JPS6255986B2 - - Google Patents

Description

TECHNICAL FIELD OF THE INVENTION The present invention relates to an apparatus used for manufacturing printed circuit boards, and in particular, to an apparatus used for manufacturing printed circuit boards, and in particular, a device for applying a member such as a dry film-like photoresist or a protective film to the surface of the printed circuit board while continuously feeding the substrate. The present invention relates to an apparatus for processing escape holes in a film member in a printed circuit board laminating apparatus that laminates printed circuit boards.

In this specification, the substrate of a printed circuit board is abbreviated as a "printed board" or simply "substrate," and film members to be laminated, such as dry film photoresist and protective films, are referred to as "photoresist films" or "photoresist films." It will be abbreviated as "resist film".

Background of the Technology In recent years, the method of manufacturing printed circuit boards involves forming a photoresist layer on the surface of a conductor layer of a board such as a copper-clad board.
The mainstream method is to form wiring patterns using photolithography technology. In this case, the method of forming the photoresist layer is mainly by laminating a dry film photoresist on the surface of the substrate.

Previously, resist film was laminated onto printed circuit boards by cutting a long strip of resist film to the length of the board and then cutting it one by one, but this method was inefficient and hindered mass production. It lacks.

Therefore, in recent years, a laminating apparatus has been developed that can continuously laminate a resist film in the form of a long strip onto a printed circuit board without cutting it. However, conventional laminating apparatuses of this type have the following problems, and countermeasures have been desired.

Prior Art and Problems The conventional laminating apparatus as described above laminates the printed circuit board on the surface of the printed circuit board by continuously feeding a long strip of resist film while continuously feeding the printed circuit board with a feed roller or the like at intervals. It is configured to be laminated by continuous thermocompression bonding using rolls.

However, the printed circuit board has a reference hole formed therein that will be used for alignment in various subsequent steps, and therefore it is necessary to form an escape hole in the resist film to escape the reference hole of the board. . However, conventional laminating apparatuses do not have the function of forming such escape holes in the resist film, and therefore, after the lamination process, an operator manually forms the escape holes using a knife or the like.
This not only hinders labor-saving or unmanned printed board manufacturing lines, but also inefficiencies and low productivity.Furthermore, defects in machining of escape holes and chips from resist films and circuit boards cause subsequent photolithography. Problems are likely to occur during the process, leading to poor quality printed boards and lower yields.

OBJECT OF THE INVENTION The present invention is directed to solving such problems, that is, in a laminating apparatus as described above, it is possible to automatically and efficiently form escape holes in a resist film in advance before laminating it onto a printed circuit board. The object of the present invention is to provide a resist film escape hole machining device that can save labor or automate the printed board lamination process, improve productivity, improve the quality of printed boards, and ultimately improve yield.

Structure of the Invention The film member escape hole processing device according to the present invention comprises: (a) a sensor disposed on the way to the lamination position of the printed circuit board feed path to detect the reference hole of the printed circuit board; and (b) film member supply. The present invention is configured to include an escape hole machining unit that is provided at a position on the path leading to the lamination position and that processes the escape hole in the film member in response to a reference hole detection signal from the sensor.

Embodiments of the Invention Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the same reference numerals indicate the same parts throughout the figures.

FIG. 1 is a perspective view schematically showing the appearance of an embodiment of a printed circuit board laminating apparatus (hereinafter simply referred to as a "laminator") equipped with a resist film escape hole processing apparatus according to the present invention, and FIG.
The figures are a plan view and a side view, respectively, schematically showing the overall configuration. In these figures, the reference numeral 1 indicates the entire laminator, and the laminator 1 basically consists of a timing section 2, a laminating section 3, and a cutting section 4. Further, reference numeral 5 in FIGS. 2 and 3 indicates a board supply unit that supplies the printed circuit board P to the laminator 1 from an earlier stage printed board processing unit or a printed board stock unit (not shown).

