JPS6216739B2 - - Google Patents
Info
- Publication number
- JPS6216739B2 JPS6216739B2 JP24902983A JP24902983A JPS6216739B2 JP S6216739 B2 JPS6216739 B2 JP S6216739B2 JP 24902983 A JP24902983 A JP 24902983A JP 24902983 A JP24902983 A JP 24902983A JP S6216739 B2 JPS6216739 B2 JP S6216739B2
- Authority
- JP
- Japan
- Prior art keywords
- opening
- control member
- molten solder
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
【発明の詳細な説明】
技術分野
本発明は、自動半田付け装置に係り、特にノズ
ルから噴出される溶融半田の波頭をプリント基板
の進行方向に往復動させて半田付けの際にフラツ
クスから発生するガスを排出し易くし、チツプ部
品についても良好な半田付け性能が得られるよう
にした自動半田付け装置に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to an automatic soldering device, and in particular to an automatic soldering device that generates flux during soldering by reciprocating the wavefront of molten solder ejected from a nozzle in the direction of movement of a printed circuit board. This invention relates to an automatic soldering device that facilitates gas discharge and provides good soldering performance even for chip parts.
従来技術
従来、プリント基板に電子部品を半田付けする
際には、半田付け面にフラツクスが塗布されるの
で、該フラツクスに高温の溶融半田が接触すると
多量のガスが発生し、このガスの逃が場がない
と、溶融半田が要半田付け箇所に接触できなくな
り、半田付け不良が発生し、このことは特にプリ
ント基板にスルーホールが形成されないチツプ部
品の半田付けの場合に顕著であつた。この欠点を
除くため、従来は噴流式の自動半田付け装置を用
いたり、またジエツト式の噴流と通常の噴流とを
併用したりすることも行われたが、いずれの方法
においても構造が複雑になりながら未だ十分な半
田付け性能が得られていなかつたものである。Prior Art Conventionally, when soldering electronic components to a printed circuit board, flux is applied to the soldering surface, so when the flux comes into contact with high-temperature molten solder, a large amount of gas is generated, and this gas has to escape. If there is no space, the molten solder will not be able to contact the points to be soldered, resulting in poor soldering, which is particularly noticeable when soldering chip components in which no through holes are formed on the printed circuit board. In order to eliminate this drawback, conventionally, jet-type automatic soldering equipment was used, or jet-type jets and normal jets were used together, but with either method, the structure became complicated. However, sufficient soldering performance was still not achieved.
即ち、第4図に示すように、プリント基板13
の下面13aに接着されたチツプ部品20を噴流
式の溶融半田3により半田付けする場合において
は、溶融半田3の波頭19がプリント基板13の
進行方向(矢印Aの方向)に対して静止していた
ので、チツプ部品20間に発生したガスGは該チ
ツプ部品間に停滞し、波頭19を通過するまで排
出されないことになり、このようなガスGの存在
した部分に半田付け不良が発生していた。 That is, as shown in FIG.
When the chip component 20 bonded to the lower surface 13a is soldered using the jet type molten solder 3, the wave crest 19 of the molten solder 3 is stationary with respect to the traveling direction of the printed circuit board 13 (direction of arrow A). Therefore, the gas G generated between the chip parts 20 stagnates between the chip parts and is not discharged until it passes through the wave crest 19, and a soldering defect occurs in the part where such gas G was present. Ta.
このような欠点を除くため、溶融半田をパイプ
の周囲にあけた複数の小孔から噴出させ、このパ
イプをプリント基板の進行方向と直角方向に往復
動させる方法も提案されていたが、この方法によ
ると溶融半田の波頭がプリント基板の進行方向と
直角方向に往復動し、しかもその往復動の周期は
約1秒程度と極めて低速であつたため、ガスの排
出効果はあまり期待できず、十分な半田付け性態
が得られないという欠点があつた。 In order to eliminate these drawbacks, a method has been proposed in which molten solder is jetted out from multiple small holes drilled around a pipe, and the pipe is moved back and forth in a direction perpendicular to the direction of travel of the printed circuit board, but this method According to the research, the wave crest of the molten solder reciprocated in a direction perpendicular to the direction of travel of the printed circuit board, and the period of this reciprocating movement was extremely slow, about 1 second, so the gas evacuation effect could not be expected to be much, and sufficient The drawback was that soldering properties could not be obtained.
