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JPS624808B2 - - Google Patents
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JPS624808B2 - - Google Patents

Info

Publication number
JPS624808B2
JPS624808B2 JP11379180A JP11379180A JPS624808B2 JP S624808 B2 JPS624808 B2 JP S624808B2 JP 11379180 A JP11379180 A JP 11379180A JP 11379180 A JP11379180 A JP 11379180A JP S624808 B2 JPS624808 B2 JP S624808B2
Authority
JP
Japan
Prior art keywords
lead
reed relay
exterior resin
reed
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11379180A
Other languages
Japanese (ja)
Other versions
JPS5738524A (en
Inventor
Ryuji Isato
Kenichi Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP11379180A priority Critical patent/JPS5738524A/en
Publication of JPS5738524A publication Critical patent/JPS5738524A/en
Publication of JPS624808B2 publication Critical patent/JPS624808B2/ja
Granted legal-status Critical Current

Links

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  • Manufacture Of Switches (AREA)

Description

【発明の詳細な説明】 この発明は外装樹脂の肉厚を一定に保つリード
リレーの製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a reed relay in which the thickness of the outer resin is kept constant.

従来、外装樹脂モールド形のリードリレーの製
造方法として、励磁コイルを巻装したスプールの
中央空洞部にリードスイツチを挿入する工程と、
このリードスイツチの外部端子および励磁コイル
の引出線をリードフレームの各リード片に接続す
る工程と、続いて外装樹脂モールドを施す工程
と、このモールド後上記各リード片をリードフレ
ーム本体から切断分離する工程とを備えたものが
ある。しかし、この製造方法では、外装樹脂モー
ルド工程において、成形金型内のリードリレーが
モールド圧力で上記リードフレームの板厚方向に
変位して、外装樹脂の肉厚がばらつき、励磁コイ
ルなどの内部部品の露出、外装樹脂のひび割れお
よびふくれをを生じるため、上記リレーの変位を
外装樹脂の肉厚に加算して、その肉厚を必要以上
に厚くしなければならない欠点があつた。
Conventionally, a method for manufacturing an exterior resin molded reed relay includes the steps of inserting a reed switch into the central cavity of a spool wrapped with an excitation coil;
A process of connecting the external terminal of the reed switch and the lead wire of the excitation coil to each lead piece of the lead frame, followed by a process of applying an exterior resin mold, and after this molding, cutting and separating each of the above lead pieces from the lead frame body. There are some that have a process. However, in this manufacturing method, during the exterior resin molding process, the reed relay in the molding die is displaced in the thickness direction of the lead frame due to mold pressure, causing variations in the thickness of the exterior resin and internal parts such as excitation coils. The disadvantage is that the displacement of the relay has to be added to the thickness of the exterior resin to make it thicker than necessary, thereby causing exposure of the exterior resin and cracking and blistering of the exterior resin.

この発明は上記のような従来のものの欠点を除
去するためになされたもので、簡単な手段により
外装樹脂の肉厚を一定に保ち、使用樹脂の無駄を
省けるリードリレーの製造方法を提供することを
目的としている。
This invention has been made in order to eliminate the drawbacks of the conventional ones as described above, and an object of the present invention is to provide a method for manufacturing a reed relay that can keep the thickness of the exterior resin constant by simple means and avoid wasting the resin used. It is an object.

以下、この発明の一実施例を図面を参考にして
説明する。
An embodiment of the present invention will be described below with reference to the drawings.

第1図はリードリレーの組立工程図を示す。こ
の工程図と第2図の断面図とにおいて、10は外
周に励磁コイル11を巻装したスプールで、この
スプール10の中央空洞部12にはリードスイツ
チ13が挿入され、かつ、接着剤14により固定
されている。リードスイツチ13の両端部に突出
した外部端子15,16はリードフレーム17の
リード片18,19にはんだや溶接により接続さ
れ、また、リードフレーム17の他の1対のリー
ド片20,21には励磁コイル11の引出線2
2,23が接続されている。スプール10の両端
部に一体形成されたつば部24,25には、第3
図のように、上下方向に突出する突起26,27
がそれぞれ設けられている。
FIG. 1 shows an assembly process diagram of a reed relay. In this process drawing and the cross-sectional view in FIG. Fixed. External terminals 15 and 16 protruding from both ends of the reed switch 13 are connected to lead pieces 18 and 19 of the lead frame 17 by soldering or welding, and the other pair of lead pieces 20 and 21 of the lead frame 17 are connected to Lead wire 2 of excitation coil 11
2 and 23 are connected. The collar portions 24 and 25 integrally formed at both ends of the spool 10 include a third
As shown in the figure, protrusions 26 and 27 that protrude in the vertical direction
are provided for each.

