JPS6240431B2 - - Google Patents
Info
- Publication number
- JPS6240431B2 JPS6240431B2 JP54105929A JP10592979A JPS6240431B2 JP S6240431 B2 JPS6240431 B2 JP S6240431B2 JP 54105929 A JP54105929 A JP 54105929A JP 10592979 A JP10592979 A JP 10592979A JP S6240431 B2 JPS6240431 B2 JP S6240431B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- powder
- amount
- added
- reducing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 claims description 95
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 94
- 229910052802 copper Inorganic materials 0.000 claims description 92
- 239000000843 powder Substances 0.000 claims description 36
- 239000003638 chemical reducing agent Substances 0.000 claims description 34
- 239000011701 zinc Substances 0.000 claims description 29
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 27
- 229910052725 zinc Inorganic materials 0.000 claims description 27
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 26
- 239000002923 metal particle Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 18
- 150000001879 copper Chemical class 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 229910052742 iron Inorganic materials 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 9
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 5
- 229910001431 copper ion Inorganic materials 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- 239000002002 slurry Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 description 31
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 15
- 229910000365 copper sulfate Inorganic materials 0.000 description 14
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 14
- 239000007788 liquid Substances 0.000 description 14
- 238000003756 stirring Methods 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 229910000599 Cr alloy Inorganic materials 0.000 description 7
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 7
- 239000000788 chromium alloy Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000008399 tap water Substances 0.000 description 6
- 235000020679 tap water Nutrition 0.000 description 6
- 235000002639 sodium chloride Nutrition 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000004453 electron probe microanalysis Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000006479 redox reaction Methods 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 229910000358 iron sulfate Inorganic materials 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- WABPQHHGFIMREM-BKFZFHPZSA-N lead-212 Chemical compound [212Pb] WABPQHHGFIMREM-BKFZFHPZSA-N 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- -1 zinc Chemical compound 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Description
本発明は金属粉、合金粉、金属化合物等の粒子
(以下、単に金属粒子という)の表面に銅被膜層
を形成した複合粉末の製造法に関するもので、そ
の用途は金属ブラシ、軸受、集電子、ブレーキ材
料さらには建材等、多目的に使用可能な素材粉を
提供するところにある。
金属粒子表面に銅を析出させて金属粒子を銅被
膜する一般的な方法は無電解メツキ法に集約でき
る。しかし、その場合金属粒子自体が水溶液中で
還元剤として働く場合には問題ないが、それ自体
が直接酸化還元反応に関与しない粒子がある。こ
の場合には金属粒子と銅液からなる系に還元作用
を行なわせる他の物質を共存させることになる。
金属粒子自体が還元剤として働く場合の複合粉末
の製造法には特開昭48−88053号や特公昭54−
11258号公報等がある。
本発明は還元剤になり難い金属粒子に銅被膜を
施した複合粉末の製造法に関するもので、したが
つて金属粒子と銅液からなる系に還元作用を行な
わせる他の物質を共存させることになる。この物
質は鉄または亜鉛あるいはアルミニウム等の金属
を使うか、あるいはフエーリング氏液のようにホ
ルマリン等の液状還元剤を使うのが普通である。
従来の金属状還元剤による銅被膜法は生成粉末中
に多量の還元剤が残留し、残留還元剤の除去操作
を付加しなければ高純度銅被膜金属粒子が得られ
ず、製造工程が複雑になり、またフエーリング氏
液を用いる方法は原料である銅塩類の他に補助試
薬を数種類添加するが、この補助試薬類には高価
なものが多く、銅被膜金属粒子もまた経済的にコ
スト高とならざるを得なかつた。
本発明は銅を被膜しようとする金属粒子と銅イ
オンを還元するための還元剤が混在するスラリー
にスラリー中の水量に対して溶解度範囲を越える
量の銅塩類結晶を添加することにより金属粒子表
面に銅被膜層を形成させると共に生成粉末への還
元剤混入率を低下させ、かつ銅被膜粒子中の銅含
有率を目的に応じて制御することが可能となり、
さらに還元剤の使用量を従来に比べ減少させたに
もかかわらず廃液への残留銅濃度をppm単位に
低下させることができるので廃液処理も容易とな
るのである。以下、本発明方法を詳述する。
金属粒子への銅被膜法に関する本発明は、一定
量の水に金属粒子を添加し、必要に応じて該粒子
に親水性を与える界面活性剤を添加する。次に、
銅イオンの還元剤を投入するが使用する還元剤は
イオン化傾向が銅よりも卑な金属、例えば亜鉛、
鉄またはアルミニウム等を使用する。更に機械撹
拌により流動化した粒子と還元剤とのスラリーに
銅塩類結晶を添加する。反応終了後は通常の方法
により篩分け、脱水、水洗、乾燥を行ない、目的
とする銅含有率を有する銅被膜金属粒子を得るの
である。
本発明に適応する金属粒子の径は撹拌によつて
水または液中で流動可能な大きさであることが望
ましい。また、親水性の悪い粒子に銅被膜をしよ
うとするときには、有機系あるいは無機系の濡れ