目 的
本発明は、上記した従来技術の欠点を除くため
になされたものであつて、その目的とするところ
は、溶融半田が噴出されるノズルの開口部に、プ
リント基板の進行方向に往復動自在でノズルの開
口状態を変化させる開口制御部材を設け、該開口
制御部材をプリント基板の進行方向に周期的に往
復動させることにより、溶融半田の波頭を同方向
に周期的に往復動させて、チツプ部品の半田付け
においても、単一の噴流によつてガスの排出を良
好にし、半田付け性能を飛躍的に向上させること
である。また他の目的は、開口制御部材の作動装
置にパルスモータを用い、該パルスモータの制御
をマイクロコンピユータを用いて行うことによ
り、プリント基板に塔載された電子部品が溶融半
田の波頭を通過する間に何回にもわたつて波頭が
電子部品を往復するようにし、発生したガスの排
出を良好に行わせることである。更に他の目的
は、マイクロコンピユータへの入力装置を設ける
ことによつて、プリント基板のサイズ、塔載され
る電子部品の大きさや形状等によつて、溶融半田
の波頭の往復動の状態を自由に設定できるように
することであり、またこれによつて最適の波頭の
動きが得られるようにし、各種のプリント基板に
も適用し得て常に良好な半田付け性能が得られる
ようにすることである。Purpose The present invention has been made in order to eliminate the drawbacks of the prior art described above, and its purpose is to provide a reciprocating motion in the traveling direction of the printed circuit board to the opening of the nozzle through which molten solder is spouted. An aperture control member that freely changes the aperture state of the nozzle is provided, and by periodically reciprocating the aperture control member in the advancing direction of the printed circuit board, the wavefront of the molten solder is caused to reciprocate periodically in the same direction. Also, when soldering chip parts, the purpose is to improve gas discharge using a single jet and dramatically improve soldering performance. Another object of the present invention is to use a pulse motor as an actuating device for the opening control member, and to control the pulse motor using a microcomputer, thereby allowing electronic components mounted on a printed circuit board to pass through the crest of a wave of molten solder. The purpose is to make the wave crest move back and forth over the electronic components many times in between, and to ensure that the generated gas is efficiently discharged. Another purpose is to freely control the reciprocating state of the wave front of the molten solder depending on the size of the printed circuit board, the size and shape of the electronic components mounted on the board, etc. by providing an input device to the microcomputer. The purpose is to make it possible to set the optimum wave front movement, and to be able to apply it to various printed circuit boards and always obtain good soldering performance. be.
概 要
要するに本発明は、溶融半田が噴出されるノズ
ルの開口部にプリント基板の進行方向に往復動自
在に設けられた開口制御部材と、該開口制御部材
をプリント基板の進行方向に周期的に往復動させ
る作動装置と、該作動装置に電気的に接続され該
作動装置を制御する制御装置とを備えたことを特
徴とするものである。Overview In short, the present invention includes an opening control member that is provided at the opening of a nozzle through which molten solder is spouted so as to be able to reciprocate in the direction of movement of the printed circuit board, and that the opening control member is periodically moved in the direction of movement of the printed circuit board. It is characterized by comprising an actuating device that causes reciprocating movement, and a control device that is electrically connected to the actuating device and controls the actuating device.
構 成
以下本発明を図面に示す実施例に基いて説明す
る。まず第1図から第10図により第1実施例に
基いて説明すると、半田槽1内には中間槽2が設
けられ、該中間槽内には溶融半田3を下方から矢
印Aの如く吸い上げて矢印Bの如くノズル4に送
り出すためのインペラ5が配設され、該インペラ
は図示しないモータにより水平方向に回転し、中
間槽2の底板2aに設けられた穴2bから溶融半
田3を吸い上げるようになつている。中間槽2の
上部に設けられたノズル4の中間部には、メツシ
ユ板からなる整流板6が設けられており、ノズル
4の開口部8には、該ノズルの開口状態を制御す
る開口制御部材9が設けられており、該開口制御
部材は、半田槽1の縁部1aに回動自在に支承さ
れた回転軸9aと該回転軸から下方に垂下したフ
ラツプ9bとからなり、回転軸9aはノズル4の
中央に支承されている。Configuration The present invention will be described below based on embodiments shown in the drawings. First, a description will be given based on the first embodiment with reference to FIGS. 1 to 10. An intermediate tank 2 is provided in the solder tank 1, and molten solder 3 is sucked up from below as shown by arrow A into the intermediate tank. As shown by arrow B, an impeller 5 is provided to feed the solder to the nozzle 4, and the impeller is rotated horizontally by a motor (not shown) to suck up the molten solder 3 from the hole 2b provided in the bottom plate 2a of the intermediate tank 2. It's summery. A rectifying plate 6 made of a mesh plate is provided at the middle part of the nozzle 4 provided at the upper part of the intermediate tank 2, and an opening control member is provided at the opening 8 of the nozzle 4 to control the opening state of the nozzle. 9 is provided, and the opening control member consists of a rotating shaft 9a rotatably supported on the edge 1a of the solder bath 1 and a flap 9b hanging downward from the rotating shaft. It is supported in the center of the nozzle 4.
