造方法による場合、サーミスタ
素子を金属ケースに固着する半田中に気泡ボイド
が形成され易い。ボイドが生ずるとサーミスタ素
子にクラツクが入り易くなつたり、サーミスタ素
子から金属ケースへの熱伝導度が低下して特性低
下ないし劣化促進を生じたりするので好ましくな
い。 However, with this manufacturing method, bubble voids are likely to be formed in the solder that fixes the thermistor element to the metal case. The occurrence of voids is undesirable because cracks are likely to occur in the thermistor element, and thermal conductivity from the thermistor element to the metal case is reduced, resulting in deterioration of characteristics or acceleration of deterioration.
従つて本発明の目的はサーミスタ素子を金属ケ
ースに固着する半田中にボイドを生じないような
サーミスタセンサーの製造方法を提供することに
ある。 SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method for manufacturing a thermistor sensor that does not create voids in the solder that secures the thermistor element to a metal case.
この目的を達成するために本発明は半田が溶融
した状態で治具を回動することによりサーミスタ
素子を金属ケースに対して回動し、それにより溶
融状態の半田をかきまわすようにしたものであ
る。 In order to achieve this object, the present invention rotates the thermistor element relative to the metal case by rotating a jig while the solder is in a molten state, thereby stirring up the molten solder. .
以下、図面を参照して本発明を詳細に説明す
る。図に示すように、例えば取付用ネジ部２ａを
形成した黄銅から成る金属ケース２内にデイスク
形半田４、サーミスタ素子６および治具８を順次
挿入配置する。サーミスタ素子６にはリード線１
０が接続されており、それは治具１０を貫通して
金属ケース２の外部に導出されている。この状態
で金属ケース２を電気炉や半田槽などに入れて金
属ケース２を外部から加熱し、半田４を溶融させ
る。半田４が溶融した状態で、治具８を例えば＋
90゜から−90゜といつた具合に２〜３回回動する
ことにより、サーミスタ素子６を金属ケース２に
対して回動させる。こうすることにより溶融状態
の半田４が軽くかきまわされ、その内部に形成さ
れ、或いは形成されつつあつたボイドは消滅す
る。そして、治具８の重量により、或いは金属ケ
ースを逆様にして金属ケース２の重量により、半
田４を金属ケース２の内底面とサーミスタ素子６
との間に一様に介在され、その後冷却することに
より半田付けによる固着が終了する。なお、同図
より判るように、治具８の先端部は、素子６を回
転させるに必要な重量を与えるべく先端部の一部
に段部７が設けられ素子の上面にあたるようにさ
れ、先端部９は素子の側面に沿つてのびかつ半田
につかないようにされている。 Hereinafter, the present invention will be explained in detail with reference to the drawings. As shown in the figure, a solder disk 4, a thermistor element 6, and a jig 8 are sequentially inserted into a metal case 2 made of brass, for example, with a mounting thread 2a formed therein. Lead wire 1 is connected to the thermistor element 6.
0 is connected, and it passes through the jig 10 and is led out to the outside of the metal case 2. In this state, the metal case 2 is placed in an electric furnace, a solder bath, etc., and the metal case 2 is heated from the outside to melt the solder 4. In the state where the solder 4 is melted, the jig 8 is
The thermistor element 6 is rotated relative to the metal case 2 by rotating from 90 degrees to -90 degrees two to three times. By doing this, the molten solder 4 is lightly stirred, and voids that have been formed or are being formed therein disappear. Then, by the weight of the jig 8 or by the weight of the metal case 2 when the metal case is turned upside down, the solder 4 is applied to the inner bottom surface of the metal case 2 and the thermistor element 6.
After that, by cooling, the fixation by soldering is completed. As can be seen from the same figure, the tip of the jig 8 is provided with a step 7 at a part of the tip to provide the weight necessary to rotate the element 6, so that it touches the top surface of the element. The portion 9 extends along the side surface of the element and is prevented from coming into contact with solder.
この後、治具８を引抜き、金属ケース２の上部
開口部に図示していない端子板を被せて封止する
ことによりサーミスタセンサーが完成される。 Thereafter, the jig 8 is pulled out and a terminal plate (not shown) is placed over the upper opening of the metal case 2 to seal it, thereby completing the thermistor sensor.
