JPS6226696B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat flow detection end and a method for manufacturing the same. More specifically, the present invention comprises a thermopile unit constituted by metal elements constituting a plurality of thermocouples supported on a single non-conductive substrate, and a conductive layer pattern surrounding the thermopile unit. The present invention relates to a heat flow detection end (hereinafter sometimes simply referred to as a "detection end") and a method for efficiently manufacturing this detection end using a plating technique and a photoetching technique.

Thermometers that utilize thermoelectromotive force are generally called thermocouple thermometers and are used in a wide range of fields. This thermometer consists of a thermocouple, which is made into a closed circuit using wires of different metals, such as copper and constantan, with one junction kept at 0°C or room temperature, and the other junction under measurement. The device is fixed to an object and the temperature difference between the two junctions is measured and detected by the electromotive force generated thereby. These thermocouples are made of a combination of various metals, but the electromotive force generated by them is extremely small, and although it may be good if the temperature difference between the two junctions is large, the temperature difference There is a problem that it cannot be measured if it is small.

The detection end of a heat flow meter disturbs the heat flow on the surface to be measured due to its existence, so in order to minimize the effect, it is desirable that the detection end has low thermal resistance and low heat capacity. The thickness of the detection end needs to be as thin as possible, so the temperature difference between the two sides is extremely small. Therefore, a thermopile array, that is, a thermopile, in which a large number of the above-mentioned thermocouples are connected in series, is used at the detection end of the heat flow meter. However, conventional thermoelectric stacks are manufactured by wrapping or embedding metal wires or metal foils around a heat resistance base, which results in a complicated process and extremely low productivity.
There were also concerns that the performance of the obtained product lacked stability. Furthermore, there is a problem in that there is almost no freedom in manufacturing a thermoelectric pile that corresponds to the area and shape of the area to be measured in which the heat flow rate is to be measured.

Therefore, one of the main objects of the present invention is to provide a heat flow detection end made of a thermoelectric stack with stable performance, which is a heat flow meter that corresponds to the area and shape of the area to be measured where the heat flow is to be measured. facilitates production,
The present invention provides a heat flow detection end comprising a thermopile unit.

Another main object of the present invention is to provide a highly reliable manufacturing method that can manufacture the above-mentioned detection end with high productivity by making full use of plating and photoetching techniques.

In the heat flow detection end according to the present invention, (a) one metal segment and the other metal segment constituting each thermocouple are sequentially and alternately connected while being supported on a heat-resistant non-conductive substrate. (b) a pattern of a conductor layer that acts as a lead wire for coupling between the units of the thermopile or for drawing out terminal portions, the pattern of the conductor layer; are formed on both sides of the substrate so as to surround at least a portion of the thermoelectric stack unit.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a heat flow detection end and a method for manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

The substrate of the heat flow meter according to the present invention consists of a plurality of thermopile units and a pattern of conductive layers surrounding the thermopile units. 1A and 1B are a front view and a back view, respectively, showing an example of a thermopile unit, and FIG. 1C is an enlarged sectional view taken along the line of FIG. 1A. In Figures 1A to 1C,
The thermopile 1 has one metal segment 23 and the other metal segment 24 constituting the thermocouple 2.
A large number of them are alternately connected while being supported on the substrate 3. As can be seen from FIG. 1C, one metal segment 23 connects the plated portion on one side of the substrate 3 and the plated portion on the other side of the substrate 3, and connects these two portions. The plated portion is formed along the inner wall of the through hole 11 formed in the substrate. The other metal segment 24 is also
Plating is performed along the part plated on one side of the substrate, the part plated on the other side of the substrate, and the inner wall of the through hole 11 formed in the substrate that communicates these two parts. It consists of parts. 1st A
As shown in the figure and FIG. 1B, a large number of through holes 11
It is preferable that the segments 23 and 24 are arranged in a grid pattern within the plane of the substrate, and the segments 23 and 24 are connected alternately so as to extend in a zigzag pattern within the plane of the substrate. That is, in the illustrated embodiment, the segment 24' located at the top leftmost position in the figure is connected to the segment immediately below. In this way, the connection is repeated in order in the downward direction until the segment located at the bottom leftmost part of the board 3 is reached. This segment is connected to the segment immediately to its right. The connecting lines of the segments then rise upwardly over the substrate surface. In this way, a large number of segments 23 and 24 are alternately connected so as to extend in a zigzag pattern to the right while moving up and down within the board surface, and reach segment 23' located at the top rightmost position of the board. Ru. The thermoelectromotive force between the segments 23' and 24' at both ends of the thermopile unit pattern constructed in this way corresponds to the heat flow passing through the entire surface of the unit pattern. In other words, the heat flow passing through the substrate is proportional to the temperature difference between the two sides of the substrate, and a thermoelectromotive force proportional to the temperature difference is obtained.

