JPS6238211B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention is a method for manufacturing a chip-shaped electronic component without lead wires into a long flexible structure having a plurality of recesses formed at predetermined intervals. Regarding an automatic manufacturing device for an assembly of chip-shaped electronic components housed in a flexible strip, this method was developed to facilitate measurement work, etc., by simply pasting multiple chip-shaped electronic components onto an adhesive tape. The present invention relates to an apparatus for manufacturing a chip-like electronic component assembly as a final product by separating chip-like electronic components from a series of tape-like electronic components and sequentially storing them in recesses of a flexible band-like body.

(Prior Art) For example, there is an inductor as shown in FIG. 1 as a chip-shaped electronic component. 1 is a drum-shaped core with square-shaped collars 2 and 3 at both ends;
The outer shape of the collar 2 is larger than that of the other collar 2. Reference numerals 4 and 5 denote a pair of electrodes formed at both ends of the outer plane of the collar 3, which has a larger external shape, and 6 a coil wound around the core 1, both terminals of which are connected to the electrodes 4 and 5, respectively. It is something that
In order to efficiently measure the electrical characteristics of a large number of chip-shaped inductors with this structure, it is necessary to align the large number of inductors so that their electrode surfaces are on the same side. Because objects have a directional shape, it is difficult to align them each time they are placed on a commonly used parts feeder. Therefore, in order to maintain the alignment required in the measurement process, etc., the following means of configuring a series of chip-shaped electronic components has been taken. FIG. 2 is a plan view showing a part of this chip-shaped electronic component series, FIG. 3 is a longitudinal sectional view thereof, and FIG. 4 is a rear view thereof. In these figures, reference numeral 11 denotes a tape member, which is a long tape member made of a flexible material such as paper or plastic, on which a plurality of through holes 12 and a plurality of feed holes 13 are formed at a constant pitch in the longitudinal direction. On one side of the elongated strip 14,
Apply adhesive tape 1 so as not to cover the feed hole 13.
5 is pasted on it. Reference numeral 16 designates a chip-shaped inductor having the configuration shown in FIG. It is fixed to an adhesive tape 15. The chip-shaped inductors 16 are sequentially arranged in the through holes 12 of the tape member 11 held by the chuck and transferred intermittently immediately after the process of soldering the end portion of the coil and the electrode. The series of chip-shaped electronic components configured in this manner is arranged with the electrodes necessary for measurement exposed on the top surface, so that continuous and efficient measurement work is possible.

However, when the chip-shaped inductor that had been measured was separated from the adhesive tape and tried to be automatically attached to the printed circuit board, the mounting surface, where the electrodes were installed, was located on the opposite side of the adhesive tape. Therefore, the chip-shaped inductor must be removed from the adhesive tape, turned 180 degrees, and then attached to the wiring board by inserting the collar on the side where no electrodes are provided with a chuck from above. There is a problem that automation becomes complicated.

Therefore, a chip-shaped electronic component assembly is formed by storing the chip-shaped electronic component in a recess of a long flexible band so that the surface on which the chip-shaped electronic component is provided with the electrode faces downward. For example, it becomes easy to automate the attachment to the printed wiring board, but the above
If an attempt is made to form the above-mentioned chip-shaped electronic component assembly from a series of tape-shaped electronic components as shown in FIG. 4, the process must be done manually since no automatic manufacturing equipment exists.

(Problem to be Solved by the Invention) However, in order to form a chip-shaped electronic component assembly, the chip-shaped electronic components are separated from the adhesive tape of the tape-shaped electronic component series as described above, and then the chip-shaped electronic components are separated.
It is necessary to turn it 180 degrees and store it in the recess of the long flexible strip, which is extremely difficult and time-consuming to do manually, which is impractical.

The present invention has been made in view of the above points, and for the purpose of measurement etc., the chip-shaped electronic component attached to the above-mentioned chip-shaped electronic component series is turned upside down and made into a long piece. It is an object of the present invention to provide an automatic manufacturing device for a chip-shaped electronic component collection band, which is stored in a recessed part of a flexible band-shaped body and can easily automate attachment to a printed wiring board.

(Means for Solving the Problems) In order to achieve such an object, the automatic manufacturing device of the present invention provides a plurality of adhesive tapes with electrodes on the opposite side of the adhesive tape. a first intermittent transfer device that intermittently transfers a series of tape-shaped electronic components to which individual chip-shaped electronic components are attached, with the chip-shaped electronic components positioned on the lower side; A long flexible strip having a plurality of recesses for accommodating the electronic components is intermittently transferred in parallel with the series of tape-shaped electronic components with the openings of the recesses facing upward. Second
An intermittent transfer device and a chip-shaped electronic component transferred by the first intermittent transfer device are held from below, separated from the adhesive tape, and moved between the tape-shaped electronic component series and the flexible strip. a first chuck for holding the chip-shaped electronic component located between the tape-shaped electronic component series and the flexible strip-shaped body from above, and a recessed portion of the flexible strip-shaped body; a second chuck for storing a chip-shaped electronic component in a recess; a cover sheet supply device that uses the second chuck to supply a tape-like cover sheet for sealing a recess to a flexible band-shaped body in which a chip-shaped electronic component is stored in the recess; The present invention is characterized in that it includes a cover sheet sticking device that sticks the cover sheet supplied by the cover sheet feeding device to a flexible band-like body.