作動装置10には、例えばパルスモータMが用
いられ、該パルスモータMの回転軸11にカツプ
リング12を介して開口制御部材9の回転軸9a
が直結されており、開口制御部材9をプリント基
板13の進行方向、即ち矢印C,Dの方向に周期
的に往復動させるようになつている。 For example, a pulse motor M is used as the actuator 10, and the rotation shaft 9a of the opening control member 9 is connected to the rotation shaft 11 of the pulse motor M via a coupling 12.
are directly connected to each other, so that the aperture control member 9 can be periodically reciprocated in the direction of movement of the printed circuit board 13, that is, in the directions of arrows C and D.
パルスモータMには制御装置14が電気的に接
続されており、該制御装置には例えばマイクロコ
ンピユータが用いられ、パルスモータMを制御す
るようになつている。そして該制御装置14に
は、手動操作により開口制御部材9の動きを任意
に変更し、また設定することができる入力装置の
一例たるデジタルスイツチ15が設けられてい
る。デジタルスイツチ15には、例えば4つのつ
まみ16及び表示部18が設けられており、つま
み16Aが開口制御部材9の動く速度を、つまみ
16Bが振幅を、つまみ16Cが往復動の死点に
おける停止時間を、つまみ16Dが振動数を夫々
設定できるようになつており、該デジタルスイツ
チからの入力によつて制御装置14は開口制御部
材9をパルスモータMを介して制御するようにな
つている。 A control device 14 is electrically connected to the pulse motor M, and the control device uses, for example, a microcomputer to control the pulse motor M. The control device 14 is provided with a digital switch 15, which is an example of an input device that can arbitrarily change and set the movement of the opening control member 9 by manual operation. The digital switch 15 is provided with, for example, four knobs 16 and a display section 18. The knob 16A indicates the moving speed of the opening control member 9, the knob 16B indicates the amplitude, and the knob 16C indicates the stopping time at the dead center of reciprocating motion. The control device 14 controls the opening control member 9 via the pulse motor M based on the input from the digital switch.
作 用
本発明は、上記のように構成されており、以下
その作用について説明する。本発明装置によつて
プリント基板13に例えばチツプ部品20を自動
半田付けするには、まずデジタルスイツチ15の
各つまみ16Aから16Dを操作して、開口制御
部材9の動く速度、振幅、往復動の死点における
停止時間及び振動数を設定する。すると各表示部
18には設定値が表示され、同時に制御装置14
に入力がなされ、該入力に基いて指定のデジタル
信号がパルスモータMに送出される。これによつ
てパルスモータMは往復回転し、カツプリング1
2を介して開口制御部材9も往復回転する。第2
図において、開口制御部材9のフラツプ9bが矢
印Cの方向に回転すると、ノズル4の開口部8の
左側開口部8Lにおける溶融半田3の流速が増
し、波頭19の頂面19aは左端に形成される。
この状態が第5図及び第8図に示す状態である。
即ち、このときは左側のチツプ部品20にのみ溶
融半田3が接触し、右側のチツプ部品20には接
触しない。また両チツプ部品20間の空間にも溶
融半田3が接触していない。このため該空間部に
発生したガスGは容易に図中右方へ逃げることが
でき、排出され易い。Effects The present invention is configured as described above, and its effects will be explained below. To automatically solder, for example, a chip component 20 to a printed circuit board 13 using the device of the present invention, first operate the knobs 16A to 16D of the digital switch 15 to control the speed, amplitude, and reciprocation of the opening control member 9. Set the stopping time and vibration frequency at the dead center. Then, each display section 18 displays the set value, and at the same time the control device 14
A designated digital signal is sent to the pulse motor M based on the input. As a result, the pulse motor M rotates back and forth, and the coupling 1
The aperture control member 9 also reciprocates via the opening control member 2 . Second
In the figure, when the flap 9b of the opening control member 9 rotates in the direction of arrow C, the flow velocity of the molten solder 3 at the left opening 8L of the opening 8 of the nozzle 4 increases, and the top surface 19a of the wave crest 19 is formed at the left end. be done.
