JPS6210779B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching a workpiece to a holder in a lap processing device by adhesively bonding the workpiece to a holder, and particularly for attaching the workpiece to a holder attachment surface by uniformly bonding the workpiece with high precision. Regarding the installation method.

Generally, as shown in FIGS. 1 and 2, in a lap processing device, a workpiece 2 is adhered to a workpiece mounting surface 1' of a holder 1 in a circumferential direction. The surface of the workpiece is lapped by rotating and revolving around the surface of the workpiece while applying a weight 5 with a predetermined load on a lapping surface plate 4 onto which abrasive grains 3 are dripped.

By the way, in this case, the workpiece is always machined parallel to the workpiece mounting surface 1' of the holder 1, so if the workpiece 2 is attached to the holder 1 at an angle, the workpiece 2 itself will be damaged by the lap process. Parallelism deteriorates and dimensional variations increase.

Therefore, when bonding the workpiece 2 to the holder 1, it is necessary to bond the workpiece 2 uniformly and without tilting as much as possible.

Furthermore, the adhesive used to bond the workpiece 2 to the holder 1 often contains impurities and dust, and these impurities and dust may be inserted between the workpiece 2 and the holder 1, causing the parallel Therefore, it is necessary to prevent impurities and dust in the adhesive from being inserted between the two.

However, in conventional devices, as shown in, for example, Japanese Patent Publication No. 46-26395, Japanese Patent Application Publication No. 47-40281, and Japanese Patent Application Publication No. 49-37278, a groove is formed on a holder. After applying the adhesive, the workpiece is placed on the holder and attached by applying pressure.

Therefore, depending on the molten state of the adhesive, the adhesive may become a nuisance, and impurities and dust in the adhesive may remain between the workpiece and the holder, and the two may not necessarily be installed parallel to each other, impairing machining accuracy. It was difficult to improve.

The present invention has been made in view of these conventional drawbacks, and involves cutting a groove in the workpiece mounting surface of the holder, placing the workpiece on top of the groove, and using an elastic body to apply the load evenly. A weight is placed on the holder, and in this state, the molten adhesive is soaked between the holder and the workpiece through the groove, forming an adhesive layer with a constant thickness that is inversely proportional to the load on the weight, and attaching the workpiece to the workpiece. A method for attaching a workpiece to a holder is provided.

The method of the present invention will be explained below with reference to the embodiments of the drawings.

A fine grid-like groove 6 is cut in the workpiece mounting surface 1' of the holder 1, as shown in FIG.

Then, as shown in FIG. 4, the holder 1 is installed horizontally with the groove 6 facing upward. Next, the workpiece 2 is placed on the groove 6 of the holder 1 in a circumferential direction, and a weight 8 with a predetermined load is placed on the workpiece 2 via a heat-resistant rubber material 7.

Then, the surface of the rubber material 7 that is in contact with the workpiece 2 is elastically deformed, and even if the surface of the workpiece 2 is slightly inclined, it comes into contact with the entire surface of the workpiece 2. Therefore, the load of the weight 8 is uniformly applied to the entire workpiece.

After this, the holder 1 is placed in an electric furnace or the like with a relatively low-viscosity adhesive mass 9 placed in the center thereof, and heated for a certain period of time at the melting temperature of the adhesive (for example, 100 to 150° C.).

Then, the melted adhesive flows from the center of the holder 1 along the groove 6 to the outer peripheral side and reaches the bottom of the workpiece 2, and then, as shown in FIG. An adhesive layer 9' is formed between the adhesive layer 9' and the attachment surface 1' by capillary action.

Since the thickness of this adhesive layer 9' is inversely proportional to the load of the weight 8, it can be set to any predetermined value by selecting the load of the weight 8. Also, since the load of the weight 8 is applied uniformly to the workpiece 2,
Formed uniformly to a certain thickness. Therefore, when such an adhesive layer 9' is formed and cooled to room temperature, the adhesive layer 9' solidifies, and the workpiece 2 is attached in this state.
is glued and pasted onto the holder 1.

Therefore, according to the invention, the workpiece 2 and the holder 1
The adhesive for bonding the two is made to penetrate through capillary action, so when bonding the two, impurities and dust in the adhesive and semi-molten adhesive will not be inserted between the two.

Therefore, the workpiece 2 can be evenly attached to the workpiece attachment surface 1' of the holder 1 by the adhesive layer 9' having a uniform thickness, and the accuracy of lap processing is significantly improved. It is also possible to correct what was causing the error.

Note that various ways of cutting and shapes of the grooves 6 can be applied in addition to the embodiment shown in FIG. 3.

[Brief explanation of the drawing]

1 and 2 are a plan view and a partial bottom view of a lapping device to which the present invention is applied, FIG. 3 is a plan view showing the workpiece mounting surface of the holder, and FIG. FIG. 5 is a side view showing the state of formation of the adhesive layer. 1... Holder, 1'... Workpiece mounting surface, 2...
...Workpiece, 3...Abrasive grain, 4...Lap surface plate, 5,
8... Weight, 6... Groove, 7... Rubber material, 9... Adhesive mass, 9'... Adhesive layer.

Claims (1)

[Claims] 1. A method for mounting a workpiece on the mounting surface of a holder, which is a member that holds the workpiece, in order to perform rolling and sliding lapping in combination with a lapping surface plate, comprising: Place the workpiece on the mounting surface of the holder, which has a groove formed to guide the adhesive from the center to the periphery, place an elastic sheet on top of the placed workpiece, and then Pressure is applied, and in this state, the melted and fluidized adhesive is infiltrated between the mounting surface of the holder and the opposing surface of the workpiece through the groove, and then the adhesive is solidified, thereby processing. A method for attaching a workpiece to a holder, which is characterized by attaching the object to the holder.