The substrate 3 must be heat-resistant and non-conductive. It must also have sufficient mechanical strength to function as a stress-bearing member for the thermopile. For this purpose, a prepreg made of a fibrous sheet impregnated with a heat-resistant, non-conductive thermosetting resin is sometimes laminated and cured, such as a glass fiber-reinforced epoxy resin plate, etc. board, glass fiber reinforced unsaturated polyester resin board, same laminate,
Paper-phenolic resin laminates and the like are suitable. Copper-clad laminates with copper foil clad on both sides can also be used. The substrate 3 is generally a plate as described above with a thickness of 1 to several mm, but a thinner sheet or film may also be used.

As for the combination of metals constituting the thermocouple 2, it is most preferable to use nickel on one side and copper on the other, but other combinations are also possible, such as silver and nickel, copper and constantan, iron and constantan, and iron and nickel. can be mentioned. These metals are preferably formed as a single plating layer on the substrate, but a different metal may be formed on the base depending on the plating procedure. However, in order to minimize the influence of this dissimilar metal on the base, it is necessary to take measures to make the thickness of the base metal as thin as possible or to make the plating layer of the surface metal relatively thick.

FIGS. 2A and 2B are a front view and a back view, respectively, showing another example of the thermopile unit. In contrast to the thermopile unit shown in FIGS. 1A and 1B, where the terminals, which are the ends of a series of thermocouples, are located at adjacent apex portions 24' and 23' of the rectangular unit pattern. In the thermopile unit shown in FIGS. 2A and 2B, the diagonal positions 23' and 2 of the rectangular unit pattern are
A terminal is provided at 3″.

The overall shape of the thermopile unit pattern is
It may be square or rectangular as shown in Figures A to 2B, and may be triangular or rectangular as modified forms.
It can also be square, circular, etc. Also, the logarithm of the thermocouples that make up the thermopile unit (i.e.,
The areal density of the thermocouple) can be freely selected within the constraints of manufacturing technology.

The pattern of the conductor layer surrounding the thermopile unit 1 is, as an example shown in FIG. will be placed. It is desirable that such a lattice-like conductor layer pattern be formed by plating and photoetching techniques in the same manner as the metal segments constituting the thermocouple, as will be described later. In addition, although FIG. 3 shows an example of a lattice-like conductor layer pattern in which four thermopile units are combined, the number of thermopile units to be combined with a conductor layer pattern may be any number greater than or equal to two. be able to. The shape of the conductor layer pattern can be appropriately designed depending on the number of thermopile stacks.

4A and 4B show the lattice-like conductor layer pattern 4 as shown in FIG.
Four thermopile units 1, 1', as shown in Figure B
Fig. 4A is a top view showing a heat flow detection end formed by combining 1'' and 1; Fig. 4A is a surface view;
Figure B is a back view. 4 thermopile units 1,
1', 1'' and 1 are housed in the respective grids of the lattice-like conductor layer pattern 4, and the four thermoelectric stacks are connected to each other by copper plating of the connecting parts between the units as shown at 7, 7' and 7'' in the figure. The units are connected in series. The ends of the series connected thermopile are joined to terminals 6 and 6' at the outer edge of the thermometer.

5A and 5B show the lattice-like conductor layer pattern 4 as shown in FIG.
Four thermopile units 1, 1', as shown in Figure B
Fig. 5A is a front view, and Fig. 5B is a back view. The four thermopile units 1, 1', 1'' and 1 are connected with copper plating 7' (Fig. 5A) and 7 and 7'' at the connecting parts between the units.
(FIG. 5B), and both ends of the series of thermoelectric stacks so connected are joined to terminals 6 and 6' at the outer edge of the heat flow meter. In the examples shown in Figures 4A and 4B and Figures 5A and 5B, a square heat flow detection end is constructed using four square thermopile unit patterns. The shape and dimensions of the thermopile unit pattern and the grid-like conductive layer pattern surrounding the thermopile unit can be appropriately selected depending on the shape and dimensions of the thermopile unit.