This state is the state shown in FIGS. 5 and 8.
That is, at this time, the molten solder 3 contacts only the chip component 20 on the left side, and does not contact the chip component 20 on the right side. Also, the molten solder 3 does not come into contact with the space between both chip parts 20. Therefore, the gas G generated in the space can easily escape to the right in the figure and is easily discharged.
そこで第6図及び第9図に示すように、フラツ
プ9bが中立位置に来ると、ノズル4の開口部8
の左側開口部8Lと右側開口部8Rとが等しい広さ
となるため、波頭19は左右対象となり、2つの
頂面19aが形成され、両チツプ部品20にガス
Gが存在しない状態で完全な半田付がなされる。 Therefore, as shown in FIGS. 6 and 9, when the flap 9b comes to the neutral position, the opening 8 of the nozzle 4
Since the left opening 8 L and the right opening 8 R have the same width, the wave crest 19 becomes left-right symmetrical, and two top surfaces 19a are formed. Soldering is done.
次に、フラツプ9bが第7図及び第10図に示
すように、矢印Dの方向に回転すると、ノズル4
の右側の開口部8Rが狭くなつて、該開口部8Rに
おける溶融半田3の流速が速くなり、波頭19の
頂面19aは右端に形成される。この結果左側の
チツプ部品20及び両チツプ部品20間の空間部
には溶融半田3が接触しなくなり、仮にガスGが
存在していた場合でも該ガスは左方に容易に逃げ
て排出されることになる。 Next, when the flap 9b rotates in the direction of arrow D as shown in FIGS. 7 and 10, the nozzle 4
The opening 8R on the right side becomes narrower, the flow velocity of the molten solder 3 in the opening 8R becomes faster, and the top surface 19a of the wave crest 19 is formed at the right end. As a result, the molten solder 3 no longer comes into contact with the left chip component 20 and the space between both chip components 20, and even if gas G is present, the gas easily escapes to the left and is discharged. become.
このようにパルスモータMによりフラツプ9b
が往復回転することによつて、溶融半田3の波頭
19の頂面19aはプリント基板13の進行方向
に相当な速度、例えば毎秒20回位の速度で往復動
することになり、発生したガスGはこの波頭19
の動きによつて押し出されて排出され、しかも1
つのチツプ部品20が波頭19を通過する間に何
回も頂面19aの移動が行われるので、ガスGの
排出が完全に行われ、半田付けは極めて順調に行
われ、半田付け不良は発生しなくなる。 In this way, the flap 9b is moved by the pulse motor M.
As a result of the reciprocating rotation, the top surface 19a of the wave crest 19 of the molten solder 3 reciprocates in the traveling direction of the printed circuit board 13 at a considerable speed, for example, about 20 times per second, and the generated gas G is this wave crest 19
It is pushed out and discharged by the movement of
Since the top surface 19a is moved many times while one chip component 20 passes through the wave crest 19, the gas G is completely discharged, the soldering is performed extremely smoothly, and no soldering defects occur. It disappears.
次に、第11図及び第12図に示すものは、本
発明の第2実施例であり、ノズル4の開口部8を
直角に横切つて往復動するスリツト22a付の開
口制御部材22を設け、該開口制御部材22の一
対のラツク部22bにパルスモータMの回転軸1
1にカツプリング12を介して直結された回転軸
23と一体の一対のピニオン24を噛合させたも
のである。 Next, what is shown in FIGS. 11 and 12 is a second embodiment of the present invention, in which an opening control member 22 with a slit 22a that reciprocates at right angles across the opening 8 of the nozzle 4 is provided. , the rotation shaft 1 of the pulse motor M is connected to the pair of rack parts 22b of the opening control member 22.
