Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPS6211502B2 - - Google Patents
[go: Go Back, main page]

JPS6211502B2 - - Google Patents

Info

Publication number
JPS6211502B2
JPS6211502B2 JP56129682A JP12968281A JPS6211502B2 JP S6211502 B2 JPS6211502 B2 JP S6211502B2 JP 56129682 A JP56129682 A JP 56129682A JP 12968281 A JP12968281 A JP 12968281A JP S6211502 B2 JPS6211502 B2 JP S6211502B2
Authority
JP
Japan
Prior art keywords
pellet
pellets
camera
flexible sheet
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56129682A
Other languages
Japanese (ja)
Other versions
JPS5831551A (en
Inventor
Satoshi Takabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56129682A priority Critical patent/JPS5831551A/en
Publication of JPS5831551A publication Critical patent/JPS5831551A/en
Publication of JPS6211502B2 publication Critical patent/JPS6211502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0442Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【発明の詳細な説明】 本発明はペレツト位置検出装置に関するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pellet position detection device.

一般に半導体ペレツトは半導体ウエハを可撓性
シートに貼着し、上記ウエハをダイシングする事
によつて得られるものである。さらに、この半導
体ウエハを貼着したシートを加熱し引き伸す事に
より、上記ペレツトは所定の間隔を持つて整列さ
せられ、ダイボンデイング工程へと送られる。半
導体ペレツトのダイボンデイングは上記ペレツト
を検出し、位置及び姿勢を認識、修正して後コレ
ツトと呼ばれるペレツト吸着治具にてリードフレ
ーム上へ載置される。このペレツト位置検出部は
上記ペレツトの配列されたシートを保持し移動可
能なテーブルとITV等を用いた検出部より構成さ
れる。
Generally, semiconductor pellets are obtained by adhering a semiconductor wafer to a flexible sheet and dicing the wafer. Furthermore, by heating and stretching the sheet to which the semiconductor wafer is attached, the pellets are aligned at predetermined intervals and sent to the die bonding process. In die bonding of semiconductor pellets, the pellets are detected, their positions and orientations recognized and corrected, and then placed on a lead frame using a pellet suction jig called a collect. This pellet position detecting section is composed of a movable table that holds the sheet on which the pellets are arranged, and a detecting section using an ITV or the like.

ペレツト検出に於る載置テーブルの移動動作は
一般には各ペレツトがほぼ等間隔に整列している
事を利用したテーブルの定ピツチ送りであり、そ
の後ペレツト認識及びそれに伴なうテーブル微動
によつてコレツト吸着にて支障のない位置まで、
ペレツト位置を修正している。ただし、ダイボン
ダーにセツトされるペレツトは、前工程に於て電
気的チエツク工程での不良ペレツト及びウエハ周
辺部等の形状不良ペレツトは除去されており、そ
のため歩留りの良くないウエハに関してはシート
上にペレツト不在箇所が発生する。上記不良ペレ
ツトが連続する場合あるいはウエハ外部の周辺シ
ート部等、連続的にペレツト不在が続く場合には
テーブルの定ピツチ送りにて移動を行なう従来方
式では、次ペレツトの検出までにテーブル駆動、
停止のための、テーブル加減速動作による遅れ時
間及びITVを用いた場合には検出までの走査時間
が余分に必要とされる欠点があつた。
The movement of the loading table during pellet detection is generally a fixed pitch feed of the table that takes advantage of the fact that the pellets are aligned at approximately equal intervals, and then pellet recognition and accompanying slight table movement. Collet adsorption to a position where there is no problem.
The pellet position has been corrected. However, from the pellets set on the die bonder, defective pellets from the electrical check process and malformed pellets from around the wafer have been removed in the previous process, so wafers with poor yields are placed on the sheet. Absent locations occur. In the conventional method, where the defective pellets mentioned above are continuous or the absence of pellets continues continuously, such as in the peripheral sheet area outside the wafer, the table is moved by fixed pitch feed, the table is driven and moved until the next pellet is detected.
There is a drawback that a delay time due to table acceleration/deceleration operation for stopping and an extra scanning time until detection is required when ITV is used.

通常ダイボンデイングは1秒程度のタクトタイ
ムで行なわれるためにペレツトの検出、位置修正
までの処理をマシンのタクトタイムである1秒以
内で行なわないと、装置の休止を招き不都合を生
じる。
Die bonding is normally carried out with a takt time of about one second, so if the process from pellet detection to position correction is not carried out within the machine's tact time of one second, the equipment will stop working, resulting in inconvenience.