剤を添加することもある。
銅イオンの還元剤にはイオン化傾向が銅よりも
卑な金属を使う。使用可能な種々金属のうち、経
済性および入手の容易性から亜鉛あるいは鉄また
はアルミニウム等が適当である。そして、被膜金
属粉末の仕上り程度例えば銅被膜率や被膜銅酸化
進行度合さらには製造廃液処理を含めて考慮した
場合には、亜鉛と鉄が最も適している。これらの
反応は次に示す通りである。
Cu2++Zn=Cu+Zn2+ ………(1)
Cu2++Fe=Cu+Fe2+ ………(2)
3Cu2++2Al=3Cu+2Al3+ ………(3)
従来の方法すなわち溶解度範囲内の濃度で構成
される銅塩類溶液からの金属粒子への銅被膜法に
おいては、還元剤使用量が1.1当量程度のとき反
応率は90%程度にとどまり、かつ製造廃液中の残
留銅量をppm単位にまで低下させようとするな
らば還元剤使用量を1.3〜1.5当量に増加しなけれ
ばならない。しかし、還元剤使用量が多いという
ことは生成粉末中に多量の還元剤を残留させる一
要因となり、残留還元剤除去操作を付加する必要
がある。
しかるに、本発明の溶解度範囲を越える銅塩類
結晶を投入する方法では、還元剤使用量が反応式
に対し1.01〜1.06当量で済むにもかかわらず、製
造廃液残留銅濃度はppm単位に低下し、従つて
反応率は向上し、かつ生成粉末への未反応還元剤
混入率は約0.3%以下に低下することができるの
である。
還元剤の形態は正方形、長方形あるいは球形さ
らには不定形等、外形はいずれでも使用可能であ
り、その大きさを表面積で示すならば概略1箇当
り0.5〜10cm2程度が適当である。表面積が0.5cm2未
満の場合は還元析出する銅が粒子表面ではなく還
元剤自体の表面を被膜してしまい、また約10cm2を
越える場合は溶液中での還元剤の良好な流動が得
られ難く、金属粒子表面への銅の析出が偏析する
と同時に、0.5cm2未満の還元剤と同様に還元剤自
体の表面に銅が析出するので、還元剤の大きさは
前記範囲内に整粒することが望まい。
銅原として添加する銅塩類結晶は、例えば硫酸
銅や塩化銅など比較的溶解度の大きい塩類を使
う。硫酸銅(CuSO4・5H2O)の水に対する溶解
度は25℃において無水物換算で18.2g/100g溶
液であり、塩化銅(CuCl2・2H2O)の溶解度は
25℃において無水物換算で43.6g/100g溶液
(丸善株式会社発行、日本化学会偏「化学便覧」)
である。銅塩類の溶解度は溶液の温度によつて異
なるが、本発明でいう溶解度は銅塩類を溶解しよ
うとする水の温度を基準に採るものとし、銅塩類
添加量は銅塩類を溶解しようとする水の温度に対
する溶解度を越える量であつて、その上限は被膜
しようとする銅含有率によつて決まる。
本発明法によれば、反応槽に銅塩類を投入した
時点では多量の未溶解銅塩類結晶が槽内を流動す
ることになるが、反応の進行に伴なつて結晶は順
次溶解し、ついには完全に溶解して全ての銅が金
属粒子を被膜することになる。また、該酸化還元
反応は発熱反応であつて、反応が進行するに従い
溶液の温度が上昇し、銅塩類の添加量によつては
沸騰状態にまでなるが、未溶解の銅塩類はこの温
度上昇によつても溶解が進行する。
なお、反応槽に添加する銅塩類の量は生成粉末
の目的とする銅含有率を満たす量であれば良い
が、注意しなければならないのは銅塩と還元剤が
置換反応して生成する塩例えば硫酸亜鉛や硫酸鉄
あるいは硫酸アルミニウム等の溶解度を考慮に入
れることも必要である。これは生成粉末中にこれ
ら還元剤の塩が混入して生成粉末の純度を低下さ
せる原因になるからである。ただしこの場合、生
成粉末を水洗や湯洗その他の方法を構ずることに
より除去することが可能である。
また、撹拌反応時間は還元剤の種類を問わず20
〜60分で充分である。
このようにして得られた銅被膜金属粒子は通常
の脱水、水洗、乾燥工程を経て製品粉末にする。
以下に示す実施例は金属粉の代表例として鉛粉
を、合金粉の代表例として銅クローム合金粉を、
水に不溶性の金属塩類の代表例として二硫化モリ
ブデン粉を例示したが、本発明法はかような金属
粉末粒子に限定されるものではない。
実施例 1
25℃の水道水1.3に第1表の粒度分布を有す
る鉛粉200gと表面積が1箇当り約5cm2〜10cm2程
度の大きさを有する花状亜鉛212gを添加し、鉛
粉が沈降せずかつ花状亜鉛が流動する程度の撹拌
(本実験装置では550RPM、周速145m/min)を
した。これに銅被膜鉛粉中の銅含有率50%を目標
に工業用硫酸銅809g(銅量200gに相当)を添加
した。上記亜鉛量は硫酸銅中の銅を還元するに要
する量の1.03当量に相当する。
The present invention relates to a method for producing a composite powder in which a copper coating layer is formed on the surface of particles such as metal powder, alloy powder, or metal compound (hereinafter simply referred to as metal particles), and its uses include metal brushes, bearings, and current collectors. Our goal is to provide material powder that can be used for multiple purposes, such as brake materials and even building materials. General methods for coating metal particles with copper by depositing copper on the surface of the metal particles can be summarized as an electroless plating method. However, in this case, there is no problem if the metal particles themselves act as reducing agents in the aqueous solution, but there are particles that do not directly participate in the redox reaction. In this case, other substances that perform a reducing action are allowed to coexist in the system consisting of metal particles and copper liquid.
JP-A-48-88053 and JP-B-Sho.
There are publications such as No. 11258. The present invention relates to a method for producing a composite powder in which copper coating is applied to metal particles that cannot easily be used as a reducing agent.Therefore, the present invention relates to a method for producing a composite powder in which copper coating is applied to metal particles that cannot easily be used as a reducing agent. Become. This substance usually uses a metal such as iron, zinc, or aluminum, or a liquid reducing agent such as formalin, such as Fehling's solution.
