JPS638607B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for aging a series of electronic parts and a series of electronic parts used therein.

BACKGROUND OF THE INVENTION Electronic component series as shown in FIGS. 1a and 1b are known for saving labor in the manufacturing process of electronic components such as capacitors and resistors and for automatically inserting them into printed circuit boards using an automatic insertion machine. This is a belt-like structure composed of an insulating paper 1 as a (tape-like) holder and an adhesive tape 2, and an electronic component 3 such as a capacitor or resistor is mounted on the long taping member with its lead wires 4 and 5. A large number of parts are held at regular intervals, and these are wound around a winding frame. 8 is a sprocket hole. In addition, it is also known that a chain of parts attached to a tape is formed in a meandering shape. Many of these electronic components are required to have stable characteristics and high reliability, and when manufacturing such electronic component series, it is not possible to batch-process the aging process after assembly. This is impossible, and the method of assembling and aging them individually and then adhering them to a holder has to be used, making it difficult to automate assembly during the manufacturing process, which is an important purpose of using electronic parts.

Therefore, the present invention has been made to address the above problems, and its purpose is to automate the assembly process, and in particular to provide a method for performing engine operation in a state where electronic parts are connected, and a method for doing so. We provide a series of electronic components for use.

That is, the first gist of the present invention is to arrange electronic components having a pair of lead wires parallel to each other in the same direction at regular intervals perpendicular to the length direction of the insulating tape that holds them, and to attach an adhesive tape thereon. In an aging method for electronic components, one of the pair of lead wires is formed shorter than the other, and the shorter lead wire is short-circuited by contacting it with a tape surface having a conductive layer such as a metallized film or metal foil. An electronic device characterized in that the longer lead wires are in contact with an insulating tape surface without a conductive layer and are connected to an electrode plate to serve as the other electrode, and aging is performed by connecting a power source between both electrodes. It is in the aging method of parts series.

A second aspect of the present invention is to arrange an electronic component having a pair of lead wires parallel to the same direction at regular intervals perpendicular to the length direction of an insulating tape holding the electronic component, and to attach the lead wires to the insulating tape. It is a series of electronic components characterized by having the front and back sides of the electronic parts separated and pasted with adhesive tape.

Hereinafter, details of the present invention will be explained with reference to the drawings.

FIG. 2a is a diagram for explaining an electronic component group and an aging method used in an aging method for an electronic component group according to an embodiment of the present invention.

In Figure 2a, 17 is an electronic component series, and 6
is the winding frame, and the electronic parts series 17 are placed on the interlayer paper 19 on this winding frame.
is wound through. By using this interlayer paper, it is possible to insulate the parts from each other and prevent the parts from becoming entangled. In FIG. 2b, 11 is an insulating paper holder. 12 is adhesive tape for electronic parts 1
It plays the role of fixing the lead wires 15 of No. 3 to the insulating paper 11. Reference numeral 22 denotes a conductor made of metallized film or metal foil, etc., which is placed on the adhesive tape 12 to connect short lead wires of electronic components to each other. 8 is a sprocket hole. Figure 2c
2b is a diagram showing the electronic component series of FIG. Further, in FIG. 2d, 19 is an interlayer paper, and 20 is an electrode plate for connecting the longer lead wires. 21 is a power source for applying voltage to both electrodes.

Next, the aging method will be explained. As shown in FIG. 2b, an adhesive tape 12 is pasted onto short lead wires, for example 15, 15', of the electronic component in order to apply an aging voltage to the electronic component fixed to the electronic component chain. Next, adhesive tape 12
If a conductor 22 made of a metallized film or metal foil is placed on top, the conductor becomes the lead wires 15, 15'.
come into contact with. By doing the same with other electronic components, short lead wires can be brought into contact with conductors. Next, the other lead wire, for example 14,
For 14', insulating paper 1 as shown in Figure 2c.
By attaching the lead wires 15 and 15' to the back surface of the electrode plate 1 with an adhesive tape 12' and making them longer than the lead wires 15 and 15', it can be easily connected to the electrode plate 20 as shown in FIG. 2d. The remaining electronic components can also be connected to the electrode plate 20 by connecting long lead wires to the electrode plate 20.
can be used as the electrode of the other lead wire of the electronic component series.

In this way, as shown in FIG. 2d, one electrode 22 is connected to the short lead wire of the electronic component.
By connecting a power source 21 to the other electrode 20 to which the other lead wire is connected, an aging voltage can be applied to all electronic components mounted in the electronic component series. Further, as shown in FIG. 19, if interlayer paper is used, the insulation of the parts is ensured even in the state of the winding frame or the state of being folded in a zigzag manner, and aging can be carried out in that state.

Incidentally, the lead wires of the electronic component series used in the aging method according to the present invention may be prepared with steps provided in advance, and there is no problem even if additional steps are provided when carrying out aging. In addition, after aging, it is convenient to trim the lead wires with steps so that they can be used for mounting with an automatic insertion machine as a final product.

As explained above, according to the present invention, it is possible to perform aging after assembling the electronic components, thereby stabilizing the characteristics of the electronic components and improving reliability. At the same time, in the manufacturing process of electronic parts that require aging, it became possible to proceed in a series of electronic parts after lead wire attachment, making it possible to greatly automate production and improve efficiency.

[Brief explanation of the drawing]

FIG. 1a is an external view of a conventional electronic component series, FIG. 1b is an enlarged view of part A in FIG. 1a, and FIG. 2a is used in an aging method for an electronic component series according to an embodiment of the present invention FIGS. 2b, 2c, and 2d are views for explaining the electronic component array and the aging method used in the aging method for the electronic component array according to an embodiment of the present invention. 1, 11... Insulating paper, 2, 12, 12'... Adhesive tape, 3, 13, 13'... Electronic component, 4, 5, 1
4, 15, 14', 15'... Lead wire, 6... Winding frame,
7, 17... Electronic parts series, 8... Sprocket hole, 19... Interlayer paper, 20... Electrode plate, 21... Power supply,
22...Electric conductor.

Claims (1)

[Claims] 1. Electronic components having a pair of lead wires running in parallel in the same direction are arranged at regular intervals perpendicular to the length direction of the insulating tape that holds them, and an adhesive tape is pasted on top of the electronic components. In the aging method for electronic components, one of the pair of lead wires is formed shorter than the other, and brought into contact with the tape surface having a conductive layer, and the shorter lead wire is short-circuited to serve as one electrode, and the longer lead wire is A method for aging electronic components, characterized in that the wires are brought into contact with a surface of an insulating tape without a conductive layer, each wire is connected to an electrode plate to serve as the other electrode, and a power source is connected between both electrodes for aging. 2. Electronic components having a pair of lead wires running parallel to the same direction are arranged at regular intervals perpendicular to the length direction of the insulating tape that holds them, and the lead wires are distributed and bonded to the front and back sides of the insulating tape, respectively. A series of electronic parts characterized by being attached with tape.