本発明の目的は、ペレツト不在が連続する場合
の従来方式での不都合を取り除き、次ペレツト検
出までをテーブルの高速連続移動として移動時間
を大幅に短縮する事にある。
An object of the present invention is to eliminate the disadvantages of the conventional method when pellets are continuously absent, and to significantly shorten the travel time by moving the table continuously at high speed until the next pellet is detected.

本発明は可撓性シート上に配列されたペレツト
の位置検出装置において、前記可撓性シートの上
方にカメラおよび照射手段を設け前記可撓性シー
トの下方であつて前記カメラの中心軸より所定距
離だけ離れた場所に光学的なセンサー手段を設
け、該センサー手段によりペレツトの端部近傍を
検知した場合には前記可撓性シートを載置せる移
動テーブルを減速させ前記カメラの視野内に該検
知されたペレツトを停止せしめ前記センサー手段
によりペレツトを検出しない場合には前記移動テ
ーブルを高速移動させることを特徴とするペレツ
ト位置検出装置にある。かかる本発明によれば、
ペレツト間の間隔にバラツキを生じるようにシー
トが引き伸ばされていても所定のペレツトはカメ
ラの視野内に確実に入れることができる。又、次
ペレツトまで高速連続移動をする場合、次ペレツ
トの有無検知までもペレツト認識用のITVで行な
わせようとすると、高速移動中の画像取り入れを
行なわなくてはならないためのノイズ問題かつペ
レツト影像がITVの視野内に入つてからの画面走
査時間分のテーブル移動及びペレツト検知からス
ローダウンして停止するまでの移動が発生し、ペ
レツト停止位置が所望の場所に得られず後方へず
れるという欠点がある。また、画像処理のソフト
ウエアも複雑なものとなつてくる。
The present invention provides a position detection device for pellets arranged on a flexible sheet, in which a camera and an irradiation means are provided above the flexible sheet, and a camera and an irradiation means are provided below the flexible sheet and at a predetermined position from the central axis of the camera. Optical sensor means is provided at a location a certain distance away, and when the sensor means detects the vicinity of the end of the pellet, the moving table on which the flexible sheet is placed is decelerated to bring the pellet into the field of view of the camera. The pellet position detecting device is characterized in that the detected pellet is stopped and the moving table is moved at high speed when no pellet is detected by the sensor means. According to this invention,
Even if the sheet is stretched so that the spacing between pellets varies, a given pellet can be reliably placed within the field of view of the camera. In addition, when continuously moving at high speed to the next pellet, if you try to use the ITV for pellet recognition to detect the presence or absence of the next pellet, you will have to take in images while moving at high speed, which will cause problems with noise and pellet images. The disadvantage is that the table moves for the screen scanning time after the pellet enters the field of view of the ITV, and the table moves from the time the pellet is detected until it slows down and stops, and the pellet cannot be stopped at the desired location and shifts backward. There is. Furthermore, image processing software is also becoming more complex.

本発明では、ペレツト認識部の画像取り入れ方
向前方にたとえばITVに先行するセンサーを設け
上記センサーにてペレツト不在域における高速移
動中のペレツト有無をリアルタイムで検出し、後
方のこのITV位置に容易にかつ正確にペレツトを
停止させる事によりペレツト不在域での移動時間
の短縮、ダイボンダーのペレツト検出待ち時間の
短縮に貢献するものである。
In the present invention, a sensor preceding the ITV is provided in front of the pellet recognition unit in the image taking direction, and the sensor detects in real time the presence or absence of a pellet moving at high speed in a pellet absent area, and the ITV position at the rear can be easily and easily detected. By accurately stopping the pellets, it contributes to shortening the travel time in areas where no pellets are present and to shortening the wait time for pellet detection by the die bonder.

以下図面を用いて詳細に説明する。 This will be explained in detail below using the drawings.

第1図は従来装置であり1が半導体ペレツト、
2がペレツトを貼着けているシート、3は移動テ
ーブル、4はカメラ、5はペレツト吸着アームで
ある。カメラ4で位置検出されたペレツト2は、
移動テーブル3で位置修正され、アーム5により
リードフレーム上へ移送・載置される。
Figure 1 shows a conventional device, where 1 is a semiconductor pellet,
2 is a sheet to which pellets are attached, 3 is a moving table, 4 is a camera, and 5 is a pellet suction arm. The pellet 2 whose position was detected by the camera 4 is
The position is corrected on the moving table 3, and the arm 5 transfers and places it onto the lead frame.

