JPS6253190B2 - - Google Patents
Info
- Publication number
- JPS6253190B2 JPS6253190B2 JP14935884A JP14935884A JPS6253190B2 JP S6253190 B2 JPS6253190 B2 JP S6253190B2 JP 14935884 A JP14935884 A JP 14935884A JP 14935884 A JP14935884 A JP 14935884A JP S6253190 B2 JPS6253190 B2 JP S6253190B2
- Authority
- JP
- Japan
- Prior art keywords
- ultraviolet
- treated
- temperature
- gas
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007789 gas Substances 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000356 contaminant Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000011282 treatment Methods 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims 2
- 239000001272 nitrous oxide Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 7
- 238000000354 decomposition reaction Methods 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052753 mercury Inorganic materials 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002957 persistent organic pollutant Substances 0.000 description 2
- 235000002918 Fraxinus excelsior Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002956 ash Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Apparatus For Disinfection Or Sterilisation (AREA)
Description
【発明の詳細な説明】
本発明は紫外線処理方法、例えばUV／O3クリ
ーニングに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to ultraviolet treatment methods, such as UV/O 3 cleaning.
紫外線ランプなどの紫外線源より発生する紫外
線を利用して有機汚染物を分解洗浄などを処理を
することが行われているが、この紫外線源、例え
ば低圧水銀ランプを点灯すると、主として波長が
254nｍの水銀共鳴線の紫外線が外部に放出さ
れ、従として波長が185nｍの紫外線が、更には
他の波長のものがわずかに放出される。そして、
波長185nｍの紫外線によつてオゾンが生成し、
次にこのオゾンが波長254nｍにより分解されて
発生基の酸素が生成し、この発生基の酸素によつ
て有機汚染物が分解され、ガス状態で飛散するこ
とが知られている。また、N2Oは波長185nｍによ
り分解されて発生基の酸素が生成し、オゾンと同
様に有機汚染物を分解し、ガス状態で飛散させ
る。 Ultraviolet light emitted from ultraviolet sources such as ultraviolet lamps is used to decompose and clean organic contaminants, but when this ultraviolet source, such as a low-pressure mercury lamp, is turned on, the main wavelength is
Ultraviolet rays with a mercury resonance line of 254 nm are emitted to the outside, followed by ultraviolet rays with a wavelength of 185 nm, and a small amount of other wavelengths are also emitted. and,
Ozone is produced by ultraviolet rays with a wavelength of 185 nm.
Next, this ozone is decomposed at a wavelength of 254 nm to generate oxygen as a generating group, and it is known that organic pollutants are decomposed by the oxygen as a generating group and scattered in a gaseous state. Furthermore, N 2 O is decomposed at a wavelength of 185 nm to generate oxygen, which decomposes organic pollutants in the same way as ozone and scatters them in a gaseous state.
ところで従来の方法は、紫外線ランプが上面に
配設された照射室内の下方に被処理体を配置し、
照射室内に酸素などの処理用ガスを含むガスを供
給しながら、被処理体に紫外線を照射していた。
そして、紫外線ランプと被処理体との距離が小さ
いと、被処理体表面の光の照射分布が不均一にな
り、有機汚染物の分解に局部的な偏りが生じるな
どの問題があるため、紫外線ランプと被処理体と
の距離はある程度大きくしなければならない。従
つて、照射室の容積が大きくなるが、このため、
照射室内の昇温は少なく、更には、ランプより発
生した紫外線は被処理体に到達するまでに酸素お
よび発生したオゾンに吸収されて減衰し、洗浄な
どの処理速度を遅くする原因となつていた。ま
た、処理速度を高く保持するためには、大きな容
積の照射室内に多量の酸素などの処理用ガスを供
給する必要があり、しかもこの多量に供給された
処理用ガスの極く一部が有機汚染物の分解に寄与
するのみであつて、大部分の処理用ガスは無駄に
照射室外に排気され、その効率は著しく悪かつ
た。 By the way, in the conventional method, the object to be treated is placed below an irradiation chamber with an ultraviolet lamp installed on the upper surface.
The object to be processed was irradiated with ultraviolet rays while a gas containing a processing gas such as oxygen was supplied into the irradiation chamber.