In the conventional copper coating method using a metallic reducing agent, a large amount of reducing agent remains in the resulting powder, and high purity copper-coated metal particles cannot be obtained without an additional operation to remove the residual reducing agent, which complicates the manufacturing process. In addition, in the method using Fehring's solution, several types of auxiliary reagents are added in addition to copper salts as raw materials, but many of these auxiliary reagents are expensive, and copper-coated metal particles are also economically expensive. I had no choice but to do so. In the present invention, by adding copper salt crystals in an amount exceeding the solubility range with respect to the amount of water in the slurry to a slurry containing a mixture of metal particles to be coated with copper and a reducing agent for reducing copper ions, the surface of the metal particles is coated. It is possible to form a copper coating layer on the particles, reduce the rate of reducing agent mixed into the produced powder, and control the copper content in the copper coating particles according to the purpose.
Furthermore, even though the amount of reducing agent used is reduced compared to the conventional method, the residual copper concentration in the waste liquid can be reduced to ppm units, making waste liquid treatment easier. The method of the present invention will be explained in detail below. In the present invention, which relates to a copper coating method on metal particles, metal particles are added to a certain amount of water, and if necessary, a surfactant that imparts hydrophilicity to the particles is added. next,
A copper ion reducing agent is introduced, but the reducing agent used is a metal whose ionization tendency is more base than that of copper, such as zinc,
Use iron or aluminum, etc. Furthermore, copper salt crystals are added to the slurry of particles and reducing agent that has been fluidized by mechanical stirring. After the reaction is completed, the particles are sieved, dehydrated, washed with water, and dried by conventional methods to obtain copper-coated metal particles having the desired copper content. The diameter of the metal particles suitable for the present invention is preferably such that they can flow in water or liquid by stirring. Furthermore, when attempting to coat particles with poor hydrophilicity with copper, an organic or inorganic wetting agent may be added. As a reducing agent for copper ions, a metal whose ionization tendency is more base than copper is used. Among the various metals that can be used, zinc, iron, aluminum, etc. are suitable from the viewpoint of economy and availability. When considering the finish of the coated metal powder, such as the copper coating rate, the progress of oxidation of the coated copper, and the treatment of manufacturing waste liquid, zinc and iron are most suitable. These reactions are shown below. Cu 2+ +Zn=Cu+Zn 2+ ………(1) Cu 2+ +Fe=Cu+Fe 2+ ………(2) 3Cu 2+ +2Al=3Cu+2Al 3+ ………(3) Conventional method, that is, within the solubility range In the copper coating method on metal particles from a copper salt solution consisting of a concentration of In order to reduce the amount to 1.3 to 1.5 equivalents, the amount of reducing agent used must be increased to 1.3 to 1.5 equivalents. However, the large amount of reducing agent used is one of the factors that causes a large amount of reducing agent to remain in the produced powder, and it is necessary to add an operation for removing the residual reducing agent. However, in the method of the present invention in which copper salt crystals exceeding the solubility range are added, the residual copper concentration in the manufacturing waste liquid decreases to ppm units, even though the amount of reducing agent used is only 1.01 to 1.06 equivalents based on the reaction formula. Therefore, the reaction rate is improved, and the rate of unreacted reducing agent mixed into the produced powder can be reduced to about 0.3% or less. The reducing agent may have any external shape, such as square, rectangular, spherical, or even irregular shape, and if the size is expressed in terms of surface area, approximately 0.5 to 10 cm 2 per piece is appropriate. If the surface area is less than 0.5 cm 2 , the copper that is reduced and precipitated will coat the