First, with reference to FIGS. 2 and 3, the substrate supply section 5
The overall structure and operation of each part 2, 3, 4 of the laminator 1 will be briefly explained. Substrate supply section 5
The substrate P is sent horizontally in the direction of arrow A along a horizontal feeding path T (indicated by a dashed line in FIG. 3) using a pair of feeding belts 7 wound horizontally around a pulley 6.
It is configured to be supplied to the timing adjustment section 2 of the laminator 1 via a free support roller 8.

The timing adjustment unit 2 of the laminator 1 includes a fast-feeding belt 11 that can be raised and lowered, a stopper 17, a fixed guide roller 18, a movable width adjusting roller 19 (Fig. 2), a clamping roller 21, and a feeding roller that can be opened and closed up and down. 22 and 23 are equipped with a substrate constant-space feeding mechanism having spacing pins 25 that can be raised and lowered and are also movable in the substrate feeding direction, and feed the substrates P supplied from the substrate supply section 5 at a predetermined distance d from each other. (for example, 2 to 3 mm) and aligned in a state facing correctly in the board feeding direction, and continuously fed to the next laminate section 3 at a predetermined feeding speed V (for example, 0.5 to 2 m/min). do. That is, the fast-feeding belt 11 is normally located below the substrate feeding path T, and the substrate P is moved from the direction of the arrow A to the fast-feeding belt 1.
1, the fast-feed belt 11 is driven by the motor M1 to fast-feed the substrate P to a position where it hits the stopper 17, and waits at a position below the substrate feeding path. During this waiting period, as shown in FIG. 2, the width adjusting roller 19 is driven by the air cylinder SY1 to press the substrate P against the fixed guide roller 18 and set it in a predetermined position and facing correctly in the substrate feeding direction. Next, the fast-feeding belt 11 of the substrate feeding path T
If there is no preceding substrate at the upper position, the fast-feeding belt 11 is raised by the motor M2 and the substrate P is clamped by the clamping rollers 21. On the other hand, the preceding substrate P is sent at a constant speed V by the feeding rollers 22 and 23 and the feeding roller 31 of the laminating section 3, which are driven in synchronization with each other.
When the rear end passes the spacing pin 25, the spacing pin 25 is raised into the substrate feeding path by the air cylinder SY3. At the same time, the upper feeding roller 23 is raised by the air cylinder SY2, and then the fast-feeding belt 11 is driven by the motor M1, so that the substrate P clamped by the clamping roller 21 is moved faster than the substrate feeding speed. It is fast-forwarded at a high speed, passes between the feeding rollers 22 and 23, follows the preceding substrate P while pushing the spacing pin 25 with its front end, and presses the spacing pin 25 between the feeding rollers 25 and the rear end of the preceding substrate P as shown in the figure. I run into it. After that, remove the spacing pin 2
5 is pulled out from between the substrates P by the air cylinder SY3, and at the same time, the upper feeding roller 23 is lowered again by the air cylinder SY2 to clamp the succeeding substrate P. As a result, both the preceding and succeeding substrates P are fed at a constant speed V by the feeding rollers 22, 23 and the feeding roller 31 while being separated by a gap d equal to the diameter d of the spacing pin 25.
On the other hand, when the upper feeding roller 23 is lowered, the fast-feeding belt 11 is lowered to the initial position shown in the figure by the motor M2, and the next substrate is placed in the standby position as described above. Thereafter, the above-mentioned process is repeated, so that the substrates P supplied from the substrate supply section 5 are continuously supplied to the laminate section 3 at a constant speed V at regular intervals and aligned in the correct direction. become.

The laminating section 3 has feed rollers 31, 32, 3
3, 34, a laminating mechanism having a laminating roll 35, a free support roller 36, a resist film reel 37, etc., and a die punch unit 4
0, etc., and continuously feeds the substrate P fed from the timing adjustment section 2 at a constant speed V while maintaining the gap d between them, Long strip-shaped resist film F (clearly marked with hatching in Figure 2)
is continuously supplied at the same speed as the substrate feeding speed, and the reference hole Hp of the substrate P is provided to the resist film F in advance.
(Fig. 2) and the corresponding escape hole Hf (Fig. 2) are processed, and then the resist film F is continuously thermocompressed onto both the upper and lower surfaces of the substrate P, and the laminated substrate P and resist film F are bonded together. It is sent to the next cutting section 4. The laminate portion 3 will be described in detail later with reference to FIG. 4.

