JPH0457578B2 - - Google Patents

Description

TECHNICAL FIELD OF THE INVENTION The present invention relates to an apparatus used for manufacturing printed circuit boards, and more particularly to a printed circuit board laminating apparatus that laminates a dry film on the surface of a printed circuit board while continuously feeding the printed circuit board.

In this specification, the substrate of a printed board is abbreviated as a "printed circuit board" or simply "substrate," and a dry film photoresist or a protective film laminated to the substrate is referred to as a "photoresist film" or "resist film." It is abbreviated as representative.

Background of the Technology In recent years, the method of manufacturing printed circuit boards involves forming a photoresist layer on the surface of a conductor layer of a board such as a copper-clad board.
The mainstream method is to form wiring patterns using photolithography technology. In this case, the method of forming the photoresist layer is mainly by laminating a dry film photoresist on the surface of the substrate.

Previously, resist film was laminated onto printed circuit boards by cutting a long strip of resist film to the length of the board and then cutting it one by one, but this method was inefficient and hindered mass production. It lacks.

Therefore, in recent years, a laminating apparatus has been developed that can continuously laminate a resist film in the form of a long strip onto a printed circuit board without cutting it. However, conventional laminating apparatuses of this type have problems as described below, and countermeasures have been desired.

Prior Art and Problems The conventional laminating apparatus as described above laminates the printed circuit board on the surface of the printed circuit board by continuously feeding the printed circuit board with a feed roller or the like at intervals, and continuously feeding the resist film in the form of a long strip. It has a laminate section that is continuously heat-pressed using rolls.

However, in the past, there were variations in the spacing between the printed circuit boards supplied from the preceding printed circuit board processing section or printed circuit board stock section to the laminate section, which caused the following problems. That is, the printed circuit boards laminated with resist films in the above laminating apparatus are sent out from the laminating apparatus while being interconnected by the resist films. Therefore, it is necessary to separate the substrates one by one by cutting the resist film between each substrate, but in this case, if the gap between the substrates is too narrow, the film cannot be cut properly, and if the gap is too wide, the substrates after cutting will be damaged. The ends of the resist film protruding from the resist film tend to curl or wrap around. As a result, problems occur in the subsequent photolithography process, resulting in poor quality of the printed board and a decrease in yield.

Purpose of the Invention The present invention aims to solve this problem, namely, in the above-mentioned laminating apparatus, the printed circuit boards can be continuously fed to the laminating section at regular intervals, and therefore the resist film can be easily and efficiently applied after laminating. The object of the present invention is to provide a printed circuit board laminating apparatus that can cut the printed circuit board, thereby improving productivity in the printed circuit board laminating process, improving the quality of printed circuit boards, and ultimately improving yield.

Structure of the Invention The present invention provides a printed circuit board that includes a laminating section that continuously laminates a long strip-shaped film member on the surface of the printed circuit board while continuously feeding the printed circuit boards at a predetermined speed at intervals from each other. In the laminating apparatus, (a) the printed circuit board supplied from the printed circuit board supply section is quickly fed to a waiting position below the printed circuit board feeding path at a speed faster than the predetermined feeding speed, and is then temporarily held there; is raised from the standby position to a predetermined feeding position in the printed circuit board feeding path above the standby position, and then the printed circuit board is moved from the feeding position toward the laminate section at a speed faster than the predetermined feeding speed. (b) a printed circuit board disposed on the side of a printed circuit board feeding path in correspondence with the rapid feeding mechanism, and rapidly fed to a standby position by the rapid feeding mechanism; (c) a width adjusting mechanism for setting the printed circuit board in a predetermined position with the feeding direction facing correctly; The printed circuit board is configured to have a feeding position where the printed circuit board is fed and a feeding stop position where the printed circuit board feeding path is opened without feeding the printed circuit board, and the printed circuit board is transported by the rapid feeding mechanism. (d) a constant speed feeding mechanism that clamps the printed circuit board and feeds it at a constant speed at the predetermined feeding speed after the rapid feeding is completed; (d) disposed between the constant speed feeding mechanism and the laminate section; It is configured to be able to be moved in and out of a printed circuit board feeding path and movable parallel to the feeding path, and is configured to be able to move in and out of a printed circuit board feeding path and to move parallel to the feeding path, and the preceding printed circuit board that is being fed at a constant speed in the laminate section and the rapid feeding mechanism. The preceding printed circuit board is inserted in between the preceding printed circuit board and the subsequent printed circuit board that is following the preceding printed circuit board, and the fixed interval is secured between the two printed circuit boards, and the subsequent printed circuit board is fixed by the constant speed feeding mechanism. a spacing member that is removed from between both printed circuit boards after the start of rapid feeding; The present invention is characterized by comprising a feeding mechanism.

