JPS6316892B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for aging a series of electronic parts and a series of electronic parts using the same.

BACKGROUND OF THE INVENTION Electronic component series as shown in FIGS. 1a and 1b are known for saving labor in the manufacturing process of electronic components such as capacitors and resistors and for automatically inserting them into printed circuit boards using an automatic insertion machine. This is a belt-shaped and long taping member consisting of an insulating paper 1 which is a holding body (tape-shaped) and an adhesive tape 2, and an electronic component 3 such as a capacitor or a resistor is placed on the lead wires 4 and 5. A large number of them are held at regular intervals and wound around a winding frame. 23 is a sprocket hole. In addition, it is also known that a chain of parts attached to a tape is formed in a meandering shape.

Many of these electronic components are required to have stable characteristics and high reliability, and when manufacturing such electronic component series, it is necessary to batch-process the aging process after assembly. It is impossible to do this, and the method of assembling and aging them individually and then adhering them to a holder has been necessary, making it difficult to automate assembly during the manufacturing process, which is an important purpose of using electronic components.

Therefore, the present invention has been made in response to the above problems, and its purpose is to automate the assembly process, and in particular, to provide a method for aging electronic components and a method for aging them. Provides a series of electronic components.

That is, the first gist of the present invention is that electronic components having parallel leads in the same direction are arranged at regular intervals perpendicular to the length direction of the tape holding them, and an adhesive tape is pasted thereon. In the aging method for electronic components, the adhesive tape is provided with a hole or notch above one of the two lead wires, the lead wire provided with the hole or notch is formed shorter than the other, and the adhesive tape is A conductor such as a metallized film or metal foil is brought into contact with the tape, the short lead wires are short-circuited and used as one electrode, and the long lead wires are connected to the electrode plate and used as the other electrode, and both electrodes are connected. A method for aging electronic components, characterized by connecting a power source between the two and aging the electronic components.

The second gist of the present invention is that electronic components having parallel leads in the same direction are arranged at regular intervals perpendicular to the length direction of the tape holding them, and an adhesive tape is pasted on top of the electronic components. A series of electronic parts is characterized in that a hole or a notch is provided in an adhesive tape on one of two lead wires.

The details of the present invention will be explained below with reference to the drawings. FIG. 2a is an external view of an electronic component series used in the aging method for an electronic component series according to an embodiment of the present invention, and FIGS. 2b and 2c are used in the aging method for an electronic component series according to an embodiment of the present invention. FIG. 2 is a diagram for explaining a series of electronic components and an aging method.

In Figure 2a, 19 is an electronic component series, and 6
is the winding frame, and the electronic parts series 19 are placed on the interlayer paper 18 on this winding frame.
is wound through. By using this interlayer paper, it is possible to insulate the parts from each other and prevent the parts from becoming entangled. In FIG. 2b, 11 is an insulating paper holder. 12 is adhesive tape for electronic parts 1
The lead wires 14 and 15 of No. 3 serve to fix to the insulating paper 11. Reference numeral 16 indicates a connection hole, which is made in the adhesive tape on one of the lead wires. Further, in the figure, the lead wire 15 on the side with the connection hole is formed shorter than the other lead wire 14. 17
is a conductor made of metallized film or metal foil, etc., and is placed on the adhesive tape 12 to connect one lead wire of the electronic components to each other. 23 is a sprocket hole. Further, in FIG. 2c, 18 is an interlayer paper, and 20 is an electrode plate for connecting the longer lead wires. 21 is a power source for applying voltage to both electrodes.

