JPS6244031B2 - - Google Patents
Info
- Publication number
- JPS6244031B2 JPS6244031B2 JP23197982A JP23197982A JPS6244031B2 JP S6244031 B2 JPS6244031 B2 JP S6244031B2 JP 23197982 A JP23197982 A JP 23197982A JP 23197982 A JP23197982 A JP 23197982A JP S6244031 B2 JPS6244031 B2 JP S6244031B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- conductive
- parts
- epoxy resin
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 239000011342 resin composition Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000011231 conductive filler Substances 0.000 claims description 9
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 238000005187 foaming Methods 0.000 claims description 7
- 239000004088 foaming agent Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000000539 dimer Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000002156 mixing Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000004070 electrodeposition Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000010425 asbestos Substances 0.000 description 4
- 229910052895 riebeckite Inorganic materials 0.000 description 4
- 239000004604 Blowing Agent Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- -1 polyacrolein Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- CFQZKFWQLAHGSL-FNTYJUCDSA-N (3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e)-octadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoic acid Chemical compound OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C CFQZKFWQLAHGSL-FNTYJUCDSA-N 0.000 description 1
- CIRMGZKUSBCWRL-LHLOQNFPSA-N (e)-10-[2-(7-carboxyheptyl)-5,6-dihexylcyclohex-3-en-1-yl]dec-9-enoic acid Chemical compound CCCCCCC1C=CC(CCCCCCCC(O)=O)C(\C=C\CCCCCCCC(O)=O)C1CCCCCC CIRMGZKUSBCWRL-LHLOQNFPSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- MWRWFPQBGSZWNV-UHFFFAOYSA-N Dinitrosopentamethylenetetramine Chemical compound C1N2CN(N=O)CN1CN(N=O)C2 MWRWFPQBGSZWNV-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical compound C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 1
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical class NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000010427 acrylic painting Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000019197 fats Nutrition 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920006215 polyvinyl ketone Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】
この発明は自動車、飛行機の車体、家電製品、
各種機器の金属部材の接着シール用に用いられ、
油面接着性にすぐれると共にスポツト溶接性や電
着塗装性にすぐれるシール用導電性樹脂組成物に
関する。[Detailed Description of the Invention] This invention is applicable to automobiles, airplane bodies, home appliances,
Used for adhesive sealing of metal parts of various devices,
The present invention relates to a conductive resin composition for seals that has excellent oil surface adhesion, as well as spot weldability and electrodeposition coating properties.
従来、金属構造物は、溶接、塗装等の工程の前
に各種ゴムや樹脂組成物で接着シールを行つてい
る。しかし、これら組成物は本来絶縁体であり、
シール用に用いた場合電着液が付着せず、ために
樹脂シール層と金属板との界面において塗装付が
悪く錆の発生を招く場合があつた。これを防ぐ
為、金属粉等を混入したゴム組成物を用いて接着
シールを行つているが、耐熱性や耐久性に劣り、
また未処理鋼板等の油膜の付着した部材に用いた
場合には密着性が悪く、貼り付け作業性が劣つた
り、シール漏れを起こす等不都合があつた。 Conventionally, metal structures have been adhesively sealed with various rubber or resin compositions before welding, painting, or other processes. However, these compositions are originally insulators;
When used for sealing, the electrodeposited liquid did not adhere to the surface of the resin seal layer and the metal plate did not adhere well to the surface of the metal plate, resulting in rust formation. To prevent this, adhesive seals are made using rubber compositions mixed with metal powder, etc., but they have poor heat resistance and durability.
Furthermore, when used on a member with an oil film such as an untreated steel plate, there were problems such as poor adhesion, poor pasting workability, and seal leakage.
この発明者らは、かかる従来技術の欠点を改良
する為種々検討した結果、長鎖アルキル主鎖を有
する液状又は半固形状のエポキシ樹脂に硬化剤と
導電性充てん剤とを配合することにより前記問題
を回避できることを知つた。また、上記配合物に
さらに発泡剤を配合することによりシール特性を
一段と改善できることを見い出した。 As a result of various studies to improve the shortcomings of the prior art, the inventors found that by blending a curing agent and a conductive filler into a liquid or semi-solid epoxy resin having a long alkyl main chain, I learned that I can avoid the problem. It has also been found that the sealing properties can be further improved by further adding a foaming agent to the above formulation.
