JPS62231B2 - - Google Patents
Info
- Publication number
- JPS62231B2 JPS62231B2 JP19787683A JP19787683A JPS62231B2 JP S62231 B2 JPS62231 B2 JP S62231B2 JP 19787683 A JP19787683 A JP 19787683A JP 19787683 A JP19787683 A JP 19787683A JP S62231 B2 JPS62231 B2 JP S62231B2
- Authority
- JP
- Japan
- Prior art keywords
- water
- plating
- sodium hydroxide
- minutes
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 15
- 239000000243 solution Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 150000004696 coordination complex Chemical class 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 42
- 239000000203 mixture Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 8
- -1 quinone compound Chemical class 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 4
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- KOUDKOMXLMXFKX-UHFFFAOYSA-N sodium oxido(oxo)phosphanium hydrate Chemical compound O.[Na+].[O-][PH+]=O KOUDKOMXLMXFKX-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 3
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 3
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- OGKAGKFVPCOHQW-UHFFFAOYSA-L nickel sulfate heptahydrate Chemical compound O.O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O OGKAGKFVPCOHQW-UHFFFAOYSA-L 0.000 description 3
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 3
- 229940074439 potassium sodium tartrate Drugs 0.000 description 3
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 3
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 150000002690 malonic acid derivatives Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 239000001119 stannous chloride Substances 0.000 description 2
- 235000011150 stannous chloride Nutrition 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemically Coating (AREA)
Description
【発明の詳細な説明】
本発明はジチオシユウ酸金属錯塩を下地液とし
て無電解メツキを行う方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for electroless plating using a dithiosoxalate metal complex as a base liquid.
無電解メツキの核としてはパラジウムがすぐれ
ており、選択的無電解メツキには感光性のキノン
化合物と塩化パラジウムを組み合せる方法や、塩
化第一スズと塩化パラジウムを組み合せる方法が
行なわれている。また、パラジウムのシユウ酸塩
とマロン酸塩及び有機酸銀もこの目的に用いられ
ている。しかし塩化パラジウムとキノン化合物の
組み合せでは、この他に更に還元剤を加えること
が必要であり、系が複雑になる欠点がある。塩化
パラジウムと塩化第一スズを用いる方法では未照
射部分にメツキが行なわれる、いわゆるポジ型で
ある。パラジウムのシユウ酸塩、マロン酸塩およ
び有機酸銀は水や有機溶剤に不溶であり、このた
めにこれらの高価な化合物を多量に用いることが
必要であり、更にメツキ後の解像力を高めること
も困難である。 Palladium is excellent as the core of electroless plating, and selective electroless plating is carried out by combining a photosensitive quinone compound and palladium chloride, or by combining stannous chloride and palladium chloride. . Palladium oxalates and malonates and organic silver acids have also been used for this purpose. However, the combination of palladium chloride and a quinone compound requires the addition of a reducing agent in addition to this, which has the disadvantage of complicating the system. The method using palladium chloride and stannous chloride is a so-called positive type in which the unirradiated areas are plated. Palladium oxalates, malonates, and organic acid silvers are insoluble in water and organic solvents, which necessitates the use of large amounts of these expensive compounds, and also increases resolution after plating. Have difficulty.
本発明者らはビス（ジチオオクサラト）パラジ
ウム塩が他の化合物と組み合せることなく、単一
で上記の目的に用いることができ、しかも水溶性
であるので、少量用いるのみで十分に上記の目的
を達することができ、解像力も高めることが可能
であることを見出した。更にパラジウムや銀のよ
うな貴金属の使用は資源の有限性や価格の騰貴の
問題があることを考慮して、安価な金属のジチオ
シユウ酸錯塩を用いる方法についても検討し本発
明に至つた。 The present inventors discovered that bis(dithiooxalato)palladium salt can be used alone for the above purpose without being combined with other compounds, and is water-soluble, so it is sufficient to achieve the above purpose by using only a small amount. We have found that it is possible to achieve this goal and improve resolution. Furthermore, considering that the use of precious metals such as palladium and silver has the problem of limited resources and rising prices, we also investigated a method using dithiosoxalate complex salts of inexpensive metals, and arrived at the present invention.