Next, the aging method will be explained. As shown in FIG. 2b, holes 16 and 16' are provided in the adhesive tape above one lead wire, for example 15 and 16, of the electronic component in order to apply an aging voltage to the electronic component fixed to the electronic component chain. In such a case, the lead wire will be exposed through the hole. Next, if a conductor 17 made of a metallized film or metal foil is placed on the adhesive tape 12, the conductor contacts through the holes 16, 16' of the adhesive tape of one lead wire.
By doing the same with other electronic components, one lead wire can be brought into contact with the conductor. Next, for the other lead wire, for example, 14, 14', 15,
By making 15' shorter than 14,14', the second
The long lead wires 14, 14' can be easily connected to the electrode plate 20 as shown in FIG. For the remaining electronic components, by connecting the long lead wires of the adhesive tape with no holes to the electrode plate 20, the electrode plate 20 can be used as the electrode for the other lead of the series of electronic components. As shown in FIG. 2c, if the power supply 20 is connected to one electrode 17 connected to one lead wire of the electronic component and the other electrode 20 connected to the other lead wire, the electronic component is mounted in the series. Aging voltage can be applied to all the parts in the Further, as shown in FIG. 18, if interlayer paper is used, insulation of the parts is ensured even in the state of the winding frame or the state of being folded in a zigzag manner, and aging can be carried out in that state.

FIG. 3 is an explanatory diagram of another embodiment of an electronic component series used in the aging method for an electronic component series according to an embodiment of the present invention. In the figure, the same parts as in FIG. 2b are given the same numbers. In this embodiment, a notch 22 or 22' is provided at the end of the adhesive tape instead of a hole in order to bring the adhesive tape into contact with a conductor.
As is clear from the figure, there is no problem even if the widths of 22 and 22' are different. It is possible to prepare a series of electronic components according to this embodiment and perform aging in the same manner as in the case of FIG. 2b.

Incidentally, the lead wires of the electronic component series used in the aging method according to the present invention may be prepared with steps provided in advance, and there is no problem even if additional steps are provided when carrying out aging. Furthermore, after aging, it is convenient to trim the stepped lead wires to make it easier to mount the final product using an automatic insertion machine.

As explained above, according to the present invention, it is possible to perform aging after assembling electronic parts, thereby stabilizing the characteristics of the electronic parts series and improving reliability. At the same time, in the manufacturing process of electronic parts that require aging, it becomes possible to proceed in the form of electronic parts after lead wire attachment, automation of production,
We were able to significantly improve efficiency.

[Brief explanation of the drawing]

FIG. 1a is an external view of a conventional electronic component series, FIG. 1b is an enlarged view of part A in FIG. 1a, and FIG. 2a is used in an aging method for an electronic component series according to an embodiment of the present invention External view of electronic components, Figure 2 b and c
3 is a diagram for explaining an electronic component series and an aging method used in an aging method for an electronic component series according to an embodiment of the present invention, and FIG. 3 is a diagram used in an aging method for an electronic component series according to an embodiment of the present invention It is an explanatory view of other examples of electronic parts series. 1,11...Insulating paper, 2,12...Adhesive tape, 3,13,13'...Electronic component, 4,5,1
4, 15, 14, 15'... Lead wire, 6... Winding frame, 7, 19... Electronic parts series, 16, 16'...
Connection hole, 17... Conductor, 18... Interlayer paper, 20
...Electrode plate, 21...Power source, 22, 22'...Connection notch, 23...Subrocket hole.

Claims (1)

[Claims] 1. An electronic component series in which electronic components having leads parallel to the same direction are arranged at regular intervals perpendicular to the length direction of a tape holding them, and an adhesive tape is pasted thereon. In the aging method, a hole or a notch is provided in the upper part of one of the two lead wires in the adhesive tape, and the lead wire on the side with the hole or notch is formed shorter than the other, and the adhesive tape is A conductor such as a metallized film or metal foil is connected to the top, the shorter lead wire is short-circuited and used as one electrode, and the longer lead wires are connected to the electrode plate and used as the other electrode, and a power source is connected between the two electrodes. A method for aging electronic components, characterized by aging them by connecting them. 2 Arrange electronic components with parallel leads in the same direction at regular intervals perpendicular to the length of the tape holding them, and affix adhesive tape on top of them,
An electronic component series characterized in that a hole or notch is provided in the adhesive tape on one of the two lead wires. 3. The electronic component according to claim 2, wherein of the two lead wires, the length of the lead wire on the side where the hole or notch is provided in the adhesive tape on the lead wire is shorter than the length of the other lead wire. Communicating.