すなわち、この発明は、炭素数5〜50の長鎖ア
ルキル主鎖を有する液状または半固形状のエポキ
シ樹脂に硬化剤と導電性充てん剤とを加えてなる
油面接着性にすぐれるシール用導電性樹脂組成物
に係る第1の発明と、上記配合物中にさらに発泡
剤を配合してなる油面接着性にすぐれる発泡性の
シール用導電性樹脂組成物に係る第2の発明とか
らなるものである。 That is, the present invention provides a conductive sealing material with excellent oil surface adhesion, which is prepared by adding a curing agent and a conductive filler to a liquid or semi-solid epoxy resin having a long alkyl main chain having 5 to 50 carbon atoms. The first invention relates to a conductive resin composition, and the second invention relates to a foamable conductive resin composition for seals having excellent oil surface adhesion, which is obtained by further incorporating a foaming agent into the above-mentioned formulation. It is what it is.
この発明により得られるシール用導電性樹脂組
成物は油膜鋼板面にも初期接着性が良く、ために
シール作業性を改善できまたシール漏れを回避で
きる。また塗装の焼き付け工程等で加熱硬化させ
ることにより機械強度、耐熱性、耐久性に優れる
シール層を形成でき、このシール層はスポツト溶
接性や電着塗装性が良好なため金属板との界面に
おいて錆の発生をきたすことがなくまた外観にも
すぐれたものとなる。さらに発泡剤を配合したも
のでは上記特性に加えて発泡構造のシール層を与
えるから密着シール性やシール特性が一段と改善
される。 The electrically conductive resin composition for sealing obtained by the present invention has good initial adhesion even to oil-film steel plate surfaces, thereby improving sealing workability and avoiding seal leakage. In addition, by heating and curing the paint during the baking process, etc., a sealing layer with excellent mechanical strength, heat resistance, and durability can be formed.This sealing layer has good spot weldability and electrodeposition coating properties, so it can be used at the interface with the metal plate. It does not cause rust and has an excellent appearance. Further, when a foaming agent is added, in addition to the above-mentioned properties, a sealing layer having a foamed structure is provided, so that the adhesive sealing properties and sealing properties are further improved.
この発明に用いられる炭素数5〜50の長鎖アル
キル主鎖を有する液状又は半固形状のエポキシ樹
脂は、アルキル鎖が疎水性基であるため油脂分と
の相溶性が良く、油膜鋼板との初期接着性の向上
に寄与するもので、このような樹脂としては、ポ
リエチレングリコール、ポリプロピレングリコー
ル、エチレンオキシドとプロピレンオキシドとの
ブロツク状コポリマーのα・ω―グリコールなど
のポリマーとエピクロルヒドリンとの反応による
エポキシ樹脂;ポリ塩化ビニル、ポリアクロレイ
ンやポリビニルケトンのカルボニル基とS―イリ
ドの反応より誘導されたエポキシ樹脂;ダイマー
酸、トリマー酸、不飽和高級脂肪酸またはそのエ
ステルから誘導されたエポキシ樹脂等が挙げられ
る。 The liquid or semi-solid epoxy resin having a long alkyl main chain with 5 to 50 carbon atoms used in this invention has good compatibility with oil and fat because the alkyl chain is a hydrophobic group, and has good compatibility with oil film steel sheets. These resins contribute to improving initial adhesion, and examples of such resins include epoxy resins produced by reacting epichlorohydrin with polymers such as polyethylene glycol, polypropylene glycol, and α/ω-glycol, a block copolymer of ethylene oxide and propylene oxide. ; Epoxy resins derived from the reaction of S-ylide with the carbonyl group of polyvinyl chloride, polyacrolein, or polyvinyl ketone; Epoxy resins derived from dimer acid, trimer acid, unsaturated higher fatty acids or esters thereof, and the like.
