JPS6312958B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating device suitable for partially plating plated objects, particularly strip-shaped plated objects such as IC lead frames.

In order to efficiently plate a large amount of plating materials, various techniques have been adopted in the past in which the materials to be plated are conveyed on a plating line and subjected to pre-treatment, plating treatment (for example, partial plating treatment), and post-treatment. Depending on the shape and structure of the plating, normal conveying means cannot be used and special racks or the like are required.Also, when jet plating is adopted as the plating process, the plating material is transferred from the inlet conveying line onto the plating device. It is necessary to transfer the plated items to the conveyor line on the exit side, and to take out the plated items to the conveyor line on the exit side.
If it has a strip shape like an IC lead frame,
From the point of view of efficiency, it is necessary to process a plurality of these strip-shaped plated items at the same time. Therefore, the applicant arranged multiple sheets of plated strips on a trolley in advance.
We have previously proposed a device that can efficiently plate a large number of objects automatically and efficiently by placing them on a platform and transporting the objects to be plated together with the cart, pre-processing, plating and post-processing them [JP-A No. 56-99127] reference〕. Although this proposal significantly increases the processing speed, it is difficult to increase the processing speed any further because the plated material is transported via a trolley. For this reason, the present applicant has newly investigated a technique for plating a plurality of objects to be plated at the same time by arranging and transporting the objects to be plated directly on a roller conveyor without using a cart.

This invention was developed under these circumstances, and includes a first device that holds and transfers the plating material on the entry side.
A chuck device is installed on the exit side for removing the plated material.
Each plating device is equipped with a chuck device, and the main body of the plating device is equipped with a vertically movable rack with a wire that can support each plating item in an appropriate position and condition when transferring multiple plating items from the entry side. For processing, the plated items can be lowered, returned and raised while being supported by wires, and positioning pins are protrudingly provided to prevent the horizontal positional deviation of the plurality of plated items during the lowering and return raising. In this way, it is an object of the present invention to provide a plating device that can efficiently perform a series of processes such as setting a plurality of plating objects, partially plating the objects, and taking out the plating objects.

Specifically, the plating device according to the present invention includes a plurality of first claw bodies for holding plating objects, and each of the plurality of plating objects is held from below in a horizontal state, and the plating device holds the plurality of plating objects from below in a horizontal state. A first chuck device is installed on the entry side to simultaneously transfer the materials from the pre-processing device, and a second chuck device grips both upper and lower surfaces of the front end of each plating object.
A second chuck device having a plurality of claw bodies and simultaneously taking out a plurality of sheets of plated material to the post-processing device is provided on the exit side, and is provided on the upper surface of the top lid with a plating liquid spray opening located above the anode-equipped nozzle of the plating liquid spray box. A pin for positioning the plating object is provided protrudingly, and a plurality of wires for supporting the plating object are easily installed horizontally above the top lid, and during the plating process, the plating object on the wires is moved to the top surface of the top lid. Each press plate with a cathode for pressing is provided vertically movably.

The details will be explained below based on the illustrated embodiment. This plating device is the first chuck device 1 on the entry side.
It mainly consists of a second chuck device 2 on the output side, and a plating device main body 3 disposed between both chuck devices 1 and 2.

The first chuck device 1 is a horizontally elliptical trajectory forming device 4 that is movable back and forth between the pretreatment device 5 and the plating device main body 3 along a trajectory X that is entirely horizontally elliptical. The trajectory forming device 4 includes a rotating arm 6 as a driving means, a slider 8 that can freely move forward and backward according to the rule 7, and a rod 9 that connects the rotating arm 6 and the slider 8.
It is composed of etc. A pair of rails 7 are provided on the left and right sides of the plating device main body 3 (the front side and the opposite side in FIGS. 1 and 6), and this pair of rails 7
Utilizing this, the first chuck device 1 and the second chuck device 2 are able to move forward and backward. However, in the figure, only one rail 7 is shown for clarity. By the way, a vertical holder 10 is attached to the rod 9, and by supporting both ends with this vertical holder 10, the horizontal base 11 crosses the direction of movement of the plating object 12 (direction of arrow A in FIG. 1). It is constructed in the direction [arrow B direction in Figure 4].
Reference numeral 13 indicates an auxiliary vertical holder, and 14 a connecting arm, which connects the lower part of the vertical holder 10 and the lower part of the slider 8. The base 11 is provided with a beam member 15 that can be shifted with respect to each other in the left-right direction [in the direction of arrow B in FIG. A plurality of plated plates 12 are arranged at positional intervals corresponding to the respective plated articles 12 on the roller conveyor of the pre-processing device, which will be described later.

