JPS6229334B2 - - Google Patents
Info
- Publication number
- JPS6229334B2 JPS6229334B2 JP56195002A JP19500281A JPS6229334B2 JP S6229334 B2 JPS6229334 B2 JP S6229334B2 JP 56195002 A JP56195002 A JP 56195002A JP 19500281 A JP19500281 A JP 19500281A JP S6229334 B2 JPS6229334 B2 JP S6229334B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- rotating shaft
- arm
- semiconductor substrates
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H10P72/3412—Batch transfer of wafers
Landscapes
- De-Stacking Of Articles (AREA)
Description
【発明の詳細な説明】
本発明は半導体基板の製造装置に係り、特に、
各種インライン処理形製造装置の供給側半導体基
板のキヤリアからの押し出し機構に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor substrate manufacturing apparatus, and in particular,
This invention relates to a mechanism for extruding semiconductor substrates from carriers on the supply side of various in-line processing type manufacturing apparatuses.
キヤリアに収納された半導体基板を搬送部を介
して処理部等へ搬送することを考慮した場合、半
導体基板が搬送部にかかる面積比率を考慮するこ
とは重要なことである。 When considering transporting a semiconductor substrate housed in a carrier to a processing section or the like via a transport section, it is important to consider the area ratio of the semiconductor substrate to the transport section.
従来、この種の要求に対して、例えばキヤリア
の両端面の開口部を大きくして搬送部がキヤリア
内に入り込む量を大きくするような方法が採られ
ていたが、この方法に於ては製造プロセスによつ
ては開口部が必要以上に大きくできないキヤリア
に於ては適用できない欠点を有していた。 Conventionally, in order to meet this kind of demand, a method was adopted in which, for example, the openings on both end faces of the carrier were made larger to increase the amount by which the conveying section entered the carrier. Depending on the process, it has the disadvantage that it cannot be applied to carriers where the opening cannot be made larger than necessary.
本発明は上記欠点を除去する目的でなされたも
のである。 The present invention has been made to eliminate the above-mentioned drawbacks.
本発明の特徴は、複数枚の半導体基板を収納す
るキヤリアを載置するステージに垂直に取り付け
られた円柱部材より成る回転軸と、平板状部材か
ら成りその一端は前記回転軸に取りつけられその
他端は前記キヤリアの内面の上下寸法より小さく
かつ前記複数枚の半導体基板の全てに当接できる
長さを有するアームとを有し、前記ステージに垂
直にかつ前記回転軸を軸とした円周運動を前記ア
ームが前記回転軸の動作によつて行うことによ
り、前記アームの他端によつて複数枚の半導体基
板の全てが同時に水平方向に前記キヤリアより搬
送部に向つて押し出されることを可能ならしめた
半導体基板の製造装置にある。 The present invention is characterized by a rotating shaft made of a cylindrical member vertically attached to a stage on which a carrier for storing a plurality of semiconductor substrates is mounted, and a flat plate-like member, one end of which is attached to the rotating shaft and the other end. has an arm that is smaller than the vertical dimension of the inner surface of the carrier and has a length that can come into contact with all of the plurality of semiconductor substrates, and has a circumferential motion perpendicular to the stage and about the rotation axis. The movement of the arm by the rotation shaft allows all of the plurality of semiconductor substrates to be simultaneously pushed out horizontally from the carrier toward the transport section by the other end of the arm. There is a semiconductor substrate manufacturing equipment.
以下、本発明を実施例により詳細に説明する。 Hereinafter, the present invention will be explained in detail with reference to Examples.