上記エポキシ樹脂のなかでも炭素数10〜20の長
鎖ダイマー酸より誘導されたエポキシ樹脂が好ま
しく用いられ、例としてリノール酸ダイマーとエ
ピクロルヒドリンとから誘導されたエポキシ樹脂
等が挙げられる。これらの樹脂を用いると、油面
接着性にとくに好結果が得られ、また耐水性や耐
薬品性等に優れたシール用導電性樹脂組成物が得
られる。 Among the above epoxy resins, epoxy resins derived from long chain dimer acids having 10 to 20 carbon atoms are preferably used, and examples include epoxy resins derived from linoleic acid dimer and epichlorohydrin. When these resins are used, particularly good results can be obtained in terms of adhesion to oil surfaces, and conductive resin compositions for seals having excellent water resistance, chemical resistance, etc. can be obtained.
なお、上記の長鎖アルキル主鎖を有するエポキ
シ樹脂と共に通常のエポキシ樹脂を全体の50重量
%以下の割合で併用することは可能である。 Note that it is possible to use an ordinary epoxy resin together with the above-mentioned epoxy resin having a long alkyl main chain in a proportion of 50% by weight or less of the total.
エポキシ樹脂を硬化させる硬化剤としては、加
熱により硬化作用を発揮する通常の硬化剤であれ
ばよく、たとえばジシアンジアミド、4・4′―ジ
アミノジフエニルスルホン、2―n―ペプタデシ
ルイミダゾールのようなイミダゾール誘導体、イ
ソフタル酸ジヒドラジド、N・N―ジアルキル尿
素誘導体、N・N―ジアルキルチオ尿素誘導体な
どが用いられる。使用量は、エポキシ樹脂100重
量部に対して通常1〜15重量部の割合でよい。 The curing agent for curing the epoxy resin may be any ordinary curing agent that exhibits a curing effect when heated, such as dicyandiamide, 4,4'-diaminodiphenylsulfone, and 2-n-peptadecylimidazole. Imidazole derivatives, isophthalic acid dihydrazide, N·N-dialkyl urea derivatives, N·N-dialkylthiourea derivatives, etc. are used. The amount used may be generally 1 to 15 parts by weight per 100 parts by weight of the epoxy resin.
この発明においては導電性充てん剤を混合する
ことが重要であるが、このような充てん剤として
は銀、パラジウム、銅、アルミニウム、鉄、ニツ
ケル等の金属粉末や、カーボンブラツク、グラフ
アイト等の金属粉末以外の無機物質が挙げられ
る。使用量は導電性充てん剤の種類,形状,粒子
径等により異なるが通常エポキシ樹脂100重量部
に対して10〜700重量部の割合で用いられる。 In this invention, it is important to mix a conductive filler, and such fillers include metal powders such as silver, palladium, copper, aluminum, iron, and nickel, and metals such as carbon black and graphite. Examples include inorganic substances other than powder. The amount used varies depending on the type, shape, particle size, etc. of the conductive filler, but it is usually used at a ratio of 10 to 700 parts by weight per 100 parts by weight of the epoxy resin.
この発明において発泡性のシール用導電性樹脂
組成物を得るには、上記成分のほか発泡剤が用い
られる。この発泡剤を配合することにより加熱硬
化と共に樹脂の発泡が起こり、シール部位に発泡
体層が形成されより完全な密着シールが行なわれ
る。 In this invention, in order to obtain a foamable conductive resin composition for seals, a foaming agent is used in addition to the above-mentioned components. By blending this foaming agent, the resin foams as it heats and hardens, forming a foam layer at the sealing site, resulting in more complete sealing.