Embodiments of the Invention Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the same reference numerals indicate the same parts throughout the figures.

FIG. 1 is a perspective view schematically showing the appearance of an embodiment of a printed circuit board laminating apparatus (hereinafter simply referred to as a "laminator") according to the present invention, and FIGS. They are a top view and a side view. In these figures, reference numeral 1 indicates the entire laminator, and the laminator 1 basically consists of a timing section 2, a laminating section 3, and a cutting section 4. Also, Figures 2 and 3
Reference numeral 5 in the figure indicates a board supply unit that supplies the printed circuit board P to the laminator 1 from an upstream printed board processing unit or a printed board stock unit (not shown).

First, with reference to FIGS. 2 and 3, the substrate supply section 5
The overall structure and operation of each part 2, 3, 4 of the laminator 1 will be briefly explained. Substrate supply section 5
The substrate P is sent horizontally in the direction of arrow A along a horizontal feeding path T (indicated by a dashed line in FIG. 3) using a pair of feeding belts 7 wound horizontally around a pulley 6.
It is configured to be supplied to the timing adjustment section 2 of the laminator 1 via a free support roller 8.

The timing adjustment section 2 of the laminator 1 includes a fast-feeding belt 11, a stopper 17, a guide roller 18, a width adjusting roller 19 (Fig. 2), a clamping roller 21, feeding rollers 22 and 23, and a spacing pin 2.
5, etc., and feeds the substrates P supplied from the substrate supply unit 5 with a predetermined gap d (for example, 2 to 3 mm) from each other and correctly orients them in the substrate feeding direction. The sheets are arranged in the same state as before and are continuously fed to the next laminating section 3 at a predetermined speed V (for example, 0.5 to 2 m/min). The device for feeding substrates at regular intervals will be described in detail later with reference to FIGS. 4 to 7.

The laminating section 3 has feed rollers 31, 32, 3
3, 34, a laminating mechanism having a laminating roll 35, a free support roller 36, a resist film reel 37, etc., and a die punch unit 4
0, etc., and continuously feeds the substrate P fed from the timing adjustment section 2 in the previous stage at a constant speed V while maintaining the gap d between them, and cuts the substrate P into a long strip shape. resist film F (second
The feed speed of the substrate is continuously fed at a constant speed (clearly indicated by hatching in the figure), and the resist film F is preliminarily provided with escape holes Hf (Fig. 2) corresponding to the reference holes Hp (Fig. 2) of the substrate P. 2), a resist film F is continuously thermocompressed onto both upper and lower surfaces of the substrate P, and the laminated substrate P and resist film F are sent to the next cutting section 4. That is, the substrate P fed from the timing alignment section 2
is the feed roller 31, 3 while maintaining the distance d.
2, 33, and 34, it is continuously sent through a laminating roll 35 at a constant speed V. On the other hand, long strip-shaped resist films F are continuously supplied from the upper and lower resist film reels 37 to the laminating roll 35, and are continuously thermocompressed onto the upper and lower surfaces of the substrate P, respectively. Furthermore, the die/punch units 40 are provided in the supply path of the resist film F at equal distances from each other from the laminating roll 35, and on the other hand, the die/punch units 40 are provided at the same distance from each other from the laminating roll 35 in the substrate feeding path T. A sensor (not shown) for detecting the reference hole Hp is arranged at the same distance from the laminating roller 35 as the die punch unit 40, and this sensor detects the reference hole Hp.
At the same time as detecting this, the die punch unit 40 forms an escape hole Hf in the resist film F. And these holes Hp and Hf are laminating roller 35
When they are sent to the position shown in FIG. 2, they are superimposed on each other as shown in FIG.