As mentioned above, the heat flow detection end according to the present invention includes:
Since the thermocouple is constructed by surrounding at least a portion of the periphery with a conductor layer pattern, it has the following three advantages.

The first advantage is that it is extremely easy to create an original image that represents the pattern required to form the plating resist and etching resist of the thermopile that corresponds to the area and shape of the area to be measured where the heat flow rate is to be measured. . The advantage of this is that the heat flow detection end is created by combining thermopile unit patterns of the same type, so by simply changing only the joints between units, it is possible to reduce the area and shape by using multiple identical unit patterns. This is because a variety of different heat flow meters can be manufactured.

The second advantage is that one heat flow meter can be divided into two or more predetermined area parts depending on the purpose of measurement, and the heat flow rate for each part can be measured independently. The advantage is that it is easy to create a thermopile pattern like this.

The second advantage mentioned above can be easily understood by referring to FIGS. 6A and 6B. FIG. 6A is a front view of the heat flow detection end, and FIG. 6B is a back view. In the illustrated heat flow detection end, the grid-like conductor layer pattern is used as a lead wire for coupling the thermopile unit pattern or as a lead wire for leading the terminal portion to the outside. Then, due to the electromotive force between the two terminals 6 and 6', the center 4
Two thermopile unit patterns B・B, B・C,
The heat flow in C.Ro and C.C can be measured, and the 12 thermopile unit patterns A.A, A.R. , A. Ha, A. Ni, B. Ha,
It is possible to measure the heat flow in the parts B, 2, C, i, C, ni, D, i, D, ro, D, ha, and D, ni.

In the example shown in FIGS. 6A and 6B, the heat flow can be measured for further subdivided smaller area portions. In other words, the electromotive force between the two terminals 6 and 7 creates two thermopile unit patterns B, B and C, and the electromotive force between the two terminals 7 and 6' creates two thermopile unit patterns. The electromotive force between the two terminals 6'' and 7' creates four thermopile unit patterns A, A, B, C, C and D. The electromotive force between the two terminals 7' and 7'' causes the parts of the two thermopile unit patterns D.Ro and D.C.
Due to the electromotive force between the four thermopile unit patterns A.D., B.D., C.D. and D.D.
Further, by the electromotive force between the two terminals 7 and 6, it is possible to measure the heat flow in the two thermopile unit patterns A.B and A.C, respectively.

To measure the heat flow over the entire surface of the heat flow detection end shown in Figures 6A and 6B, short-circuit the two terminals 6 and 6'' and measure the electromotive force between the two terminals 6' and 6. 6A and 6B show examples of heat flow detection terminals with relatively simple patterns for convenience of explanation, but detection terminals with more complex patterns are usually used as detection terminals that are actually used. An example of the pattern of such a highly practical heat flow detection end is shown in Fig. 7A.
Shown in FIGS. 7B and 7C. The detection end illustrated in Fig. 7A is a combination of 6 x 6 = 36 thermopile unit patterns as shown in Figs. 1A and 2A, and each thermopile unit pattern has 288 thermopile unit patterns.
Consists of a pair of thermocouples. In FIG. 7A, each thermopile unit pattern is schematically shown as in FIG. 7B. In the wiring diagram shown in FIG. 7A, solid lines represent wiring on the front surface of the board, and dotted lines represent wiring on the back surface of the board. In addition, the front/back boundary points of the wiring are represented by black dots. By adopting the connection method shown in FIG. 7A, this heat flow detection end can independently measure the heat flow in portions A, B, and C3 in FIG. 7C.

Generally, in a conventional heat flow meter, the center part of the heat flow detection end, for example, the parts B, B, B, C, and C in FIGS. 6A and 6B, and A and C in FIG. If a closed part like part B is attempted to be measured separately, drawing out the lead wire to the outer edge is difficult in terms of design and manufacturing. However, as in the present invention, heat flow can be detected by using the conductive layer pattern surrounding the thermopile unit as a lead wire for connecting the thermopile unit pattern or as a lead wire for drawing out the terminal portion to the outside. Measurement of the center portion of the end can be accomplished without any difficulty in design or manufacturing.

A third advantage of the heat flow detection end according to the present invention is that it can be easily cut to a size that matches the area and shape of the surface to be measured.

