JPS6228434B2 - - Google Patents
Info
- Publication number
- JPS6228434B2 JPS6228434B2 JP53117667A JP11766778A JPS6228434B2 JP S6228434 B2 JPS6228434 B2 JP S6228434B2 JP 53117667 A JP53117667 A JP 53117667A JP 11766778 A JP11766778 A JP 11766778A JP S6228434 B2 JPS6228434 B2 JP S6228434B2
- Authority
- JP
- Japan
- Prior art keywords
- wax
- workpiece
- substrate
- fixing
- porous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 claims 1
- 239000001993 wax Substances 0.000 description 34
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011297 pine tar Substances 0.000 description 1
- 229940068124 pine tar Drugs 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Electric Clocks (AREA)
- Jigs For Machine Tools (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は特に時計、電子器機等を構成する水
晶、ガラス、セラミツク、シリコン、フエライト
等よりなる小形部品又は厚みが100μ以下のウエ
ハー等の超薄形部品の精密加工に用いるワーク接
着用の固定基板に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is particularly applicable to small parts made of crystal, glass, ceramics, silicon, ferrite, etc. that constitute watches, electronic devices, etc. The present invention relates to a fixed substrate for bonding workpieces used in precision machining of thin parts.
時計や電子器機等を構成する小形部品や、超薄
型部品等の精密加工として一般にラツピング加工
又はポリシング加工等の方法があるが、これら加
工法においてワークをベースとなる基板に固定す
るには、従来は基板にワツクスを塗布し、基板と
ワークとの間にワツクスを介在させることで固定
強度を保持する方法で行なわれていた。
Wrapping or polishing are commonly used for precision processing of small parts and ultra-thin parts that make up watches, electronic devices, etc., but in these processing methods, in order to fix the workpiece to the base substrate, Conventionally, the fixing strength was maintained by applying wax to the substrate and interposing the wax between the substrate and the workpiece.
そして、この際使用するワツクスの選定につい
ても、パラフイン等を主成分とする低融点のもの
を用いているのが実状であつた。 Regarding the selection of the wax used at this time, the actual situation is to use a low melting point wax whose main component is paraffin or the like.
他の方法としてワツクスを全く使用しないで真
空で吸引してワークを基板に固定する方法も行な
われている。 Another method is to fix the workpiece to the substrate by vacuum suction without using wax at all.
しかし、ワークを基板にワツクスを用いて固定
する方法を用いた時、ワツクス量が多いと固定力
は維持出来るが、ワツクス層に厚みのバラツキを
生じせしめ、また逆にワツクス量を極端に少くす
ると固定強度が弱まる。ワツクスの選定について
も、融点があまり高いと作業性が悪く又薄く延ば
すという条件からも制約があり、一般的には強度
を犠性にしてパラフイン等を主成分とする低融点
のものを使用しているのが実状である。
However, when using the method of fixing a workpiece to a substrate using wax, if the amount of wax is large, the fixing force can be maintained, but it may cause variations in the thickness of the wax layer, and conversely, if the amount of wax is extremely small, Fixation strength weakens. There are also restrictions on the selection of waxes due to the fact that if the melting point is too high, workability will be poor, and waxes must be rolled out thinly, so in general, waxes with a low melting point mainly composed of paraffin etc. are used at the expense of strength. The reality is that
又、ワツクスの精製上不純物を皆無にすること
は難かしく、又、ワツクスの層の均一性及びワー
クとワツクス間の熱応力分布の不均一性からし
て、ワツクスの層を高精度に均一にすることは非
常に難かしかつた。 In addition, it is difficult to completely eliminate impurities when refining wax, and due to the uniformity of the wax layer and the non-uniformity of the thermal stress distribution between the workpiece and the wax, it is difficult to completely eliminate impurities in the wax layer with high precision. It was very difficult to do.
このためワークのサイズが大きくなると特に量
産性も加味すると、３〜５μｍのワツクス層のバ
ラツキは必然的に生じてしまい、一応の限界値と
考えられていた。 For this reason, as the size of the workpiece increases, especially when mass production is taken into account, variations in the wax layer of 3 to 5 μm inevitably occur, and this was considered to be a temporary limit.