If the distance between the UV lamp and the object to be treated is small, the distribution of light irradiation on the surface of the object to be treated will be uneven, causing problems such as localized bias in the decomposition of organic contaminants. The distance between the lamp and the object to be processed must be increased to some extent. Therefore, the volume of the irradiation chamber increases;
The temperature rise in the irradiation chamber was small, and furthermore, the ultraviolet rays generated by the lamp were absorbed by oxygen and generated ozone and attenuated by the time they reached the object to be treated, slowing down the processing speed of cleaning and other processes. . In addition, in order to maintain a high processing speed, it is necessary to supply a large amount of processing gas such as oxygen into the large volume irradiation chamber, and a small portion of this large amount of processing gas supplied is organic. Most of the processing gas was wastefully exhausted outside the irradiation chamber, only contributing to the decomposition of the contaminants, and its efficiency was extremely poor.
そこで本発明は、これらの事情にかんがみてな
されたものであつて、洗浄などの処理速度が早
く、もつて紫外線強度や処理用ガスの供給量を少
なくすることが可能となる紫外線処理方法を提供
することを目的とする。そして、その構成は、紫
外線源の光によりオゾンもしくはN2Oを分解し、
これにより生成される発生基の酸素により被処理
体の表面に付着する有機汚染物などを分解して洗
浄などの処理を行うに際し、紫外線源と被処理体
との間を石英ガラスやエヤーカーテンなどで紫外
線が透過可能な状態で区画し、被処理体の近傍に
のみ処理用ガスを供給し、紫外線源を含む空間は
真空や紫外線を吸収しないガス雰囲気とし、か
つ、被処理体の温度を赤外線や抵抗加熱ヒーター
などにより適温に調整し、有機汚染物などの分解
を促進することを特徴とする。 Therefore, the present invention has been made in view of these circumstances, and provides an ultraviolet treatment method that has a high processing speed such as cleaning, and can reduce the intensity of ultraviolet rays and the amount of processing gas supplied. The purpose is to Its composition is to decompose ozone or N 2 O with light from an ultraviolet source,
The generated oxygen generated by this process decomposes organic contaminants adhering to the surface of the object to be treated, and when performing cleaning or other treatments, the space between the ultraviolet ray source and the object to be treated is removed using quartz glass, air curtains, etc. The process gas is supplied only to the vicinity of the object to be processed, the space containing the ultraviolet source is kept in a vacuum or a gas atmosphere that does not absorb ultraviolet rays, and the temperature of the object to be processed is controlled by the infrared rays. It is characterized by adjusting the temperature to an appropriate temperature using a resistance heater, etc., and promoting the decomposition of organic contaminants.
以下に図面に示す実施例に基いて本発明を具体
的に説明する。 The present invention will be specifically described below based on embodiments shown in the drawings.
第１図は本発明の実施例に使用される装置の断
面図を示すが、照射室１は図示略の装置箱に内蔵
されて二重構造をなし、発生したオゾンが外部に
漏洩しないようになつている。照射室１内の上方
には紫外線ランプ２としてＵ字状の200W低圧水
銀灯が２本配設され、その背部にはミラー３が配
置され、紫外線ランプ２の光は下方に向けて照射
される。そして、照射室１の天井上面には冷却水
路４が固着され、水冷されている。被処理体５は
直径約10cmのウエハーであつて、底面に固着され
た支持具６によつて支持されているが、紫外線ラ
ンプ２から被処理体５までの距離は10cmである。
そして、被処理体５の下方にはハロゲンランプ８
とミラー９からなる温度調節装置が設けられてい
るが、このハロゲンランプ８は最大消費電力が
150Wであつて、これから照射される赤外線によ
つて被処理体５の温度を常温から200℃近傍まで
の範囲で調整できるようになつている。 FIG. 1 shows a cross-sectional view of the apparatus used in the embodiment of the present invention. The irradiation chamber 1 is built into a device box (not shown) and has a double structure to prevent the generated ozone from leaking outside. It's summery. Two U-shaped 200W low-pressure mercury lamps are installed as ultraviolet lamps 2 in the upper part of the irradiation chamber 1, and a mirror 3 is placed behind the lamps, so that the light from the ultraviolet lamps 2 is directed downward. A cooling water channel 4 is fixed to the upper surface of the ceiling of the irradiation chamber 1 and is water-cooled. The object to be processed 5 is a wafer with a diameter of about 10 cm, and is supported by a support 6 fixed to the bottom surface, and the distance from the ultraviolet lamp 2 to the object to be processed 5 is 10 cm.