It will be easily understood that the heat flow detection end according to the present invention can be cut along a grid-like conductor layer pattern in order to adopt a structure in which a plurality of thermopile units are partitioned by a grid-like conductor layer pattern. For example, by cutting the heat flow detection end shown in FIG. 4A along the P-P line,
When the two parts 8 and 8' are connected by means such as soldering, they can be divided into a detection end having terminals 6 and 6' and a detection end having terminals 7 and 7''.

It will be readily appreciated that, as in the above example, the grid dimensions of the conductor layer pattern surrounding each thermopile unit can be the basic longitudinal as well as transverse cutting dimensions. Furthermore, the heat flow detection end of the present invention can be cut into smaller pieces only in one direction. For example, the area in Figures 4A and 4B above is the area in Figure 5A.
If the heat flow detection end shown in Fig. 5B is cut along the Q-Q line and the two parts 9 and 9' are connected by means such as soldering, a detection end with terminals 6 and 6' will be obtained. It can be divided into a detection end with terminals 10 and 10'. In addition, 4th A, 4B, 5A,
In Figure 5B, the thermopile pattern is drawn relatively large to make it easier to understand, but the actual dimensions are, for example, the center line dimension of the square lattice conductor layer pattern is 75 mm, and the hole pitch of the through holes is 3 mm. can do. In this dimension example, cutting can be performed with a minimum pitch of 75 mm in the Y direction and with a minimum pitch of 6 mm in the X direction. As mentioned above, connection by soldering etc. is required when cutting the board, but the 4th A and 5th A
For the connections between 8 and 8' and the connections between 9 and 9' shown in the figure, the arrangement of the unit patterns has been devised so that copper plating can be done very closely together, making the connection work easy. be able to.

As described above, cutting according to the area and shape of the surface to be measured can be easily performed at the measurement site. Generally, the size and shape of the surface to be measured varies, so a heat flow detection end with a fixed size and shape is not practical. Those that can be easily cut to fit are extremely useful.

The heat flow detection end as described above can be manufactured by the following process using plating and photoetching techniques.

In one process according to the present invention, in manufacturing the heat flow detection end, (a) a large number of through holes are formed in a heat-resistant, non-conductive substrate at predetermined positions, and (b) the through holes are Electroless plating is applied to the inner wall and both surfaces of the substrate, (c) plating of the one metal (preferably nickel) is applied to the entire surface of the electroless plating layer, (d) the plating layer of the one metal A plating resist covering an area other than the part where the segment of the other metal (preferably copper) is to be formed on the surface of the substrate and the area corresponding to the opening of the plating formed through hole opening in the said part. (e) plating the other metal using the plating resist as a mask; (f) removing the plating resist; and (g) placing segments of the two metals on the composite plating layer of the two metals. (h) etching is performed using the etching resist as a mask, and (li) Remove the etching resist.

FIGS. 8A to 8I are enlarged end views for explaining steps of an example of the process. Figure 8A
1 shows a state in which a 0.7 mmφ through hole 11 is formed in a 1.6 mm thick glass fiber reinforced epoxy resin substrate 3 with copper foil 21 formed on both sides. Next, this substrate 3 is subjected to electroless copper plating, and electroless copper 22 is deposited on the entire surface of the substrate 3 including the inner wall of the through hole 11 (FIG. 8B). This electroless copper plating is performed through known pretreatment steps such as a degreasing step and a catalytic step. Incidentally, plating in this step has conventionally been generally performed by electroless copper plating, but electroless nickel plating can also be used.
Subsequently, a nickel plating layer 23 is formed as one of the metals on this electroless copper plating layer 22 (FIG. 8C), but in this case, after a sulfuric acid treatment is performed as a pretreatment, a nickel plating layer 23 is formed using nickel sulfamate as the main material, for example. Dip in a nickel plating bath and perform nickel plating. Next, a pattern of the other metal and conductor layer, that is, a plating resist 12 is formed to form copper plating only in required portions. As the plating resist, for example, DuPont's photosensitive resin "Riston" can be used. This plating resist 12 is formed so as to cover only the areas where copper plating is not desired, as shown in FIG. 8D. A film layer or gelatin film is formed, a photographic film showing a desired pattern is placed thereon and exposed, and unexposed areas are eluted with an organic solvent such as trichloroethane. Therefore, the plating resist 12 shown in FIG. 8D is made of a film that is exposed to light and hardened to match the pattern. The board in this state is subjected to pre-treatment for the degreasing process, ammonium vulcanization treatment process, and sulfuric acid treatment process, and then immersed in a copper pyrophosphate plating bath or copper sulfate plating bath, and electrolytic copper plating. administer. When this copper plating is applied, copper plating layers 24 and 4 are formed only on the exposed portions of the nickel plating layer 23, as shown in FIG. 8E.
Next, the plating resist 12 formed in the step of FIG. 8D is dissolved and removed with an appropriate organic solvent, for example, a dichloride-based solvent (FIG. 8F). Next, remove unnecessary parts of the metal from one side and the other side. First, as shown in FIG. 8G, an etching resist 1 similar to the plating resist 12 described above is applied.
form 3. This etching resist 13 is
By etching to cover the parts that do not want to be removed, and then etching with a suitable etching solution, such as a ferric chloride solution, all the metal in the parts where there is no etching resist is eluted, and the substrate is removed as shown in Figure 8H. A discontinuous portion 14 is formed. Finally, the etching resist 13 mentioned above is removed. In this way, the segment 24 of the other metal and the pattern 4 of the conductor layer made of the same metal are formed simultaneously, as shown in FIG.
A heat flow meter board like this is manufactured.