The cutting unit 4 includes a cutting mechanism including a feed roll 51, a feed belt 54 horizontally wound around pulleys 52 and 53, a cutter 60, etc., and cuts the laminated substrate P sent out from the laminate unit 3 and While continuously feeding the resist film F, cut the resist film F at the gap between the substrates P and separate the substrates P one by one. Send as shown. That is, the rows of substrates P interconnected by the resist film F sent out from the laminating section 3 are moved by the feed roller 51 and the feed belt 5.
4 is a constant speed V (however, in practical terms, it is advantageous to make the peripheral speed of the feed belt 54 a little faster than the constant speed V)
is sent continuously. The cutter 60 is provided between the feed roller 51 and the feed belt 54, and has a razor-shaped cutter blade 65. This cutter blade 65 can be moved up and down as shown in FIG. 3 by a support mechanism and a drive mechanism (not shown), and can move in the same direction B and at the same speed V as the substrate array as shown in FIG. It is configured so that it is fed along the substrate line and at the same time crosses it at right angles (the actual trajectory is oblique to the substrate row feeding direction B, as shown by the dotted line in FIG. 2). Then, the feed roller 5
1 and the feed belt 54 by a sensor (for example, a photo sensor), not shown, detects the gap between the substrates in the row of substrates, the cutter blade 65 descends as shown in FIG. While moving at a constant speed V, the resist film F is cut at the gap between the substrates. As a result, the preceding substrate P is separated from the substrate row and sent out in the direction of arrow B by the feeding belt 54. On the other hand, after cutting is completed, the cutter blade 65 rises to the position indicated by the reference numeral 65' in FIG.
It moves above the substrate row in the opposite direction to the direction used during cutting and returns to the initial position.

Next, the substrate constant-space feeding device will be described in detail with reference to FIGS. 4 to 7. 4 and 5 are a plan view and a side view, respectively, showing the timing alignment section 2 together with parts of the substrate supply section 5 and the laminating section 3. FIG. In addition, in FIGS. 4 and 5, the substrate P
are shown with imaginary lines (double-dashed lines) at the relevant positions to facilitate understanding of the configuration and operation of each element of the device, and do not indicate the actual position of the board at a certain point in time. . The substrate constant-space feeding device feeds the substrate at a substrate feeding section 5 along the substrate feeding path T (FIG. 5).
A pair of fast-forwarding belts 1 installed in the front section near the
1. This fast-feeding belt 11 is wound horizontally around pulleys 12 and 13, and is driven by a two-speed variable speed motor M1 connected to the pulley 13 by a belt or chain 14, so that the high speed v ₁ of the substrate P can be controlled as described later. and low speed v ₂ (however, V<v ₂ <v ₁ ). Note that symbols S1, S2, and S3 indicate sensors for detecting the substrates P that are fed from the substrate supply section 5 to the fast-feeding belt 11 and are fast-forwarded, and although these sensors are not clearly shown in the figure, they each have light-emitting elements and It is a photo sensor consisting of a light receiving element.

The fast-feeding belt 11 is mounted on a support base 15 that can be raised and lowered in the vertical direction by a linear motor M2, and is at a lower position (initial position) where the upper surface of the belt is lower than the substrate feeding path T, as shown by the solid line in FIG. and an upper position where the upper surface of the belt is approximately at the same level as the substrate feeding path T as shown by a dotted line 11'. For example, the lifting stroke is 15~
It is 20mm. A stopper 17 is disposed near the rear end of the fast-feeding belt 11 when it is at its initial position (lower position). This stopper 17 is for stopping the substrate P fast-forwarded by the fast-forwarding belt 11 at a predetermined standby position, as will be described later. Incidentally, reference numerals S4 and S5 indicate sensors for respectively detecting the initial position and the upper position of the fast-feeding belt 11, and these are the aforementioned photo sensors or mechanical microswitches.

As shown in FIG. 4, fixed guide rollers 18 and width adjusting rollers 19 movable in the horizontal direction (arrows Z1, Z2) perpendicular to the substrate feeding path T are arranged on both sides of the fast-feeding belt 11, respectively. The width adjusting roller 19 is driven by a cylinder SY1 using air or the like, and presses the substrate P at a standby position on the fast-feeding belt 11 against the guide roller 18 to keep the substrate P in a predetermined position and straighten the substrate feeding direction. It has the effect of setting it so that it is facing the right direction. In addition, spring 20
is for adjusting the board pressing force of cylinder SY1.