A halogen lamp 8 is provided below the object to be processed 5.
A temperature control device consisting of a mirror 9 and a mirror 9 is provided, but this halogen lamp 8 has a maximum power consumption.
The power is 150W, and the temperature of the object to be processed 5 can be adjusted in the range from room temperature to around 200°C by the infrared rays irradiated.
次に、被処理体５の上方２cmの位置には石英ガ
ラス板７が配設されており、被処理体５と紫外線
ランプ２とを区画しているが、被処理体５を含む
空間は紫外線ランプ２を含む空間よりずつと小さ
い。石英ガラス板７の下方には、酸素などの処理
用ガスを含むガスを供給する吸入孔１１と、内部
のガスを分解された汚染物とともに排出する排気
孔１２が設けられているが、排気孔１２より吸引
されたガスはオゾン分解室で処理された後に大気
中に放出される。そして、石英ガラス板７の上方
であつて、紫外線ランプ２を含む空間には、減圧
装置に接続された減圧孔１３と、窒素ガスのよう
に不活性であつて紫外線を吸収しないガスの注入
孔１４が設けられている。もつとも、注入孔１４
は設けずに、紫外線ランプ２を含む空間を真空に
することにより、紫外線がこの空間内で吸収され
ないようにしてもよい。 Next, a quartz glass plate 7 is placed 2 cm above the object 5 to separate the object 5 and the ultraviolet lamp 2, but the space containing the object 5 is exposed to ultraviolet light. It is slightly smaller than the space containing the lamp 2. Below the quartz glass plate 7, there are provided an inlet hole 11 for supplying a gas containing a processing gas such as oxygen, and an exhaust hole 12 for discharging the internal gas together with decomposed contaminants. The gas sucked through 12 is treated in an ozone decomposition chamber and then released into the atmosphere. In the space above the quartz glass plate 7 and containing the ultraviolet lamp 2, there is a pressure reduction hole 13 connected to a pressure reduction device and an injection hole for a gas that is inert and does not absorb ultraviolet rays, such as nitrogen gas. 14 are provided. However, the injection hole 14
Alternatively, the space containing the ultraviolet lamp 2 may be evacuated to prevent ultraviolet light from being absorbed in this space.
第２図は、他の実施例を示すが、温度調節装置
はハロゲンランプ８に代つて抵抗加熱ヒーター１
０が配設され、これの輻射熱によつてハロゲンラ
ンプ８の場合と同様に被処理体５の温度を調節で
きるようになつている。そして、石英ガラス板７
に代つてエヤーカーテンが配設されており、第１
図の石英ガラス板７に対応する位置に窒素ガスを
流出するノズル８１とこれを吸引して受入れる吸
引孔８２とが対向して設けられている。従つて、
被処理体５の少し上方には窒素ガスのエヤーカー
テンが張られ、紫外線はこれを透過するが、処理
用ガスはこれを超えて上方には拡散しないように
なつている。 FIG. 2 shows another embodiment in which the temperature control device is a resistance heating heater 1 instead of a halogen lamp 8.
0 is provided, and the temperature of the object to be processed 5 can be adjusted by its radiant heat in the same manner as in the case of the halogen lamp 8. And quartz glass plate 7
An air curtain is installed instead of the first
A nozzle 81 for discharging nitrogen gas and a suction hole 82 for sucking and receiving the nitrogen gas are provided at a position corresponding to the quartz glass plate 7 in the figure, facing each other. Therefore,
A nitrogen gas air curtain is placed slightly above the object to be processed 5, and ultraviolet rays are transmitted through this, but the processing gas is not diffused upward beyond this.
