JPS6248293B2 - - Google Patents
Info
- Publication number
- JPS6248293B2 JPS6248293B2 JP9666281A JP9666281A JPS6248293B2 JP S6248293 B2 JPS6248293 B2 JP S6248293B2 JP 9666281 A JP9666281 A JP 9666281A JP 9666281 A JP9666281 A JP 9666281A JP S6248293 B2 JPS6248293 B2 JP S6248293B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- short circuit
- thin film
- circuit detection
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 25
- 238000005498 polishing Methods 0.000 claims description 23
- 239000010409 thin film Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910000889 permalloy Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
- G11B5/3166—Testing or indicating in relation thereto, e.g. before the fabrication is completed
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】
本発明は薄膜磁気ヘツドの製造工程中のギヤツ
プ部の加工に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to machining of a gap portion during the manufacturing process of a thin film magnetic head.
従来、第１図に示すような磁性体コア１と導体
コイル２よりなる薄膜マルチトラツクヘツドの研
摩方法としては、ヘツド素子列の両側に研摩用電
極３を配置し、研摩用電極３が研摩により切断さ
れ抵抗値が無限大となる位置を外部検出装置（図
示せず）で検出し、所定の寸法を得る方法が知ら
れている。 Conventionally, as a method of polishing a thin film multitrack head consisting of a magnetic core 1 and a conductive coil 2 as shown in FIG. A method is known in which a predetermined dimension is obtained by detecting the position where the resistance value becomes infinite after cutting with an external detection device (not shown).
しかし、薄膜マルチトラツクヘツドの下部磁性
層は通常、製作プロセスの簡略化のため共通磁性
層としており、また、上記磁性層はパーマロイあ
るいはセンダスト等の導電性薄膜で形成すること
が多い。したがつて下部磁性層と研摩用電極の間
隔がギヤツプ間隔程度で非常に近く、上記のよう
な方法では研摩時にバリやダレにより研摩用電極
と導電性の下部磁性層が短絡し、研摩用電極の切
断位置を正確に検出することができないという欠
点がある。 However, the lower magnetic layer of a thin film multitrack head is usually a common magnetic layer to simplify the manufacturing process, and the magnetic layer is often formed of a conductive thin film such as permalloy or sendust. Therefore, the distance between the lower magnetic layer and the polishing electrode is very close to the gap distance, and in the above method, the polishing electrode and the conductive lower magnetic layer are short-circuited due to burrs and sag during polishing, and the polishing electrode The disadvantage is that the cutting position cannot be detected accurately.
また、磁気記録の高密度化に伴ないギヤツプ間
隔すなわち絶縁層厚さがさらに狭くなつて上記研
摩用電極、下部導電性層間の短絡現象が顕著とな
つている。 Furthermore, as the density of magnetic recording increases, the gap distance, ie, the thickness of the insulating layer, becomes narrower, and the phenomenon of short circuit between the polishing electrode and the lower conductive layer becomes more prominent.
本発明は上記した従来技術の欠点をなくし研摩
位置を正確に検出する方法を提供するにある。 The present invention eliminates the drawbacks of the prior art described above and provides a method for accurately detecting the polishing position.
本発明は、薄膜マルチトラツクヘツドの製造方
法において、短絡検出端子を設け上記短絡現象を
積極的に利用したことを特徴としている。 The present invention is characterized in that a short circuit detection terminal is provided in a method for manufacturing a thin film multitrack head to actively utilize the short circuit phenomenon.
以下本発明の実施例を第２図，第３図を用いて
詳細に説明する。第２図は本発明の実施例を示す
平面図、第３図は第２図のＹ―Y′の断面図であ
る。同図においてガラス等の基板１６上にパーマ
ロイ等の導電性の下部磁性層１５を設け、該磁性
層上にSiO2等の絶縁層１４を介して短絡検出端
子１３及びAl等の導体コイル１２、パーマロイ
等の上部磁性層１１を設ける。短絡検出端子１３
は、AlまたはAuの導電性薄膜を用いている。 Embodiments of the present invention will be described in detail below with reference to FIGS. 2 and 3. FIG. 2 is a plan view showing an embodiment of the present invention, and FIG. 3 is a sectional view taken along YY' in FIG. In the figure, a conductive lower magnetic layer 15 made of permalloy or the like is provided on a substrate 16 made of glass or the like, and a short circuit detection terminal 13 and a conductor coil 12 made of Al or the like are placed on the magnetic layer via an insulating layer 14 made of SiO 2 or the like. An upper magnetic layer 11 made of permalloy or the like is provided. Short circuit detection terminal 13
uses a conductive thin film of Al or Au.
研摩目標位置は、図中Ｘ―X′で示され、短絡
検出端子１３の一端がＸ―X′線上に重なるよう
に設定されている。上記短絡検出端子１３と上記
導電性の下部磁性層１５との間には、短絡検知装
置７が接続されている。短絡検知装置７の検知出
力８は、研摩装置（図示せず）の制御入力となつ
ている。 The polishing target position is indicated by XX' in the figure, and is set so that one end of the short circuit detection terminal 13 overlaps the line XX'. A short circuit detection device 7 is connected between the short circuit detection terminal 13 and the conductive lower magnetic layer 15. A detection output 8 of the short circuit detection device 7 serves as a control input for a polishing device (not shown).
なお、前記研摩装置は、上記制御入力があつた
場合には、研摩動作を停止するようになつてい
る。 The polishing device is configured to stop the polishing operation when the control input is received.