As shown in FIG. 5, the first claw body 16 is provided with a pair of left and right claw bodies 16A, 16B in the front and back direction, and the claw body 16A is attached to the lower surface of the beam member 15A.
6B are each fixed to the lower surface of the beam material 15B, and by shifting both the beam materials 15A, 15B, the left and right pair of claws 16A, 16B come into contact with and separate from each other, and "approach".
When the lower surface of both sides of the plating object 12 is attached to each claw body 16A, 1
The corresponding lower bending portion 17 of 6B holds the plating object 12 so that it can be transferred while drawing a horizontal elliptical locus X while remaining in a horizontal state. 18 is a damper that can be opened and closed, and the plated object 12 held by the claw bodies 16A and 16B.
This is to prevent it from falling off in the front-rear direction (direction of arrow C in Figure 5).

The second chuck device 2 on the exit side is arranged between a pair of left and right vertical base plates 19 that are movable forward and backward along the rail 7 in a direction transverse to the traveling direction of the plated object 12 [in the direction of arrow B in FIG. 4]. A beam member 20 is installed on the beam member 20, and a plurality of second clamping claws 21 corresponding to the number of plated objects 12 are attached to the first claw body 16 of the first chuck device 1. Similarly, they are provided at positional intervals corresponding to the plating objects 12. This second chuck device 2 has a plating device main body 3 as a whole.
The second claw body 21 is configured to be able to freely move forward and backward between the and post-processing device 22, and each second claw body 21 combines a rotating claw 24 with a fixed claw 23, and opens and closes both claws 23, 24 with a pressure cylinder 25. The front end portion 12A of the plating object 12 can be held at both upper and lower surfaces thereof. Furthermore, both mating surfaces 23 of the fixed claw 23 and the rotating claw 24
A, 24A are inclined, so that when the front end 12A is clamped, the entire plated object 12 can be lifted obliquely as shown in FIG. Also, since the claws 23 and 24 have a gap 26 between them (see Fig. 9), they can grip the front end 12A of the plated object 12 without interfering with the positioning pin 34, which will be described later. It is. 27 is a pressure cylinder, base plate 1
9. It moves the other parts forward and backward.

The plating device main body 3 mainly includes a plating liquid injection box 28 called a "sparger" and a rack 29.
and a press plate 30. The plating liquid injection box 28 has a plurality of nozzles 31 with anodes, and an upper cover 32 is attached above the nozzles 31.
A plurality of plating liquid injection openings 33 are formed in the upper lid 32. A plurality of openings 33 are formed at appropriate intervals depending on the number of plated objects 12 and the number of plated parts 12B of each plated object 12. Top lid 3
Positioning pins 34 and 35 are protruded from the upper surface of 2. One of the pins 34 is provided protrudingly on the top cover 32 at a position such that it supports the front and rear ends of the plated object 12 at three points from the outside. One of the pins 34 serves as a guide when the plated object 12 is lowered and returned to its uppermost position, and is actually installed at a height h slightly above the upper limit position of a wire 36, which will be described later. The other pin 35 has an extremely small size so as to minutely position the plating part 12B of the plating object 12 and the plating liquid injection opening 33 by penetrating into and engaging with the slit, gap, hole, etc. of the plating object 12. is provided on the upper lid 32. 37 is a wire storage groove.

The rack 29 has a rectangular shape in its entirety, supported by a bracket 40A connected to a pressure cylinder 39 fixed to a base 38, and a pair of guide poles 41 in the front and rear, and a pair on the left and right, whose lower ends are connected to another bracket 40B. It is a frame-shaped thing, and the pressure cylinder 3
9, it is made vertically movable. Reference numeral 42 denotes a pair of wire bases, which are provided on the rack 29 in pairs on the left and right.
A real wire 36 is stretched. Reference numeral 43 denotes a "tension applying means" for tensioning, and the peg 44 tensions the end of each wire 36 using a worm gear (not shown). The wire 36 is stretched between the wire bases 42 and installed horizontally above the top lid 32, when a plurality of plating objects 12 are transferred by the first chuck device 1. Each plating object 12 is received and supported in a horizontal state, and a plurality of plating objects 1 are
The second chuck device 2 functions to lower and return to the upper lid 32 while supporting the plating object 2, and to transfer it to the second chuck device 2 when it comes to take out the plating object 12 after the plating process. Note that the upper limit position of the wire 36 is set slightly below the height of the tip of the pin 34.

During the plating process, the press plate 30 is
2 to the upper surface of the upper lid 32, and is provided at a position above the upper lid 32 so as to be freely movable up and down, and has a pad 45 made of an elastic material on the lower side, and a pad 45 for the cathode on the lower surface side of this pad 45. A wire 46 is provided.

In FIG. 1 and FIG. 2, 47 and 48 respectively indicate roller conveyors, and the rear part of the pre-processing device 5 and the front part of the post-processing device 22 with respect to the plating device main body 3,
Each roller is provided with its upper surface side exposed.

