JPS6312957B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a partial plating device, and particularly to a partial plating device suitable for partially plating a rectangular plated object such as an IC lead frame.

To partially plate the object to be plated, use a mask plate with openings, place the object to be plated on the mask plate, and spray plating liquid from the other side to the openings to plate only the parts exposed through the openings. Techniques such as the spot plating device disclosed in Japanese Patent Publication No. 49-24775 are known. However, other techniques are required to efficiently plate a large number of plated items in a relatively short period of time while transporting the plated items on the line, and the applicant has developed a method for preparing multiple strip-shaped plated items in advance. We have previously proposed a device that can efficiently plate a large number of objects by placing them in a row on a trolley, using the trolley as a kind of ease, transporting the objects to be plated together with the cart, and automatically plating a large number of objects.
See No. 99127]. Although the plating device according to this proposal has a considerably improved processing speed compared to the conventional plating device, it is difficult to further increase the processing speed because the plating object is transported via a trolley. For this reason, the applicant has developed a new technology in which the objects to be plated are directly aligned and transferred on a roller conveyor without using a trolley, and the objects to be plated are simultaneously picked up and transferred onto a plating device to be plated at the same time. It was considered.

This invention was developed under these circumstances, and it is easier to transfer plated items than a roller conveyor or other transfer line, and moreover, it guides the transferred multiple plated items to an accurate position to ensure reliability. Plating is applied only to the necessary areas, and after plating, the plated items are transferred to other lines (e.g. post-processing line).
It is an object of the present invention to provide a partial plating device that can be easily removed.

Specifically, the partial plating device according to the present invention includes an upper lid having an opening for spraying the plating liquid, a plurality of wire storage grooves formed on the upper surface, and a plurality of protruding object positioning pins, and a top lid having a plurality of protruding object positioning pins; A plating liquid spray box equipped with a nozzle for spraying plating liquid, and a plurality of wires for supporting the plating object are installed above the top cover, and these wires can be lowered and raised to at least a position corresponding to the top surface of the top cover. It consists of a rack made of metal, and a pressing plate that can be lowered and raised to press the plated object onto the upper surface of the upper lid.

Details will be described below with reference to drawings showing one embodiment. This partial plating device mainly consists of a plating liquid injection box 1, a rack 2, and a pressing plate 3.

Metsuki liquid injection box 1 is a "sparger"
A top cover 5 is attached to a box body 4, and a nozzle 6 for spraying plating liquid is provided inside the top cover 5. The upper cover 5 has the role of a so-called mask plate, and has a number of plated objects (IC lead frames in the illustrated example) according to the parts to be plated.
It is equipped with an opening 8 for spraying plating liquid of different size and position, and furthermore, a wire storage groove 1 is provided on the upper surface 9 of the upper lid 5.
Multiple 0's are formed. These wire storage grooves 1
0 are formed at positions corresponding to the lowering of the wires 11 provided on the rack 2 in a number corresponding to the number of wires 11. Further, on the upper surface 9 of the upper lid 5, there are a first pin 12 and a second pin 1 as "plating object positioning pins".
A plurality of protruding numbers 3 and 3 are respectively provided. The first pin 12 engages with the side surfaces of both ends of the plated object 7, and has a height h that allows it to protrude slightly above the upper limit position of the wire 11.
It is provided in a protruding manner on the upper lid 5 at a position corresponding to the size of the plated object 7 in advance so as to support it at 3 points on one side and 6 points on both sides. The first pin 12 has a positioning function when the plating object 7 is transferred onto the wire 11 from a roller conveyor or other transfer line (not shown), and also has a positioning function when the plating object 7 is lowered while being supported by the wire 11. It serves as a guide when ascending, and the entire structure is tapered to suit both functions. The second pin 13 can be said to be a minute pin compared to the first pin 12, and by engaging in the opening or gap of the plating object 7, the opening 8 of the upper cover 5 and the part to be plated of the plating object 7 are connected. It performs minute positioning, and for that purpose it is provided protruding from the upper surface 9 of the upper lid 5 at a slight height.