1 through a coupling ring 12, and a pair of integral pinions 24 are meshed with each other.
該実施例においても、パルスモータMを往復回
転させれば、ピニオン24によつてラツク部22
bを介して開口制御部材22が矢印E,Fの方向
に往復動するので、スリツト22aの位置がプリ
ント基板13の進行方向に往復動し、溶融半田3
の流れは、ノズル4内で矢印H又はIの方向に変
化する。このことによつて溶融半田3の波頭19
の頂面19aはプリント基板13の進行方向に往
復動し、制御装置14及び入力装置15を設ける
ことによつて第1実施例と同様な結果を得ること
ができる。 In this embodiment as well, if the pulse motor M is reciprocated, the rack portion 22 is moved by the pinion 24.
Since the aperture control member 22 reciprocates in the directions of arrows E and F through the opening control member 22a, the position of the slit 22a reciprocates in the direction of movement of the printed circuit board 13, and the molten solder 3
The flow changes in the direction of arrow H or I within the nozzle 4. As a result, the wave crest 19 of the molten solder 3
The top surface 19a of the printed circuit board 13 reciprocates in the advancing direction of the printed circuit board 13, and by providing a control device 14 and an input device 15, the same results as in the first embodiment can be obtained.
なお、開口制御部材9,22は図示の実施例に
限定されるものではなく、作動装置10もパルス
モータMに限定されるものではなく、更に入力装
置もデジタルスイツチ15に限定されるものでは
ない。 Note that the opening control members 9 and 22 are not limited to the illustrated embodiment, the actuating device 10 is not limited to the pulse motor M, and the input device is not limited to the digital switch 15. .
効 果
本発明は、上記のように構成され、作用するも
のであるから、溶融半田が噴出されるノズルの開
口部に、ノズルの開口状態を変化させる開口制御
部材を設け、該開口制御部材をプリント基板の進
行方向に周期的に往復動させるようにしたので、
溶融半田の波頭を同方向に周期的に往復動させ
て、チツプ部品の半田付けにおいても、単一の噴
流によつてガスの排出を良好にし、半田付け性能
を飛躍的に向上させることができる効果がある。
また開口制御部材の作動装置にパルスモータを用
い、該パルスモータの制御をマイクロコンピユー
タを用いて行うことで、プリント基板に塔載され
た電子部品が溶融半田の波頭を通過する間に何回
にもわたつて波頭が電子部品を往復するようにす
ることができ、発生したガスの排出を良好に行わ
せることができる効果が得られる。更には、マイ
クロコンピユータへの入力装置を設けることで、
プリント基板のサイズ、塔載される電子部品の大
きさや形状等によつて、溶融半田の波頭の往復動
の状態を自由に設定できるので、最適の波頭の動
きが得られ、各種のプリント基板にも適応し得て
常に良好な半田付け性能が得られるようにするこ
とができる効果がある。Effects Since the present invention is configured and operates as described above, an opening control member that changes the opening state of the nozzle is provided at the opening of the nozzle through which molten solder is spouted, and the opening control member is Since it is made to move back and forth periodically in the direction of travel of the printed circuit board,
By periodically reciprocating the wavefront of molten solder in the same direction, even when soldering chip parts, a single jet can improve gas discharge and dramatically improve soldering performance. effective.
In addition, by using a pulse motor as the actuating device for the opening control member and controlling the pulse motor using a microcomputer, the electronic components mounted on the printed circuit board can be The crest of the wave can be caused to reciprocate over the electronic components, and the effect of effectively discharging the generated gas can be obtained. Furthermore, by providing an input device to the microcomputer,
The reciprocating state of the wave crest of the molten solder can be freely set depending on the size of the printed circuit board and the size and shape of the electronic components mounted on it, so the optimum movement of the wave crest can be obtained, making it suitable for various printed circuit boards. The present invention also has the advantage of being adaptable and ensuring good soldering performance at all times.