As shown in FIG. 5, a clamping roller 21 is provided above the fast-feeding belt 11 and facing the pulley 13 thereof. The clamping roller 21 is always urged downward by a spring 21a.
As will be described later, when the fast-feeding belt 11 rises, it clamps the substrate P placed on it, and cooperates with the fast-feeding belt 11 to rapidly feed the substrate P at a low speed _v2 .

A pair of feeding rollers 22 and 23 are arranged downstream of the clamping roller 21, that is, on the laminating section 3 side. The lower roller 22 is constantly driven by a belt or chain 24 in synchronization with the feed roller 31 of the laminating section 3, and can feed the substrate P at a predetermined speed V. The upper roller 23 is a driven roller that can be moved up and down by a cylinder SY2 using air or the like. This upper feeding roller 23 is normally located at the upper position (initial position), and the fast-feeding belt 11 and the clamping roller 2
1, the substrate P that is rapidly fed is fed by the feeding roller 22,
23, but as will be described later, when this substrate rapid feeding is completed, it descends and clamps the substrate P between it and the lower feeding roller 22, and the substrate P
is configured to feed at a constant speed V. still,
Symbols S6, S7, and S8 indicate the above-mentioned photo sensors for detecting the substrate P that is fed rapidly or at a constant speed along the feeding path T, and symbol S9
indicates the photo sensor or micro switch as described above for detecting the lower position of the upper feeding roller 23.

Further, two spacing pins 25 on the left and right (see FIG. 4) are provided at the rear stage of the feeding rollers 22 and 23, that is, on the side of the laminating section 3. The spacing pins 25 are set equal to a predetermined substrate spacing d, and are configured to be freely inserted and removed between the substrates P by being driven up and down by a cylinder SY3 using air or the like. On the other hand, the cylinder
SY3 is the horizontal guide rod 27 of the fixed support base 26
The spacing pin 25 is attached to the sliver 28 mounted on the sliver 28, so that the spacing pin 25 extends between the front position near the feed rollers 22, 23, shown in solid lines in FIG. Board feed path T
It can move freely in parallel to the As will be described later, the spacing pin 25 is normally located at a lower front position (initial position), and when the rear end of the substrate P passes the spacing pin 25, it is raised as shown in FIG. When the succeeding substrate P is rapidly fed by the fast-feeding belt 11 and the clamping roller 21, it is pushed by the front end of the succeeding substrate as shown by the dotted line 25' in FIGS. It hits the rear end. As a result, the distance between the front and rear substrates P is set to d. Thereafter, the spacing pin 25 is removed from between the substrates P and returned to the initial position by a return spring 29 stretched between the support base 26 and the slider 28. Incidentally, the reference numeral S10 indicates the aforementioned photo sensor or microswitch for detecting the rear position 25' of the slider 28, that is, the spacing pin 25.

Now, the constant interval feeding of the substrates P by the above-described substrate constant interval feeding apparatus will be explained in detail based on the process diagrams of FIGS. 6A to 6K and the time chart of FIG. 7. In addition, only the relevant parts are shown schematically in FIGS. 6A to 6M, and sensors S1 to S1 are shown in FIG.
0, from motors M1, M2, and cylinder SY1
Only the operation of SY3 is shown.

(a) First, as shown in FIG. 6A, it is assumed that the fast-feeding belt 11, upper feeding roller 23, and spacing pin 25 are all in their initial positions at the time of startup. In this state, when the first substrate P1 is fed by the feed belt 7 of the supply section 5, the substrate P1 tilts diagonally when it passes more than half the support roller 8, and its front end rests on the fast-feeding belt 11.

(b) As shown in Figure 6B, the substrate P1 is connected to the sensor S1.
When detected, the fast-feeding belt 11 is driven at high speed by the motor M1, and the substrate P1 is fast-forwarded at high speed _v1 .

(c) Next, as shown in FIG. 6C, when the sensor S2 detects the front end of the board P1, the motor M1 is switched to low speed drive, and the board P1 is decelerated to a low speed _v2 and hits the stopper 17. Then, the sensor S3 detects the substrate P1, the drive of the motor M1, that is, the fast-forwarding belt 11 is stopped, and the substrate P1 is made to stand by at that position. At the same time, the signal from sensor S3 causes the cylinder to move as shown in FIG.
SY1 operates and moves the width adjusting roller 19 in the direction of arrow Z1
direction, and presses the substrate P1 against the guide rollers 18 to set it in a predetermined position and in the correct orientation.