即ち本発明は、ジチオシユウ酸金属錯塩水溶液
を被メツキ物の所要部分に塗布乾燥した後に所要
の画像状に露光し、次いでその露光面を化学メツ
キ液で処理することを特徴とする無電解メツキ方
法である。 That is, the present invention provides an electroless plating method, which comprises applying an aqueous solution of a dithiosoxalate metal complex to a desired part of the object to be plated, drying it, exposing it to light in a desired image, and then treating the exposed surface with a chemical plating solution. It is.
本発明に用いる感光性の成分はN3M
（C2S2O2）3の化学構造を有するジチオシユウ酸金
属錯酸塩である。前記構造式中、Ｎはカリウム、
ナトリウム等のアルカリ金属あるいはアルカリ土
類金属、またはこの両方の金属を含むものであ
る。Ｍは遷移金属であり、パラジウム、コバルト
を用いることができる。 The photosensitive component used in the present invention is N 3 M
It is a dithiosoxalate metal complex salt having the chemical structure (C 2 S 2 O 2 ) 3 . In the above structural formula, N is potassium,
It contains an alkali metal such as sodium, an alkaline earth metal, or both metals. M is a transition metal, and palladium or cobalt can be used.
これらの錯塩は文献に記載の方法で合成するこ
とができる。（日本化学会編：新実験化学講座、
８、丸善（1977）p.1584、Ｆ、Ａ、Bruger and
Ａ、Ｍ、Sargenson、Ｊ、Am、Chem、81、2335
（1959）これらの錯塩の水溶液をメツキを行う部
分に塗布して乾燥する。この感光層に紫外光で所
要の画像状に露光した後に、化学メツキ液に浸漬
してメツキを行う。 These complex salts can be synthesized by methods described in the literature. (Edited by the Chemical Society of Japan: New Experimental Chemistry Course,
8, Maruzen (1977) p.1584, F. A. Bruger and
A, M, Sargenson, J, Am, Chem, 81, 2335
(1959) Aqueous solutions of these complex salts are applied to the area to be plated and dried. After this photosensitive layer is exposed to ultraviolet light in a desired image, plating is performed by immersing it in a chemical plating solution.
本発明に用いるメツキ液は次亜リン酸塩あるい
はホルマリンを還元剤とするが、その詳細な組成
は感光性成分であるジチオシユウ酸金属塩の金属
の種類によつても、又メツキする金属によつても
異なる。メツキは銅およびニツケルメツキを行う
ことができる。 The plating solution used in the present invention uses hypophosphite or formalin as a reducing agent, but its detailed composition depends on the metal type of the photosensitive component dithiosoxalate metal salt and the metal to be plated. Even though it's different. The plating can be copper and nickel plating.
本発明に用いるジチオシユウ酸金属錯塩は紫外
光のみに感光し、可視光には感光しないので、通
常のケイ光灯の下で作業を行うことができる。 Since the dithiosoxalate metal complex used in the present invention is sensitive only to ultraviolet light and not to visible light, it can be worked under an ordinary fluorescent lamp.
次に本発明を実施例に基づきさらに詳細に説明
する。 Next, the present invention will be explained in more detail based on examples.
実施例 １
ビス（ジチオオクサラト）パラジウムカリウム
（K2〔pd（C2S2O2）2〕）の0.02ｇを１mlの水に溶解
して、10×20mmのジアゾ用紙に塗布して乾燥し
た。これを100Wの超高圧水銀灯で40cmの距離か
ら15〜20分間露光した。これを以下の組成の一次
浴に室温で６〜10分間浸漬した後水洗した。Example 1 0.02 g of potassium bis(dithiooxalato)palladium (K 2 [pd(C 2 S 2 O 2 ) 2 ]) was dissolved in 1 ml of water, applied to a 10×20 mm diazo paper, and dried. This was exposed for 15 to 20 minutes from a distance of 40 cm using a 100 W ultra-high pressure mercury lamp. This was immersed in a primary bath having the following composition at room temperature for 6 to 10 minutes, and then washed with water.