しかして、被処理体５の近傍に処理用ガスが供
給され、紫外線ランプ２を含む空間が減圧され、
もしくは更に窒素ガスが注入されるとともにハロ
ゲンランプ８もしくは抵抗加熱ヒーター１０に通
電される。そして、紫外線ランプ２が点灯される
と紫外線は被処理体５の表面に照射され、表面に
付着していた有機汚染物は分解されて洗浄などの
処理がなされる。 Thus, the processing gas is supplied to the vicinity of the object to be processed 5, and the space containing the ultraviolet lamp 2 is depressurized.
Alternatively, nitrogen gas is further injected and the halogen lamp 8 or resistance heater 10 is energized. Then, when the ultraviolet lamp 2 is turned on, the surface of the object to be treated 5 is irradiated with ultraviolet rays, and organic contaminants adhering to the surface are decomposed and processing such as cleaning is performed.
ここで、被処理体５が温度調節装置により適温
に調節されているので、有機汚染物の分解は著し
く促進される。因みに、従来例の適温に調節しな
いときに、350W高出力低圧水銀灯を２本点灯し
て２分間で処理が完了するような汚染度のもの
を、本実施例で70℃に加熱すると、２本の200W
低圧水銀灯のうち１本のみ点灯し、同じ２分間で
処理が完了した。従つて、紫外線強度は、70℃に
加熱することによつて1/3以下とすることができ
る。次に、被処理体５の加熱温度を変化させて処
理時間への影響を調べた結果を第３図に示す。こ
こで被処理体５はガラス板であり、純水の接触角
により清浄度の判定を行ない、θ＝10deg.をもつ
て処理の完了とした。これから明らかなように、
加熱温度を上げると処理時間は反比例して短かく
なり、120〜150℃に調節すれば20〜30秒で処理を
完了でき、紫外線強度や処理ガス供給量を少なく
することも可能であることが判明した。そして、
石英ガラス板やエヤーカーテンなどにより紫外線
源と被処理体とを紫外線透過可能に区画したの
で、これにより、紫外線の処理用ガスへの吸収を
少なくして処理速度を更に向上でき、また、処理
用ガスの供給量を著しく少なくできる効果があ
る。 Here, since the temperature of the object to be processed 5 is adjusted to an appropriate temperature by the temperature control device, the decomposition of the organic contaminants is significantly accelerated. By the way, if the contamination level is such that the treatment can be completed in 2 minutes by lighting two 350W high output low pressure mercury lamps when the temperature is not adjusted to the appropriate temperature as in the conventional example, if heated to 70℃ in this example, two 350W high output low pressure mercury lamps will be turned on. 200W
Only one of the low-pressure mercury lamps was turned on, and the treatment was completed in the same two minutes. Therefore, the intensity of ultraviolet rays can be reduced to 1/3 or less by heating to 70°C. Next, FIG. 3 shows the results of examining the effect on processing time by varying the heating temperature of the object to be processed 5. Here, the object to be treated 5 was a glass plate, and the cleanliness was determined based on the contact angle of pure water, and the treatment was completed when θ=10 degrees. As is clear from this,
Increasing the heating temperature will shorten the processing time inversely, and if the heating temperature is adjusted to 120 to 150°C, the processing can be completed in 20 to 30 seconds, and it is also possible to reduce the intensity of ultraviolet rays and the amount of processing gas supplied. found. and,
The ultraviolet light source and the object to be treated are separated using a quartz glass plate or an air curtain so that the ultraviolet rays can pass through, thereby reducing the absorption of ultraviolet rays into the processing gas and further improving the processing speed. This has the effect of significantly reducing the amount of gas supplied.