This Figure 8I is the same as that of Figures 5A and 5B.
FIG. 3 is an enlarged cross-sectional view taken along the line. In FIG. 8I, the surface copper layer 4 at the left end of the figure is a copper pattern surrounding the thermopile unit. In addition, this heat flow detection end has a protective layer formed on both surfaces as necessary.
Furthermore, external processing etc. are performed.

In another process according to the present invention, in manufacturing the heat flow detection end, (a) a large number of through holes are formed in a heat-resistant non-conductive substrate at predetermined positions, and (b) the through holes are (c) plating the one metal (preferably nickel) on the entire surface of the electroless plating layer; (d) plating the one metal; plating the other metal (preferably copper) on the entire surface of the layer; (e) on the composite plating layer of both metals, segments of both metals are to be formed on the surface of the substrate and on the portions thereof; forming a first etching resist that covers only the opening of the through hole in which the opening plating is formed; (f) performing etching using the first etching resist as a mask; (g) etching the first etching resist; (h) on the remaining composite plating layer, a portion of the other metal segment is to be formed on the surface of the substrate, and a portion corresponding to the opening of the plating-formed through hole opening in that portion; forming a second etching resist covering the area; (i) etching using the second etching resist as a mask, thereby exposing the one metal at a predetermined location; Remove the etching resist.

FIGS. 9A to 9J are enlarged end views illustrating the steps of this method. Figure 9 A to 9
Figure C is the same process as Figures 8A to C, that is, Figure 9A is the process of forming the through hole 11 in the substrate 3 to which the copper foil 21 is bonded, and Figure 9B is the process of forming the electroless copper plating 22. FIG. 9C shows a step of forming one of the metals, nickel 23, by electroplating. Next, in this method, copper, on which the other metal segment 24 and the pattern 4 of the conductor layer are to be formed, is formed on the entire surface of the nickel plating layer 23 by electrolytic copper plating (FIG. 9D). Next, a first etching resist 1 is applied to remove unnecessary parts of these metals.
Then, etching is performed to form a discontinuous portion 14 (FIG. 9F), and the first etching resist 13 is removed (FIG. 9G). Next, in order to remove unnecessary portions of the copper plating layer 24, which is the other metal, a second etching resist 1 is applied to the corresponding pattern.
3' (FIG. 9H), and only a predetermined portion of the copper is removed with a suitable etchant, such as an ammonia-based alkaline etchant or an ammonium persulfate-based etchant. In this state, as shown in FIG. 9I, one of the metals, the nickel plating layer 23, is exposed in the area where the copper has been removed. Finally, the second etching resist 13' is removed as shown in FIG. 9J.
In this way, the other metal segment 2
4 and the pattern 4 of the conductive layer made of the same metal are formed at the same time to obtain the intended heat flow detection end. Note that FIG. 9J shows an enlarged end view of FIG. 6A. In FIG. 9J, the surface copper layer 4 at the left end of the figure is a copper pattern surrounding the thermopile unit. In the case of this process as well, a protective layer is formed and external processing is performed at the end, if necessary.

Which of the above two processes to adopt is determined depending on the purpose.

Since the above-described process is based on the plating technique, it is possible to form a metal layer that is stable in strength and relatively homogeneous, and as a result, it is possible to efficiently produce a product with stable performance. Furthermore, the pattern arrangement and degree of density of the thermopile units can be changed as desired.