The cutting section 4 includes a cutting mechanism including a feeding roll 51, a feeding belt 54 horizontally wound around pulleys 52 and 53, a cutter 60, etc., and cuts the laminated substrate P and resist sent out from the laminating section 3. While continuously feeding the film F, the resist film F is cut at the gap between the substrates P, and the substrates P are separated one by one. Send it out as you like. That is, the rows of substrates P interconnected by the resist film F sent out from the laminating section 3 are moved by the feed roller 51 and the feed belt 5.
4 is a constant speed V (however, in practical terms, it is advantageous to make the peripheral speed of the feed belt 54 a little faster than the constant speed V)
is sent continuously. The cutter 60 is provided between the feed roller 51 and the feed belt 54, and has a razor-shaped cutter blade 65. This cutter blade 65 can be moved up and down as shown in FIG. 2 by a support mechanism and a drive mechanism (not shown), and can move in the same direction B and at the same speed V as the substrate row as shown in FIG. It is configured so that it is fed along the substrate line and at the same time crosses it at right angles (the actual trajectory is oblique to the substrate row feeding direction B, as shown by the dotted line in FIG. 2). Then, the feed roller 5
1 and the feed belt 54 by a sensor (for example, a photo sensor), not shown, detects the gap between the substrates in the row of substrates, the cutter blade 65 descends as shown in FIG. While moving at a constant speed V, the resist film F is cut at the gap between the substrates. As a result, the preceding substrate P is separated from the substrate row and sent out in the direction of arrow B by the feeding belt 54. On the other hand, after cutting is completed, the cutter blade 65 rises to the position indicated by the reference numeral 65' in FIG.
It moves above the substrate row in the opposite direction to the direction used during cutting and returns to the initial position.

Next, the laminate portion 3 will be described in detail with reference to FIG. 4. FIG. 4 is an enlarged side view of the main parts of the laminate part 3. The laminating mechanism of the laminating unit 3 includes feed rollers 31, 32, 3 that are arranged at approximately equal intervals along the substrate feed path T and that are constantly rotated in synchronization with each other by a drive mechanism (not shown).
3, 34 and a laminating roll 35, whereby the substrate P fed from the timing adjustment section 2 in the previous stage is continuously passed through the laminating roll 35 in the direction of the arrow at a constant speed V while maintaining the gap d between them. sent to. Note that there are two types of lamination methods: a normal pressure method and a vacuum method, and the present invention can be used with either method, but the illustrated example is a vacuum method, and the feed rollers 31 and 34 at both ends are used to maintain airtightness. Also serves as a seal roll.

Further, as shown in FIG. 3, resist film reels 37 are provided above and below the substrate feeding path T, and a roll-shaped resist film F is loaded onto these reels. The resist film F is pulled out from these upper and lower reels 37 and transferred to the fourth film in the form of a long strip.
As shown in the figure, it is supplied to the laminate roll 35 via a guide roller 38 at the same speed as the feed speed V of the substrate P, and is continuously bonded to the upper and lower surfaces of the substrate P by thermocompression.

As shown in cross section in FIG. 5, the resist film F is wound into a roll with a thin protective film Fa made of polyethylene or the like applied to both the upper and lower surfaces, and when pulled out from the reel 37, the protective film on one side is removed.
Fa is peeled off by a peeling means (not shown),
As shown in cross section in FIG. 6, the surface from which the protective film has been peeled off is laminated onto the substrate P. In addition, the width of the resist film F is generally narrower than the width of the substrate P, and as is clear from FIGS. 2 and 6, the resist film F is laminated to the central portion of the substrate P, leaving both sides where the conductor pattern is not formed. be done. In the resist film cutting step described above, the resist film F is cut by detecting the substrate spacing d using a photo sensor at the side of the substrate on which the resist film F is not laminated.