上記のようにリードスイツチ13の外部端子1
5,16をリード片18,19に、励磁コイル1
1の引出線22,23をリード片20,21にそ
れぞれ接続すると、その後、励磁コイル11およ
びスプール10のつば部24,25を内包するリ
レー外装部28を第4図のように成形金型29の
上型30と下型31間に装入して型閉めする。こ
のとき、スプール10のつば部24,15の上下
の突起26,27が上型30と下型31との対向
面32,33に接触して、つば部24,25が対
向面32,33間に把持、あるいはこの対向面3
2,33に対して突起26,27が微かな隙間を
保つて対向する。しかる後、成形金型29のキヤ
ビテイ34にエポキシなどの樹脂を注入して外装
樹脂モールドを施し、このモールド後、リードフ
レーム17の各リード片18,19および20,
21をリードフレーム本体35から切断分離す
る。これにより第5図ないし第7図に示すような
外装樹脂36を有し、かつ、この外装樹脂36よ
り各リード片18,19および20,21が突出
したリードリレー37が得られる。
External terminal 1 of reed switch 13 as described above.
5 and 16 to lead pieces 18 and 19, and excitation coil 1.
After connecting the lead wires 22 and 23 of 1 to the lead pieces 20 and 21, respectively, the relay exterior part 28 containing the excitation coil 11 and the collars 24 and 25 of the spool 10 is placed in a molding die 29 as shown in FIG. The mold is placed between the upper mold 30 and lower mold 31 and the mold is closed. At this time, the upper and lower protrusions 26, 27 of the collars 24, 15 of the spool 10 come into contact with the opposing surfaces 32, 33 of the upper mold 30 and lower mold 31, and the collars 24, 25 are moved between the opposing surfaces 32, 33. or this opposing surface 3
The protrusions 26 and 27 face the protrusions 2 and 33 with a slight gap between them. Thereafter, a resin such as epoxy is injected into the cavity 34 of the molding die 29 to form an exterior resin mold, and after this molding, each of the lead pieces 18, 19 and 20 of the lead frame 17,
21 is cut and separated from the lead frame main body 35. As a result, a reed relay 37 having an exterior resin 36 as shown in FIGS. 5 to 7 and from which each lead piece 18, 19 and 20, 21 protrudes is obtained.

上記外装樹脂モールド工程では、リードフレー
ム17の板厚方向(第6図参照)Aの外装樹脂厚
さtを設定するための、スプール10のつば部2
4,25の突起26,27が上型30と下型31
との対向面32,33に接することにより、リー
ドリレー37がリードフレーム17の板厚方向に
位置決めされる。したがつて、リードリレー37
はモールド圧力でリードフレーム17の板厚方向
に変位することがない。これにより、リードリレ
ー37の外装樹脂36の肉厚が一定に保たれて、
使用樹脂の無駄が省かれ、最小必要限の樹脂によ
り励磁コイル11などの内部部品の露出、外装樹
脂36のひび割れおよびふくれが阻止される。
In the above-mentioned exterior resin molding process, the flange portion 2 of the spool 10 is used to set the exterior resin thickness t in the thickness direction A of the lead frame 17 (see FIG. 6).
The protrusions 26 and 27 of 4 and 25 are the upper mold 30 and the lower mold 31
The reed relay 37 is positioned in the thickness direction of the lead frame 17 by contacting the opposing surfaces 32 and 33 thereof. Therefore, reed relay 37
is not displaced in the thickness direction of the lead frame 17 due to mold pressure. As a result, the thickness of the exterior resin 36 of the reed relay 37 is kept constant,
Waste of the resin used is eliminated, and the exposure of internal parts such as the excitation coil 11 and the cracking and blistering of the exterior resin 36 are prevented by using the minimum amount of resin.

一方、上記つば部24,25の各突起26,2
7の先端部は外装樹脂36の表面に露出して外観
に影響を与えるが、この影響はスプール10を外
装樹脂36と同色に設定することにより回避する
ことができる。
On the other hand, each protrusion 26, 2 of the brim portion 24, 25
Although the tip of the spool 7 is exposed on the surface of the exterior resin 36 and affects the appearance, this influence can be avoided by setting the spool 10 to the same color as the exterior resin 36.