第2図にシート拡大後のペレツト配列状態の一
例を示す。6はシート2を保持しているリングで
あるが、ペレツト1はほぼ等ピツチlで配列され
ている。したがつて移動テーブル3に定ピツチl
送りを与えてやれば容易に確実にカメラ4は次ペ
レツトの像を取り込む事ができる。ただしペレツ
ト不在部7及びウエハ周辺部8に於ては上記定ピ
ツチ送りではその移動時間にむだが生じ装置のペ
レツト検出待ちという事になりかねない。
FIG. 2 shows an example of the pellet arrangement after enlarging the sheet. Reference numeral 6 denotes a ring holding the sheet 2, and the pellets 1 are arranged at approximately equal pitches l. Therefore, the moving table 3 has a fixed pitch l.
By feeding the pellet, the camera 4 can easily and reliably capture the image of the next pellet. However, in the pellet-absent area 7 and the wafer peripheral area 8, the constant pitch feeding described above wastes the moving time, and the apparatus may have to wait for pellet detection.

本発明の実施例を第3図に示す。9は照明であ
り、10がペレツト有無検出センサー、11はラ
イトガイドである。ライトガイド11はカメラ4
の両サイドに一定間隔Lを保つて設置され、移動
テーブル3の移動方向により常にカメラ4に先行
する様左右センサーを切り換える。センサー10
がペレツト有りを検出するまで高速連続移動を行
ないペレツト検出後L+(ペレツトセンターとセ
ンサとのずれ量△L)だけ移動し停止する事にす
ればペレツトはサイズ及び配列間隔に問題無くカ
メラ視野内にセツトされる。間隔Lはテーブルの
高速移動中に停止信号入力後、減速、停止するま
での移動量(オーバーラン)以上ならば良くペレ
ツト有無検出もセンサーによるリアルタイムでの
検出なので時間的な遅れはない。ペレツト有無検
出後はペレツト認識部によりペレツト不在が確認
されるまでは従来同様の定ピツチ移動にて作業す
る。
An embodiment of the invention is shown in FIG. Reference numeral 9 is a lighting device, 10 is a pellet presence/absence detection sensor, and 11 is a light guide. Light guide 11 is camera 4
The left and right sensors are installed at a constant interval L on both sides of the table, and the left and right sensors are switched so that they always precede the camera 4 depending on the direction of movement of the moving table 3. sensor 10
If the pellet is moved continuously at high speed until it detects the presence of a pellet, and after detecting a pellet, it is moved by L + (the amount of deviation △L between the pellet center and the sensor) and then stopped, the pellet will be within the camera field of view without any problems in size or arrangement interval. is set to The interval L may be at least the amount of movement (overrun) required for the table to decelerate and stop after inputting a stop signal during high-speed movement of the table, and the presence or absence of pellets is detected in real time by a sensor, so there is no time delay. After detecting the presence or absence of pellets, the work is performed by moving at a fixed pitch as in the conventional method until the absence of pellets is confirmed by the pellet recognition section.

このように本実施例によればカメラに先行する
光学的なセンサーにてペレツト有無情報をリアル
タイムに取り入れているために、ペレツト不在時
でのテーブル移動にむだがなく、容易かつ高速、
確実にペレツトの位置検出を行なう事ができる。
In this way, according to this embodiment, information on the presence or absence of pellets is taken in in real time by an optical sensor preceding the camera, so table movement when pellets are not present is efficient, easy and fast.
The pellet position can be detected reliably.

本発明はテーブルの定ピツチ送り及び高速連続
送りの両者の利点を取り入れたものであり、従来
装置に対しても容易に本機能を追加できるもので
ある。さらに、ペレツト不在部での高速送りが可
能となるためダイボンダーの稼動率が向上し、生
産性向上ボンデイングコストの低減に貢献するも
のである。
The present invention incorporates the advantages of both constant pitch feeding and high-speed continuous table feeding, and this function can be easily added to conventional devices. Furthermore, since high-speed feeding is possible in areas where pellets are not present, the operating rate of the die bonder is improved, contributing to improved productivity and reduced bonding costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はダイボンダーの従来のペレツト検出部
の説明図であり、第2図はシート上のペレツト配
列状態を示す説明図、第3図は本発明の実施例の
図である。 尚、図において、1……半導体ペレツト、2…
…ペレツト貼着シート、3……移動テーブル、4
……カメラ、5……ペレツト吸着アーム、6……
シート保持リング、7……シート上の不良ペレツ
トによるペレツト不在部、8……シート上のウエ
ハ周囲のペレツト不在部、9……照明、10……
ペレツト有無検出センサ、11……ライトガイド
である。
FIG. 1 is an explanatory diagram of a conventional pellet detection section of a die bonder, FIG. 2 is an explanatory diagram showing the arrangement of pellets on a sheet, and FIG. 3 is a diagram of an embodiment of the present invention. In the figure, 1...semiconductor pellet, 2...
...Pellet adhesive sheet, 3...Moveable table, 4
...Camera, 5...Pellet suction arm, 6...
Sheet holding ring, 7... Pellet absent area due to defective pellets on the sheet, 8... Pellet absent area around the wafer on the sheet, 9... Lighting, 10...
Pellet presence/absence detection sensor 11... Light guide.

