JPS628514B2 - - Google Patents
Info
- Publication number
- JPS628514B2 JPS628514B2 JP11994178A JP11994178A JPS628514B2 JP S628514 B2 JPS628514 B2 JP S628514B2 JP 11994178 A JP11994178 A JP 11994178A JP 11994178 A JP11994178 A JP 11994178A JP S628514 B2 JPS628514 B2 JP S628514B2
- Authority
- JP
- Japan
- Prior art keywords
- convex
- bath
- current density
- plated
- thiourea
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は金属などの導電体表面に凸状条痕の模
様めつき層を形成して模様めつき物を製造する方
法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a patterned article by forming a patterned layer of convex striations on the surface of a conductor such as a metal.
従来、金属表面に凹凸模様を形成する方法とし
ては所望の模様にレジスト膜を形成して、パター
ンエツチングを行なう方法が一般に知られてい
る。 Conventionally, as a method for forming an uneven pattern on a metal surface, a method is generally known in which a resist film is formed in a desired pattern and pattern etching is performed.
このパターンエツチング法においては極めて精
巧な模様を形成できるが、そのためには予めレジ
スト膜を形成しなければならない。このレジスト
膜の形成は被加工面が平面であれば割合容易に行
なうこともできるが、被加工面が曲面または立体
状である場合には非常に難しい。 Although this pattern etching method can form extremely elaborate patterns, it is necessary to form a resist film in advance. Formation of this resist film can be performed relatively easily if the surface to be processed is flat, but it is extremely difficult if the surface to be processed is curved or three-dimensional.
又その表面模様の質感は第１図に示す如くエツ
チング面と非エツチング面の境目が明確な段差１
となり、あまりにも規則的で興趣に乏しい。第２
図に示す如く被メツキ体６の上に形成されたなだ
らかな山形の凹凸模様２は装飾性に優れ興趣に富
むが、本発明はこのような特有の質感を有する第
２図の凹凸模様２を、被めつき体６に絶縁性のレ
ジスト膜を部分的に形成するような特殊な前処理
を一切必要とせず、ただ電気めつきを行なうだけ
で形成しようとするものである。すなわち本発明
は、チオ尿素を10〜200mg／添加した硫酸銅め
つき浴を用い、電流密度２〜15A／ｄm2、浴温30
〜60℃の範囲にて電気めつきを行なうものであ
り、被めつき体である陰極面上に浴液が静止状態
の場合には直線状の凸状条痕が、浴液が流動状態
の場合には任意の流れ方向を有する凸状条痕が、
形成されるものである。 The texture of the surface pattern is as shown in Figure 1, with a clear step 1 between the etched surface and the non-etched surface.
It's too regular and uninteresting. Second
As shown in the figure, the gentle mountain-shaped uneven pattern 2 formed on the body 6 to be plated is highly decorative and full of interest, but the present invention uses the uneven pattern 2 shown in Fig. 2 that has such a unique texture. This method does not require any special pretreatment to partially form an insulating resist film on the body 6 to be plated, and is intended to be formed simply by electroplating. That is, the present invention uses a copper sulfate plating bath containing 10 to 200 mg of thiourea, a current density of 2 to 15 A/dm 2 , and a bath temperature of 30
Electroplating is performed at a temperature of ~60°C, and when the bath liquid is in a static state, linear convex streaks are formed on the cathode surface, which is the plated body, and when the bath liquid is in a fluid state, linear convex streaks are formed. In some cases, convex striations with arbitrary flow direction are
It is something that is formed.
以下、本発明を詳細に説明する。 The present invention will be explained in detail below.