斯る構成によれば、薄膜マルチトラツクヘツド
ガ研摩装置によつて図中Ｘ―X′で示す研摩目標
位置まで研摩されると短絡検出端子１３と、導電
性の下部磁性層１５が短絡し、短絡検知装置７の
検知出力により研摩動作が停止される。これによ
つて研摩が目標位置まで行なわれたことを自動的
に検出して薄膜マルチトラツクヘツドの研摩を終
了させることができる。 According to this configuration, when the thin film multi-track head polishing device polishes the head to the polishing target position indicated by X-X' in the figure, the short-circuit detection terminal 13 and the conductive lower magnetic layer 15 are short-circuited. The polishing operation is stopped by the detection output of the short circuit detection device 7. Thereby, it is possible to automatically detect that the polishing has been completed to the target position and to terminate the polishing of the thin film multitrack head.
なお、上記実施例では、第２図のような薄膜マ
ルチトラツクヘツドの両側にそれぞれ短絡検出端
子を設けたものについて述べたが、これに限定さ
れるものではなく、薄膜マルチトラツクヘツドの
どちらか片側にのみ短絡検出端子を設けたもので
もよい。また上記実施例では、この発明をインダ
クテイブ薄膜マルチトラツクヘツドについて述べ
たが、これに限定されるものではなくたとえば、
磁気抵抗効果型薄膜マルチトラツクヘツドについ
ても同様に使用可能である。また、上記実施例に
おいては、導電性の下部磁性層と短絡検出端子と
の短絡を検出したが、短絡検出端子の上部に絶縁
層を介して導電性の上部磁性層あるいは他の導電
性層を設けて、該導電性層との短絡を検出しても
よい。あるいは、短絡検出をより容易にするため
に、短絡検出端子の両側に絶縁層を介して導電体
層を設けた構造にしても良いことは言うまでもな
い。 In the above embodiment, short circuit detection terminals are provided on both sides of the thin film multitrack head as shown in FIG. 2, but the short circuit detection terminals are not limited to this. A short-circuit detection terminal may be provided only in the terminal. Further, in the above embodiments, the present invention has been described with respect to an inductive thin film multi-track head, but the present invention is not limited thereto, and for example,
A magnetoresistive thin film multitrack head can also be used. Further, in the above embodiment, a short circuit between the conductive lower magnetic layer and the short circuit detection terminal was detected, but a conductive upper magnetic layer or another conductive layer was placed above the short circuit detection terminal with an insulating layer interposed therebetween. may be provided to detect a short circuit with the conductive layer. Alternatively, in order to make short circuit detection easier, it goes without saying that a structure may be used in which conductive layers are provided on both sides of the short circuit detection terminal with an insulating layer interposed therebetween.
以上述べた本発明によれば、インダクテイブ薄
膜マルチトラツクヘツドを所定の研摩目標位置ま
で研摩する場合に、上記短絡検出端子と下部導電
性磁性層との短絡を検出することにより研摩動作
を停止させるため、研摩量が研摩目標位置に達し
たことを自動的に検知し、研摩動作を停止させる
ことができ、かつ研摩作業が容易にできる。 According to the present invention described above, when polishing an inductive thin film multitrack head to a predetermined polishing target position, the polishing operation is stopped by detecting a short circuit between the short circuit detection terminal and the lower conductive magnetic layer. It is possible to automatically detect that the amount of polishing has reached the polishing target position, stop the polishing operation, and facilitate the polishing work.
第１図は、従来例を示す平面図、第２図は本発
明の一実施例を示す平面図、第３図は第２図のＹ
―Y′における断面図である。
７…短絡検知装置、８…検知出力、１１…上部
磁性体、１２…導体コイル、１３…短絡検出端
子、１４…絶縁層、１５…下部導電性磁性層、１
６…基板。
Fig. 1 is a plan view showing a conventional example, Fig. 2 is a plan view showing an embodiment of the present invention, and Fig. 3 is a plan view showing the Y of Fig. 2.
- It is a cross-sectional view at Y'. 7... Short circuit detection device, 8... Detection output, 11... Upper magnetic body, 12... Conductor coil, 13... Short circuit detection terminal, 14... Insulating layer, 15... Lower conductive magnetic layer, 1
6...Substrate.
Claims (1)
介して導電性薄膜よりなる短絡検出端子を設けた
薄膜磁気ヘツドを所定の目標位置まで研摩する際
に、上記導電性磁性層と短絡検出端子との短絡を
検知することにより加工進行状態を検出し所定の
寸法にまで加工する薄膜磁気ヘツドの製造方法。1. When polishing a thin film magnetic head, which has a short-circuit detection terminal made of a conductive thin film on the top or bottom of the conductive magnetic layer via an insulating layer, to a predetermined target position, the conductive magnetic layer and the short-circuit detection terminal A method for manufacturing a thin film magnetic head that detects the progress of processing by detecting a short circuit with the head and processes it to a predetermined size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9666281A JPS57212609A (en) | 1981-06-24 | 1981-06-24 | Manufacture of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9666281A JPS57212609A (en) | 1981-06-24 | 1981-06-24 | Manufacture of thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57212609A JPS57212609A (en) | 1982-12-27 |
| JPS6248293B2 true JPS6248293B2 (en) | 1987-10-13 |
Family
ID=14171025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9666281A Granted JPS57212609A (en) | 1981-06-24 | 1981-06-24 | Manufacture of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57212609A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3513431A1 (en) * | 1985-04-15 | 1986-10-23 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR PRODUCING AT LEAST ONE MAGNETIC HEAD IN THIN FILM TECHNOLOGY |
| JP2001053039A (en) * | 1999-08-05 | 2001-02-23 | Okamoto Machine Tool Works Ltd | Wafer polishing end point detecting method and polishing end point detecting apparatus |
-
1981
- 1981-06-24 JP JP9666281A patent/JPS57212609A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57212609A (en) | 1982-12-27 |
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