次に真空吸引による固定方法によれば、特に薄
物となると吸着部と非吸着部との間に接着応力の
不均一を招き、結果的にはポリシング面に吸引模
様を生じせしめ、平坦度は極めて悪いものとなる
のが通常である。又、ワツクスの層にバラツキが
あればワークのラツピングやポリシングの厚み精
度としては、直接的にその影響も受け、ワークの
厚み寸法精度は悪いものとなる。 Next, when fixing by vacuum suction, especially when the object is thin, the adhesive stress becomes uneven between the adhesion part and the non-adsorption part, resulting in a suction pattern on the polished surface and extremely poor flatness. Usually it's bad. Furthermore, if there are variations in the wax layer, the thickness accuracy of wrapping and polishing of the workpiece will be directly affected, and the thickness dimensional accuracy of the workpiece will be poor.
本発明の目的はこれらの弊害をさけ、ワツクス
層の影響を極めて少くするためワツクスの層を均
一にして接着力を保持しワークの加工精度を向上
させるためのワーク固定用の基板を提供すること
である。
The object of the present invention is to avoid these disadvantages and to provide a substrate for fixing a workpiece, which minimizes the influence of the wax layer, makes the wax layer uniform, maintains adhesive strength, and improves the machining accuracy of the workpiece. It is.
上記目的を達成するために本発明は、焼結体を
ポーラス状に形成し、該ポーラス状の部分にワツ
クスを含浸させたワーク固定用の基板を提供する
ものである。
In order to achieve the above object, the present invention provides a substrate for fixing a workpiece, in which a sintered body is formed into a porous shape and the porous portion is impregnated with wax.
以下、本発明について説明する。焼結体は
Al2O3、SiO2又はWC、金属粉末を主成分とする
原料粉末をCO、Ni等のバインダーと混合型に充
填し、電気炉還元雰囲気中で850℃〜1500℃で加
熱焼結を行うことでポーラス基板を形成する。気
孔率40〜65％、圧縮強度100〜700Kg／cm2、空隙径
は粒子径の約15％を標準とする。
The present invention will be explained below. The sintered body
Raw material powder mainly composed of Al 2 O 3 , SiO 2 or WC, and metal powder is filled in a mixed mold with binders such as CO and Ni, and heated and sintered at 850°C to 1500°C in a reducing atmosphere in an electric furnace. This forms a porous substrate. The standard porosity is 40 to 65%, the compressive strength is 100 to 700 Kg/cm 2 , and the pore diameter is approximately 15% of the particle diameter.
このポーラス状焼結体に融点100℃前後のマツ
ヤニ、シエラツク、パラフインを主成分とするワ
ツクスを真空含浸又は加熱強制含侵させることに
よりワークを固定するための接着用基板を作成で
きる。 An adhesive substrate for fixing a workpiece can be prepared by vacuum impregnating or heating forcedly impregnating this porous sintered body with a wax whose main ingredients are pine tar, ciara wax, or paraffin with a melting point of around 100°C.
次に本発明ワーク固定基板を使用して該基板１
にワーク２を固定する方法について説明する。 Next, using the work fixing substrate of the present invention, the substrate 1
The method for fixing the workpiece 2 will be explained below.
第１図は時計の１部品であるロータ磁石をラツ
ピング加工するために基板に接着した状態を示す
断面図である。また第２図は水晶ウエハー等の極
薄物部品をラツピング加工するために基板に接着
した状態を示す断面図である。 FIG. 1 is a sectional view showing a state in which a rotor magnet, which is one component of a timepiece, is adhered to a substrate for wrapping processing. Further, FIG. 2 is a sectional view showing a state in which an ultra-thin component such as a crystal wafer is bonded to a substrate for wrapping processing.