Note that the features of the present invention are as described in the claims, and include the following embodiments.

(1) Each metal segment constituting each thermocouple has a plated portion on one side of the substrate, a plated portion on the other side of the substrate, and a portion of the substrate that communicates the two portions. The heat flow detection method according to claim 1, wherein the conductive layer surrounding the thermoelectric stack unit is a layer formed by plating. end.

(2) The pattern of the conductor layer surrounding the thermopile unit is formed in a grid, and thermocouples are connected in each grid so as to extend in a zigzag pattern within the plane of the substrate. The heat flow detection end described in section.

(3) The heat flow detection end according to claim 1, wherein one metal is nickel and the other metal is copper, and the conductor layer surrounding the thermopile is made of copper.

(4) The heat flow detection end according to claim 1, wherein the thermoelectric stack unit has a quadrilateral shape, and terminals are formed at adjacent vertex portions.

(5) The heat flow detection end according to claim 1, wherein the thermoelectric stack unit has a quadrilateral shape, and terminals are formed at diagonal positions thereof.

(6) The heat flow detection end according to claim 1, wherein the pattern of the conductor layer is formed so as to surround the entire periphery of the thermopile unit.

(7) The heat flow detection end according to claim 1, wherein the pattern of the conductor layer is formed so as to surround a part of the periphery of the thermopile unit.

(8) The heat flow detection end according to claim 1, in which a plurality of pairs of terminals are formed.

(9) The heat flow detection end according to claim 1, in which a pair of terminals is formed.

(10) The method for manufacturing a heat flow detection end according to claim 2 or 3, wherein one metal is nickel and the other metal is copper.

(11) Further cutting the heat flow detection end obtained by the steps (a) to (li) or (a) to (n) above on the conductor layer to divide it into a plurality of heat flow detection ends. A method for manufacturing a heat flow detection end according to claim 2 or 3, comprising:

(12) The heat flow detection end obtained by the steps (a) to (li) or (a) to (n) above is further cut inside some of the thermoelectric stack units to generate multiple heat sources. A method for manufacturing a heat flow rate detection end according to claim 2 or 3, which comprises dividing the heat flow rate detection end into flow rate detection ends.

[Brief explanation of the drawing]

1A and 1B are a front view and a back view, respectively, showing an example of a thermopile unit, and FIG. 1C is an enlarged sectional view taken along the line of FIG. 1A. FIGS. 2A and 2B are a front view and a back view, respectively, showing another example of the thermopile unit. FIG. 3 is a plan view showing an example of a grid-like conductor layer pattern surrounding the thermopile unit. 4th A
Figures 4 and 4B are a front view and a back view, respectively, showing a heat flow detection end constructed by combining the lattice conductor layer pattern shown in Figure 3 and the thermopile unit shown in Figures 1A and 1B. It is. Fifth
Figures A and 5B are a front view and a back view, respectively, showing a heat flow detection end configured by combining the lattice conductor layer pattern shown in Figure 3 and the thermopile unit shown in Figures 2A and 2B. It is a diagram. FIGS. 6A and 6B are a front view and a back view, respectively, showing another example of the heat flow detection end. Fig. 7A is a diagram showing an example of the connection state of the heat flow detection terminal, Fig. 7B is a symbol indicating one thermopile unit in Fig. 7A, and Fig. 7C is a diagram showing an example of the connection state of the heat flow detection end. 2 is a schematic diagram showing a divided measurement plane of FIG. FIG. 8 is an enlarged sectional view illustrating the process of one manufacturing method for a heat flow detection end, in which (A) an end view showing a state in which a through hole is formed in a substrate to which copper foil is bonded; (B) End view showing the state with electroless copper plating including through holes, (C) End view showing the state with nickel plating, (D) End view showing the state with plating resist formed, (E) Copper plating (F) An end view showing the state with the plating resist removed; (G) An end view showing the state with the etching resist formed; (H) An end view showing the state with the etching applied. (I) An end view showing a state with the etching resist removed. FIG. 9 is a cross-sectional view illustrating the steps of another manufacturing method, including (A) an end view showing a state in which a through hole is formed in a substrate to which copper foil is bonded, and (B) a view including the through hole. (C) End view showing the state with electroless copper plating, (C) End view showing the state with nickel plating, (D) End view showing the state with copper plating, (E)
(F) End view showing the state with etching resist formed, (G) End view showing the state with etching applied.
(H) End view showing the state with etching resist (for copper removal) formed; (I) End view showing the state after etching; (J) End view showing the state with etching resist formed. (J) End view showing the state with etching resist formed. FIG. 3 is an end view showing a removed state. 1, 1', 1'', 1... thermoelectric stack unit, 2...
Thermocouple, 3... A substrate carrying the thermocouple, 4... A conductor layer pattern surrounding the thermopile unit, 6, 6',
6″, 6, 7, 7′, 7″, 7…Terminal, 11…
Through hole, 12... plating resist, 13... etching resist, 21... copper foil, 22... electroless copper plating layer, 23... plating layer of one metal, 24... plating layer of the other metal.