以上述べたように本発明によれば、溶融状態の
半田を、治具およびサーミスタ素子を介して軽く
かきまわすことにより半田中のボイドを無くし、
それによりサーミスタ素子のクラツク発生を防止
し、熱伝導度の優れた良品質のサーミスタセンサ
ーを提供することができる。このようなセンサー
は例えば水温計の場合のように放熱係数のばらつ
きが直接影響するような器具に利用してその効果
は大きい。 As described above, according to the present invention, voids in the solder are eliminated by gently stirring the molten solder through a jig and a thermistor element.
This prevents the thermistor element from cracking and provides a high-quality thermistor sensor with excellent thermal conductivity. Such a sensor is highly effective when used in appliances that are directly affected by variations in heat dissipation coefficients, such as water thermometers.
図は本発明の製造方法を説明するための断面図
である。
２…金属ケース、４…デイスク形半田、６…サ
ーミスタ素子、８…治具。
The figure is a sectional view for explaining the manufacturing method of the present invention. 2...Metal case, 4...Disc-shaped solder, 6...Thermistor element, 8...Jig.
Claims (1)
素子および治具を順次挿入配置した後、前記金属
ケースを外部から加熱して前記デイスク形半田を
溶融し、半田溶融状態において前記治具を回動す
ることにより前記サーミスタ素子を前記金属ケー
スに対して回動すると共に前記治具または金属ケ
ースの重量を利用して前記サーミスタ素子を前記
金属ケースの内底面に固着することを特徴とする
サーミスタセンサーの製造方法。1. After sequentially inserting and arranging a disc-shaped solder, a thermistor element, and a jig into a metal case, heating the metal case from the outside to melt the disc-shaped solder, and rotating the jig while the solder is in a molten state. A method for manufacturing a thermistor sensor, comprising: rotating the thermistor element relative to the metal case, and fixing the thermistor element to the inner bottom surface of the metal case using the jig or the weight of the metal case. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14334978A JPS5570002A (en) | 1978-11-22 | 1978-11-22 | Method of manufacturing thermistor sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14334978A JPS5570002A (en) | 1978-11-22 | 1978-11-22 | Method of manufacturing thermistor sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5570002A JPS5570002A (en) | 1980-05-27 |
| JPS6161243B2 true JPS6161243B2 (en) | 1986-12-24 |
Family
ID=15336713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14334978A Granted JPS5570002A (en) | 1978-11-22 | 1978-11-22 | Method of manufacturing thermistor sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5570002A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01119442A (en) * | 1987-11-02 | 1989-05-11 | Yokohama Rubber Co Ltd:The | Energy absorbing type seat |
-
1978
- 1978-11-22 JP JP14334978A patent/JPS5570002A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01119442A (en) * | 1987-11-02 | 1989-05-11 | Yokohama Rubber Co Ltd:The | Energy absorbing type seat |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5570002A (en) | 1980-05-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0464025A (en) | Temperature sensor for cooking apparatus | |
| JPH01250730A (en) | Thermocouple | |
| US3896409A (en) | Liquid level sensor for corrosive baths | |
| JPS6161243B2 (en) | ||
| US3376376A (en) | Miniature transistor enclosed in a glass disc-shaped housing | |
| JPH02910Y2 (en) | ||
| KR100403140B1 (en) | heat block device for manufacturing semiconductor package | |
| JPS61163644A (en) | Method and member material for sealing semiconductor device | |
| JPH0230837Y2 (en) | ||
| JPH0517834Y2 (en) | ||
| SU101167A1 (en) | Method of connecting parts of glass bulbs of electronic and other lamps | |
| JPS59111625U (en) | electric cooker | |
| JPS595284B2 (en) | How to manufacture an electric cooker | |
| JPS5844342Y2 (en) | Thermistor sensor for water heater | |
| JPS60116932U (en) | boiler | |
| JPS5919394A (en) | Method of soldering multiterminal element | |
| JPH0555071A (en) | Film capacitor | |
| KR820000468Y1 (en) | Semiconductor device | |
| JPS61271774A (en) | Heater unit | |
| JPH01178207A (en) | Cooker | |
| JPH0279440A (en) | Ball forming method | |
| JPH05243722A (en) | Semiconductor device mounting method | |
| JPH08264929A (en) | Bump melting and connecting structure | |
| JPS5972747A (en) | Semiconductor package and sealing method thereof | |
| JPH02237141A (en) | Semiconductor device |