(d) Furthermore, the motor M2 is actuated by the signal from the sensor S3 as shown in FIG.
is raised to an upper position as shown by an arrow Y1, and the substrate P1 is clamped by a clamping roll 21 at a feeding position on the feeding path T. Incidentally, when the fast-feeding belt 11 reaches the upper position, it is detected by the sensor S5 and the motor M2 is stopped.

(e) Next, the motor M1 is again driven at a low speed as shown in FIG. 6E by the signal from the sensor S5, and the substrate P1 is moved from the feeding position to the feeding roller 22,
23 at a low speed _v2 .

(f) Then, as shown in FIG. 6F, when the sensor S8 detects the front end of the substrate P1, the drive of the motor M1, that is, the fast-feeding belt 11 is stopped. At the same time, the cylinder SY2 is actuated and the upper feeding roller 23 descends in the direction of the arrow Y3, clamps the substrate P1, and starts feeding it at a predetermined speed V.
On the other hand, the lowering of the upper feeding roller 23 is detected by the sensor S9.
The motor M2 is reversely driven by the signal, and the fast-forwarding belt 11 is lowered as shown by the arrow Y2, and when it returns to the initial position, it is detected by the sensor S4.
is detected and motor M2 is stopped. Furthermore, as shown in FIG. 4, the cylinder SY1 is actuated by the signal from the sensor S9, and the width adjusting roller 19 returns to the direction of the arrow Z2.

(g) Next, as shown in FIG. 6G, while the first substrate P1 is fed at a constant speed by the feeding rollers 22 and 23, the fast-feeding belt 11, which has returned to the initial position, is The second board P2 is the 6th A
It is supplied as described in (a) to (c) above with reference to FIGS. 6C to 6C, is fast-forwarded at high speed _v1 and low speed _v2 , and is then brought to a widthwise position and waits at a predetermined position. In addition, since there is a vertical step between the standby position and the feeding position in the substrate feeding path, the feeding of the second substrate P2 to the standby position is carried out at the first position as shown in the figure.
This is possible before the rear end of the substrate P1 is completely fed out of its feeding position, which results in the effects described below.

(h) Then, as shown in Fig. 6H, the feeding roller 2
The first substrate P1 fed at a constant speed by 2 and 23 is supplied to the feed roller 31 of the laminating section 3,
It continues to be sent at constant speed V. On the other hand, the second substrate P
2 is maintained in a standby state.

(i) Then, as shown in Fig. 6T, when the rear end of the first substrate P1 passes the sensor S6, the motor M2 is activated, and the fast-forwarding belt 11 is raised as in the case of Fig. 6D explained in (d) above. The second substrate P2 is then clamped by the clamping rollers 21.

(j) Next, as shown in Figure 6J, when the rear end of the first substrate P1 passes the sensor S7, the cylinder SY3
is activated, and the spacing pin 25 rises in the direction of arrow Y5 and is inserted between the substrates P1 and P2. At the same time, the cylinder SY2 operates, and the upper feeding roller 23 ascends back to the initial position as shown by arrow Y4. At the same time, motor M1 is driven at low speed again.
The second substrate P2 is rapidly fed by the fast-feeding belt 11 and the clamping roller 21 at a low speed _v2 .

(h) As shown in FIG. 6K, the second substrate P2, which is being fed at a fast forward speed, follows the first substrate P1, which is being fed at a constant speed, while pushing the spacing pin 25 at the front end (v ₂ > V ), butts against the rear end of the first substrate P1 via the spacing pin 25. Thereby, the gap d between the first substrate P1 and the second substrate P2 is set to a predetermined value. Note that when the succeeding second board P2 bumps into the preceding first board P1, the first board P1 is pushed forward by the impact, which causes damage to the first board P1 and the prints in front of it. There is no problem that the distance from the substrate (not shown) is distorted. That is, when the second substrate P2 hits the first substrate P1, the first substrate P2 is already in contact with the first substrate P1.
1 is because the laminating portion 3 is firmly clamped by a plurality of feed rollers 31 to 33 and fed at a constant speed. Furthermore, in order to prevent a feeding force larger than the printed circuit board clamping force of the laminate section 3 from acting on the printed circuit board during rapid feeding, if a large force close to the clamping force of the printed circuit board is applied, the fast feeding bolt 11 of the rapid feeding mechanism is applied. The clamping roller 21 is configured to slip against the printed circuit board.