Claims (1)

【特許請求の範囲】[Claims] 1 良品ペレツトのみ残された可撓性シート上に
配列されたペレツトの位置検出装置において、前
記可撓性シートの上方にカメラおよび照射手段を
設け、前記可撓性シートの下方であつて、テーブ
ルの移動方向に沿つて、前記カメラの中心軸より
等距離だけ離れた2ケ所にそれぞれ光学的なセン
サー手段を設け、前記センサー手段によりペレツ
トの端部近傍を検知した場合には前記可撓性シー
トを載置せる移動テーブルを減速させ前記カメラ
の視野内に該検知されたペレツトを停止せしめ、
かつ前記センサー手段によりペレツトを検出しな
い場合には前記移動テーブルを高速移動させるた
めの制御部を設けたことを特徴とするペレツト位
置検出装置。
1. In a position detecting device for pellets arranged on a flexible sheet in which only good pellets remain, a camera and an irradiation means are provided above the flexible sheet, and a table is located below the flexible sheet. Optical sensor means are provided at two locations equidistant from the central axis of the camera along the direction of movement of the pellet, and when the sensor means detects the vicinity of the end of the pellet, the flexible sheet decelerating the moving table on which the pellet is placed to stop the detected pellet within the field of view of the camera;
A pellet position detection device further comprising a control section for moving the moving table at high speed when the sensor means does not detect a pellet.
JP56129682A 1981-08-19 1981-08-19 Pellet position detector Granted JPS5831551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56129682A JPS5831551A (en) 1981-08-19 1981-08-19 Pellet position detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56129682A JPS5831551A (en) 1981-08-19 1981-08-19 Pellet position detector

Publications (2)

Publication Number Publication Date
JPS5831551A JPS5831551A (en) 1983-02-24
JPS6211502B2 true JPS6211502B2 (en) 1987-03-12

Family

ID=15015562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56129682A Granted JPS5831551A (en) 1981-08-19 1981-08-19 Pellet position detector

Country Status (1)

Country Link
JP (1) JPS5831551A (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53160368U (en) * 1977-05-23 1978-12-15
JPS57115242U (en) * 1981-01-07 1982-07-16

Also Published As

Publication number Publication date
JPS5831551A (en) 1983-02-24

Similar Documents

Publication Publication Date Title
US5152390A (en) Automatic chip separating and feeding apparatus
US8021509B2 (en) Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
US4887758A (en) Apparatus for connecting external leads
US7490399B2 (en) Electronic component mounting apparatus
JP3759820B2 (en) Method and apparatus for attaching semiconductor wafer protective film
JP2641595B2 (en) Sheet-fed sheet method
JPH0964147A (en) Wafer ring supply / return device
US4913335A (en) Method and apparatus for die bonding
JPS6211502B2 (en)
JP3919292B2 (en) Method and apparatus for cutting semiconductor wafer protective film
JPH11207586A (en) Deburring device
JP2000288863A (en) Feeder
US20050034577A1 (en) Apparatus and method for indexing and severing film
JPS6258659B2 (en)
TW200823774A (en) Image capturing for pattern recognition of electronic devices
JP3314764B2 (en) Transport device and transport method for electronic component mounting device
US20250256353A1 (en) Laser processing apparatus, laser processing method, laser processing program, recording medium, semiconductor chip manufacturing method and semiconductor chip
US20250285888A1 (en) Laser processing apparatus, laser processing method, laser processing program, recording medium, semiconductor chip manufacturing method and semiconductor chip
US20250256352A1 (en) Laser processing apparatus, laser processing method, laser processing program, recording medium, semiconductor chip manufacturing method and semiconductor chip
US20250329555A1 (en) Laser processing apparatus, laser processing method, laser processing program, recording medium, semiconductor chip manufacturing method and semiconductor chip
JPS577135A (en) Wire bonding apparatus
JP3041209B2 (en) Component recognition device for mounting machines
JPS60189944A (en) Wire bonding device
JP3455137B2 (en) Wire bonding method and apparatus
JP2506743B2 (en) Object detection method