JPS6240148B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cutting blade, and more particularly to a cutting blade suitable for precision cutting of semiconductors such as silicon and germanium, crystal, ferrite, glass, and other hard and brittle materials.

As such a cutting blade, as shown in FIG. 1, grooves 2 extending from the end surface of the base metal 1 in the depth direction of the base metal 1 are formed alternately on both the front and back surfaces, and the grooves 2 are coated with electrodeposited nickel bonding. This cutting blade has a base abrasive layer 3 formed by fixing cemented carbide abrasive grains such as diamond, and a supporting abrasive layer 4 formed of similar abrasive grains and bond on the opposite surface of the base metal 1. The inventor of the application has previously proposed this (see FIG. 8 in Japanese Patent Application Laid-open No. 146678/1983).

When this cutting blade is used with a large tension applied to the base metal 1, the blade edge displaces in a zigzag pattern as shown in Figure 2 due to the difference in the materials of the base metal 1 and the bond. Even if the support abrasive layer 3 has the advantage of being able to support the side drag that acts on the side surface of the cutting blade, it can prevent an increase in cutting resistance caused by the cracking. .

However, although the depth of the groove 2 needs to be at least half the thickness of the end face of the base metal 1, it cannot be formed too deep due to strength issues. As a result, as shown in Fig. 3, when the sharpness increases, a portion x where no abrasive grain layer is present occurs in the circumferential direction of the end face of the base metal, resulting in a problem in which the sharpness decreases and chipping is likely to occur in the material to be cut. be.

The object of the present invention is to solve the above-mentioned problems and to ensure that an abrasive grain layer exists in the circumferential direction of the end face of the base metal even if the sag increases.

In order to achieve the above object, the present invention has a structure in which an end surface abrasive layer that is continuous with a base abrasive layer and a support abrasive layer is formed on the end surface of the base metal that is continuous with the above-mentioned groove.

Hereinafter, embodiments of the present invention will be described based on the attached FIGS. 4 and 5.

In the cutting blade of the present invention, grooves 2 extending from the end face of the base metal 1 in the depth direction are formed almost evenly on both sides of the base metal 1, and cemented carbide abrasive grains are fixed to each groove. A base abrasive grain layer 3 is formed using the base abrasive grain layer 3, and a support abrasive grain layer 4 is formed by fixing similar cemented carbide abrasive grains to the base metal surface on the opposite side. In the case of this invention, in addition to the two abrasive grain layers 3 and 4 described above, an end face abrasive layer 5 is formed on the end face of the base metal 1, which is continuous with both the abrasive grain layers 3 and 4.

Each of these abrasive grain layers 3, 4, and 5 is formed in a layered manner, as shown in FIG. That is, the first layer 6 of the base abrasive grain layer 3 is continuously formed on the bottom surface of the groove 2 and the end surface of the base metal 1 that is continuous with the groove 2, and then the second layer 6
Layer 7 and third layer 8 are formed. After that, one layer of support abrasive grain layer 4 is formed and laminated on the third layer 8 at the end face, resulting in a total of four end face abrasive grain layers 5.
form.

Note that the support abrasive layer 4 may be formed to have a shorter depth than the base abrasive layer 3, as shown in FIG.

As described above, since the cutting blade of the present invention has an end surface abrasive grain layer on the end surface of the base metal, even if a large sag occurs, there will be no discontinuous part of the abrasive grains in the circumferential direction of the end surface, resulting in a good Demonstrates sharpness.

In addition, as with the conventional case (see Figure 1), the effect of a cutting blade with a groove structure, that is, the blade thickness can be reduced, the cutting fluid circulates smoothly, and chips are discharged well. Demonstrate.

[Brief explanation of the drawing]

FIG. 1 is a partially enlarged perspective view of the conventional example, and FIGS. 2 and 3 are partially enlarged end views when clams occur.
Fig. 4 is a partially enlarged sectional view of the present invention, Fig. 5 is a partially enlarged plan view of Fig. 4, Fig. 6 is an enlarged sectional view of Fig. 4, and Fig. 7 is a partially enlarged view of another example. FIG. 1... Base metal, 2... Groove, 3... Base abrasive layer, 4... Support abrasive layer, 5... End surface abrasive layer.

Claims (1)

[Scope of Claims] 1. Grooves extending in the depth direction from the end face of the base metal are formed almost evenly on both sides of the base metal, and cemented carbide abrasive grains are fixed to each groove by a plating method to form a base abrasive grain layer. ,
In a cutting blade in which a support abrasive layer is formed by fixing similar carbide abrasive grains to the base metal surface on the opposite side using a plating method, a support abrasive layer is formed on the base metal end surface that is continuous with the grooves and is continuous with each of the above abrasive grain layers. A cutting blade characterized by forming an abrasive grain layer on the end surface. 2. The cutting blade according to claim 1, wherein the base abrasive grain layer and the end surface abrasive grain layer are formed in a plurality of layers. 3. The cutting blade according to claim 2, wherein the outermost layer of the end surface abrasive layer is formed of a layer continuous with the support abrasive layer.