第１図、第２図は本発明の一実施例である。第
１図に於て回転軸２はキヤリア４を載置するステ
ージに図示のように軸受３を介して取り付けられ
ており、アーム１は更に回転軸２に図示のように
固定されているものとする。この状態に於て回転
軸２に矢視Ａ方向の回転動作を与えるとアーム１
の先端部１ａは、回転軸２を軸とした半径Ｒの軌
跡をえがき始める。この動作をアーム１が一点鎖
線の状態図に至るまで続けて停止させる。このア
ーム１の先端部の動作によりキヤリア４に収納さ
れていた半導体基板６は距離Ｄだけ搬送方向に押
し出される。５は矢視Ｃ方向に回転方向を持つ搬
送ベルトであり、θはアーム１の回転角度であ
る。又、アーム１の先端部１ａの長さ１ｂはキヤ
リア４の上下内面寸法４ｂより小さく、複数枚半
導体基板を全て押し出すに充分な長さであること
は云うまでもない。 FIGS. 1 and 2 show an embodiment of the present invention. In FIG. 1, the rotating shaft 2 is attached to a stage on which a carrier 4 is placed via a bearing 3 as shown, and the arm 1 is further fixed to the rotating shaft 2 as shown. do. In this state, when a rotational movement is applied to the rotating shaft 2 in the direction of arrow A, the arm 1
The tip 1a begins to trace a trajectory with a radius R around the rotating shaft 2. This operation continues until the arm 1 reaches the state shown by the dashed line and is stopped. Due to this movement of the tip of the arm 1, the semiconductor substrate 6 stored in the carrier 4 is pushed out by a distance D in the transport direction. 5 is a conveyor belt whose rotation direction is in the direction of arrow C, and θ is the rotation angle of arm 1. It goes without saying that the length 1b of the tip 1a of the arm 1 is smaller than the upper and lower inner dimensions 4b of the carrier 4, and is sufficient to push out all the semiconductor substrates.
以上の説明から明らかなように本発明による半
導体基板の押し出し機構によれば回転軸の回転動
作により簡単に半導体基板を押し出し搬送部に対
する載置面積を大にすることが可能なので、開口
部４ａの小さいキヤリアの使用を余儀なくされる
製造装置に於ては非常に適した一手段であると云
える。 As is clear from the above description, according to the semiconductor substrate extrusion mechanism according to the present invention, it is possible to easily extrude the semiconductor substrate by the rotational movement of the rotating shaft and increase the mounting area on the transport section. It can be said that this is a very suitable means for manufacturing equipment that is forced to use small carriers.
第１図は本発明の一実施例の斜視図、第２図は
第１図のＺ−Ｚ部の断面図である。
尚、各図に於て、１……アーム、２……回転
軸、３……軸受、４……キヤリア、５……搬送ベ
ルト、６……半導体基板である。
FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line Z--Z in FIG. In each figure, 1...arm, 2...rotating shaft, 3...bearing, 4...carrier, 5...transport belt, 6...semiconductor substrate.
Claims (1)
置するステージに垂直に取り付けられた円柱部材
より成る回転軸と、平板状部材から成り、その一
端は前記回転軸に取りつけられその他端は前記キ
ヤリアの内面の上下寸法より小さくかつ前記複数
枚の半導体基板の全てに当接できる長さを有する
アームとを有し、前記ステージに垂直にかつ前記
回転軸を軸とした円周運動を前記アームが前記回
転軸の動作によつて行うことにより、前記アーム
の他端によつて複数枚の半導体基板の全てが同時
に水平方向に前記キヤリアより搬送部に向つて押
し出されることを可能ならしめたことを特徴とす
る半導体基板の製造装置。1 Consists of a rotating shaft made of a cylindrical member vertically attached to a stage on which a carrier containing a plurality of semiconductor substrates is placed, and a flat plate-shaped member, one end of which is attached to the rotating shaft and the other end of which is attached to the carrier. an arm that is smaller than the vertical dimension of the inner surface and has a length that can come into contact with all of the plurality of semiconductor substrates; By operating the rotating shaft, all of the plurality of semiconductor substrates can be simultaneously pushed out from the carrier in the horizontal direction by the other end of the arm toward the transport section. Manufacturing equipment for semiconductor substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56195002A JPS5896749A (en) | 1981-12-03 | 1981-12-03 | Manufacturing device for semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56195002A JPS5896749A (en) | 1981-12-03 | 1981-12-03 | Manufacturing device for semiconductor substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5896749A JPS5896749A (en) | 1983-06-08 |
| JPS6229334B2 true JPS6229334B2 (en) | 1987-06-25 |
Family
ID=16333893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56195002A Granted JPS5896749A (en) | 1981-12-03 | 1981-12-03 | Manufacturing device for semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5896749A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453941A (en) * | 1987-08-25 | 1989-03-01 | Nec Corp | Housing device for sheet |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW296361B (en) * | 1995-06-26 | 1997-01-21 | Kakizaki Seisakusho Kk | |
| CN102969262B (en) * | 2012-12-07 | 2017-03-01 | 上海集成电路研发中心有限公司 | Silicon chip rewinder |
-
1981
- 1981-12-03 JP JP56195002A patent/JPS5896749A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453941A (en) * | 1987-08-25 | 1989-03-01 | Nec Corp | Housing device for sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5896749A (en) | 1983-06-08 |
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