surface of the reducing agent itself instead of the particle surface, and if it exceeds about 10 cm 2 , good flow of the reducing agent in the solution may not be achieved. However, the size of the reducing agent should be sized within the above range, as copper precipitates on the surface of the metal particles and segregates, and at the same time copper precipitates on the surface of the reducing agent itself in the same way as reducing agents smaller than 0.5 cm2. I hope that. As the copper salt crystal added as a copper source, salts with relatively high solubility, such as copper sulfate and copper chloride, are used. The solubility of copper sulfate (CuSO 4.5H 2 O) in water is 18.2 g/100 g solution in terms of anhydride at 25°C, and the solubility of copper chloride (CuCl 2.2H 2 O) is
43.6g/100g solution in terms of anhydride at 25℃ (published by Maruzen Co., Ltd., "Chemistry Handbook" published by the Chemical Society of Japan)
It is. The solubility of copper salts varies depending on the temperature of the solution, but the solubility in the present invention is determined based on the temperature of the water in which the copper salts are to be dissolved, and the amount of copper salts added is determined by the temperature of the water in which the copper salts are to be dissolved. This is the amount exceeding the solubility at temperature, and its upper limit is determined by the copper content to be coated. According to the method of the present invention, when copper salts are introduced into the reaction tank, a large amount of undissolved copper salt crystals flow in the tank, but as the reaction progresses, the crystals gradually dissolve and eventually Complete melting will result in all the copper coating the metal particles. In addition, the redox reaction is an exothermic reaction, and as the reaction progresses, the temperature of the solution rises, and depending on the amount of copper salts added, it reaches a boiling state. Dissolution also progresses. Note that the amount of copper salts added to the reaction tank may be sufficient as long as it satisfies the desired copper content of the resulting powder; however, care must be taken to prevent the salts that are generated from the substitution reaction between the copper salt and the reducing agent. It is also necessary to take into account the solubility of, for example, zinc sulfate, iron sulfate or aluminum sulfate. This is because the salts of these reducing agents are mixed into the produced powder, causing a decrease in the purity of the produced powder. However, in this case, the generated powder can be removed by washing with water, hot water, or other methods. In addition, the stirring reaction time is 20% regardless of the type of reducing agent.
~60 minutes is sufficient. The copper-coated metal particles thus obtained are made into a product powder through conventional dehydration, water washing, and drying steps. The examples shown below use lead powder as a representative example of metal powder, copper chromium alloy powder as a representative example of alloy powder,
Although molybdenum disulfide powder was illustrated as a representative example of water-insoluble metal salts, the method of the present invention is not limited to such metal powder particles. Example 1 200 g of lead powder having the particle size distribution shown in Table 1 and 212 g of flower-like zinc having a surface area of about 5 cm 2 to 10 cm 2 per piece were added to 1.3 g of tap water at 25°C, and the lead powder was Stirring was carried out to the extent that the zinc flowers flowed without settling (in this experimental device, 550 RPM, circumferential speed 145 m/min). To this, 809 g of industrial copper sulfate (equivalent to 200 g of copper) was added to aim for a copper content of 50% in the copper-coated lead powder. The above amount of zinc corresponds to 1.03 equivalents of the amount required to reduce copper in copper sulfate.
