JPS624861B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a technique for forming an index (index portion) in a resin-sealed semiconductor device.

A resin-sealed semiconductor device is a device in which a semiconductor element and a plurality of leads extending outward from the periphery of the semiconductor element are sealed with epoxy resin or the like, and the plurality of leads are arranged in one or two rows on the outer end side. Some of these leads are tab leads to which semiconductor elements are directly attached, and need to be distinguished from other leads as ground leads, so conventionally a resin molded body has been asymmetrically deformed to form an index.

By the way, in the above-mentioned type where multiple leads are arranged in a line and the number of leads is relatively small, for example, the single 8-pin type, the resin molding body is thin and small, so indexes may not be attached, and even if there is, it is difficult to distinguish. There is a problem. Figure 1 a, b
is an example of a conventional single 8-pin type resin-sealed semiconductor device, in which leads 2 are led out in a line from the bottom surface of a resin-sealed body 1, and by dropping one corner of the resin-sealed body. The index is set to 3. This resin encapsulant is generally made of dark epoxy resin, but the index is very difficult to see when viewed from above, which also causes inefficiency in the mounting work on the printed wiring board.

In order to solve the above-mentioned problems, the present invention has been made by focusing on using a part of the lead member as an index.The purpose of the present invention is to use a part of the lead member as an index. It is an object of the present invention to provide a resin-sealed semiconductor device having an easy index.

In order to achieve the above object, in the present invention,
The gist of the present invention is to expose the ends of some of the plurality of lead members from the surface of the resin sealing body in a direction other than the direction in which the plurality of leads are led out, and use this as an index.

The present invention will be described in detail below with reference to Examples.

FIGS. 2a to 2d show an example in which the present invention is applied to a single 8-pin resin-sealed semiconductor device. In the figure, 1 is a resin molded body, 2 is a lead lead-out portion (8 pins) that protrudes from the bottom surface of the resin body, and 4 is a part of the lead member that is exposed or protrudes from the top surface of the resin molded body. It is. When a black colored resin is used as the resin encapsulant, even if the index 4 made of the lead member is simply exposed without protruding from the resin surface, the white colored index as shown in Fig. Easily identified from above.

FIG. 3 is a sectional view showing the form of the resin-sealed lead frame of the resin-sealed semiconductor device. In the figure, reference numeral 5 denotes an outer frame portion (frame) of the lead frame, and 6 and 7 are waste portions forming a boundary with the resin body. 8 is a semiconductor element (pellet) mounted on tab 9, and this tab 9 is connected to tab lead 1.
0 is supported by the frame 5. Reference numeral 4 designates a part of a lead member that serves as an index, and in this case is provided continuously between the tab lead 10 and the dam 6. A hatched portion 11 surrounded by a dashed-dotted line in the figure is a resin sealing body, and a portion 4 of the lead member serving as the index is cut along the dashed-dotted line and exposed on the surface of the resin body.

The lead member serving as an index is not limited to a tab lead. A part of other lead-out leads may be used, and as shown in FIGS. 4a and 4b, an independent lead member 12 that is not used as a dam lead or a lead connected to the frame may be used.

The exposed part of the lead member that becomes the index is 1
It is not limited to one location, but may be provided in a plurality of locations as shown in FIG. 5, or may be formed in an arbitrary size as shown in FIG. 5B. The surface of the resin body where the lead member serving as the index is exposed is not limited to the top surface of the sealing body.
It may be provided on one side as shown in FIG. 5c, or on a slope with an upper corner as shown in FIG. 5d.

According to the present invention described in the above embodiments, (1) since the index is constituted by a lead member made of metal, it is very easy to identify the marking position in the resin-sealed body; (3) Manufacturing is easy once the lead frame pattern is determined.
(4) There is no need to renew the mold for indexing, and the standard mold for single pin and double pin can be used as is, which is advantageous in terms of mass production and economy. (5) ) It is highly effective in that the index does not fall off or peel off.

The present invention is applicable to resin-sealed semiconductor devices (double pin, single pin) in general.

[Brief explanation of the drawing]

FIGS. 1a and 1b are perspective views showing an example of a conventional resin-sealed semiconductor device. 2a to 2e show an embodiment of a resin-sealed semiconductor device according to the present invention;
is a top view, b is a front view, c is a bottom view, d is a right (left) side view, and e is a partially enlarged perspective view. Third
The figure is a sectional view showing the internal form of the semiconductor device according to the present invention immediately after resin sealing. Figure 4 a, b
5 is a partially sectional view showing another embodiment of the present invention, and FIGS. 5A to 5D are partially perspective views showing other embodiments of the present invention. 1...Resin sealing body, 2...Lead, 3...Index with corner of resin body cut off, 4...Index consisting of part of lead member, 5...Lead frame outer frame (frame) , 6, 7... Dam portion, 8... Semiconductor element, 9... Tab, 10... Tab lead, 11... Resin sealing body, 12... Lead member.

Claims (1)

[Scope of Claims] 1 Consists of a semiconductor element, a plurality of lead members leading out in one direction from the periphery of the semiconductor element, and a resin sealing body that includes the inner ends of the semiconductor element and the plurality of lead members. 1. A resin-sealed semiconductor device, characterized in that an index lead portion is provided at a location different from the plurality of leads. 2. The resin-sealed semiconductor device according to claim 1, wherein the plurality of leads led out in one direction are arranged in a line. 3. The resin-sealed semiconductor device according to claim 1, wherein the index lead portion has its end exposed from the surface of the resin-sealed body in a direction opposite to the direction in which the plurality of leads are led out.