The nozzles 6 are used to spray plating liquid into the openings 8 of the upper cover 5. As shown in the figure, each nozzle 6 is provided directly below a plurality of openings 8, and serves as an anode.

The rack 2 supports the transferred plated object 7,
During the plating process, the plated object 7 is moved (lowered) toward the upper lid 5, and when the plating process is completed, the plated object 7 is returned and raised to its original position for removal. Specifically, a base plate 15 is provided on the base 14, and a rack plate 18 is supported on the base plate 15 via an air cylinder 16 and a guide shaft 17. Air cylinder 16 supports rack plate 18 via bracket 19 and moves rack plate 18 up and down. A pair of guide shafts 17 are provided in the front and rear to guide the vertical movement of the rack plate 18, and the upper cover 5 adjusts the height position of the rack plate 18 with respect to a transfer device (not shown).

In the figure, only the right side of the rack plate 18 is shown and the left side is omitted, but there is a pair of left and right rack plates 18, and they are integrated with a pair of front and rear joint plates 20, forming a rectangular frame as a whole. . This "rectangular frame" is arranged so as to surround the upper lid 5 of the plating liquid injection box 1 described above, and has a plurality of wires 1 for supporting the plating object 7.
1 is installed above the upper lid 5. That is, a wire base 21, a peg 22 as a tension applying means, a peg holder 23, etc. are attached to the pair of left and right rack plates 18, respectively.
In the illustrated example, three wires 11 at the front and rear are installed in the left-right direction in FIG. 3, both ends of which are supported on wire bases 21 and wound around pegs 22 to apply tension to the entire wire. These wires 1
The height of the construction 1 is such that a chuck device (not shown) can easily grasp the plated item 7 after the plating process in order to take it out to another place (for example, a post-processing line). Note that the number of wires 11 is not limited to three, and may be any number as long as it can stably support the plating object 7.

The pressing plate 3 is for pressing the plating object 7 supported by the wire 11 against the upper surface 9 of the upper lid 5 and turning the plating object 7 into a cathode while being fixed on the upper lid 5. It is said that it can be lowered and raised freely, and a plurality of first pins 1 with a height greater than the height h of the first pin 12 are provided on the lower surface side of the press plate 3.
An elastic body 24 of a size that can penetrate between the two is attached, and a plurality of cathode lead wires 25 are stretched at a position corresponding to the lower surface of the elastic body 24.

Next, the action will be explained.

When the plating object 7 is transferred from a roller conveyor or other transfer line (not shown) to this partial plating device, the press plate 3 is raised, the rack 2 is also raised, and the wire 11 is at its upper limit position. is in The plated object 7 transferred in this state has three wires 1 at both ends and at the center.
1 is supported in a well-balanced manner, and the first pin 12
The position is determined by Then, the press plate 3 is lowered by a pressure cylinder (not shown), and the air cylinder 16 of the rack 2 is operated to lower the wire 11. That is, the air cylinder 16 lowers the rack plate 18 via the bracket 19, and the three wires 11, which are strung and stretched between the wire bases 21 on the pair of left and right rack plates 18, are lowered together. Then, the plated object 7 is lowered while its both ends are guided by the first pin 12. When approaching the upper surface 9 of the upper cover 5, the plated object 7 is guided by the second pin 13 in addition to the first pin 12, and the second pin 13 engages with the plated object 7. For example, the plated object 7 is an IC lead frame. If so, the second pin 13 enters and engages into the small hole (crosspiece hole) or gap formed in advance in the IC lead frame, and the minute positioning of the part to be plated of the plated object 7 with respect to the opening 8 is automatically performed. At this point, the upper surface side of the plating object 7 is covered with the elastic body 2 of the pressing plate 3.
This elastic body 24 performs a kind of masking on the upper surface side so that the plating liquid that is pressed at 4 does not reach the non-plating target portion on the upper surface side. Therefore, the elastic body 24 enters between the plurality of first pins 12 and descends to come into contact with the upper surface side of the plated object 7, bringing the lower surface side into close contact with the upper lid 5. At this time, the cathode lead wire 25 comes into contact with the upper surface of each plating object 7 to turn each plating object 7 into a cathode. Further, the wire 11 supporting the plating object 7 is stored in the wire storage groove 10, so that the lower surface side of the plating object 7 and the upper surface side of the upper lid 5 are brought into close contact with each other.