【表】
40分撹拌した後、標準篩(28mesh)で篩分け
したところ篩上に24gが残つた。篩下をブフナー
斗で吸引、脱水して得られた液量は1.34
で、残留銅量は0.2ppmであつた。銅被膜鉛の銅
被膜量は47.53w.t%、亜鉛含有率は0.23w.t%で
あつた。標準篩(28mesh)の篩上残留物は亜鉛
と銅から成り、亜鉛含有率は21.16w.t%であつ
た。生成した銅被膜鉛粉末の粒度分布は第2表の
通りであり、鉛粒子への銅被膜率は顕微鏡観察か
ら完全被膜しているものが98.0%(1000粒子中
980粒子)であつた。添付写真によりE.P.M.A.に
よる鉛表面への銅の付着状態を示す。[Table] After stirring for 40 minutes, the mixture was sieved through a standard sieve (28 mesh), and 24 g remained on the sieve. The amount of liquid obtained by suctioning and dehydrating the bottom of the sieve with a Buchner container was 1.34.
The amount of residual copper was 0.2 ppm. The copper coating amount of the copper-coated lead was 47.53wt%, and the zinc content was 0.23wt%. The residue on the standard sieve (28 mesh) consisted of zinc and copper, and the zinc content was 21.16 wt%. The particle size distribution of the copper-coated lead powder produced is shown in Table 2, and the percentage of copper coating on the lead particles was determined by microscopic observation to be 98.0% (out of 1000 particles).
980 particles). The attached photo shows the state of copper adhesion to the lead surface by EPMA.
【表】
比較例
水道水4に実施例1と同様な工業用硫酸銅
809g(銅量200gに相当)を溶解した。この場
合、硫酸銅は完全に溶解し、未溶解結晶は残らな
かつた。これに鉛粉200gと花状亜鉛212gを添加
し、550RPM(周速145m/min)で40分間撹拌し
た。標準篩(28mesh)で篩分けした後、篩下を
吸引、脱水して得られた液は4.05で、残留銅
濃度は17.99g/、篩下の被膜鉛粉末中の銅含
有率は38.35w.t%であつた。
実施例 2
25℃の水道水4.5に第1表と同様の鉛粉500g
と表面積が約0.5cm2〜4cm2程度の大きさを有する
鉄片(鉄含有率98.9%)471gを添加し、鉛が沈
降せずかつ鉄片が流動する程度の撹拌(本実験装
置では600RPM、周速158m/min)をした。還元
剤に用いた鉄はCr、Ni等の改質添加剤を含有し
ない工業用普通鋼材であつた。これに銅被膜鉛粉
末中の銅含有率50%を目標に工業用硫酸銅2022g
(銅量500gに相当)を添加した。この鉄量は硫酸
銅中の銅を還元するに要する量の1.06当量に相当
する。30分間撹拌した後、標準篩(28mesh)で
篩分けしたところ、篩上は86gが残つた。篩下を
ブフナー斗で吸引、脱水して得られた液量は
4.8で、残留銅濃度は1.7ppmであつた。銅被膜
鉛粉末の銅含有率は46.38w.t%、鉄含有率は
0.27w.t%であつた。篩上残留物の鉄含有率は
29.18w.t%であつた。また鉛粒子への銅被膜率は
完全被膜しているものが95.4%(1000粒子中954
粒子)であつた。
実施例 3
25℃の水道水1.5に第1表と同様に鉛粉300g
と表面積が約1cm2〜5cm2程度の大きさを有するア
ルミニウム片(アルミニウム含有率99.2%)45g
を添加し、鉛粉が沈降せずかつアルミニウム片が
流動する程度の撹拌(本実験装置では530RPM、
周速140m/min)をした。これに銅被膜鉛粉末
中の銅含有率50%を目標に工業用硫酸銅1214g
(銅量300gに相当)と還元剤に活性を付与するた
めに食塩20mgを添加した。このアルミニウム量は
硫酸銅中の銅を還元するに要する量の1.04当量に
相当する。50分間撹拌した後、標準篩
(28mesh)で篩分けしたところ、篩上には44gが
残つた。篩下をブフナー斗で吸引、脱水して得
られた液量は1.6で、残留銅濃度は4.6ppmであ
つた。銅被膜鉛の銅含有率は46.58w.t%、アルミ
ニウム含有率は0.17w.t%であつた。篩上残留物
のアルミニウム含有率は21.27w.t%であつた。ま
た鉛粒子への銅被膜率は完全被膜しているものが
86.5%(1000粒子中865粒子)であつた。
実施例 4
実施例1と同様に亜鉛を還元剤として銅含有率
80%の被膜鉛を造る実験を行なつた。鉛粉を50g
とした他は実施例1と同様である。このとき、標
準篩上には20gが残つた。液量は1.38で残留
銅量は3.4ppmであつた。銅被膜鉛の銅含有率は
78.56w.t%、亜鉛含有率は0.39w.t%であつた。
篩上残留物の亜鉛含有率は24.18w.t%で鉛粒子へ
の銅被膜率は顕微鏡観察から完全被膜しているも
のは99.2%(1000粒子中992粒子)であつた。
実施例 5
25℃の水道水2に−100mesh粒度の銅クロー
ム合金粉300gと表面積が約0.5cm2〜10cm2程度の大
きさを有する花状亜鉛318gを添加し、銅クロー
ム合金粉が沈降せずかつ花状亜鉛が流動する程度
の撹拌(本実験装置では550RPM、周速145m/
min)をした。これに銅クローム合金粉中の銅含
有率50%を目標に工業用硫酸銅1214g(銅量300
gに相当)を添加した。上記亜鉛量は硫酸銅中の
銅を還元するに要する量の1.03当量に相当する。
40分間撹拌した後、標準篩(28mesh)で篩分け
したところ、篩上に23gが残つた。篩下をブフナ
ー斗で吸引、脱水して得られた液量は2.08