Next, the escape hole processing apparatus according to the present invention includes a photo sensor S1 for detecting the reference hole Hp of the substrate P, which is composed of a light emitting element 48a and a light receiving element 48b, which are arranged at a position on the way to the laminating roll 35 on the substrate feeding path T. , and a die punch which is arranged in the resist film supply path between the resist film reel 37 (FIG. 3) and the laminating roll 35 and is used to process an escape hole Hf for escaping the reference hole Hp of the substrate P. It has a unit 40. In the illustrated embodiment, reference holes Hp are formed on both left and right sides of the substrate P as shown in FIG. There is also a die punch unit 4
0 has a total of four sensors, two on the top and two on the left and right sides, but the figure shows one set of sensors S1 and 2 on one side.
Only the base die punch unit 40 is shown.

The die punch unit 40, as shown in cross section in FIG.
It has a die 41 and a punch 42 that face each other with the die 41 and the punch 42 facing each other. The punch 42 is a cylinder 4 that uses air or the like.
As described later, when the sensor S1 detects the reference hole Hp, the cylinder 43 is actuated based on the signal, and the punch 42 is driven toward the die 41 as shown by arrow a, and the resist film F is connected to the piston rod 44 of the resist film F. Punch out and machine an escape hole Hf. And sensor S2 provided on the die 41 side
However, when it is detected that the punch 42 has penetrated the resist film F and reached the die 41, the cylinder 4
3 is reversely operated, and the punch 42 is pulled out from the die 41 and resist film F as shown by arrow b. Reference numeral 47 indicates a stripper for pulling out this punch. Note that the optical path of the sensor S2 is
This can be ensured by providing a through hole or notch in a part of the area. The scraps of the resist film F are accommodated in the accommodating portion 45 provided in the die 41, thereby preventing contamination of the surface of the substrate P and the inside of the device. During punching of escape holes, since the resist film F is continuously fed at a constant speed V, the die punch unit 40 moves the resist film F from its initial position as indicated by arrow c to the punching end position indicated by reference numeral 40'. It is configured so that it can be moved to. That is,
While the punch 42 is inserted into the die 41, it is pulled by the resist film F and reaches near the punching end position 40', and when the cylinder 43 is reversely operated and the punch 42 is pulled out from the die 41 and the resist film F, it is returned to its original state. Die by spring 46.
The punch unit 40 returns to its initial position as shown by arrow d.

In the illustrated example, the distances l ₁ and l ₂ from the respective laminating rolls 35 of the reference hole detection sensor S1 and the die punch unit 40 are equal (l ₁
= l ₂ ). Then, at the same time that the sensor S1 detects the reference hole Hp of the substrate P, the die punch unit 40 detects the resist film F.
It is configured to machine an escape hole Hf.
As a result, the escape hole Hf is machined at a position equidistant from the laminating roll 35 with respect to the reference hole Hp detected by the sensor S1. The holes Hp and Hf will be accurately overlapped. According to such an arrangement of the sensor S1 and the die punch unit 40, even if the feeding speed V of the substrate P and the resist film F is changed, the relative positions of the reference hole Hp and the relief hole Hf do not change in any way. Accurate overlay is always obtained without the need for adjustment.

On the other hand, the sensor S1 and the die punch unit 4
It is also possible to configure the zero distances l ₁ and l ₂ differently. However, in this case, the configuration is such that l ₁ > l ₂ , and after the sensor S1 detects the reference hole Hp, the difference between the two distances (l ₁ - l ₂ ) and the feeding speed V of the substrate and resist film are determined. Therefore, the die punch unit 40 may be configured to perform the escape hole processing after a predetermined period of time (l ₁ -l ₂ )/V. For example, as shown in the block diagram of FIG. 7, the control circuit 49 of the escape hole machining device is provided with a pulse generator and a pulse counter that generate a number of pulses proportional to the feeding speed V of the substrate and resist film. This can be done by configuring the device so that after inputting the reference hole detection signal from the sensor S1, the drive signal for the die punch unit 40 is output after counting a certain number of pulses corresponding to the time (l ₁ −l ₂ )/V. be.

As described above, according to the relief hole processing apparatus according to the present invention, relief holes can be formed in the resist film continuously supplied in the laminating section 3 in advance in correspondence with the reference holes of the substrate before lamination onto the substrate P. , Therefore, manual hole machining after the lamination process is no longer necessary. Further, this escape hole processing device can efficiently and satisfactorily process escape holes, and can also prevent contamination of the substrate and the device by chips of the resist film during the escape hole processing.