Claims (1)

[Scope of Claims] 1 (a) One metal segment and the other metal segment constituting each thermocouple are supported on a heat-resistant non-conductive substrate and are successively and alternately connected. It consists of at least two thermoelectric stack units, and (b) a pattern of a conductive layer that acts as a lead wire for coupling between the units of the thermoelectric stack or for drawing out terminal parts, and the pattern of the conductive layer is connected to the thermoelectric stack. A heat flow detection end, characterized in that it is formed on both sides of the substrate so as to surround at least a part of the periphery of the unit. 2. Segments of one metal and segments of the other metal are supported on a heat-resistant non-conductive substrate and are successively and alternately connected to constitute at least two thermopile units, and A conductive layer pattern is formed on both sides of the substrate so as to surround at least a part of the units of the thermopile, and the pattern acts as a lead wire for coupling between the units or for drawing out the terminal portion. In the manufacturing method of the flow rate detection end, (a) a large number of through holes 11 are formed in the heat-resistant non-conductive substrate 3;
(b) on the inner walls of those through holes 11 and on the substrate 3;
(c) plating the one metal 23 on the entire surface of the electroless plating layer 22; (d) plating the other metal on the plating layer 23 of the one metal; A plating resist 12 that covers areas other than the areas where the metal segments 24 and the pattern 4 of the conductive layer are to be formed on the surface of the substrate and the areas corresponding to the openings 11 of the through holes in which the plating is formed opening in these areas. (e) using the plating resist 12 as a mask, plating the other metal 24 and plating the conductive layer pattern 4 made of the same metal; (f) plating the plating resist 12 (g) On the composite plating layer of both metals, place a portion where the segments 23 and 24 of the two metals and the pattern 4 of the conductive layer are to be formed on the surface of the substrate, and a plating opening in the portion. forming an etching resist 13 that covers only the opening 11 of the through hole in which the etching resist 13 is formed; (h) performing etching using the etching resist 13 as a mask; and (li) removing the etching resist 13. A method for manufacturing a heat flow detection end characterized by: 3 Segments of one metal and segments of the other metal are supported on a heat-resistive non-conductive substrate and are sequentially and alternately connected to constitute at least two thermopile units; A conductive layer pattern is formed on both sides of the substrate so as to surround at least a part of the units of the thermopile, and the pattern acts as a lead wire for coupling between the units or for drawing out the terminal portion. In the manufacturing method of the flow rate detection end, (a) a large number of through holes 11 are formed in the heat-resistant non-conductive substrate 3;
(b) on the inner walls of those through holes 11 and on the substrate 3;
(c) plating the one metal 23 on the entire surface of the electroless plating layer 22; (d) plating the other metal on the entire surface of the one metal plating layer 22; plating to form metal segments 24 and the pattern 4 of the conductive layer made of the same metal; (e) on the composite plating layer of both metals, the segments 23, 24 of both metals and the conductive (f) forming a first etching resist 13 that covers only the portion where the pattern 4 of the body layer is to be formed on the surface of the substrate and the opening 11 of the through hole in which the plating is formed; Etching is performed using the first etching resist 13 as a mask, (g) the first etching resist 13 is removed, and (h) the other metal segment 24 and the conductor layer are placed on the remaining composite plating layer. A second etching resist 13' is formed to cover the area where the pattern 4 is to be formed on the surface of the substrate and the area corresponding to the opening 11 of the plated through hole opening in the area. ) Etching is performed using the second etching resist 13' as a mask, thereby exposing the one metal 23 at a predetermined location, and (v) removing the second etching resist 13' and etching the other metal 23. A method for manufacturing a heat flow detection end, comprising the step of simultaneously exposing the segments 24 and the pattern 4 of the conductor layer.