一次浴組成
硫酸銅５水和物 ２ｇ
酒石酸カリウムナトリウム 10ｇ
水酸化ナトリウム 0.8ｇ
ホルマリン（37％） ６ml
全体を水で100mlにし、水酸化ナトリウム溶液
でPH9.5〜10に調節する。次で以下の組成の二次
浴に75℃で15分間浸漬した後に、浴を室温に移
し、10分間メツキを続けて、水洗した。露光部分
に銅メツキが行なわれた。Primary bath composition Copper sulfate pentahydrate 2g Potassium sodium tartrate 10g Sodium hydroxide 0.8g Formalin (37%) 6ml The total volume is made up to 100ml with water, and the pH is adjusted to 9.5-10 with sodium hydroxide solution. Next, after immersing in a secondary bath having the following composition at 75°C for 15 minutes, the bath was moved to room temperature, plating was continued for 10 minutes, and then washed with water. Copper plating was performed on the exposed areas.
二次浴組成
硫酸銅５水和物 ２ｇ
酒石酸カリウムナトリウム 10ｇ
水酸化ナトリウム 1.5ｇ
ホルマリン（37％） ８ml
全体を水で100mlにし、水酸化ナトリウム溶液
でPH12.0に調節する。Secondary bath composition: Copper sulfate pentahydrate 2g Potassium sodium tartrate 10g Sodium hydroxide 1.5g Formalin (37%) 8ml The total volume is made up to 100ml with water, and the pH is adjusted to 12.0 with sodium hydroxide solution.
実施例 ２
実施例１と同様にして作成した試料を同様の方
法で15〜20分間露光した後に、以下の組成の一次
浴に室温で10分間浸漬して水洗した。Example 2 A sample prepared in the same manner as in Example 1 was exposed for 15 to 20 minutes in the same manner, and then immersed in a primary bath having the following composition at room temperature for 10 minutes and washed with water.
一次浴組成
硫酸ニツケル７水和物 ６ｇ
クエン酸ニアンモニウム ５ｇ
次亜リン酸ナトリウム１水和物 ６ｇ
水酸化ナトリウム ２ｇ
全体を水で100mlにし、水酸化ナトリウム溶液
でPH８に調節する。Primary bath composition Nickel sulfate heptahydrate 6g Niammonium citrate 5g Sodium hypophosphite monohydrate 6g Sodium hydroxide 2g The total volume is made up to 100ml with water, and the pH is adjusted to 8 with sodium hydroxide solution.
これを以下の組成の二次浴に75℃で20分間浸漬
した後に、浴を室温に移し、５分間メツキを続け
て、水洗した。これにより、露光部分にニツケル
メツキが行われた。 This was immersed in a secondary bath having the following composition at 75°C for 20 minutes, then the bath was moved to room temperature, plating was continued for 5 minutes, and then washed with water. As a result, nickel plating was performed on the exposed areas.
二次浴組成
硫酸ニツケル７水和物 12ｇ
クエン酸ニアンモニウム 10ｇ
次亜リン酸ナトリウム１水和物 12ｇ
水酸化ナトリウム ２ｇ
全体を水で100mlにし、水酸化ナトリウム溶液
でPH11に調節する。Secondary bath composition Nickel sulfate heptahydrate 12g Niammonium citrate 10g Sodium hypophosphite monohydrate 12g Sodium hydroxide 2g The total volume is made up to 100ml with water, and the pH is adjusted to 11 with sodium hydroxide solution.
実施例 ３
トリス（ジチオオクサラト）コバルトカリウム
カルシウム（KCa〔Co（C2S2O2）3〕・6H2O）の
0.03ｇを水１mlに溶解して、実施例１と同様に塗
布し、乾燥した。実施例１と同様の方法で30〜40
分間露光して、以下の組成の一次浴に室温で15分
間浸漬した後に、水洗した。Example 3 Tris(dithiooxalate) cobalt potassium calcium (KCa[Co(C 2 S 2 O 2 ) 3 ]・6H 2 O)
0.03 g was dissolved in 1 ml of water, applied in the same manner as in Example 1, and dried. 30-40 in the same manner as in Example 1
After being exposed to light for a minute and immersed in a primary bath with the following composition at room temperature for 15 minutes, it was washed with water.