このような発泡剤としては、一般的にはアゾジ
カルボンアシド、アゾビスイソブチロニトリルの
ようなアゾ系化合物、ジニトロソペンタメチレン
テトラミンのようなニトロソ化合物、パラトルエ
ンスルホニルヒドラジツド、4・4′―オキシビス
ベンゼンスルホニルヒドラジツドのようなヒドラ
ジツド系化合物などを広く使用できる。これらは
単独又は混合して場合によつては尿素,カルボン
酸の金属塩などの発泡助剤と共に用いてもよい。
このような発泡剤(もしくはこれと発泡助剤)の
使用割合は一般に樹脂分100重量部に対して1〜
25重量部程度であつて、硬化させる温度で発泡が
起こり、加熱後の発泡倍率が実用上約2〜30倍と
なるようにするのがよい。 Such blowing agents generally include azo dicarbonate, azo compounds such as azobisisobutyronitrile, nitroso compounds such as dinitrosopentamethylenetetramine, paratoluenesulfonylhydrazide, 4.4 A wide range of hydrazide compounds such as '-oxybisbenzenesulfonyl hydrazide can be used. These may be used alone or in combination, if necessary together with foaming aids such as urea and metal salts of carboxylic acids.
The proportion of such blowing agents (or foaming aids) is generally 1 to 1 to 100 parts by weight of resin.
It is preferably about 25 parts by weight so that foaming occurs at the curing temperature and the foaming ratio after heating is practically about 2 to 30 times.
この発明におけるシール用導電性樹脂組成物お
よび発泡性のシール用導電性樹脂組成物には、上
記の各成分の他に必要に応じて各種の配合剤を添
加することができる。たとえば耐熱性をより向上
させる目的でフエニル―β―ナフチルアミン、ジ
フエニル―P―フエニレンジアミン、ジターシヤ
リブチル―4―メチルフエノール、パラフエニル
フエノール、ステアリン酸カルシウム、ジラウリ
ルチオジプロピオネートなどの安定剤や老化防止
剤を、接着性をより向上させる目的でジエステル
類、エステルガム、アルキツド樹脂、クマロン樹
脂を、組成物のタレ防止やコストダウンを図る目
的でクレー、タルク、炭酸カルシウム、シリカ、
炭酸バリウム、アスベストなどの充てん剤を、そ
れぞれ添加することができる。その他着色剤など
を配合してもよい。これらの配合量は、エポキシ
樹脂100重量部に対して5〜300重量部程度とすれ
ばよい。 In addition to the above-mentioned components, various compounding agents can be added to the conductive resin composition for seals and the foamable conductive resin composition for seals in this invention, as necessary. For example, stabilizers such as phenyl-β-naphthylamine, diphenyl-P-phenylenediamine, ditertiarybutyl-4-methylphenol, paraphenylphenol, calcium stearate, and dilaurylthiodipropionate are used to further improve heat resistance. and anti-aging agents, diesters, ester gums, alkyd resins, and coumaron resins to further improve adhesion; clay, talc, calcium carbonate, silica, and silica to prevent compositions from sagging and reduce costs.
Fillers such as barium carbonate and asbestos can be added respectively. Other coloring agents and the like may also be added. The blending amount of these components may be approximately 5 to 300 parts by weight per 100 parts by weight of the epoxy resin.
この発明のシール用導電性樹脂組成物および発
泡性のシール用導電性樹脂組成物を得るには、前
記エポキシ樹脂に硬化剤と導電性充てん剤を加
え、発泡性とするときはこれにさらに発泡剤を加
え、その他必要に応じて各種の添加剤を加えて、
常温又は硬化や発泡等の起こらない程度の温度
(わずかに起こつてもよい)で混合撹拌釜,各種
ニーダ類,二本又は三本ミキシングロール等で混
合すればよい。 In order to obtain the conductive resin composition for seals and the foamable conductive resin composition for seals of the present invention, a curing agent and a conductive filler are added to the epoxy resin, and when the epoxy resin is made foamable, it is further foamed. and various other additives as necessary,
Mixing may be carried out at room temperature or at a temperature at which curing or foaming does not occur (although slight curing or foaming may occur) using a mixing stirrer, various kneaders, two or three mixing rolls, etc.
この発明によるシール用導電性樹脂組成物およ
び発泡性のシール用導電性樹脂組成物は、液状あ
るいは半固形状でそのままシール部位に塗布して
用いることができるほか、ガラス、ポリエステル
等のクロス、不織布か各種フイルムにシート状に
塗工し、シート状物として用いることができる。 The conductive resin composition for seals and the foamable conductive resin composition for seals according to the present invention can be applied directly to the sealing area in liquid or semi-solid form, and can also be applied to cloths such as glass, polyester, non-woven fabrics, etc. Alternatively, it can be applied to various films in the form of a sheet and used as a sheet-like product.