で残留銅量は0.2ppmであつた。銅被膜銅クロー
ム合金粉の銅含有率は48.56w.t%、亜鉛含有率は
0.15w.t%であつた。標準篩(28mesh)の篩上残
留物は銅と亜鉛からなり、亜鉛含有率は27.56w.t
%であつた。銅クローム合金粉粒子への銅被膜率
は顕微鏡観察の結果完全被膜しているものが99%
(1000粒子中990粒子)であつた。添付写真により
E.P.M.A.による銅クローム合金粉表面への銅の
付着状態を示す。
実施例 6
25℃の水道水1.3に第3表の粒度分布を有す
るMoS2粉200gと表面積が約0.5cm2〜10cm2程度の
大きさを有する花状亜鉛212gを添加し、MOS2
粉が沈降せずかつ花状亜鉛が流動する程度の撹拌
(本実験装置では530RPM、周速140m/min)を
した。これに銅被膜MoS2粉中の銅含有率50%を
目標に工業用硫酸銅809g(銅量200gに相当)を
添加した。上記亜鉛量は硫酸銅中の銅を還元する
に要する量の1.03当量に相当する。60分間撹拌し
た後、標準篩(28mesh)で篩分けしたところ、
篩上に15gが残つた。篩下をブフナー斗で吸
引、脱水して得られた液量は1.38で残留銅量
は0.2ppmであつた。銅被膜MoS2の銅含有率は
47.58w.t%、亜鉛含有率は0.28w.t%であつた。
標準篩(28mesh)の篩上残留物は亜鉛と銅から
なり、亜鉛含有率は38.14w.t%であつた。生成し
た銅被膜MoS2粉の粒度分布は第4表の通りであ
り、MoS2粒子への銅被膜率は顕微鏡観察から完
全被膜しているものが95%(1000粒子中950粒
子)であつた。添付写真によりE.P.M.A.による
MoS2表面への銅の付着状態を示す。[Table] Comparative example Industrial copper sulfate similar to Example 1 was added to tap water 4.
809g (equivalent to 200g of copper) was dissolved. In this case, the copper sulfate was completely dissolved and no undissolved crystals remained. 200 g of lead powder and 212 g of flower-like zinc were added to this, and the mixture was stirred at 550 RPM (peripheral speed 145 m/min) for 40 minutes. After sieving with a standard sieve (28 mesh), the liquid obtained by suctioning and dehydrating the bottom of the sieve was 4.05, the residual copper concentration was 17.99g/, and the copper content in the coated lead powder under the sieve was 38.35wt%. It was hot. Example 2 500g of lead powder similar to Table 1 in 4.5g of tap water at 25℃
and 471 g of iron pieces (iron content: 98.9%) with a surface area of about 0.5 cm 2 to 4 cm 2 , and stirred to the extent that the lead does not settle and the iron pieces flow (600 RPM and periphery in this experimental device). The speed was 158m/min). The iron used as the reducing agent was ordinary industrial steel material that did not contain modifying additives such as Cr and Ni. In addition to this, 2022g of industrial copper sulfate was added with the goal of achieving a copper content of 50% in the copper-coated lead powder.
(equivalent to 500 g of copper) was added. This amount of iron corresponds to 1.06 equivalents of the amount required to reduce copper in copper sulfate. After stirring for 30 minutes, the mixture was sieved through a standard sieve (28 mesh), and 86 g remained on the sieve. The amount of liquid obtained by suctioning and dehydrating the bottom of the sieve with a Buchner Too is
4.8, and the residual copper concentration was 1.7 ppm. The copper content of the copper-coated lead powder is 46.38wt%, and the iron content is
It was 0.27wt%. The iron content of the sieve residue is
It was 29.18wt%. In addition, the copper coating rate on lead particles is 95.4% (954 out of 1000 particles).
particles). Example 3 Add 300 g of lead powder to 1.5 liters of tap water at 25°C as in Table 1.