第1図から第10図は本発明の第1実施例に係
り、第1図は半田槽の正面要部縦断面図、第2図
は同じく側面要部縦断面図、第3図は開口制御部
材、作動装置、制御装置及び入力装置を示す概略
斜視図、第4図は溶融半田の静止波頭によるチツ
プ部品の半田付け状態を示す側面図、第5図は開
口制御部材のフラツプが左端に回転した際の波頭
の状態を示す部分縦断面図、第6図はフラツプが
中央に位置した際の同様な縦断面図、第7図はフ
ラツプが右端に回転した際の同様な縦断面図、第
8図はフラツプが左端に回転した際の要部平面
図、第9図はフラツプが中央に位置した際の要部
平面図、第10図はフラツプが右端に回転した際
の要部平面図、第11図及び第12図は本発明の
第2実施例に係り、第11図は要部平面図、第1
2図は第11図のXII―XII矢視要部縦断面図であ
る。
3は溶融ハンダ、4はノズル、8は開口部、9
は制御部材、10は作動装置、13はプリント基
板、14は制御装置、15は入力装置の一例たる
デジタルスイツチ、19は溶融半田の波頭、19
aは波頭の頂面、22は開口制御部材、Mは作動
装置の一例たるパルスモータである。
1 to 10 relate to the first embodiment of the present invention, in which FIG. 1 is a front longitudinal cross-sectional view of the main part of the solder tank, FIG. 2 is a side longitudinal cross-sectional view of the main part, and FIG. 3 is an opening control A schematic perspective view showing the members, actuating device, control device, and input device. Fig. 4 is a side view showing the state of soldering of chip components by a stationary wave front of molten solder. Fig. 5 shows a state in which the flap of the aperture control member is rotated to the left end. Figure 6 is a similar vertical cross-sectional view when the flap is located at the center; Figure 7 is a similar vertical cross-sectional view when the flap is rotated to the right end; Figure 8 is a plan view of the main part when the flap is rotated to the left end, Figure 9 is a plan view of the main part when the flap is located in the center, and Figure 10 is a plan view of the main part when the flap is rotated to the right end. 11 and 12 relate to the second embodiment of the present invention, FIG. 11 is a plan view of the main part, and FIG.
FIG. 2 is a longitudinal sectional view of the main part taken along arrows XII-XII in FIG. 11. 3 is molten solder, 4 is a nozzle, 8 is an opening, 9
10 is a control member, 10 is an actuator, 13 is a printed circuit board, 14 is a control device, 15 is a digital switch which is an example of an input device, 19 is a wave crest of molten solder, 19
22 is an aperture control member, and M is a pulse motor which is an example of an actuating device.
Claims (1)
ント基板の進行方向に往復動自在に設けられた開
口制御部材と、該開口制御部材をプリント基板の
進行方向に周期的に往復動させる作動装置と、該
作動装置に電気的に接続され該作動装置を制御す
る制御装置とを備えたことを特徴とする自動半田
付け装置。 2 前記作動装置は、パルスモータであることを
特徴とする特許請求の範囲第1項に記載の自動半
田付け装置。 3 前記制御装置は、前記開口制御部材の動く速
度、振幅、往復動の死点における停止時間及び振
動数を入力操作可能な入力装置を含むマイクロコ
ンピユータであることを特徴とする特許請求の範
囲第1項に記載の自動半田付け装置。[Scope of Claims] 1. An opening control member provided at the opening of a nozzle through which molten solder is spouted so as to be able to reciprocate in the direction in which the printed circuit board advances; An automatic soldering device comprising: an actuating device for reciprocating; and a control device electrically connected to the actuating device to control the actuating device. 2. The automatic soldering device according to claim 1, wherein the actuating device is a pulse motor. 3. The control device is a microcomputer including an input device capable of inputting and operating the moving speed, amplitude, stopping time at the dead center of reciprocating motion, and vibration frequency of the opening control member. The automatic soldering device according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24902983A JPS60145266A (en) | 1983-12-30 | 1983-12-30 | Method and device for automatic soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24902983A JPS60145266A (en) | 1983-12-30 | 1983-12-30 | Method and device for automatic soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60145266A JPS60145266A (en) | 1985-07-31 |
| JPS6216739B2 true JPS6216739B2 (en) | 1987-04-14 |
Family
ID=17186942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24902983A Granted JPS60145266A (en) | 1983-12-30 | 1983-12-30 | Method and device for automatic soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60145266A (en) |
-
1983
- 1983-12-30 JP JP24902983A patent/JPS60145266A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60145266A (en) | 1985-07-31 |
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