JPS6222550B2 - - Google Patents
Info
- Publication number
- JPS6222550B2 JPS6222550B2 JP59114102A JP11410284A JPS6222550B2 JP S6222550 B2 JPS6222550 B2 JP S6222550B2 JP 59114102 A JP59114102 A JP 59114102A JP 11410284 A JP11410284 A JP 11410284A JP S6222550 B2 JPS6222550 B2 JP S6222550B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- optical coupling
- emitting element
- present
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
【発明の詳細な説明】
本発明は、発光素子と受光素子とを組合せた光
結合装置に関し、とくに製作が容易な構造の光結
合装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optical coupling device that combines a light emitting element and a light receiving element, and particularly relates to an optical coupling device having a structure that is easy to manufacture.
光結合装置は、発光素子から出た光を受光素子
に受光させる構造となつている。しかしながら従
来の構造では、発光素子と受光素子とを透明樹脂
で覆い、結合効率を高めるため、透明樹脂の表面
に反射層を設けているため製作工程が増す等の欠
点があつた。 The optical coupling device has a structure in which a light receiving element receives light emitted from a light emitting element. However, in the conventional structure, the light-emitting element and the light-receiving element are covered with a transparent resin, and a reflective layer is provided on the surface of the transparent resin in order to increase the coupling efficiency, which has the disadvantage of increasing the number of manufacturing steps.
本発明の目的は、製作の容易な新規構造の光結
合装置を提供することにある。 An object of the present invention is to provide an optical coupling device with a novel structure that is easy to manufacture.
本発明によれば、散乱剤を混入した透明樹脂で
発光素子と受光素子とを共通に覆つたことを特徴
とする光結合装置が得られる。 According to the present invention, there is obtained an optical coupling device characterized in that a light emitting element and a light receiving element are commonly covered with a transparent resin mixed with a scattering agent.
以下図面を参照して、本発明を実施例に基づき
説明する。 The present invention will be described below based on embodiments with reference to the drawings.
第１図は、本発明の装置の製作途中における平
面図を示す。第１図において、発光素子１および
受光素子２は、共通リードフレーム３の対向する
リード上に、その発光面および受光面がフレーム
面に平行となるようにマウントボンデイングされ
ボンデイングワイヤ４でリードと電気的接続され
ている。さらに発光素子１からの出射光が受光素
子２へとどくようにSiO2等の散乱剤を混入させ
たシリコン等の透明樹脂５で素子１および２を共
通に覆つている。第１図に示された製作段階を経
たのち、光結合に有害な外来光を遮えぎるため
に、フレーム３の内側の光結合部全体を不透明樹
脂でモールド成形する。第２図に示されているよ
うに、不透明樹脂成形物６で封着された発光素子
側リード７および受光素子側リード８を残して、
リードフレーム３の不要部分（図中の破線部）を
切り離すことにより本発明の光結合装置が完成さ
れる。 FIG. 1 shows a plan view of the device of the present invention during its manufacture. In FIG. 1, a light-emitting element 1 and a light-receiving element 2 are mounted and bonded on opposing leads of a common lead frame 3 so that their light-emitting and light-receiving surfaces are parallel to the frame surface. are connected. Further, the elements 1 and 2 are commonly covered with a transparent resin 5 such as silicon mixed with a scattering agent such as SiO 2 so that the light emitted from the light emitting element 1 reaches the light receiving element 2. After going through the manufacturing steps shown in FIG. 1, the entire optical coupling part inside the frame 3 is molded with an opaque resin in order to block out external light that is harmful to the optical coupling. As shown in FIG. 2, leaving the light emitting element side lead 7 and the light receiving element side lead 8 sealed with the opaque resin molding 6,
The optical coupling device of the present invention is completed by cutting off the unnecessary portion of the lead frame 3 (the broken line portion in the figure).
以上説明したように、本発明によれば両素子散
乱剤入り透明樹脂で共通に覆つているので、従来
の単なる透明樹脂を用い、その表面に凹面鏡状の
反射物をかぶせその内面での反射を利用し発光素
子から受光素子への光の伝達を行わしめる構造の
ものに比べ形成工程を減少させることができる。 As explained above, according to the present invention, since both elements are commonly covered with a transparent resin containing a scattering agent, a conventional transparent resin is used, and a concave mirror-like reflective object is covered on the surface of the resin to reduce the reflection on the inner surface. The number of formation steps can be reduced compared to a structure in which light is transmitted from a light-emitting element to a light-receiving element.
以上述べたのは、代表的な実施例であつてリー
ドフレームに代えてプリント配線されたセラミツ
ク等の基板を用いる等材料、形状の変更が本発明
の趣旨を損わない範囲で可能な事は、言うまでも
ない。 The above-mentioned embodiments are typical examples, and changes in materials and shapes, such as using a printed circuit board such as ceramic in place of the lead frame, are possible within the scope of the spirit of the present invention. , Needless to say.
第１図は本発明実施例の製造途中における平面
図である。第２図は本発明実施例の装置の平面図
である。
１……発光素子、２……受光素子、３……リー
ドフレーム、４……ボンデイングワイヤ、５……
散乱剤入り透明樹脂、６……不透明樹脂、７……
発光素子側リード、８……受光素子側リード。
FIG. 1 is a plan view of an embodiment of the present invention during manufacture. FIG. 2 is a plan view of the apparatus according to the embodiment of the present invention. 1... Light emitting element, 2... Light receiving element, 3... Lead frame, 4... Bonding wire, 5...
Transparent resin containing scattering agent, 6... Opaque resin, 7...
Light emitting element side lead, 8... Light receiving element side lead.
Claims (1)
よび受光部の間隙および周囲を散乱剤を混入させ
た透明樹脂で直接覆つたことを特徴とする光結合
装置。1. An optical coupling device characterized in that the gap and periphery of a light emitting part and a light receiving part which are arranged close to each other on substantially the same plane are directly covered with a transparent resin mixed with a scattering agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59114102A JPS6084889A (en) | 1984-06-04 | 1984-06-04 | optical coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59114102A JPS6084889A (en) | 1984-06-04 | 1984-06-04 | optical coupling device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12920876A Division JPS5353990A (en) | 1976-10-26 | 1976-10-26 | Photo coupler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6084889A JPS6084889A (en) | 1985-05-14 |
| JPS6222550B2 true JPS6222550B2 (en) | 1987-05-19 |
Family
ID=14629166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59114102A Granted JPS6084889A (en) | 1984-06-04 | 1984-06-04 | optical coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6084889A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3096824B2 (en) * | 1992-04-17 | 2000-10-10 | ローム株式会社 | LED manufacturing frame and LED manufacturing method using the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2272377B1 (en) * | 1974-05-24 | 1977-06-24 | Texas Instruments France |
-
1984
- 1984-06-04 JP JP59114102A patent/JPS6084889A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6084889A (en) | 1985-05-14 |
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