Next, the plating liquid is sprayed from the nozzle 6 of the plating liquid injection box 1 toward the opening 5 of the upper lid 5, and the plating liquid is applied to the exposed part of the object 7 to be plated. The plating object 7 is made into a cathode by the lead wire 25 in advance, and the sprayed plating liquid is anodized by the anode on the nozzle 6 side, so when the plating liquid is applied to the part to be plated, the sprayed electroplating is applied thereto. Partial plating will also be carried out. When these specific plating processes are completed, the air cylinder 16 is operated in the opposite direction to the previous operation to return and raise the rack plate 18 and the wire 11, and at the same time, the pressure plate 3 is also returned and raised under pressure (not shown). The plating object 7 is returned and raised to its original position via a cylinder.
Then, the plating object 7 is located above the upper lid 5 and a gap is created between the two, so that a chuck device (not shown) in the next process, for example, a post-processing line, can easily enter and the plating object 7 can be grabbed and taken out. It becomes easier.

Then, the plating object 7 is transferred onto the wire 11 as described above, and the first pin 1 is transferred while being supported by the wire 11.
2. A series of actions such as lowering guidance and positioning via the second pin 13, and returning and raising using the wire 11 after applying the plating liquid, are performed when a plurality of plating objects 7 are arranged in a row. This can be expected as long as it is transferred onto the wire 11 at the same time, and the plating process can be performed very efficiently.

As explained above, according to the present invention, a plurality of wires are installed above the top cover with an opening for spraying plating solution and are movable up and down, and the object to be plated supported by the wires is lowered, restored, and The lift is guided by a plurality of positioning pins protruding from the top cover in advance, and the positioning pins are minutely positioned relative to the opening of the top cover, making it easy to transfer multiple plated items onto the wire while keeping them aligned. If it is transferred, the plating process can be done efficiently. Moreover, after the plating process, it is separated from the top cover and supported with a wire above it, so it is very easy to take out the plated items.
Overall, there are many excellent effects such as shortening the processing time for partial plating.

[Brief explanation of the drawing]

Fig. 1 is a cutaway side view of a main part of a partial plating device showing an embodiment of the present invention, Fig. 2 is a partial plan view seen from the - line direction in Fig. 1, and Fig. 3 is a partial plan view in Fig. 2. A reduced side view of the main parts as seen from the arrow direction,
FIG. 4 is a side view of the rack seen from the direction of the arrow in FIG. 1...Metsuki liquid injection box, 2...Lack,
3...Press plate, 5...Top lid, 6...Nozzle, 7...
... Plating object, 8... Opening for plating liquid injection, 10
...Wire storage groove, 11...Wire, 12...
...The first pin as a plating object positioning pin, 13
...Second pin as a positioning pin for plating, 1
6... Air cylinder, 18... Rack plate, 21... Wire base, 24... Elastic body.

Claims (1)

[Scope of Claims] 1. An upper lid having an opening for spraying plating liquid, a plurality of wire storage grooves formed on the upper surface, and a plurality of protruding object positioning pins, and a nozzle for spraying plating liquid into the opening. a plating liquid injection box, a rack equipped with a plurality of wires for supporting the plating object installed above the top cover, and capable of lowering and rising these wires to at least a position corresponding to the top surface of the top cover; and a rack for supporting the plating object. A partial plating device consisting of a press plate that can be lowered and raised freely to press the upper surface of the upper cover.