Next, the action will be explained.

The plurality of plated objects 12 that have been pretreated in the pretreatment device 5 are conveyed to the exit side of the pretreatment device 5 while being lined up on a roller conveyor 47, and wait to be held and transferred by the first chuck device 1. At this point, if the rotating arm 6 is rotated in the counterclockwise direction (in the direction of arrow Y) in FIG. Move to the left in Figures 2 and 4. However, the vertical holder 10
The base 11, which is sustained and supported at the lower end of the roller conveyor 47, moves in a horizontal elliptical locus X and reaches directly above the roller conveyor 47. At this time, the beam members 15, 15A, and 15B are shifted, and the first claw body 16, specifically, the pair of left and right claw bodies 16A, 16B are opened. Therefore, if the base 11 descends along the horizontal elliptical locus X, the claw body 1
The lower bent portions 17 of 6A and 16B are the roller conveyor 4
7 and is positioned slightly below the left and right sides of the plating object 12. [At this time, the damper 18 is open. ] Next, the girder materials 15, 15A,
If 15B is shifted in the opposite direction, the claw bodies 16A,
16B is closed, and its lower bent portion 17 holds the plating object 12 from the left and right sides. In this holding state, each claw body 16A, 1 corresponding to a plurality of plating objects 12
6B respectively. Then, by rotating the rotating arm 6 clockwise, the base 1
Each of the plurality of first claw bodies 16, 16A, 16B can be moved in a horizontal elliptical locus X in the opposite direction to the tip, and the object 12 to be plated can be held from above the roller conveyor 47 and kept in a horizontal state at a height H. The first chuck device 1 transports the plating object 12 onto the plating device main body 3, specifically onto the wire 36, while drawing a trajectory X. [At this time, the damper 18 is closed]. Next, the first claw body 16,1
By opening 6A and 16B, each plating object 12 is transferred onto the wire 36. [At this time, damper 18
opens again]. In addition, the press plate 3 of the plating device main body 3
0 is in a state of being lifted upward at this time,
In order to shorten the plating processing time, the upper distance is not so large, and the wire 36 and press plate 30 are
Although the space between the two is inevitably small, the first chuck device 1 draws a horizontally elliptical trajectory X, so that it can enter laterally [from a direction that does not interfere with the press plate 30]. Then, the plating object 12 is transferred onto the wire 36. In this way, the entire first chuck device 1 moves again to the left in FIGS. 1, 2, and 4 due to the action of the horizontally oval trajectory X forming device 4. On the other hand, each plated item 12 left on the wire 36
Since a plurality of sheets are transferred in an aligned state, when the rack 29 starts to descend by the pressure cylinder 39, it descends together with the racks 29 in an aligned state and supported by the wires 36. By the way, the positioning pin 34 protruding from the top cover 32
is in contact with the plating object 12 at a position where both the front and rear ends of the plating object 12 are supported at three points each, and the plating object 12 is guided by this positioning pin 34 when descending, and after approaching the top cover 32, Since positioning is also forced by other positioning pins 35,
The plated portion 12B of each plated object 12 is attached to the upper lid 3.
This corresponds precisely to the position of the plating liquid injection opening 33 of No. 2. At the lower limit position, the wire 36 enters the wire storage groove 37 so that the lower surface of the plated object 12 can directly contact the upper surface of the upper lid 32. At this time, the press plate 30 has begun to descend, and the pad 45 presses the plating object 12 onto the upper surface of the upper lid 32. By this pressing, the cathode wire 46 is brought into contact with the upper surface side of each plating object 12, and the plating object 12 is turned into a cathode.

Then, when the plating liquid is injected from the nozzle 31, the plating liquid is applied to the part to be plated 12B exposed from the plating liquid injection opening 33, and the partial plating process is performed on a plurality of objects 12 to be plated at the same time.

When the partial plating process is completed, the press plate 30 returns and rises, and the rack 29 also returns and rises accordingly.
Therefore, the plurality of plated objects 12 are connected to the positioning pins 34.
While being guided by the wire 36, it returns to its original upper limit height while being supported on the wire 36 without losing its alignment, and waits for the second chuck device 2 on the output side to come to take out the chuck.