以上説明したように、この発明によれば、リー
ドリレーの外装樹脂モールドに際し、励磁コイル
のスプールのつば部をその上下に設けた突起にお
いて成形金型の上型と下型間に位置決めさせると
いう簡単な手段により、外装樹脂の肉厚を一定に
保ち、使用樹脂の無駄を省けるリードリレーの製
造方法を提供することができる。
As explained above, according to the present invention, when molding the exterior resin of a reed relay, the collar of the excitation coil spool is positioned between the upper mold and the lower mold of the molding die using projections provided above and below the collar. By this means, it is possible to provide a method for manufacturing a reed relay in which the thickness of the exterior resin can be kept constant and waste of resin used can be avoided.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例にかかるリードリ
レーの組立工程を示す斜視図、第2図は第1図の
2―2線断面図、第3図はスプールの側面図、第
4図はリードリレーの外装樹脂モールド工程図、
第5図はリードリレーの正面図、第6図は第5図
の6―6線断面図、第7図は第5図の7―7線断
面図である。 10…スプール、11…励磁コイル、12…中
央空洞部、13…リードスイツチ、15,16…
外部端子、17…リードフレーム、18,19…
リード片、20,21…リード片、22,23…
引出線、24,25…つば部、26,27…突
起、29…成形金型、30…上型、31…下型、
35…リードフレーム本体、37…リードリレ
ー。
FIG. 1 is a perspective view showing the assembly process of a reed relay according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line 2-2 in FIG. 1, FIG. 3 is a side view of the spool, and FIG. Reed relay exterior resin molding process diagram,
5 is a front view of the reed relay, FIG. 6 is a sectional view taken along line 6-6 in FIG. 5, and FIG. 7 is a sectional view taken along line 7-7 in FIG. DESCRIPTION OF SYMBOLS 10... Spool, 11... Excitation coil, 12... Central cavity, 13... Reed switch, 15, 16...
External terminal, 17... Lead frame, 18, 19...
Lead piece, 20, 21... Lead piece, 22, 23...
Leader line, 24, 25...Brim part, 26, 27...Protrusion, 29...Molding die, 30...Upper die, 31...Lower die,
35...Lead frame body, 37...Reed relay.

Claims (1)

【特許請求の範囲】 1 励磁コイルを巻装したスプールの中央空洞部
にリードスイツチを挿入する工程と、このリード
スイツチの外部端子および上記励磁コイルの引出
線をリードフレームの各リード片に接続する工程
と、続いて外装樹脂モールドを施す工程と、この
モールド後上記各リード片をリードフレーム本体
から切断分離する工程とを備えたリードリレーの
製造方法において、上記外装樹脂モールドに際
し、上記スプールのつば部をその上下に設けた突
起において成形金型の上型と下型間に位置決めさ
せることを特徴とするリードリレーの製造方法。 2 スプールは外装樹脂と同色である特許請求の
範囲第1項記載のリードリレーの製造方法。
[Claims] 1. A step of inserting a reed switch into the central cavity of the spool around which the excitation coil is wound, and connecting the external terminal of the reed switch and the lead wire of the excitation coil to each lead piece of the lead frame. In the method for manufacturing a reed relay, the method includes a step of applying an exterior resin mold, and a step of cutting and separating each of the lead pieces from the lead frame body after the molding. A method of manufacturing a reed relay, characterized in that the part is positioned between an upper mold and a lower mold of a molding die using protrusions provided above and below the reed relay. 2. The method for manufacturing a reed relay according to claim 1, wherein the spool has the same color as the exterior resin.
JP11379180A 1980-08-19 1980-08-19 Method of producing reed relay Granted JPS5738524A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11379180A JPS5738524A (en) 1980-08-19 1980-08-19 Method of producing reed relay

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11379180A JPS5738524A (en) 1980-08-19 1980-08-19 Method of producing reed relay

Publications (2)

Publication Number Publication Date
JPS5738524A JPS5738524A (en) 1982-03-03
JPS624808B2 true JPS624808B2 (en) 1987-02-02

Family

ID=14621172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11379180A Granted JPS5738524A (en) 1980-08-19 1980-08-19 Method of producing reed relay

Country Status (1)

Country Link
JP (1) JPS5738524A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1706753A1 (en) * 2004-01-20 2006-10-04 Hydrogenics Corporation Fuel cell voltage monitoring system and associated electrical connectors
FR2907962B1 (en) * 2006-10-30 2010-01-08 Valeo Securite Habitacle METHOD FOR MANUFACTURING LOW CURRENT SWITCHING MODULE AND DEVICE OBTAINED BY SAID METHOD
TW201031591A (en) 2008-10-30 2010-09-01 Mitsubishi Materials Corp Process for production of trichlorosilane and method for use thereof
JP5633160B2 (en) 2009-03-11 2014-12-03 三菱マテリアル株式会社 Trichlorosilane production equipment

Also Published As

Publication number Publication date
JPS5738524A (en) 1982-03-03

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