(Function) The automatic manufacturing device for a chip-shaped electronic component collection band of the present invention has a first chuck and a second chuck.
The chip-shaped electronic component is turned over 180 degrees and placed in the recess of the elongated flexible band-shaped body, with the surface on which the electrode is provided, which is the mounting surface of the chip-shaped electronic component, facing downward. These first and second chucks are synchronized with each other with a first intermittent transfer device that transfers a series of tape-shaped electronic components and a second intermittent transfer device that transfers a long flexible strip. As a result, continuous high-speed processing becomes possible.

(Example) An example of the present invention will be described below in detail with reference to the drawings.

FIG. 5 is a side view showing the main parts of the device of the present invention, and 21 and 22 are a pair of pin wheels constituting the first intermittent transfer device, which are intermittently transferred by a barrel cam fitted to a drive shaft (not shown). The device is rotated and the series of tape-shaped electronic components shown in FIGS. 2 to 4 is intermittently transferred by a pin that engages with the feed hole 13 with the chip-shaped inductor positioned on the lower side. As shown in FIG. 6, this tape-shaped electronic component chain 23 has pin wheels 21,
The first rail 24 arranged between the two is arranged as shown in FIG. 7, which shows a longitudinal section, and transferred. 25 and 26 are a pair of pin wheels constituting a second intermittent transfer device;
It is rotated intermittently on the same drive shaft as 1 and 22 via a barrel cam, and a plurality of recesses 27 and a plurality of feed holes 28 are formed at predetermined intervals as shown in FIG. A long flexible strip 29 made of plastic or the like is transported intermittently by a pin that engages with the feed hole 28 with the opening surface of the recess facing upward. .
This flexible band-like body 29 is arranged substantially parallel to the tape-shaped electronic component chain 23 at a predetermined interval, and is connected to the pin wheels 25, 29 as shown in FIG.
It is arranged and transferred to a second rail 30 arranged between them as shown in FIG. 9, which shows a longitudinal section. Reference numeral 31 denotes a measurement terminal that contacts a pair of electrodes of a chip-shaped inductor to measure its electrical characteristics such as inductance, and as shown in FIG. It is arranged at the lower part of the electronic component chain 23 and is configured to move up and down in synchronization with the transfer of the electronic component series 23. Reference numeral 32 denotes a first chuck disposed at the bottom of the tape-shaped electronic component chain 23 transferred by the first intermittent transfer device, and a chip-shaped inductor is transferred to the upper part of the chuck as shown in FIGS. 10 and 11. When the inductor is attached to the adhesive tape, it moves upward and pinches the flange with the clamping portion 33, then moves downward while holding the flange to separate the inductor from the adhesive tape, and then removes the inductor from the tape-shaped electronic component series 23. and the flexible strip 29. The series of electronic components whose inductor has been separated from the adhesive tape in this manner is transferred forward one pitch. Reference numeral 34 denotes a second chuck disposed on the top of the flexible strip 29 transferred by the second intermittent transfer device, and as shown in FIG. When the inductor is transferred between the electronic component chain 23 and the flexible strip 29, it moves downward and the suction portion 35 comes into contact with the outer surface of the flange to suction and hold the inductor. At this time, the first chuck 32 releases its hold on the inductor, and the second chuck 34 moves upward while holding the inductor. And the flexible strip 2
9 and further moves downward to accommodate the chip-shaped inductor in the recess 27 of the flexible band-shaped body 29. At this time, the second chuck 34 releases its suction and moves upward. Recess 2
At 7, the flexible strip 29 containing the chip-shaped inductor is transferred forward one pitch. The first intermittent transfer device, the second intermittent transfer device, the first chuck, and the second chuck are each driven in synchronization with each other by the drive shaft (not shown). The device in this embodiment also measures the chip-shaped inductor at the same time, so if the measured value deviates from the specified value, the inductor is transferred to the upper part of the first chuck 32. Even if the first chuck does not move as expected, the inductor remains attached to the adhesive tape and is transferred forward, and the inductor that should have been housed in the recess of the flexible strip 29 is is not stored, so the flexible strip 29 is set not to be transported forward. Note that if all the inductors of the tape-shaped electronic component series 23 are within the measured standard range, there is no need to add a measuring process to this device, and therefore there is no need to perform the above operation. 36 is a tape-shaped cover sheet made of a transparent thin film such as plastic, which is wound around a winding frame 37 that is rotatably attached to a column (not shown) above the device of the present invention, and is pulled out via a guide roller 38. It is disposed on the upper surface of the flexible band-like body 29 in which the chip-shaped inductor is housed in the recess 27 via the roller 39, excluding the feed hole 28. This winding frame 37, roller 3
8, 39, etc. constitute a cover sheet supply device. Reference numeral 40 denotes a heating body made of copper or the like, which is heated by a heater 41 attached to a column (not shown), presses the tape-shaped cover sheet 36 onto the upper surface of the flexible band-shaped body 29, heats the cover sheet 36, and heats it slightly. It is melted and attached to both ends of the recess 27 of the movable strip 29. In other words, the heating body 40 and the heater 41 constitute a cover sheet sticking device. Note that the cover sheet pasting device is not necessarily limited to such a heating means; for example, adhesive may be applied to both longitudinal ends of the cover sheet or both ends of the recess 27 of the flexible strip 29. It is also possible to use a method such as attaching the material to the surface. in this way,
A cover sheet 36 is attached to the flexible strip 29 in which the chip-shaped inductor is housed in the recess to form a chip-shaped electronic component assembly as a final product. The electronic component assembly is wound onto a reel or stored in a storage box in a cassette shape so that it can be easily applied to an automatic machine for attachment to a printed wiring board. In the chip-shaped electronic component assembly constructed in this way, since the electrodes of the chip-shaped electronic components are located at the bottom, in order to attach the chip-shaped electronic components to the printed wiring board, the top of the chip-shaped electronic components must be clamped with a chuck. It is extremely easy to install it, as it only needs to be moved by adsorption.