(l) When the spacing pin 25 reaches its rear position, this is detected by the sensor S10, and the cylinder SY2 operates as shown in FIG.
3 descends in the direction of arrow Y3 and clamps the second substrate P2. At the same time, the cylinder SY3 operates again to remove the spacing pin 25 from between the substrates P1 and P2 in the direction of arrow Y6. As a result, the substrates P1 and P2 are continuously fed at a constant speed V while maintaining a predetermined distance d from each other. On the other hand, the spacing pin 25 that has been removed downward is moved by the arrow X by the return spring 29.
As shown in 2, it returns to the initial position in front (indicated by the dotted line). At the same time, the lowering of the upper feeding roller 23 is also detected by the sensor S9, and as described above, the fast feed belt 11 is lowered and returned to the initial position by the motor M2.

(m) From then on, the third board P3 (Figure 6L)
The same steps as in the case of the second substrate P2 described in (g) to (l) above are repeated for each subsequent substrate. In this case, the third and subsequent boards are the preceding boards (in the figure, P
2) Even if the material is not completely sent out from the feeding position in the conveyance path, it is possible to supply it to the waiting position below it and keep it on standby, thereby achieving the effects described below. teeth,
This is as explained in (g) above. Furthermore, the seventh
As is clear from the figure, sensor S8 is used only to detect the first substrate P1.

In this way, the substrates P supplied from the substrate supply section 5 are aligned at a predetermined interval with each other in the timing alignment section 2 and are continuously transferred to the laminate section 3 even if there are variations in the substrate spacing at the time of supply. It will be shipped.

As described above, according to the laminating apparatus according to the present invention, the printed circuit board P is
can be continuously fed to the laminating section 3 at predetermined intervals, which not only enables good lamination of the resist film in the laminating section 3, but also makes it possible to efficiently cut the resist film after lamination. It also makes it possible to perform it well.

In particular, one of the important features of the apparatus of the present invention is that the substrate supplied from the substrate supply section is temporarily placed on standby at a standby position below the substrate feeding path, and the substrate at the waiting position is transferred to the substrate feeding path above the substrate feeding section. The structure includes a rapid feeding mechanism that raises the paper to an intermediate feeding position and feeds it through the feeding path.
According to this configuration, it is possible to have a large degree of freedom in the distance or time interval at which substrates are supplied from the substrate supply unit. That is, as shown in FIG. 6G or FIG. 6M, the preceding substrate (first substrate P1 in FIG. 6G,
Even if the second substrate P2 in FIG. 6M has not yet been completely fed out of the feeding position, the subsequent substrate (the second substrate P2 in FIG. 6G and the third substrate P3 in FIG. 6M) is placed in a waiting position below it. It can be supplied to a location and placed on standby. This is very effective, for example, when processing different types of substrates with different lengths. In other words, in the case of a long board, compared to a short board, it takes extra time for it to be completely fed out from the feeding position in the feeding path, but during that time the next board is fed to the waiting position below. can do. In this way, even if there are variations in the supply interval of substrates from the supply section or in the length of the substrates, it is possible to maintain the appropriate substrate spacing at the feeding position in the substrate transport path where the constant spacing setting process actually starts. It is possible to adjust the distance within a certain range, and as a result, it is possible to smoothly and reliably perform the subsequent constant interval setting process.

In addition, as a mechanism for adjusting the feeding interval by temporarily waiting in front of a predetermined position in order to feed the substrates at regular intervals, the waiting position and the feeding position are identical without providing a step as in the present invention. A configuration in which the process is performed in a horizontal plane is also conceivable. However, in this case, it is necessary to set the substrate standby position before the feeding position, and a feeding process is required from the substrate waiting position to the feeding position, which is the starting position of the constant interval setting process. In particular, when a long substrate is assumed, this feeding stroke becomes long, which not only causes unstable feeding, but also increases the horizontal dimension of the apparatus. In contrast, with the configuration of the present invention, the substrate is simply moved upward from the standby position with a slight step to the feeding position.
Stable movement is possible by a simple mechanism with a short stroke, and the size of the device in the direction of the feeding path can be shortened, resulting in an effect that the device can be made more compact.
In addition, in the device of the present invention, in order to correct lateral positional deviation or posture collapse of the rapidly traversed substrate at the standby position before raising the substrate to the feeding position, the width adjusting mechanism can be used to ensure constant spacing. It is possible to achieve this.