Effects of the Invention As described above, according to the present invention, it is possible to realize an escape hole processing device that can automatically and efficiently process escape holes in a resist film in advance before laminating it onto a printed circuit board. Therefore, it is possible to save labor or automate the printed board laminating process, improve productivity, improve printed board quality, and ultimately improve yield, and the technical and economic effects thereof are significant.

[Brief explanation of the drawing]

FIG. 1 is a perspective view schematically showing the external appearance of an embodiment of a printed circuit board laminating apparatus equipped with a resist film escape hole processing apparatus according to the present invention, and FIGS. 2 and 3 are plan views schematically showing the overall structure of the laminating apparatus. Figure 4 is a partially cross-sectional side view showing the main parts of the laminating section of the laminating device, Figure 5 is a cross-sectional view of the resist film, and Figure 6 is a cross-sectional view of the printed circuit board and resist film after lamination. The top view and FIG. 7 are block diagrams of the control system of the escape hole machining mechanism. DESCRIPTION OF SYMBOLS 1... Printed circuit board laminating device, 2... Timing alignment section, 3... Laminating section, 4... Cutting section, 5... Board supply section, 7... Feeding belt, 1
1...Fast forward belt, 17...Stopper, 21...
... Clamp roller, 22, 23 ... Feeding roller, 25 ... Spacing pin, 31, 32, 33, 34
...Feed roller, 35...Lamination roll, 3
7...Resist film reel, 40...Die
Punch unit, 41...Die, 42...Punch, 43...Cylinder, 44...Piston rod, 45...Punched waste storage section, 46...Return spring, 47...Stopper, 49...Control circuit, 51
...Feed roller, 54...Feed belt, 60...
Cutter, 65...Cutter blade, P...Printed circuit board, Hp...Reference hole, F...Resist film, Hf...Escape hole, S1...Sensor, M
1, M2...Motor, SY1~SY5...Cylinder.

Claims (1)

[Scope of Claims] 1. In a printed circuit board laminating apparatus that continuously feeds the printed circuit board through the lamination position and continuously supplies a long strip-shaped film member to the lamination position to continuously laminate the surface of the printed circuit board. An escape hole machining device for a film member that processes an escape hole corresponding to a reference hole of a printed circuit board in the film member, the apparatus comprising: (a) disposed at a position on the way of the printed circuit board feeding path to the lamination position; (b) a sensor for detecting the reference hole in the film member; and (b) an escape hole provided at a position on the film member supply path leading to the lamination position and for forming the escape hole in the film member in response to a reference hole detection signal from the sensor. A hole processing device for a laminating film member, comprising: a hole processing unit. 2. In the escape hole machining device according to claim 1, the reference hole detection sensor and the escape hole machining unit are arranged at positions equidistant from the lamination position, and the escape hole is detected at the same time as the sensor detects the reference hole. A relief hole machining device characterized in that a hole machining unit performs relief hole machining. 3. In the relief hole machining device according to claim 1, a distance l ₁ from the lamination position of the relief hole machining unit is smaller than a distance l ₂ from the lamination position of the reference hole detection sensor, and detects _the reference hole, and then a certain period _{of time ((l 1 -}
l ₂ )/V) An escape hole machining device characterized in that the escape hole machining unit performs the escape hole machining after (l 2 )/V). 4. In the escape hole machining device according to any one of claims 1 to 3, the escape hole machining unit is provided so as to be movable in the same direction as the film member when machining the escape hole. An escape hole machining device characterized in that it has a return spring for returning the unit to its initial position when the escape hole machining is completed. 5. In the escape hole machining device according to any one of claims 1 to 4, the escape hole machining unit includes a die and a punch that are opposed to each other with a film member in between, and a die and a punch that drive the punch. An escape hole machining device characterized by comprising a driving means. 6. The escape hole machining device according to any one of claims 1 to 5, characterized in that the escape hole machining unit is provided with a storage section for accommodating machining waste of the film member. Escape hole machining device.