以下に、この発明を実施例により具体的に説明
する。実施例中の部は重量部である。 The present invention will be specifically explained below using examples. Parts in the examples are parts by weight.
実施例 1
エピコート#871(油化シエル社製ダイマー酸
変性エポキシ樹脂)80部、エピコート#1001(油
化シエル社製ビスフエノールA型固形エポキシ樹
脂)20部を、溶解釜にて溶融混合し粘稠な組成物
を得た。この組成物100部にジシアンジアミド
(日本カーバイド社製エポキシ樹脂硬化剤)5
部、キユアゾール2MZ―AZINE(四国化成社製
エポキシ樹脂硬化剤)5部、グラフアイト粉末
100部、アスベスト粉末3部を配合し、通常のミ
キシングロールにて混練りすることにより樹脂組
成物を得、これをフイルムセパレータ上に直圧式
プレスにてシート状に成形して厚さ0.5mmからな
る未硬化状態のシール用導電性樹脂シートを得
た。Example 1 80 parts of Epicoat #871 (dimer acid-modified epoxy resin manufactured by Yuka Shell Co., Ltd.) and 20 parts of Epicoat #1001 (bisphenol A type solid epoxy resin manufactured by Yuka Shell Co., Ltd.) were melted and mixed in a melting pot to form a viscosity. A thick composition was obtained. Add 5 parts of dicyandiamide (epoxy resin curing agent manufactured by Nippon Carbide Co., Ltd.) to 100 parts of this composition.
5 parts, Kyuazol 2MZ-AZINE (epoxy resin curing agent manufactured by Shikoku Kasei Co., Ltd.), graphite powder
A resin composition is obtained by mixing 100 parts of asbestos powder and 3 parts of asbestos powder, and kneading it with a normal mixing roll. This is formed into a sheet shape on a film separator using a direct press to form a sheet with a thickness of 0.5 mm or more. A conductive resin sheet for sealing in an uncured state was obtained.
この樹脂シートを油分の付着した2枚の鋼板の
間隙に挿入シールし、その後電着塗装、アクリル
焼付塗装を行つた。加熱は各180℃×20分,160℃
×30分であつた。加熱工程で樹脂シートは硬化し
て鋼板間の間隙を良好にシールし、又電着塗料が
樹脂表面にも付着し、界面塗装性も良好なもので
あつた。 This resin sheet was inserted into the gap between two oily steel plates and sealed, followed by electrodeposition coating and acrylic baking coating. Heating: 180℃ x 20 minutes, 160℃
×It was hot in 30 minutes. In the heating process, the resin sheet hardened to seal the gap between the steel plates well, and the electrodeposition paint also adhered to the resin surface, resulting in good interfacial coating properties.
実施例 2
実施例1で用いた粘稠な組成物100部に、ジシ
アンジアミド(実施例1のものと同じ)5部、キ
ユアゾール2MZ―AZINE(前出)5部、グラフ
アイト粉末100部、ネオセルボンP#1000(永和
化成社製の発泡剤)2部、アスベスト粉末3部を
配合し、実施例1と同様に混練およびシート化
し、0.3mm厚のシート状物を作製した。このシー
ト状物を油分の付着した2枚の鋼板間に挿入し、
スポツト溶接を行つた。その後、電着塗装、アク
リル塗装を行つた。両塗装時の加熱によつて樹脂
は硬化と共に発泡し、2枚の鋼板間は非常に良好
に密着シールされた。シール部は発泡構造である
ためシール特性が良好で、また界面の塗装性も良
好であり、錆の発生等も防止された。Example 2 To 100 parts of the viscous composition used in Example 1, 5 parts of dicyandiamide (same as in Example 1), 5 parts of Kyuazol 2MZ-AZINE (mentioned above), 100 parts of graphite powder, and Neocellvon P were added. Two parts of #1000 (a blowing agent manufactured by Eiwa Kasei Co., Ltd.) and three parts of asbestos powder were mixed and kneaded and formed into a sheet in the same manner as in Example 1 to produce a sheet with a thickness of 0.3 mm. Insert this sheet-like material between two oily steel plates,
Performed spot welding. After that, electrodeposition painting and acrylic painting were performed. Due to the heating during both coatings, the resin hardened and foamed, resulting in a very good seal between the two steel plates. Since the seal part has a foamed structure, the sealing properties are good, and the paintability of the interface is also good, and the occurrence of rust etc. is prevented.
