JPS62566B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electronic component, and more particularly to a method of connecting, packaging, and inspecting an electronic component element and a lead wire, and a lead wire holder used therein.

A conventional method for attaching this type of lead wire and its holder (plate) was called a chain lead wire and was constructed as shown in FIG. 1 or 2. That is, the first
The figure shows a chain lead wire punched from a single metal plate, and the lead wire holding plate 1 and the lead wire 2 were connected as a single plate from the beginning.
By clamping an electronic component such as a chip capacitor 3 to the tip of the chain lead wire and immersing it in a molten solder bath, the lead wire 2 is connected to the chip capacitor 3 by soldering. A patch plate made of aluminum or stainless steel is used to prevent the chip capacitor from falling off when it is immersed in this molten solder bath, and the through hole 4 for positioning is used to position the chain lead wire with respect to this patch plate. It's useful.

The chain lead wire shown in FIG. 1 has drawbacks such as the amount of unnecessary material used due to punching and the cross-sectional shape of the formed lead wire is not circular. Therefore, the welded chain lead wire shown in FIG. has been used.

This is a chain lead wire formed by arranging a lead wire holding plate 1 and a lead wire 2 at a predetermined interval using a suitable jig and welding the welding points 5.

The lead wire 2 is connected to the chip capacitor 3 by soldering in the same manner as the chain lead wire shown in FIG. 1, and then the capacitor portion is covered with a transfer mold or a resin dip. In this case, the positioning through hole 4 is also used for positioning.
is used.

As described above, in the conventional lead wire holders shown in FIGS. 1 and 2, the base of the lead wire is cut off for inspection in the next process during the manufacturing process after the packaging is completed or after the seal is stamped on the exterior surface. The lead wire holding plate 1, which was no longer needed, was discarded. In other words, since the lead wire holding plate 1 is a metal plate and has good electrical conductivity, the lead wires soldered to both ends of the capacitor element 3 are in a shortened state. It was necessary to make them electrically independent.

In this way, the cut capacitors need to be aligned again in order to be connected to each measuring device in the inspection process, which is one of the causes of an increase in the number of inspection steps. In addition, since the electrical characteristics cannot be checked during the manufacturing process before cutting the lead wires, exterior work and stamping work can be carried out on products with poor electrical characteristics due to thermal shock during soldering of the lead wires. This resulted in wasted man-hours and materials.

An object of the present invention is to provide a lead attachment method for electronic components and a lead wire holding jig that solve these drawbacks.

The electronic component manufacturing method according to the present invention connects electronic component elements such as capacitors and resistors to each tip of a plurality of electrically insulated lead wires that are folded back in almost parallel at predetermined intervals. After that, by cutting the folded part of the lead wire,
This method is characterized by including a step of making each lead wire terminal connected to the electronic component element electrically independent. Preferably, the elasticity of the folded lead wire is used to clamp and fix the electronic component, and the lead wire is held by a holding means made of an electrically insulating material such as synthetic resin. Preferably, folded lead wires whose tips are flattened are arranged at predetermined intervals and connected to electronic components at the flattened portions. Alternatively, the lead wire holding jig according to the present invention is characterized in that it has a plurality of grooves or holes for holding the lead wires by folding them approximately parallel to each other so as to be removable, and that at least the lead wires are electrically insulated. do.

Embodiments of the present invention will be described in detail below with reference to FIG.

FIG. 3 shows an embodiment of the present invention, in which 6 is a lead wire arrangement plate, 7 is a U-shaped lead wire (hereinafter referred to as a U-shaped lead wire), and 8 is a fixing spacer, which is a U-shaped lead wire. A chip capacitor 3 is soldered between the tip ends 7a and 7b of the wire 7. Fourth
The figure is a sectional view showing the state in which the U-shaped lead wire 7 in FIG. 3 is held, and the lead wire is held between the lead wire placement plate 6 and the fixing spacer 8.

FIG. 5 shows a method for arranging and fixing the U-shaped lead wires as shown in FIG. The U-shaped lead wire 7 is obtained by cutting the lead wire 7 at a certain length. By repeating this lead wire processing operation for each lead wire fixing position on the lead wire arrangement plate 6, the U-shaped lead wire fixing patch shown in Fig. 3 can be obtained, making it easy to automate lead wire processing and insertion by machine. can be done. Alternatively, a method may be adopted in which the long straight lead wire 9 is previously formed into a U-shape using another tool, or the tip of the U-shaped lead wire 7 may be cut into a desired length. It is also possible to flatten the portion to increase the soldering contact area with the terminals of the chip capacitor 3. In the present invention, no matter which method is used, the amount of lead wire material used is small and can be controlled to the minimum necessary amount, and the number of man-hours required can be extremely reduced by automating the repeating operation.

FIG. 6 shows each tip 7a of the U-shaped lead wire 7,
After the chip capacitor 3 is soldered and connected between 7b and the folded curved part of the lead wire is cut, the lead wire arrangement plate 6 and the fixing spacer 8 are made of an electrically insulating material such as synthetic resin. Because of this structure, each lead terminal is electrically independent.

The lead wire arrangement plate 6 and the fixed spacer 8 may be made of a metal material such as aluminum, nickel, or stainless steel, and may have an insulating layer formed on the entire surface or a partial surface thereof.

In the present invention, since each lead wire terminal is electrically independent in this way, it is possible to perform not only exterior work and sealing work but also inspection work in batches, thereby saving the man-hours of realignment work. , complete automation through batch processing becomes easy. It also makes it possible to check electrical characteristics during the manufacturing process.
Early detection of defective products has an extremely large effect on improving production efficiency, such as eliminating wasted materials and man-hours.

The slit position for inserting the U-shaped lead wire shown in FIG. 3 can be used for the positioning through hole 4 in FIGS. If a holding structure is adopted in which a sufficient slit is not provided at the insertion position, it goes without saying that a through hole for positioning as shown in FIGS. 1 and 2 is provided.

[Brief explanation of the drawing]

1 and 2 are examples of conventional lead wire holding jigs, FIGS. 3 to 6 are examples of lead wire holding jigs according to the present invention, and FIG. 3 shows lead wire holding jigs. FIG. 4 is a partial sectional view of FIG. 3, FIG. 5 is a perspective view showing how to insert the U-shaped lead wire, and FIG. 6 shows the curved part of the U-shaped lead wire after connecting the chip capacitor. It is a perspective view showing a cut state. Symbols in the figure: 1: Lead wire holding plate, 2: Lead wire, 3: Chip capacitor, 4: Through hole for positioning, 5: Welding point, 6: Lead wire placement plate, 7: U
Shape lead wire 8: Fixing spacer, 7a, 7b:
Lead wire tip 9: Straight and long lead wire.

Claims (1)

[Claims] 1. Insert a lead wire into each slit of a lead wire arrangement plate having a plurality of electrically insulated slits, and connect the lead wire in each slit with a fixed spacer that is detachable and electrically insulated from the lead wire. a step of fixing a plurality of U-shaped lead wires to the lead wire arranging plate so that their outer widths are approximately equal to the inner diameter of the slit; A method for manufacturing an electronic component, comprising the steps of: connecting an electronic component element to the lead wire; and then cutting the U-shaped portion of the lead wire.