JPS6316839B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bubble memory device, and particularly to a bubble memory device equipped with a bias coil that varies a bias magnetic field for margin measurement.

[Conventional technology]

Generally, a bubble memory device has a structure as shown in FIG. That is, the bubble memory chip 1 consists of a magnetic thin film formed on a non-magnetic substrate such as garnet by a liquid crystal epitaxial growth method, and a pattern of a soft magnetic material and a conductive material formed on this magnetic thin film. As shown in FIG. 2, it is fixed in the central recess of the insulating substrate 2, and the wiring from the chip 1 is connected to the pin hole 2a of the insulating substrate 2. Furthermore, on the outer surface of the insulating substrate 2 to which the chip 1 is fixed, a Y-direction driving coil 3 is wound in the Y-axis direction as shown in FIG. 3 in order to supply a horizontal rotating magnetic field to the chip 1. An X-direction drive coil 4 is wound in the X-axis direction perpendicular to this. The insulating substrate 2 around which the coil blocks 3 and 4 are wound in this way
is fixed to a lead frame 5 as shown in FIG. This lead frame 5 is used for signal propagation to electrically connect between the chip 1 and an external circuit, and the rising connection portions 5b of the leads 5a of the lead frame 5 are inserted into the pin holes 2a of the insulating substrate 2, and soldered etc. Fixed. Lead frame 5 like this
As shown in FIG. 1, the insulating substrate 2 to which the insulating substrate 2 is attached is subjected to a mold 6 to form a mold device 7. Furthermore, flat permanent magnets 8a and 8b that provide a uniform bias magnetic field to the chip 1 are arranged on the upper and lower surfaces of the mold device 7, with magnetic field shunt plates 9a and 9b interposed therebetween. A bubble memory device is constructed by being fitted into a shield case 10 made of a high magnetic permeability material such as. And the magnetic shunt plate 9a,
A bias static magnetic field necessary for stable operation of the bubble is generated by permanent magnets 8a and 8b between the opposing surfaces of the bubble 9b.

The margin of such a bubble memory device is generally expressed with the bias magnetic field on the vertical axis and other parameters on the horizontal axis. Therefore, in order to measure the margin, it is necessary to make the bias magnetic field variable. A bias coil is used to make this bias magnetic field variable.

Incidentally, a package of a magnetic bubble memory using a lead frame is known from Japanese Patent Application Laid-open No. 78130/1983, but there is no description in that publication about the attachment of a bias coil.

[Problem that the invention seeks to solve]

Conventionally, the margin measurement has been carried out by winding a coil 11 around the side surface of a shield case 10 as shown in FIG. −
Publication No. 5334). However, this method has the disadvantage that the coil 11 must be attached and detached one by one, is difficult to handle, and requires a lot of time for preparation work.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a bubble memory device that is easy to handle in margin measurement and manufacturing process.

[Means for solving problems]

According to an embodiment of the present invention, there is provided a method of resin-sealing an external connection lead and a member for supporting a bias coil using a lead frame integrally formed.

[Effect]

The bias coil can be positioned with high precision.

〔Example〕

Hereinafter, the present invention will be explained with reference to illustrated embodiments.

5 is a front view and a side view before molding showing an embodiment of the bubble memory device according to the present invention, FIG. 6 is a perspective view of the lead frame of FIG. 5,
7 is a perspective view of the molded device, FIG. 8 is a completed view of the bubble memory device, and FIG. 9 is an enlarged sectional view of the bubble memory device shown in FIG. 8.
Note that the same or equivalent members as in FIGS. 1 to 4 are designated by the same reference numerals, and their explanations will be omitted.

As shown in FIG. 6, the lead frame 5 has a downwardly bent bias coil mounting portion 5c formed on the inner side where the leads 5a are not formed. The rising connection portion 5b of the lead 5a of this lead frame 5 is connected to the pin hole 2 of the insulating substrate 2 around which the coil blocks 3 and 4 are wound as shown in FIG.
a, and as shown in FIG. 5, is fixed with solder or the like as in the conventional case. One feature of the present invention is that the bias coil 12 is fixed to the bias coil mounting portion 5c of the lead frame 5 as shown in FIG. Then, the terminal of the bias coil 11 is connected to the lead 5a of the lead frame 5. This makes it possible to vary the bias magnetic field by passing a current through the lead 5a. Furthermore, by passing a large current through this bias coil when using the bubble memory, the information stored in the bubble memory can be cleared (erased) at once. Next, a mold 6 is applied so as to enclose the coil blocks 3, 4 and bias coil 12 of the assembly assembled as shown in FIG. 5, to form a mold device 7 as shown in FIGS. 7 and 9. At this time, magnetic shunt plates 9 are provided on the upper and lower surfaces of the mold device 7.
A, 9b and a recessed portion for arranging the permanent magnets 8a, 8b are formed. Then, the magnetic field shunt plates 9a, 9b and permanent magnets 8a, 8b are placed in the recessed portions of the upper and lower surfaces of the mold device 7, and the bubble memory device is constructed as shown in FIGS. 8 and 9 by fitting into the shield case 10. Complete. Thereby, the bias coil 12 is arranged around the magnetic shunt plate 9b. Note that after resin molding, unnecessary portions of the lead frame are of course removed.

〔Effect of the invention〕

As is clear from the above description, according to the bubble memory device according to the present invention, since the bias coil is attached to the lead frame, the dimensional accuracy is greatly improved to ±0.1 mm, and the attachment position is stable.

[Brief explanation of the drawing]

Figure 1 is a sectional view of a conventional bubble memory device, Figure 2 is a front view of an insulating substrate on which a bubble memory chip is fixed, Figure 3 is a front view of an insulating substrate around which a coil block is wound, and Figure 4 is a front view of an insulating substrate on which a coil block is wound. 5 is a front view and side view of a bubble memory device according to an embodiment of the present invention before molding; FIG. 6 is a perspective view of the lead frame of FIG. 5; FIG. 7 is a perspective view of a conventional lead frame; 8 is a perspective view of the molded device, FIG. 8 is a completed view of the bubble memory device, and FIG. 9 is an enlarged sectional view of the bubble memory device shown in FIG. 8. DESCRIPTION OF SYMBOLS 1...Bubble memory device, 2...Insulating substrate, 3...X direction drive coil, 4...Y direction drive coil, 5...Lead frame, 5a...Lead, 5b...Rising connection part, 5c... Bias coil attachment part, 6...Mold, 7...Mold device, 8a, 8b...Permanent magnet, 9a, 9b
...Magnetic adjustment plate, 10...Shield case, 12...
bias coil.

Claims (1)

[Claims] 1. Prepare a lead frame in which a plurality of leads for electrically connecting the magnetic bubble memory chip with the outside and a supporting part for attaching a bias coil capable of supplying a bias magnetic field to the chip are integrally formed. A method of manufacturing a magnetic bubble memory, characterized in that the chip, the bias coil, and a part of the lead frame are sealed together with a resin capsule.