Claims (1)
状または半固形状のエポキシ樹脂に硬化剤と導電
性充てん剤とを加えてなる油面接着性にすぐれる
シール用導電性樹脂組成物。 2 炭素数5〜50の長鎖アルキル主鎖を有する液
状または半固形状のエポキシ樹脂が炭素数10〜20
の長鎖ダイマー酸から誘導されたものである特許
請求の範囲第1項記載の油面接着性にすぐれるシ
ール用導電性樹脂組成物。 3 導電性充てん剤が金属粉末である特許請求の
範囲第1項または第2項記載の油面接着性にすぐ
れるシール用導電性樹脂組成物。 4 導電性充てん剤がカーボンブラツクやグラフ
アイトの如き金属粉末以外の無機物質からなる特
許請求の範囲第1項または第2項記載の油面接着
性にすぐれるシール用導電性樹脂組成物。 5 炭素数5〜50の長鎖アルキル主鎖を有する液
状または半固形状のエポキシ樹脂に硬化剤と導電
性充てん剤と発泡剤とを加えてなる油面接着性に
すぐれる発泡性のシール用導電性樹脂組成物。[Claims] 1. A seal with excellent oil surface adhesion made by adding a curing agent and a conductive filler to a liquid or semi-solid epoxy resin having a long alkyl main chain with 5 to 50 carbon atoms. Conductive resin composition. 2 A liquid or semi-solid epoxy resin having a long alkyl main chain with 5 to 50 carbon atoms has 10 to 20 carbon atoms.
The conductive resin composition for sealing having excellent oil surface adhesion according to claim 1, which is derived from a long chain dimer acid. 3. The conductive resin composition for sealing having excellent oil surface adhesion according to claim 1 or 2, wherein the conductive filler is a metal powder. 4. The conductive resin composition for seals having excellent oil surface adhesion according to claim 1 or 2, wherein the conductive filler is an inorganic substance other than metal powder such as carbon black or graphite. 5 For foaming seals with excellent oil surface adhesion, made by adding a curing agent, a conductive filler, and a foaming agent to a liquid or semi-solid epoxy resin having a long alkyl main chain with 5 to 50 carbon atoms. Conductive resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23197982A JPS59124972A (en) | 1982-12-29 | 1982-12-29 | Conductive resin composition for seal excellent in adhesion to oily surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23197982A JPS59124972A (en) | 1982-12-29 | 1982-12-29 | Conductive resin composition for seal excellent in adhesion to oily surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59124972A JPS59124972A (en) | 1984-07-19 |
| JPS6244031B2 true JPS6244031B2 (en) | 1987-09-17 |
Family
ID=16932036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23197982A Granted JPS59124972A (en) | 1982-12-29 | 1982-12-29 | Conductive resin composition for seal excellent in adhesion to oily surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59124972A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100357583B1 (en) * | 2000-08-22 | 2002-10-18 | 현대자동차주식회사 | Adhesive composition for automobile hem flange structures and process for manufacturing automobile hem flange structures using same |
| JP2006137924A (en) * | 2004-07-01 | 2006-06-01 | Murata Mfg Co Ltd | Electroconductive resin composition, electroconductive resin cured product, and electronic component module |
| CN103694640A (en) * | 2013-12-20 | 2014-04-02 | 北京郁懋科技有限责任公司 | Preparation method of conductive thermo-cured epoxy resin system |
-
1982
- 1982-12-29 JP JP23197982A patent/JPS59124972A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59124972A (en) | 1984-07-19 |
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