ポーラス状に形成しワツクスが含侵されている
基板１の上面をきれいにふきとり、その上面にワ
ーク２を直接のせて圧力をかけた状態でワツクス
の融点温度以上に加熱する、すると毛細管現象で
ワツクス３が浮き出て基板１とワーク２間に浸透
し基板１にワーク２が接合した時点で冷却させて
基板１にワーク２を接着させる。 The upper surface of the substrate 1, which has been formed into a porous shape and is impregnated with wax, is wiped clean, and the workpiece 2 is directly placed on the upper surface and heated to a temperature higher than the melting point of the wax while applying pressure.Then, the wax 3 is formed by capillary action. When the liquid comes out and penetrates between the substrate 1 and the workpiece 2 and the workpiece 2 is bonded to the substrate 1, it is cooled and the workpiece 2 is bonded to the substrate 1.
すると毛細管現象で浮き出たワツクス量は極め
て少量であつてワツクスの層は極めて薄い層とな
り、且つ均一な層となる。しかも十分な接着強度
を得られる。このようにワークを固定した基板を
ラツピング等の機械にセツトして加工を行なえば
ワツクス層が薄く且つ均一であるので寸法精度の
高い部品を得ることができる。 Then, the amount of wax that floats out due to capillary action is extremely small, and the wax layer becomes an extremely thin and uniform layer. Moreover, sufficient adhesive strength can be obtained. If the substrate on which the workpiece is fixed in this manner is placed in a wrapping machine or the like and processed, parts with high dimensional accuracy can be obtained because the wax layer is thin and uniform.
尚、焼結体の選定はワークの種類に応じて両者
の熱膨張係数差を極力少なくするように適宜選定
すると良い。 The sintered body may be selected appropriately depending on the type of work so as to minimize the difference in thermal expansion coefficient between the two.
以上説明した如く本発明によれば、前もつて焼
結基板にワツクスを含浸させた基板としたため、
ワークと基板間のワツクス量はポーラス内に侵入
した量しかないのでワークの平行度は基板面の面
状態によつて決まり、一方固定力はワークと基板
間のワツクスの量だけでなく基板内に含侵してい
るワツクス量もきいてくるため、ワークの固定力
を何等低下させることなく非常に均一な接着力を
維持しつつワークを固定することができて、ラツ
ピングやポリシング加工上極めて精度の高い加工
が得られる。
As explained above, according to the present invention, since the sintered substrate is previously impregnated with wax,
The amount of wax between the workpiece and the board is only the amount that has penetrated into the porous surface, so the parallelism of the workpiece is determined by the surface condition of the board surface.On the other hand, the fixing force is determined not only by the amount of wax between the workpiece and the board but also by the amount inside the board. Since the amount of wax impregnated is also determined, it is possible to fix the workpiece while maintaining a very uniform adhesion force without reducing the fixation force of the workpiece in any way, making it extremely accurate for wrapping and polishing processing. Processing is obtained.
第１図および第２図は、本発明の実施例による
加工法を示す断面図。
１…基板、２…ワーク、３…ワツクス。
1 and 2 are cross-sectional views showing a processing method according to an embodiment of the present invention. 1...Substrate, 2...Work, 3...Wax.
Claims (1)
は、超薄型のウエハーの精密ラツピングまたはポ
リシング加工等に用いるワーク接着用の固定基板
に於て、アルミナ系または炭化タングステン系ま
たは金属等の焼結体をポーラス状に形成し、該ポ
ーラス状の部分にワツクス（接着剤）が含浸され
ていることを特徴とするワーク固定基板。1. Sintered bodies of alumina, tungsten carbide, metal, etc. are used in fixed substrates for adhering small parts constituting watches, electronic devices, etc., or workpieces used for precision wrapping or polishing of ultra-thin wafers, etc. 1. A work fixing substrate, characterized in that it is formed into a porous shape, and the porous portion is impregnated with wax (adhesive).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11766778A JPS5543475A (en) | 1978-09-25 | 1978-09-25 | Working method of parts of clock or wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11766778A JPS5543475A (en) | 1978-09-25 | 1978-09-25 | Working method of parts of clock or wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5543475A JPS5543475A (en) | 1980-03-27 |
| JPS6228434B2 true JPS6228434B2 (en) | 1987-06-19 |
Family
ID=14717293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11766778A Granted JPS5543475A (en) | 1978-09-25 | 1978-09-25 | Working method of parts of clock or wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5543475A (en) |
-
1978
- 1978-09-25 JP JP11766778A patent/JPS5543475A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5543475A (en) | 1980-03-27 |
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