When the vertical base plate 19 is moved to the left in FIGS. 1 and 8 via the pressure cylinder 27, the plurality of second pawls 21 provided on the beam member 20 are also moved to the left. At this time, pressure cylinder 2
5 to keep each second claw body 21 open. That is, the mating surface 24A of the rotary claw 24 is rotated in a direction away from the mating surface 23A of the fixed claw 23. and each second claw body 21
When the entire body has been moved to a position where it can grip the front end 12A of each plating object 12, the pressure cylinder 25
By operating in the opposite direction, as shown in FIGS. 7 and 10, the mating surface 24A of the rotary claw 24 presses the lower surface of the front end 12A, and the mating surface 23A of the fixed claw 23 simultaneously presses the upper surface. A state of "pinching" is obtained.
As mentioned above, there is a gap 26 between the center of both the rotary claw 24 and the fixed claw 23, and the front end 12 is located in the middle of the plated object 12 despite the presence of the positioning pin 34 on the front end side.
It is something that can “hold” A. Furthermore, since these mating surfaces 23A and 24A are sloped surfaces, by ``sandwiching'' the other side can be held diagonally upward, and each plated object 12 can be held diagonally upward as shown in FIG. At this time, the other [rear end] is lifted, and it is taken out from above the wire 36 by the second claw body 21 of the second chuck device in a state where it is easily removed from the positioning pin 34. Next, by the action of the pressure cylinder 27, the plurality of second claw bodies 21 are simultaneously moved to the right in FIGS. Multiple matte items 1
When the second pawl body 21 is opened in such a manner as to move the plating objects 2, the objects 12 to be plated are carried into the post-processing device 22 in an aligned state. Then, the second chuck device 2 again goes to receive the plating object 12 on the plating device main body 3.

Incidentally, it is preferable to move the first chuck device along the horizontal elliptical locus X as in this embodiment, since the distance between the wire 36 and the press plate 30 can be narrowed as described above. Of course, it is possible to replace it with other means, for example, a means for moving in combination of both vertical and horizontal forward and backward movement.

Since the plating device according to the present invention is as described above, a plurality of plating objects, particularly strip-shaped plating objects such as IC lead frames, are aligned on a roller conveyor adopted as a pre-processing and post-processing device. "Holding/transferring" and "picking/unloading" are carried out between the pre-processing device and the plating device main body, and between the plating device main body and the post-processing device using the first chuck device and the second chuck device, respectively. By doing this, it is possible to transfer a large number of sheets of plating at the same time while maintaining the initial alignment until the end, which has the excellent effect of shortening the overall processing time. The main body has a wire installed above the top cover with a plating liquid spray opening, so that the first chuck device can easily transfer the plating object held by the first chuck device, and at the same time, the second chuck device can easily pick up the plating object for removal. The lever wire can be lowered, returned and raised freely, and the plating object supported by the wire is lowered and returned to the upper position along with the wire, and the plating object is guided in its lowering and return raising by positioning pins, as well as the plating liquid injection opening. Since the corresponding positioning is performed, there is also the effect that partial plating can be accurately applied to a large number of plating objects without disrupting the alignment of the plurality of plating objects.

[Brief explanation of the drawing]

FIG. 1 is an overall side view showing an embodiment of a plating device according to the present invention, FIG. 2 is a side view of a first chuck device, and FIG. 3 is a side view seen from the direction of the arrow in FIG. Figure 4 is a plan view of the device shown in Figure 2;
FIG. 5 is an enlarged perspective view of the first claw body, FIG. 6 is a cutaway side view of the main body of the plating device, FIG. 7 is a partial plan view taken along the arrow line in FIG. 6, and FIG. 8
FIG. 9 is an enlarged side view of the second chuck device, FIG. 9 is an enlarged perspective view of the second claw body, and FIG. 10 is a partial side view showing the state in which the plated object is taken out. DESCRIPTION OF SYMBOLS 1...First chuck device, 2...Second chuck device, 3...Plucking device main body,
... Second claw body, 23 ... Fixed claw, 24 ... Rotating claw, 28 ... Plating liquid injection box, 29 ... Rack, 30 ... Press plate, 31 ... Nozzle, 32
...Top lid, 33...Plating liquid injection opening, 34,3
5...Positioning pin, 36...Wire, 47,4
8...Roller conveyor.

Claims (1)

[Claims] 1. A plurality of first claw bodies for holding plating objects are provided, each of which holds a plurality of plating objects from below in a horizontal state, and the plurality of plating objects are removed from a pre-processing device. A first chuck device is provided on the entry side for simultaneous transfer, and a second chuck device is provided for holding both upper and lower surfaces of the front end of each plated object.
A second chuck device having a plurality of claw bodies and simultaneously taking out a plurality of sheets of plated material to the post-processing device is provided on the exit side, and is provided on the upper surface of the top lid with a plating liquid spray opening located above the anode-equipped nozzle of the plating liquid spray box. A pin for positioning the plating object is provided protrudingly, and a plurality of wires for supporting the plating object are easily installed horizontally above the top lid, and during the plating process, the plating object on the wires is moved to the top surface of the top lid. A plating device consisting of a press plate with a pressing cathode, each of which is movable up and down.