JPS6318359B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of taping a self-supporting electronic component.

Conventionally, when taping electronic components, polarity is determined by making external lead wires of different lengths extending in the same direction, as shown in FIGS. , the external lead wires 4 and 5 of different lengths of the electronic component 3 are connected to the adhesive tape 2.
After that, the entire width of the adhesive tape 2 was pressed against the backing paper 1 using a pressure roll 6. However, according to this method, the lengths of the external lead wires 4 and 5 located within the width of the adhesive tape 2 are different. Therefore, when the adhesive tape 2 is pressed onto the backing paper 1 while being pressed by the pressure roll 6, the adhesive tape 2 meanders as shown by the dashed line in FIG. This has the disadvantage that it protrudes further and requires a correction device and auxiliary equipment to correct this protrusion, which increases the cost accordingly.

The present invention has been made in view of the above-mentioned drawbacks, and aims to provide a method for taping free-standing electronic components that can prevent the adhesive tape from protruding from the mount and is inexpensive. .

In FIGS. 3 to 5, 11 is an electronic component such as a solid electrolytic capacitor having external lead wires 12 and 13 of different lengths extending in the same direction, 14 is a mount having a predetermined length, and 15 is a mount attached to the mount 14. The adhesive tape 16 to be bonded is a first pressure roller supported movably along the mount 14, which sandwiches the external lead wires 12, 13 of the electronic component 11 between the mount 14 and the adhesive tape 15. When the short external lead 12 is held in place, only the area where the short external lead 12 is sandwiched can be pressed. Similarly to the first pressure roller 16, a second pressure roller 17 is supported movably along the mount 14, and is configured to press the entire width of the adhesive tape 15.

Then, when taping the electronic components 11 to the mount 14, the external lead wires 12 and 13 of a large number of electronic components 11 are connected between the mount 14 and the adhesive tape 15 as shown in the figure. interpose. As shown in FIG. 3, first, the first pressure roller 16 is pressed against one end of the adhesive tape 15 within the range where the short external lead wire 12 is sandwiched.
The pressing roller 16 is rotated and moved in the longitudinal direction to press the adhesive tape 15 and press it onto the mount 14. Therefore, at this time, the adhesive tape 15 is pressed to the mount 14 in the range where the short external lead wire 12 is sandwiched, so that the mount 14
It is positioned and glued straight without protruding from the surface. After that, the second pressure roller 17 is brought into pressure contact with one end of the adhesive tape 15 over its entire width, and then the pressure roller 17 is rotated and moved along the mount 14 to press the adhesive tape 15 and press the adhesive tape 15. The unpressed portion is pressed onto the mount 14, and the electronic component 11 is taped to the mount 14 as shown in FIG.

Note that in the above embodiment, the second pressure roller 17
The pressure roller 17 was designed to press the entire width of the adhesive tape 15.
It may be configured such that only the uncrimped portion of 5 is pressed and crimped. Further, the mount may be made of a resin material other than a paper material, and may be provided with adhesive properties.

As explained above, the present invention provides a method for taping an electronic component having external lead wires of different lengths extending in the same direction to a mount using adhesive tape. After crimping the adhesive tape to the mount, the uncrimped part of the adhesive tape is crimped to the mount, so the electronic parts can be taped while positioning the adhesive tape straight without protruding from the mount and crimping it to the mount. Can be done. Therefore, as before,
There is no need for a correction device or its auxiliary equipment to correct the adhesive tape protruding from the backing paper.
That's how much cheaper it is.

[Brief explanation of the drawing]

1 and 2 are explanatory diagrams of a conventional taping method for electronic components, FIGS. 3 to 5 are explanatory diagrams of a taping method according to the present invention, and FIG. 3 is a crimping procedure using a first crimping roller. FIG. 4 shows the procedure for crimping using the second crimping roller. FIG. 5 shows the completed state of taping. 11... Electronic parts, 12, 13... External lead wires, 14... Mounting paper, 15... Adhesive tape.

Claims (1)

[Claims] 1. In a method of sequentially taping external lead wires of different lengths extending in the same direction on each of a plurality of electronic components to a mount with adhesive tape so as to be perpendicular to the longitudinal direction of the mount, short external lead wires are A self-supporting type characterized in that after the adhesive tape is crimped to the mount within the sandwiched area, the unpressed portion of the adhesive tape is crimped to the mount, and the crimping direction at each crimping is along the longitudinal direction of the mount. How to tape electronic parts.