使用するめつき浴液は含硫酸硫酸銅めつき液で
あり、これに添加する薬剤としてチオ尿素が有効
である。チオ尿素の添加量は10mg／より少ない
とチオ尿素を添加した効果すなわち凸状条痕のめ
つき層が得られず、1000mg／以上では、析出障
害または純然たる光沢めつきとなつてしまう。本
発明のための適性添加量は10〜200mg／であ
り、最も望ましいのは30〜120mg／である。ま
ためつき浴の温度は極めて重要な因子で、30℃よ
り低温では電着面は光沢めつきとなつてしまい、
60℃より高温では無光沢となり、いずれの場合も
凸状条痕の模様めつき層は得られない。特に安定
しためつき層が得られる最適温度は40〜50℃であ
る。しかしながら本発明において最も興味深いこ
とは、電流密度の値と得られるめつき層の模様と
の間にみられる相関関係である。すなわち、浴温
30〜60℃、チオ尿素30〜120mg／の範囲では、
電流密度が４〜5A／ｄm2の場合に第３図に示す
ような点状の凸状条痕３となり、電流密度５〜
6A／ｄm2の範囲では第４図に示すように細かい
毛髪状の凸状条痕４となる。さらに電流密度を高
めて６〜15A／ｄm2の範囲に設定すれば第５図に
示すような大柄の凸状条痕５となる。しかし電流
密度も15A／ｄm2より高くすると、めつき層にい
わゆるヤケ現象が起きるので、本発明の電流密度
の上限は15A／ｄm2としたい。下限は、4A／ｄ
m2である。それ以下では無光沢で凸状痕はできな
いからである。 The plating bath solution used is a sulfuric acid-containing copper sulfate plating solution, and thiourea is effective as a chemical added thereto. If the amount of thiourea added is less than 10 mg, the effect of adding thiourea, that is, a plated layer with convex striations, cannot be obtained, and if it is more than 1000 mg, it will result in precipitation failure or pure glossy plating. A suitable addition amount for the present invention is 10 to 200 mg/, most preferably 30 to 120 mg/. The temperature of the plating bath is also an extremely important factor; at temperatures lower than 30°C, the electrodeposited surface will become glossy.
At temperatures higher than 60°C, it becomes matte, and in either case, a patterned layer with convex striations cannot be obtained. The optimum temperature at which a particularly stable stuck layer can be obtained is 40 to 50°C. However, what is most interesting about the present invention is the correlation between the value of current density and the pattern of the resulting plated layer. In other words, the bath temperature
In the range of 30-60℃ and 30-120mg/thiourea,
When the current density is 4 to 5 A/ dm2 , dotted convex striations 3 as shown in Fig. 3 are formed, and when the current density is 5 to 5 A/dm2,
In the range of 6 A/dm 2 , fine hair-like convex streaks 4 are formed as shown in FIG. If the current density is further increased to a range of 6 to 15 A/dm 2 , large convex striations 5 as shown in FIG. 5 can be obtained. However, if the current density is higher than 15 A/dm 2 , a so-called fading phenomenon occurs in the plated layer, so the upper limit of the current density in the present invention is preferably 15 A/dm 2 . The lower limit is 4A/d
m2 . This is because if it is less than that, it will be matte and no convex marks will be formed.
その外、本発明のめつき物の製法によれば、凸
状条痕の筋の方向が、めつき浴液の流れ方向に依
存するということがあり、故にめつき中に浴液を
強制的に撹拌すれば、条痕の方向が曲線となつた
り、うずを形成するなど用い方によつては装飾性
を高めることができる。 In addition, according to the method for producing a plated product of the present invention, the direction of the convex striations depends on the flow direction of the plating bath solution, so the bath solution is forced to flow during plating. If the material is agitated, the direction of the streaks may become curved or swirls may be formed, depending on how it is used, making it more decorative.
以下に本発明の実施例を述べる。 Examples of the present invention will be described below.
実施例 １
硫酸銅220ｇ／、硫酸60ｇ／の浴組成の銅
めつき浴にチオ尿素100mg／を添加した。純銅
板をアノードとし基板としての印刷用銅板をカソ
ードとして、浴温45℃、電流密度10A／ｄm2でカ
ソード面に平行にエアーを上昇させる空気撹拌法
を行ないながら８分間電気めつきを行なつた。そ
の結果やなぎ状の大柄な条痕を得、模様として充
分なる意匠性を有していた。Example 1 100 mg of thiourea was added to a copper plating bath having a bath composition of 220 g of copper sulfate and 60 g of sulfuric acid. Using a pure copper plate as an anode and a printing copper plate serving as a substrate as a cathode, electroplating was carried out for 8 minutes at a bath temperature of 45°C and a current density of 10 A/dm 2 while performing an air agitation method in which air was raised parallel to the cathode surface. Ta. As a result, large, willow-shaped striations were obtained, which had sufficient design properties as a pattern.