45 g of an aluminum piece (99.2% aluminum content) with a surface area of approximately 1 cm 2 to 5 cm 2
and stirred to the extent that the lead powder does not settle and the aluminum pieces flow (530 RPM in this experimental equipment).
The circumferential speed was 140m/min). In addition to this, 1214g of industrial copper sulfate was added with the goal of achieving a copper content of 50% in the copper-coated lead powder.
(equivalent to 300 g of copper) and 20 mg of common salt were added to impart activity to the reducing agent. This amount of aluminum corresponds to 1.04 equivalents of the amount required to reduce copper in copper sulfate. After stirring for 50 minutes, the mixture was sieved through a standard sieve (28 mesh), and 44 g remained on the sieve. The amount of liquid obtained by suctioning and dehydrating the bottom of the sieve with a Buchner funnel was 1.6, and the residual copper concentration was 4.6 ppm. The copper content of the copper-coated lead was 46.58 wt%, and the aluminum content was 0.17 wt%. The aluminum content of the residue on the sieve was 21.27wt%. In addition, the copper coating rate on lead particles is completely coated.
It was 86.5% (865 particles out of 1000 particles). Example 4 Copper content using zinc as reducing agent as in Example 1
An experiment was conducted to produce 80% coated lead. 50g lead powder
The rest is the same as in Example 1. At this time, 20 g remained on the standard sieve. The liquid volume was 1.38, and the residual copper amount was 3.4 ppm. The copper content of copper-coated lead is
The zinc content was 78.56wt% and 0.39wt%.
The zinc content of the residue on the sieve was 24.18 wt%, and the percentage of copper coating on the lead particles was 99.2% (992 out of 1000 particles), which was completely coated by microscopic observation. Example 5 300 g of copper chromium alloy powder with -100 mesh particle size and 318 g of flower-shaped zinc having a surface area of about 0.5 cm 2 to 10 cm 2 were added to tap water 2 at 25°C, and the copper chromium alloy powder was allowed to settle. Stirring to the extent that Zukatsu flower-shaped zinc flows (in this experimental device, 550 RPM, circumferential speed 145 m/
min). In addition to this, 1214 g of industrial copper sulfate (copper amount 300
g) was added. The above amount of zinc corresponds to 1.03 equivalents of the amount required to reduce copper in copper sulfate.
After stirring for 40 minutes, the mixture was sieved through a standard sieve (28 mesh), and 23 g remained on the sieve. The amount of liquid obtained by suctioning the bottom of the sieve with a Buchner toe and dehydrating it is 2.08
The amount of residual copper was 0.2 ppm. The copper content of the copper-coated copper chromium alloy powder is 48.56wt%, and the zinc content is
It was 0.15wt%. The residue on the standard sieve (28mesh) consists of copper and zinc, and the zinc content is 27.56wt
It was %. Microscopic observation shows that 99% of copper chromium alloy powder particles are completely coated.
(990 particles out of 1000 particles). According to the attached photo
The state of copper adhesion to the surface of copper chromium alloy powder by EPMA is shown. Example 6 200 g of MoS 2 powder having the particle size distribution shown in Table 3 and 212 g of flower-like zinc having a surface area of approximately 0.5 cm 2 to 10 cm 2 were added to 1.3 g of tap water at 25°C to form MOS 2 powder.
Stirring was carried out to the extent that the powder did not settle and the zinc flowers flowed (530 RPM and peripheral speed of 140 m/min in this experimental device). To this, 809 g of industrial copper sulfate (equivalent to 200 g of copper) was added with the aim of achieving a copper content of 50% in the copper-coated MoS 2 powder. The above amount of zinc corresponds to 1.03 equivalents of the amount required to reduce copper in copper sulfate. After stirring for 60 minutes, it was sieved using a standard sieve (28mesh).
15g remained on the sieve. The bottom of the sieve was suctioned and dehydrated using a Buchner funnel, and the amount of liquid obtained was 1.38, and the amount of residual copper was 0.2 ppm. The copper content of copper coated MoS 2 is
The zinc content was 0.28 wt%.
The residue on the standard sieve (28mesh) consisted of zinc and copper, and the zinc content was 38.14wt%. The particle size distribution of the produced copper-coated MoS 2 powder is shown in Table 4, and the percentage of copper coating on the MoS 2 particles was 95% (950 out of 1000 particles) as determined by microscopic observation. . By EPMA with attached photo
The state of copper adhesion to the MoS 2 surface is shown.