Effects of the Invention As described above, according to the present invention, it is possible to realize a laminating device that can continuously feed printed circuit boards at regular intervals, which makes cutting of the resist film after lamination easier and better, and as a result, It is possible to improve the quality of printed circuit boards and the yield, and the technical and economic effects are significant.

[Brief explanation of the drawing]

FIG. 1 is a perspective view schematically showing the external appearance of an embodiment of a printed circuit board laminating apparatus according to the present invention, FIGS. 2 and 3 are a plan view and a side view, respectively, schematically showing the overall structure of the laminating apparatus, and FIGS. FIG. 5 is a plan view and a side view of the timing adjustment section of the laminating apparatus, and FIGS. 6A to 6M and 7 are a process diagram and a time chart showing the operation of the printed circuit board fixed interval feeding apparatus, respectively. DESCRIPTION OF SYMBOLS 1... Printed circuit board laminating device, 2... Timing alignment section, 3... Laminating section, 4... Cutting section, 5
... Substrate supply unit, 7 ... Feed belt, 11 ... Rapid feed belt, 17 ... Stopper, 21 ... Clamp roller, 22, 23 ... Feed roller, 25 ... Spacing pin,
31, 32, 33, 34...Feed roller, 35...Laminating roll, 37...Resist film reel, 40...Die punch unit, 51...Feed roller, 54...Feed belt, 60...Cutter, 65
... Cutter blade, P... Printed circuit board, F... Resist film, T... Board feeding path, S1 to S10...
Sensor, M1, M2...Motor, SY1~SY3...Cylinder.

Claims (1)

[Scope of Claims] 1. A laminating section 3 is provided, which continuously laminates a long strip-shaped film member on the surface of the printed circuit boards P while continuously feeding the printed circuit boards P at a predetermined speed V at intervals from each other. In the printed circuit board laminating apparatus, (a) the printed circuit board supplied from the printed circuit board supply section 5 is rapidly fed to a waiting position below the printed circuit board feeding path at a speed faster than the predetermined feeding speed V, and is temporarily held there. Then, the printed circuit board is raised from the standby position to a predetermined feeding position in the printed circuit board feeding path above it, and then the printed circuit board is moved from the feeding position to the predetermined feeding position toward the laminating section 3 side. Rapid feeding mechanism 11, 17, 21 that performs rapid feeding at a speed faster than speed V
and (b) disposed on the side of the printed circuit board feeding path in correspondence with the rapid feeding mechanism, the printed circuit board rapidly fed to the standby position by the rapid feeding mechanism is moved in the feeding direction at a predetermined position. (c) a feeder which is disposed on the side of the laminate section with respect to the rapid feed feeder mechanism and which clamps and feeds the printed circuit board; It is configured to have a feeding position and a feeding stop position in which the printed circuit board feeding path is opened without carrying out feeding of the printed circuit board, and the rapid feeding of the printed circuit board by the rapid feeding mechanism is completed. (d) constant speed feeding mechanisms 22 and 23 that clamp the printed circuit board and feed it at a constant speed at the predetermined feeding speed; The printed circuit board is configured to be able to be moved in and out of the board feeding path and movable parallel to the feeding path, and is fast-forwarded by the preceding printed board being fed at a constant speed in the laminating section and the fast-forwarding feeding mechanism. The preceding printed circuit board being fed is inserted between the preceding printed circuit board and the succeeding printed circuit board following it to ensure the constant spacing between the two printed circuit boards, and the constant speed feeding mechanism feeds the succeeding printed circuit board at a constant speed. a spacing member 25 that is removed from between both printed circuit boards after the start of the process; A printed circuit board laminating device comprising: a feeding mechanism; 2. In the device according to claim 1,
The device is characterized in that the rapid feeding mechanism is capable of rapidly feeding the printed circuit board at two speeds v ₁ and v ₂ , both of which are faster than the predetermined feeding speed V.