実施例 ２
硫酸銅220ｇ／ 硫酸60ｇ／の浴組成の銅
めつき浴にチオ尿素50mg／を添加した。純銅板
をアノードとし、ニツケルめつきしたステンレス
板をカソードとし浴温50℃ 電流密度4A／ｄm2
でカソード面に平行にエアーを上昇させて撹拌し
ながら８分間電気めつきを行なつた。その結果水
玉状の凸面模様を得た。Example 2 50 mg of thiourea was added to a copper plating bath having a bath composition of 220 g of copper sulfate/60 g of sulfuric acid. A pure copper plate is used as an anode, a nickel-plated stainless steel plate is used as a cathode, bath temperature is 50℃, current density is 4A/dm 2
Electroplating was carried out for 8 minutes while stirring by raising air parallel to the cathode surface. As a result, a polka-dot-like convex pattern was obtained.
実施例 ３
硫酸銅220ｇ／ 硫酸60ｇ／の浴組成の銅
めつき浴にチオ尿素100mg／を添加した。純銅
板をアノードとし、ニツケルめつきした鉄板をカ
ソードとし浴温50℃ 電流密度5A／ｄm2で液を
静止状態にして16分間電気めつきを行なつた。そ
の結果、細かいヘアライン状の条痕を有するめつ
き物を得た。Example 3 100 mg of thiourea was added to a copper plating bath having a bath composition of 220 g of copper sulfate/60 g of sulfuric acid. Using a pure copper plate as an anode and a nickel-plated iron plate as a cathode, electroplating was carried out for 16 minutes at a bath temperature of 50° C. and a current density of 5 A/dm 2 with the solution in a stationary state. As a result, a plated product having fine hairline-like streaks was obtained.
以上のように、本発明は、従来のようなレジス
トエツチング法を用いず、めつきするだけで表面
凹凸状の条痕模様を得ることができるのであり、
その得られる模様も、電流密度を変化させること
により三種類のものが任意に選定できる。また浴
の温度やチオ尿素の濃度は、わりと広範囲である
ので調整がしやすく、しかもチオ尿素はめつき通
電による経時変化（変質）がなく、したがつてめ
つき中に消費した分を途中で追加することで補充
ができるという便宜さがある。 As described above, the present invention makes it possible to obtain an uneven surface pattern by simply plating without using the conventional resist etching method.
The resulting pattern can also be arbitrarily selected from three types by changing the current density. In addition, the temperature of the bath and the concentration of thiourea can be adjusted easily over a relatively wide range, and thiourea does not change over time (deterioration) due to energization during plating, so the amount consumed during plating can be absorbed during the process. There is the convenience of being able to replenish by adding more.
第１図はエツチング法による凸状条痕を示す断
面図であり、第２図は本発明による凸状条痕を示
す断面図であり、第３図から第５図までは、本発
明により得られる凸状条痕を示す平面図である。
１……段差、２……凹凸模様、３……点状の凸
状条痕、４……毛髪状の凸状条痕、５……大柄の
凸状条痕。
FIG. 1 is a cross-sectional view showing convex scratches formed by the etching method, FIG. 2 is a cross-sectional view showing convex scratches according to the present invention, and FIGS. FIG. 1... Step, 2... Uneven pattern, 3... Dot-like convex striations, 4... Hair-like convex striations, 5... Large convex striations.
Claims (1)
凸状条痕のめつき層を形成する模様めつき物の製
造方法において、チオ尿素を10〜200mg／添加
した硫酸銅めつき浴を用い、電流密度２〜15A／
ｄm2、浴温30〜60℃の範囲にて電気めつきを行な
うことを特徴とする模様めつき物の製造方法。1. A method for producing a patterned plated article in which a plated layer of dotted or convex striations is formed on a plated body by electroplating, using a copper sulfate plating bath to which 10 to 200 mg of thiourea has been added, Current density 2~15A/
dm 2 and a bath temperature in the range of 30 to 60°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11994178A JPS5547390A (en) | 1978-09-29 | 1978-09-29 | Manufacture of pattern-plated ware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11994178A JPS5547390A (en) | 1978-09-29 | 1978-09-29 | Manufacture of pattern-plated ware |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5547390A JPS5547390A (en) | 1980-04-03 |
| JPS628514B2 true JPS628514B2 (en) | 1987-02-23 |
Family
ID=14773953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11994178A Granted JPS5547390A (en) | 1978-09-29 | 1978-09-29 | Manufacture of pattern-plated ware |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5547390A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH035027U (en) * | 1989-05-20 | 1991-01-18 |
-
1978
- 1978-09-29 JP JP11994178A patent/JPS5547390A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH035027U (en) * | 1989-05-20 | 1991-01-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5547390A (en) | 1980-04-03 |
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