Although the automatic manufacturing apparatus for chip-shaped electronic component assemblies of the present invention is configured as described above, it is not necessarily limited to the above configuration, and various modifications are possible. For example, a series of tape-shaped electronic components does not have the structure shown in Figs. 2 to 4, but double-sided adhesive tape is pasted on one side of the tape member without through-holes, and a predetermined line is placed on the adhesive tape. The electronic component series may be constructed by pasting chip-shaped electronic components at intervals, or if the required thickness is present, the electronic component series may be constructed by simply using adhesive tape without using any tape member. Furthermore, the flexible band-like body 29 does not have the structure shown in FIG. 8, but a tape member having a thickness sufficient to accommodate chip-shaped electronic components is provided with a through hole in the bottom surface of the tape member, and the flexible band-like member 29 does not have the structure shown in FIG. A cover sheet similar to that used may be attached. Furthermore, it goes without saying that the chip-shaped electronic component is not limited to the inductor having the structure used in the above embodiments, but may be other electronic components such as inductors of other structures, capacitors, and resistors. In short, any chip-shaped electronic component can be applied as long as it has a structure in which a required electrode is provided on one side of the component. Furthermore, the first and second chucks are
Any structure may be used as long as the electronic component is held by appropriate means such as mechanical clamping or suction.

(Effects of the Invention) Since the automatic manufacturing device for a chip-shaped electronic component assembly of the present invention is configured as described above, the chip-shaped electronic component assembly in the tape-shaped electronic component series is reversed in the vertical direction and then attached to the printed wiring board. It is possible to easily configure a chip-shaped electronic component collecting band whose attachment can be easily automated.

[Brief explanation of the drawing]

Figure 1 is a longitudinal cross-sectional view of a chip-shaped inductor;
The figure is a plan view showing a part of a tape-shaped electronic component series, FIG. 3 is a longitudinal sectional view thereof, FIG. 4 is a rear view thereof, and FIG.
The figure is a side view of the essential parts of an automatic manufacturing apparatus according to an embodiment of the present invention, FIG. 6 is a plan view of the essential parts, and FIG. 7 is a longitudinal sectional view showing the arrangement of a series of tape-shaped electronic components in the first rail. , FIG. 8 is a perspective view showing a part of the flexible strip, FIG. 9 is a longitudinal sectional view showing the arrangement of the flexible strip within the second rail, and FIG. 10 is a tape-shaped electronic component chain. FIG. 11 is a schematic diagram for explaining the operation of the first and second chucks. 21, 22, 25, 26...pin wheel, 2
3... Tape-shaped electronic component series, 24... First rail, 29... Flexible strip, 30... Second rail, 31... Measuring element, 32... First chuck, 34... ...Second chuck, 36... Tape-shaped cover sheet, 37... Winding frame, 38, 39... Roller, 40... Heating body, 41... Heater.

Claims (1)

[Scope of Claims] 1. A series of tape-shaped electronic components in which a plurality of chip-shaped electronic components are attached to an adhesive tape such that the surface on which electrodes are provided is on the opposite side of the adhesive tape. a first intermittent transfer device that intermittently transfers the chip-like electronic component so that it is located on the lower side; and a long flexible band-like body formed with a plurality of recesses for storing the chip-like electronic component. a second intermittent transfer device that intermittently transfers the chip in parallel with the series of tape-shaped electronic components so that the opening surface of the recess is located on the upper side; a first chuck that holds the electronic components from below and separates them from the adhesive tape and moves them between the tape-shaped electronic component series and the flexible strip; a second chuck for holding the chip-shaped electronic component located between the flexible strip-shaped body from above and storing it in the recess of the flexible strip-shaped body; A cover sheet supplying device that supplies a tape-like cover sheet for sealing a concave portion of a flexible strip containing electronic components; and a cover sheet supplied by the cover sheet supplying device is attached to the flexible strip. An automatic manufacturing device for a chip-shaped electronic component assembly, comprising: a cover sheet pasting device for attaching a cover sheet;