【表】【table】
図は図面代用写真で、本発明に係る銅被膜法を
適用した場合をE.P.M.A.(X線マイクロアナラ
イザー、500倍)により撮影したものであり、第
1図は銅被膜鉛粉の場合でイは組成像、ロはCu
−KαのX線像、ハはPb−LαのX線像、第2
図は銅被膜銅クローム合金粉の場合でイは組成
像、ロはCu−KαのX線像、ハはCr−KαのX
線像、第3図は銅被膜MoS2粉の場合でイは組成
像、ロはCu−KαのX線像、ハはMo−LαのX
線像である。
The figure is a photograph substituted for a drawing, and was taken using an EPMA (X-ray microanalyzer, 500x) when the copper coating method according to the present invention was applied. Figure 1 shows the case of copper-coated lead powder, and A shows the composition. Statue, ro is Cu
- X-ray image of Kα, C is X-ray image of Pb-Lα, second
The figure shows the case of copper-coated copper chromium alloy powder, where A is the composition image, B is the X-ray image of Cu-Kα, and C is the X-ray image of Cr-Kα.
Line image, Figure 3 is the case of copper-coated MoS 2 powder, A is the composition image, B is the X-ray image of Cu-Kα, C is the X-ray image of Mo-Lα
It is a line image.
Claims (1)
属粒子表面に銅被膜層を形成させる方法におい
て、被膜しようとする金属粒子と銅イオンを還元
するため添加した亜鉛、鉄、アルミニウム等イオ
ン化傾向が銅よりも卑な金属の還元剤とが混在す
るスラリーに、該スラリー中の水分量に対して溶
解度を越える量の銅塩類結晶を添加し、上記還元
剤の添加量は上記添加銅塩類結晶中の銅量に対し
て1.01〜1.06当量であることを特徴とする金属粒
子への銅被膜法。 2 前記還元剤の表面積は1個当り約0.5〜10cm2
である特許請求の範囲第1項記載の金属粒子への
銅被膜法。[Scope of Claims] 1. In a method for forming a copper coating layer on the surface of metal particles such as metal powder, alloy powder, water-insoluble metal salt powder, etc., the copper ion is added to reduce the metal particles to be coated and copper ions. Copper salt crystals are added in an amount exceeding the solubility relative to the amount of water in the slurry to a slurry containing a reducing agent of a metal whose ionization tendency is more base than that of copper, such as zinc, iron, or aluminum. A method for coating metal particles with copper, characterized in that the amount added is 1.01 to 1.06 equivalents relative to the amount of copper in the added copper salt crystal. 2 The surface area of the reducing agent is approximately 0.5 to 10 cm 2 per piece.
A method for coating metal particles with copper according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10592979A JPS5633467A (en) | 1979-08-22 | 1979-08-22 | Copper coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10592979A JPS5633467A (en) | 1979-08-22 | 1979-08-22 | Copper coating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5633467A JPS5633467A (en) | 1981-04-03 |
| JPS6240431B2 true JPS6240431B2 (en) | 1987-08-28 |
Family
ID=14420539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10592979A Granted JPS5633467A (en) | 1979-08-22 | 1979-08-22 | Copper coating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5633467A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727582U (en) * | 1993-10-26 | 1995-05-23 | 株式会社セントラルユニ | Medical equipment picking device |
| JP2003183844A (en) * | 2001-12-18 | 2003-07-03 | Murata Mfg Co Ltd | Electronic component and manufacturing process therefor |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54132443A (en) * | 1978-04-06 | 1979-10-15 | Nippon Steel Corp | One-side oxidizing apparatus for steel strip |
| JPS558441A (en) * | 1978-07-04 | 1980-01-22 | Nippon Steel Corp | One-side oxiding method of steel hoop in one-side plating |
| DE10016024A1 (en) * | 2000-03-31 | 2001-10-04 | Merck Patent Gmbh | Active anode material in electrochemical cells and process for their manufacture |
| CN100348351C (en) * | 2005-08-18 | 2007-11-14 | 重庆扬子粉末冶金有限责任公司 | Manufacturing method of copper-coated iron composite powder |
-
1979
- 1979-08-22 JP JP10592979A patent/JPS5633467A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727582U (en) * | 1993-10-26 | 1995-05-23 | 株式会社セントラルユニ | Medical equipment picking device |
| JP2003183844A (en) * | 2001-12-18 | 2003-07-03 | Murata Mfg Co Ltd | Electronic component and manufacturing process therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5633467A (en) | 1981-04-03 |
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