一次浴組成
塩化ニツケル６水和物 12ｇ
クエン酸ニアンモニウム ９ｇ
次亜リン酸ナトリウム１水和物 11ｇ
水酸化ナトリウム 0.5ｇ
エチレンジアミン四醋酸ニナトリウム 0.1ｇ
全体を水で100mlにし、水酸化ナトリウム又は
塩酸溶液でPH６に調節する。Primary bath composition Nickel chloride hexahydrate 12g Niammonium citrate 9g Sodium hypophosphite monohydrate 11g Sodium hydroxide 0.5g Disodium ethylenediaminetetraacetate 0.1g The total volume is made up to 100ml with water, and sodium hydroxide or hydrochloric acid solution is used. Adjust the pH to 6.
これを以下の組成の二次浴に90℃で10分間浸漬
した後に、浴を室温に移して、更に10分間メツキ
を続けた。これにより露光部分にニツケルメツキ
が行われた。 After this was immersed in a secondary bath having the following composition at 90°C for 10 minutes, the bath was moved to room temperature and plating was continued for an additional 10 minutes. As a result, nickel plating was performed on the exposed areas.
二次浴組成
塩化ニツケル６水和物又は（硫酸ニツケル７水
和物） 12ｇ
クエン酸ニアンモニウム ９ｇ
次亜リン酸ナトリウム１水和物 11ｇ
水酸化ナトリウム 0.8ｇ
エチレンジアミン四醋酸ニナトリウム 0.1ｇ
全体を水で100mlにし、水酸化ナトリウム溶液
でPH９〜10に調節する。Secondary bath composition Nickel chloride hexahydrate or (nickel sulfate heptahydrate) 12g Niammonium citrate 9g Sodium hypophosphite monohydrate 11g Sodium hydroxide 0.8g Disodium ethylenediaminetetraacetate 0.1g Water Make the volume to 100ml and adjust the pH to 9-10 with sodium hydroxide solution.
実施例 ４
実施例３と同様の試料を同様の方法で30分間露
光した。これを１％硫酸銅水溶液に20分間室温で
浸漬した後に、簡単に水洗した。更に以下の組成
の二次浴に室温で2.5時間浸漬した。これにより
露光部分に銅メツキが行われた。Example 4 A sample similar to Example 3 was exposed for 30 minutes in the same manner. This was immersed in a 1% copper sulfate aqueous solution for 20 minutes at room temperature, and then briefly washed with water. Furthermore, it was immersed in a secondary bath having the following composition at room temperature for 2.5 hours. As a result, copper plating was performed on the exposed areas.
二次浴組成
硫酸銅５水和物 ３ｇ
酒石酸カリウムナトリウム 10ｇ
エチレンジアミン四醋酸ニナトリウム 1.2ｇ
水酸化ナトリウム １ｇ
ホルマリン（37％） ６ml
全体を100mlにし、水酸化ナトリウム溶液でPH
12.5に調節する。Secondary bath composition Copper sulfate pentahydrate 3g Potassium sodium tartrate 10g Disodium ethylenediaminetetraacetate 1.2g Sodium hydroxide 1g Formalin (37%) 6ml Dilute the total to 100ml and PH with sodium hydroxide solution
Adjust to 12.5.
Claims (1)
の所定部分に塗布乾燥した後、所要の画像状に露
光し、次いでその露光面を化学メツキ液で処理す
ることを特徴とする無電解メツキ方法。1. An electroless plating method, which comprises applying an aqueous solution of a metal complex dithiosoxalate to a predetermined portion of the object to be plated, drying it, exposing it to light in a desired image, and then treating the exposed surface with a chemical plating solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19787683A JPS6089576A (en) | 1983-10-22 | 1983-10-22 | Electroless plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19787683A JPS6089576A (en) | 1983-10-22 | 1983-10-22 | Electroless plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6089576A JPS6089576A (en) | 1985-05-20 |
| JPS62231B2 true JPS62231B2 (en) | 1987-01-06 |
Family
ID=16381784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19787683A Granted JPS6089576A (en) | 1983-10-22 | 1983-10-22 | Electroless plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6089576A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6222707U (en) * | 1985-07-24 | 1987-02-12 |
-
1983
- 1983-10-22 JP JP19787683A patent/JPS6089576A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6222707U (en) * | 1985-07-24 | 1987-02-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6089576A (en) | 1985-05-20 |
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