以上説明した実施例からも理解される様に、本
発明は、被処理体の温度を適温に調整し、かつ、
石英ガラス板やエヤーカーテンなどにより紫外線
源と被処理体とを紫外線透過可能に区画したの
で、有機汚染物などの分解を促進できるようにな
り、処理速度が早く、紫外線強度や処理用ガスの
供給量も少なくすることが可能な紫外線処理方法
とすることができる。なお、この方法は、洗浄の
他にフオトレジストのアツシング等にもそつくり
そのまゝ適用できる。 As can be understood from the embodiments described above, the present invention adjusts the temperature of the object to be processed to an appropriate temperature, and
Since the ultraviolet source and the object to be treated are separated using a quartz glass plate or air curtain so that ultraviolet light can pass through, it is possible to accelerate the decomposition of organic contaminants, etc., resulting in faster processing speed and improved ultraviolet intensity and processing gas supply. It is possible to provide an ultraviolet treatment method that can reduce the amount of ultraviolet rays. In addition to cleaning, this method can also be applied directly to ashes of photoresist, etc.
第１図は本発明実施例の断面図、第２図は同じ
く他の実施例の断面図、第３図は加熱温度と処理
時間の関係図である。
１……照射室、２……紫外線ランプ、３……ミ
ラー、５……被処理体、６……支持具、７……石
英ガラス板、８……ハロゲンランプ、１０……抵
抗加熱ヒーター。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a sectional view of another embodiment, and FIG. 3 is a diagram showing the relationship between heating temperature and processing time. DESCRIPTION OF SYMBOLS 1... Irradiation chamber, 2... Ultraviolet lamp, 3... Mirror, 5... Treated object, 6... Support tool, 7... Quartz glass plate, 8... Halogen lamp, 10... Resistance heating heater.
Claims (1)
酸化窒素）を分解し、これにより生成される発生
基の酸素により被処理体の表面に付着する有機汚
染物などを分解して洗浄などの処理を行うに際
し、紫外線源と被処理体との間を石英ガラスやエ
ヤーカーテンなどで紫外線が透過可能な状態で区
画し、被処理体の近傍にのみ紫外線により発生基
の酸素を生成するガスを供給するとともに、紫外
線源を含む空間は、真空や紫外線を吸収しないガ
ス雰囲気とし、かつ、被処理体の温度を適温に調
整し、有機汚染物などの分解を促進することを特
徴とする紫外線処理方法。 ２ 赤外線の照射により被処理体の温度を調整す
ることを特徴とする特許請求の範囲第１項記載の
紫外線処理方法。 ３ 抵抗加熱ヒーターにより被処理体の温度を調
整することを特徴とする特許請求の範囲第１項記
載の紫外線処理方法。[Claims] 1. Ozone or N 2 O (nitrous oxide) is decomposed by light from an ultraviolet source, and organic contaminants adhering to the surface of the object to be treated are decomposed by the generated radical oxygen. When carrying out processing such as cleaning, the space between the ultraviolet source and the object to be treated is separated using quartz glass or an air curtain in a manner that allows the ultraviolet rays to pass through. In addition to supplying the gas that generates the Characteristic ultraviolet ray treatment method. 2. The ultraviolet treatment method according to claim 1, wherein the temperature of the object to be treated is adjusted by irradiation with infrared rays. 3. The ultraviolet treatment method according to claim 1, wherein the temperature of the object to be treated is adjusted by a resistance heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14935884A JPS6129357A (en) | 1984-07-20 | 1984-07-20 | Treatment by ultraviolet rays |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14935884A JPS6129357A (en) | 1984-07-20 | 1984-07-20 | Treatment by ultraviolet rays |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6129357A JPS6129357A (en) | 1986-02-10 |
| JPS6253190B2 true JPS6253190B2 (en) | 1987-11-09 |
Family
ID=15473381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14935884A Granted JPS6129357A (en) | 1984-07-20 | 1984-07-20 | Treatment by ultraviolet rays |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6129357A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11285566B2 (en) | 2017-03-14 | 2022-03-29 | Honda Motor Co., Ltd. | Laser machining apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6501486B2 (en) * | 2014-10-27 | 2019-04-17 | 学校法人東海大学 | Sterilizer |
| JP2018102635A (en) * | 2016-12-27 | 2018-07-05 | 株式会社トクヤマ | Sterilization method and sterilization apparatus |
-
1984
- 1984-07-20 JP JP14935884A patent/JPS6129357A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11285566B2 (en) | 2017-03-14 | 2022-03-29 | Honda Motor Co., Ltd. | Laser machining apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6129357A (en) | 1986-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |